MOTOROLA MC14040BD

SEMICONDUCTOR TECHNICAL DATA
L SUFFIX
CERAMIC
CASE 620
The MC14040B 12–stage binary counter is constructed with MOS
P–channel and N–channel enhancement mode devices in a single
monolithic structure. This part is designed with an input wave shaping circuit
and 12 stages of ripple–carry binary counter. The device advances the count
on the negative–going edge of the clock pulse. Applications include time
delay circuits, counter controls, and frequency–driving circuits.
P SUFFIX
PLASTIC
CASE 648
•
•
•
•
Fully Static Operation
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
• Common Reset Line
• Pin–for–Pin Replacement for CD4040B
D SUFFIX
SOIC
CASE 751B
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ORDERING INFORMATION
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol
VDD
Parameter
DC Supply Voltage
Value
Unit
– 0.5 to + 18.0
V
Vin, Vout
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
lin, lout
Input or Output Current (DC or Transient),
per Pin
± 10
mA
PD
Power Dissipation, per Package†
500
mW
Tstg
Storage Temperature
– 65 to + 150
_C
260
_C
TL
Lead Temperature (8–Second Soldering)
Plastic
Ceramic
SOIC
TA = – 55° to 125°C for all packages.
TRUTH TABLE
Clock
Reset
Output State
X
0
0
1
No Change
Advance to next state
All Outputs are low
X = Don’t Care
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
LOGIC DIAGRAM
Q1
Q2
9
CLOCK
10
C
C
R
Q3
6
7
Q
C
Q
C
R
Q
C
Q
C
R
Q10
14
Q
C
Q
C
R
Q11
15
Q
C
Q
C
R
Q12
1
Q
C
Q
C
Q
R
RESET
11
Q4 = PIN 5
Q5 = PIN 3
Q6 = PIN 2
Q7 = PIN 4
Q8 = PIN 13
Q9 = PIN 12
VDD = PIN 16
VSS = PIN 8
REV 3
1/94
MC14040B
Motorola, Inc. 1995
150
MOTOROLA CMOS LOGIC DATA
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ #
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
µAdc
IT
5.0
10
15
Vin = 0 or VDD
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
“1” Level
VIH
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
Vdc
IOH
Source
Sink
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
mAdc
IT = (0.42 µA/kHz) f + IDD
IT = (0.85 µA/kHz) f + IDD
IT = (1.43 µA/kHz) f + IDD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** The formulas given are for the typical characteristics only at 25_C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
This device contains protection circuitry to guard against damage
due to high static voltages or electric fields. However, precautions must
be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, Vin and
Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage
level (e.g., either VSS or VDD). Unused outputs must be left open.
MOTOROLA CMOS LOGIC DATA
PIN ASSIGNMENT
Q12
1
16
VDD
Q6
2
15
Q11
Q5
3
14
Q10
Q7
4
13
Q8
Q4
5
12
Q9
Q3
6
11
R
Q2
7
10
C
VSS
8
9
Q1
MC14040B
151
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SWITCHING CHARACTERISTICS (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
TTLH, TTHL = (1.5 ns/pF) CL + 25 ns
TTLH, TTHL = (0.75 ns/pF) CL + 12.5 ns
TTLH, TTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time
Clock to Q1
tPHL, tPLH = (1.7 ns/pF) CL + 315 ns
tPHL, tPLH = (0.66 ns/pF) CL + 137 ns
tPHL, tPLH = (0.5 ns/pF) CL + 95 ns
tPLH,
tPHL
Clock to Q12
tPHL, tPLH = (1.7 ns/pF) CL + 2415 ns
tPHL, tPLH = (0.66 ns/pF) CL + 867 ns
tPHL, tPLH = (0.5 ns/pF) CL + 475 ns
VDD
Vdc
Min
Typ #
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
5.0
10
15
—
—
—
260
115
80
520
230
160
5.0
10
15
—
—
—
1625
720
500
3250
1440
1000
Unit
ns
ns
ns
Propagation Delay Time
Reset to Qn
tPHL = (1.7 ns/pF) CL + 485 ns
tPHL = (0.86 ns/pF) CL + 182 ns
tPHL = (0.5 ns/pF) CL + 145 ns
tPHL
Clock Pulse Width
Clock Pulse Frequency
Clock Rise and Fall Time
ns
5.0
10
15
—
—
—
370
155
115
740
310
230
tWH
5.0
10
15
385
150
115
140
55
38
—
—
—
ns
fcl
5.0
10
15
—
—
—
2.1
7.0
10.0
1.5
3.5
4.5
MHz
tTLH, tTHL
5.0
10
15
ns
No Limit
Reset Pulse Width
tWH
5.0
10
15
960
360
270
320
120
80
—
—
—
ns
Reset Removal Time
trem
5.0
10
15
130
50
30
65
25
15
—
—
—
ns
* The formulas given are for the typical characteristics only at 25_C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
VDD
VDD
500 µF
0.01 µF
CERAMIC
ID
PULSE
GENERATOR
C Q1
Q2
Q
R n
PULSE
GENERATOR
CL
CL
CL
CL
CLOCK
20 ns
90%
50%
10%
20 ns
20 ns
20 ns
VDD
VSS
50% DUTY CYCLE
Figure 1. Power Dissipation Test Circuit
and Waveform
MC14040B
152
CL
CL
VSS
VSS
CLOCK
C Q1
Q2
Q
R n
tPLH
Q
90%
50%
10%
tWH
tPHL
90%
50%
10%
tTLH tTHL
Figure 2. Switching Time Test Circuit
and Waveforms
MOTOROLA CMOS LOGIC DATA
1
2
4
8
16
32
64
128
256
512
1024
2048
4096
CLOCK
RESET
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
Q10
Q11
Q12
Figure 3. Timing Diagram
APPLICATIONS INFORMATION
TIME–BASE GENERATOR
A 60 Hz sinewave obtained through a 1.0 Megohm resistor
connected directly to a standard 120 Vac power line is
applied to the clock input of the MC14040B. By selecting
outputs Q5, Q10, Q11, and Q12 division by 3600 is accomplished. The MC14012B decodes the counter outputs,
produces a single output pulse, and resets the binary counter. The resulting output frequency is 1.0 pulse/minute.
VDD
1.0 M
MC14040B
Q5
C
≥ 20 pF
Q10
120 Vac
60 Hz
Q11
R
1/2
MC14012B
1/2
MC14012B
1.0 PULSE/MINUTE
OUTPUT
Q12
VSS
MOTOROLA CMOS LOGIC DATA
MC14040B
153
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
9
1
8
B
F
C
L
S
–T–
K
H
G
D
J
16 PL
0.25 (0.010)
MC14040B
154
SEATING
PLANE
M
T A
M
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MOTOROLA CMOS LOGIC DATA
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
–T–
SEATING
PLANE
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
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MOTOROLA CMOS LOGIC DATA
◊
*MC14040B/D*
MC14040B
MC14040B/D
155