OVERVIEW MCP (microchannel plate) is a two-dimensional sensor that detects electrons, ions, vacuum UV rays, X-rays and gamma rays in a vacuum, and amplifies the detected signals. Circular and rectangular MCPs are available in various dimensions, including easy-touse MCP assemblies with pre-mounted electrode leads and supports. These MCPs are widely used in many types of analytical equipment such as for "mass spectroscopy", "semiconductor inspection" and "surface analysis". The MCP assemblies are available with three different readout devices to meet application needs. The devices are of: (1) single anode (electrical output signal measurement within effective area), (2) multianode (electrical output signal measurement corresponding to signal input positions), and (3) phosphor screen (optical imaging of output signal). Select the output device that best matches your application. From one to three stage MCPs can be selected for the assembly to obtain necessary gain, allowing uses in the analog mode (the output signal is measured as a continuous electrical current) or the counting mode (the low level signal can be measured by a binary processing). OPERATING PRINCIPLE As shown in the figure on the lower right, a potential gradient is established along the channel when the voltage VD is applied between the input and output sides of the MCP. Multiple secondary electrons are emitted when an electron enters a channel from the input side and strikes its inner wall. These secondary electrons are accelerated by the potential gradient to draw parabolic trajectories that are determined by their initial velocities. They then strike the opposite wall in the channel causing further secondary electrons to be emitted. The electrons in this way travel towards the output end while striking the inner wall of the channel repeatedly. As a result, a large number of exponentially increased electrons are extracted from the output side. ■Thickness The thickness of an MCP is nearly equal to the channel length. The ratio of the channel length (L) to the channel diameter (d) is referred to as α (α=L/d), and this α and the secondary emission factor inherent to the channel wall material determine the gain of the MCP. Standard MCPs are fabricated so that α is 40 to 60. The MCP thickness is therefore determined by the required channel diameter and the design value of this α. Schematic structure of MCP CHANNEL DIAMETER: d LENGTH: L ■Open Area Ratio: OAR The OAR indicates the ratio of the channel open area to the entire effective area of and MCP. ■Bias angle The bias angle is an angle formed by the channel axis and the axis perpendicular to the plate surface. This angle is chosen by considering the detection efficiency and spatial resolution as well as the prevention of input signals from passing through the channels without colliding with the channel walls. The optimum value is usually from 5° to 15°. CHANNEL WALL INCIDENT ELECTRON INPUT SIDE ELECTRODE OUTPUT SIDE ELECTRODE OUTPUT ELECTRONS STRIP CURRENT VD TMCPC0002EF 1 LARGE OAR: FUNNEL TYPE (OPTION) The open area ratio (OAR) of standard MCPs is normally set to 60 %, but we also provide "funnel type" MCPs whose open area ratio is improved up to 90 % in order to guide more signals into each channel. Please contact us if you are interested in funnel type MCPs. Standard OAR 60 % Ion Chan Funnel OAR 90 % Ion nel Chan nel 12 µm 12 µm Cross-sectional view Cross-sectional view ▲Shape of channel entrance (SEM image) ▲Shape of channel entrance (SEM image) CHARACTERISTICS ■MCP gain characteristics ■Pulse height distribution (PHD) TMCPB0005EB TMCPB0034ED 108 NUMBER OF COUNTS (S-1) 3 STAGE MCP 107 GAIN 106 2 STAGE MCP 105 2 STAGE MCP 3 STAGE MCP 104 PULSE HEIGHT (CHANNEL NUMBER) 1 STAGE MCP 103 0 1.0 2.0 3.0 SUPPLY VOLTAGE (kV) ■MCP saturation characteristics (output linearity) Analog mode Counting mode TMCPB0072EA TMCPB0042EE 150 108 NUMBER OF COUNTS (s-1) RELATIVE GAIN (%) F6584 WIDE DYNAMIC RANGE MCP RESISTANCE : 7.5 MΩ EFFECTIVE AREA: 20 mm 100 50 STANDARD MCP RESISTANCE : 200 MΩ EFFECTIVE AREA: 20 mm 0 10-8 STANDARD MCP RESISTANCE: 400 MΩ / 2 STAGE MCP GAIN : 5 × 106 EFFECTIVE AREA: 20 mm 107 106 105 F6584 WIDE DYNAMIC RANGE MCP RESISTANCE: 22.4 MΩ / 2 STAGE MCP GAIN : 8 × 106 EFFECTIVE AREA: 20 mm 104 10-7 10-6 10-5 OUTPUT CURRENT (A) 10-4 10-8 10-7 10-6 10-5 10-4 OUTPUT CURRENT (A) 2 MCP SPECIFICATIONS AND DIMENSIONAL OUTLINES Circular MCP MCPF0006 INPUT SIDE D C A θ B INDICATOR 1 OUTPUT SIDE TMCPA0056EA F1552 F1217 F1551 F1094 Type F1208-01 F1942-04 F2395-04 Unit Parameter -015 -06 -011 -074 -015 -011 -074 -015 -011 -074 -015 -011 Outer size A 17.9 32.8 49.9 86.7 113.9 mm 24.8 38.4 Electrode area B 17 31.8 49 84.7 112 mm 23.9 36.5 Effective area C 14.5 27 42 77 105 mm 20 32 Thickness D mm 0.48 0.48 0.3 0.48 0.3 0.48 1 0.48 0.2 0.48 0.3 Channel diameter µm 12 12 4 12 6 12 6 12 6 25 12 Channel pitch µm 15 15 5 15 7.5 15 7.5 15 7.5 31 15 Bias angle θ 8 12 8 8 8 8 12 12 8 12 degrees Open area ratio 55 60 60 % Electrode material — Inconel Gain (Min.) 3 104 — 5×103 104 5×103 104 5×103 104 Resistance 3 100 to 700 10 to 100 20 to 100 20 to 200 50 to 500 10 to 50 10 to 100 15 to 200 6.7 to 33.3 6.7 to 66 20 to 100 10 to 200 4 to 20 10 to 100 5 to 50 MΩ Dark current (Max.) 3 0.5 pA·cm-2 7 % of strip current 2 Maximum linear output 3 — 4 kV Supply voltage 1.0 Operating ambient °C -50 to +70 temperature 4 NOTE: 1Indicates MCP input side. Shape varies depending on product type. 2Strip current is the current that flows through channel walls when a voltage is applied between MCP IN and OUT. It is given by dividing the applied voltage by the MCP resistance. 3Supply voltage: 1.0 kV, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C 4Vacuum: 1.3×10-4 Pa 5The F1551-01, F1094-01, F1552-01, F1208-01 and F1217-01 are also available with a center through-hole (6 mm diameter). 3 Rectangular MCP C’ A’ θ B’ MCPF0011 C D INDICATOR 1 B A INPUT SIDE Type Parameter Outer size A×A' Electrode size B×B' Effective area C×C' Thickness D Channel diameter Channel pitch Bias angle θ Open area ratio Electrode material Gain (Min.) 3 Resistance 3 Dark current (Max.) 3 Maximum linear output 3 Supply voltage 4 Operating ambient temperature 4 OUTPUT SIDE TMCPA0057EA F2370-01 F4772-01 F2806-01 F1943-02 F2805-03 F2396-04 Unit 15.9×9.4 15×8.5 13×6.5 61.9×13.9 61×13 55×8 0.48 12 15 49.9×39.9 49×39 45×35 87.9×37.9 87×37 81×31 0.60 15 19 59.9×59.9 58×58 53×53 0.80 20 25 96.9×78.9 95.6×77.3 90×72 1.00 25 31 20 to 120 10 to 50 0.5 7 % of strip current 2 1.0 mm mm mm mm µm µm degrees % — — MΩ pA·cm-2 — kV -50 to +70 °C 8 60 Inconel 104 100 to 500 20 to 200 4 MCP ASSEMBLY SELECTION GUIDE BY PURPOSE Target object Electron +/- Ion VUV X-ray TOF Signal Amount Measurement (Time of Flight) Detection Measures the difference in the arrival time Measures the signal amount MCPF0081 MCPF0088 Demountable SIGNAL READOUT LEAD Up to 3 MCPs can be added according to level of X-rays or electrons to be detected. The screw mount allows easy replacement of the MCP and readout device. MCP FLANGE Standard Center hole Circular and rectangular types are provided. The circular type also includes an even smaller device. Fast response ION, X-RAY, etc. OUTPUT WAVEFORM SAMPLE This type of MCP assembly has a throughhole in the center that allows ions, X-rays and so on to pass through it to irradiate a sample. The signal from the sample can then be detected effectively. Page 5 Using an anode specially designed for the high-speed signal readout, this type of MCP assembly eliminates signal distortions called "ringing" and ensures an accurate signal output. Circular Rectangular Compact Standard Fast time response Anode ground Floating Compact Compact and 4 µm MCP P9 P.10 P.11 P.12 P.12 P.13 P.13 P.14 P.14 MCP Readout device 1: Single anode 2: Multianode 3: Phosphor screen Position Detection Image Readout Captures a signal distribution as an image Measures the signal amount and position distribution Thin MCPF0077 Nondemountable MCPF0082 Multianode Phosphor screen output ION, X-RAY, etc. MCP PHOSPHOR SCREEN MCP (15.1) MULTIANODE ION or ELECTRON (5.6) ELECTRON TMCPC0104EA SIGNAL Its thin and flat shape permits installation in minimum spaces as add on parts. Maintenance and servicing of this MCP assembly are quite easy since there are only 2 wiring connections. Fast response P.15 This type is compact, light in weight and economical. Unlike the demountable type, however, the assembled MCP cannot be replaced. NonNondemountable demountable P.8 P.8 Features •Wide room for choice of readout patterns in one dimension (1×n) or two dimensions (a×n) •Simultaneous counting (parallel counting) •High counting efficiency •Anode pitch: 3 mm or more The phosphor screen coated on the glass plate converts the output charge distribution from the MCP into a visible image. A resolution of 40 µm to 50 µm can be obtained with a one-stage MCP, and that of 80 µm to 100 µm can be done with a two-stage MCP. Select the desired phosphor screen among three types of P43, P46 and P47. (See page 9 for detailed specifications.) Circular Rectangular Circular Rectangular Vacuum flange P.9 P.10 P.9 P.10 P.16 6 MCP ASSEMBLY SELECTION GUIDE BY APPLICATIONS Major applications of MCP assemblies include "mass spectroscopy", "semiconductor inspection" and "surface analysis". The table below gives you a quick reference for selecting the best MCP assembly in these major application fields. This table shows only typical applications. Feel free to contact our sales office in your area if you do not find your specific application here. : Best suited Demountable, circular MCP assembly (single anode) Total amount measurement, TOF Demountable, rectangular MCP assembly (single anode) Non-demountable, circular MCP assembly (single anode) F2223-21SH F4294-09 F4655/-14 F4655-10/-11 F4655-13 F9890-31/-32, F9892-31/-32 F9890-13/-14, F9892-13/-14 Image readout Position detection F12334-11, F12395-11, F12396-11 7 Demountable, circular MCP assembly (multi-anode) Demountable, rectangular MCP assembly (multi-anode) Non-demountable, circular MCP assembly (multi-anode) Demountable, circular MCP assembly (phosphor screen) Demountable, rectangular MCP assembly (phosphor screen) F2225-21PGF F6959 Positron detector Soft X-ray microscope (SXM) Tranmission electron microscope (TEM) Field ion microscope (FIM) Low energy electron diffraction (LEED) Reflection medium energy electron diffraction (RMEED) Soft X-ray spectroscopy (SXS) Vacuum UV spectroscopy (VUVS) Rutherford backscattering spectroscopy (RBS) Electron spectroscopy for chemical analysis (ESCA) Ion scattering spectroscopy (ISS) Surface analysis Auger electron spectroscopy (AES) FIB system Mask aligner Electron or ion beam lithography Electron beam measuring system (EBMS) Scanning ion microscope (SIM) Scanning electron microscope (SEM) Secondary ion mass spectroscopy (SIMS) Inductive-coupled plasma mass spectroscopy (ICP-MS) Gas or liquidchromatographic mass spectroscopy (GC/LC-MS) Double focusing mass spectroscopy (Sector-MS) MCP assembly Quadrupole mass spectroscopy (Q-MS) Detection method Application Time-of-flight mass spectroscopy (TOF-MS) (LC-MS) Mass spectroscopy Semiconductor inspection Time-of-flight mass spectroscopy (TOF-MS) (MALDI) Field : Applicable MCP ASSEMBLY SPECIFICATIONS AND DIMENSIONAL OUTLINES (Unit: mm) 1 Type No. F1551 F1094 F1552 F1208 F1217 Channel diameter (µm) 12 1 Number of MCPs Gain (Min.) Puls height resolution (Max.) (%) 1 to 3 1 stage MCP : 1 × 104 2 stage MCP : 1 × 106 3 stage MCP : 1 × 107 2 stage MCP: 120 3 stage MCP: 80 1 2 2 Dark count (Max.) (s-1·cm-2) MCP supply voltage (kV) MCP-OUT to anode supply voltage (kV) 3 (2 or 3 stage MCP) 1 stage MCP: 1.0 2 stage MCP: 2.0 3 stage MCP: 3.0 Single anode: 0.5 Multianode: 0.5 NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C 2Vacuum: 1.3×10-4 Pa Circular (Non-demountable) MCP B EFFECTIVE AREA A ANODE LEAD 8 × 0.5 SUS Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa. ° 30 30° 1 2-EYELET 2 EYELET 3 D 1 1 EYELET 3 1MCP-IN LEAD (4) 2MCP-OUT LEAD (2) 3ANODE LEAD (2) 2 C EYELET 30 MIN. 1 TMCPA0027EF Anode type Number of MCPs Without readout device Single anode 1 to 3 Symbol Assembly outer size B Effective area Multianode Phosphor output type are not available. C D F1551 F1094 F1552 F1208 F1217 Unit Description A Assembly No. of height MCPs 27 34 42 49 62 mm 14.5 20 27 32 42 mm 1 4.5 2 5.7 3 5.7 Lead pin circle 22.5 29.5 37.5 mm 44 56 mm * Multianode types have different dimensions. Types with no anode are also available. TYPE NUMBER DESIGNATION FOR NON-DEMOUNTABLE TYPE The following ordering information applies only to circular MCP assemblies (non-demountable type). When ordering other MCPs (non-assembled MCPs) and MCP assemblies, use their type numbers as listed. * When the customer prepares a read-out device, we supply MCP assemblies without readout devices. F 1551-2 1S Readout device No suffix: Without readout device * S: Single anode Channel diameter Type No. : Assembly type 1: 12 µm Number of MCPs 1: 1-stage 2: 2-stage 3: 3-stage 8 MCP ASSEMBLY SPECIFICATIONS AND DIMENSIONAL OUTLINES (Unit: mm) 1 Channel diameter (µm) Type No. F2221 F2222 F2223 F2224 F2225 F2226 12 1 Number of MCPs Gain (Min.) Puls height resolution (Max.) (%) Refer to "Anode Type" below 1 stage MCP : 1 × 104 2 stage MCP : 1 × 106 3 stage MCP : 1 × 107 2 stage MCP: 120 3 stage MCP: 80 25 1 2 2 Dark count (Max.) (s-1·cm-2) MCP supply voltage (kV) MCP-OUT to anode supply voltage (kV) 3 (2 or 3 stage MCP) 1 stage MCP: 1.0 2 stage MCP: 2.0 3 stage MCP: 3.0 Single anode: 0.5 Multianode: 0.5 Phosphor screen : 3.0 to 4.0 NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C 2Vacuum: 1.3×10-4 Pa Circular (Demountable) Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa. Anode type ELECTRODE LEAD 45° NUT M2 MCP-OUT LEAD Single anode G INSULATOR CHANNEL BIAS DIRECTION D C B A H 1.0 DEGASSING SPACE READ-OUT DEVICE MCP Phosphor screen Symbol 20 F2221 F2222 F2223 F2224 F2225 F2226 Unit Assembly outer size 54 61 69 75 86 123 mm B Mounting screw hole pitch 46 53 61 67 78 115 mm C Insulator outer size 34 41 49 55 66 103 mm D Effective area 14.5 20 27 32 42 77 mm E Effective area of readout device 10 17 24 30 40 75 mm F Maximum height 15 15 15 15 15 17 mm Distance from 4 × 3.5 H ANODE OR PHOSHOR SCREEN LEAD 1 to 2 Description A G 4 × 4.5 1 to 3 Multianode 3 SUBSTRATE E 3 MCP-IN LEAD Number of MCPs Without readout device F No. 1 bottom of substrate 10.9 12.9 2 11.9 14.4 mm to insulator surface MCPs 3 11.9 15.9 Distance from MCP No. 1 2.8 3.8 input surface to 3.3 4.3 of of 2 insulator surface 2.9 MCPs 3 Shape may differ depending on product type number. mm 4.8 TMCPA0026EH PHOSPHOR SCREEN Select the desired phosphor screen by taking into account the decay time according to the readout method and application, and the emission wavelength according to the readout device sensitivity. Phosphor screen type P43 P46 P47 Peak emission wavelength (nm) 545 510 430 Emission color Yellowish green Yellowish green Purplish blue NOTE: 1Supply voltage: 6 kV. Value relative to P43 which is specified as 1. ■Spectral emission characteristics TMCPB0090EA RELATIVE INTENSITY (%) P43 60 40 P46 20 450 500 550 600 WAVELENGTH (nm) 9 Standard type Short decay Very short decay TMCPB0091EA P43DC3 101 P46 100 P47 10-1 1 ms 100 ns 1 ms 400 1 ms 0.2 µs to 0.4 µs 2 0.11 µs EYE RESPONSE 80 0 350 Remarks ■Decay characteristics 102 P47 10 % decay time 2Varies depending on the input pulse width. RELATIVE INTENSITY (%) 100 Relative energy efficiency 1 1 0.3 0.3 650 700 100 ns INPUT LIGHT PULSE WIDTH PHOSPHOR SCREEN PEAK CURRENT 8 nA/cm2 10-2 10-8 10-7 10-6 10-5 10-4 10-3 DECAY TIME (s) 10-2 3 Decay characteristics after removal of continuous light input 1 Type No. F2813 Gain (Min.) Puls height resolution (Max.) (%) Refer to "Anode type" below 1 stage MCP : 1 × 104 2 stage MCP : 1 × 106 3 stage MCP : 1 × 107 2 stage MCP: 120 3 stage MCP: 80 15 F2814 20 F3490 12 1 Number of MCPs Channel diameter (µm) 1 2 2 Dark count (Max.) (s-1·cm-2) MCP supply voltage (kV) MCP-OUT to anode Supply voltage (kV) 3 (2 or 3 stage MCP) 1 stage MCP: 1.0 2 stage MCP: 2.0 3 stage MCP: 3.0 Single anode: 0.5 Multianode: 0.5 Phosphor screen : 3.0 to 4.0 NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C 2Vacuum: 1.3×10-4 Pa Rectangular (Demountable) Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa. MCP-OUT LEAD 3 CHANNEL BIAS DIRECTION Anode type Number of MCPs Without readout device Single anode 20 MCP-IN LEAD 1 to 3 Multianode Phosphor screen ANODE OR PHOSPHOR SCREEN LEAD E’ A’ B’ D’ Symbol 4 × 3.5 D C B A G DEGASSING SPACE E A×A' Assembly outer size 128×54 96×76 F3490 Unit 78×29.5 mm B×B' Mounting screw hole pitch 120×46 86×68 C×A' Insulator outer size 104×54 76×76 D×D' Effective area 81×31 53×53 55×8 mm E×E' Effective area of readout device 80×30 50×50 52×7 mm 11.9 mm F G SCREW M2 INSULATOR bottom of substrate No. 1 10.9 10.9 of 2 11.9 11.9 to insulator surface MCPs 3 11.9 12.9 Distance from MCP input surface to insulator surface 72×18 mm 66×29.5 mm No. 1 2.7 2.5 3.8 of 2 3.1 2.7 3.3 MCPs 3 2.5 2.9 2.9 mm Shape may differ depending on product type number. 3 SUBSTRATE F2814 F MCP F2813 Distance from ELECTRODE LEAD 1 to 2 Description READ-OUT DEVICE TMCPA0029EG TYPE NUMBER DESIGNATION FOR DEMOUNTABLE TYPE The following ordering information applies only to circular/rectangular MCP assemblies (demountable type). When ordering other MCPs (non-assembled MCPs) and MCP assemblies, use their type numbers as listed. * When the customer prepares a read-out device, we supply MCP assemblies without readout devices. If using a phosphor screen as the readout device, there is a need to change some points, so please consult us in advance. F 2224-2 1P Readout device No suffix: Without readout device * S: Single anode M: Multianode P: Phosphor screen selectable from among P43, P46 and P47 see page 9 ( ) Channel diameter Type No. : Assembly type 1: 12 µm 2: 15 µm (Only rectangular type) 3: 20 µm (Only rectangular type) 4: 25 µm (Only circular type) Number of MCPs 1: 1-stage 2: 2-stage 3: 3-stage 10 MCP ASSEMBLY SPECIFICATIONS AND DIMENSIONAL OUTLINES (Unit: mm) 1 Type No. Channel diameter (µm) Number of MCPs Gain (Min.) Puls height resolution (Max.) (%) 12 2 5 × 107 50 F4655 F4655-14 1 1 2 2 Dark count (Max.) (s-1·cm-2) MCP supply voltage (kV) MCP-OUT to anode supply voltage (kV) 3 2.5 0.5 NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C 2Vacuum: 1.3×10-4 Pa F4655 Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa. 8.5 3 3 × 2.2 P.C.D.* 25.6 MCP-IN LEAD 0.5t SUS 7.5 ° 0° 6 60 * P.C.D. (Pitch Circle Diameter) 14.5 EFFECTIVE AREA 18 12 MCP (2-STAGE) 2 SUBSTRATE ANODE 3.5 MCP-OUT LEAD 3.5 ANODE LEAD PROTECTION ELECTRODE FOR CHARGING-UP (SAME POTENTIAL AS SUBSTRATE) TMCPA0001EJ F4655-14 Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa. 3 3 × 2.2 P.C.D.* 25.6 MCP-IN LEAD (8) 0.5t SUS 7.5 (4.5) 6 ° 12 0° 60 * P.C.D. (Pitch Circle Diameter) 14.5 EFFECTIVE AREA 18 FOR FIXING (M1.6) 2 MCP (2-STAGE) SUBSTRATE 3.5 3 × M1.6 LENGTH 12 P.C.D.* 21.5 11 ANODE LEAD 3.5 ANODE MCP-OUT LEAD PROTECTION ELECTRODE FOR CHARGING-UP (SAME POTENTIAL AS SUBSTRATE) TMCPA0086EB 1 Type No. Channel diameter (µm) Number of MCPs 12 2 F2223-21SH F4294-09 MCP center dead area (mm) 8 12 Gain (Min.) Puls height resolution (Max.) (%) 1 × 106 — 1 1 2 2 Dark count (Max.) (s-1·cm-2) MCP supply voltage (kV) MCP-OUT to anode supply voltage (kV) 3 2.0 0.5 NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C 2Vacuum: 1.3×10-4 Pa F2223-21SH * P.C.D. (Pitch Circle Diameter) 8.6 MESH MCP (2-STAGE) 41 10 27 EFFECTIVE AREA 8 DEAD SPACE 4 × 2.6 P.C.D.* 50.8 56.5 45° MCP CENTER HOLE 6 CENTER PIPE (OUTER 5) CENTER PIPE (INNER 4) Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa. 4× 1 6 1 234 3 SUBSTRATE 1.6 1MESH LEAD 2MCP-IN LEAD 3MCP-OUT LEAD 4ANODE LEAD TMCPA0002EH F4294-09 MCP-IN LEAD 4 × 3.5 P.C.D.* 61 17 (8.5) 14.6 5.3 3 ANODE SUBSTRATE MCP (2-STAGE) 69 49 27 EFFECTIVE AREA 12 DEAD SPACE 45 ° 20 3 MCP-OUT LEAD MCP CENTER HOLE 10 CENTER PIPE (OUTER 8) CENTER PIPE (INNER 6) * P.C.D. (Pitch Circle Diameter) INSULATOR 9.5 SMA CONNECTOR TMCPA0042EF 12 MCP ASSEMBLY SPECIFICATIONS AND DIMENSIONAL OUTLINES (Unit: mm) 1 Type No. F9890-13 F9890-14 F9890-31 F9890-32 F9892-13 F9892-14 F9892-31 F9892-32 Channel diameter (µm) 12 6 12 6 12 6 12 6 Number of MCPs Pulse width (FWHM) (ps) Gain (Min.) Puls height resolution (Max.) (%) 1 × 106 150 1 1 2 2 Dark count (Max.) (s-1·cm-2) MCP supply voltage (kV) MCP-OUT to anode supply voltage (kV) 3 2.0 0.5 900 450 2 1200 700 NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C 2Vacuum: 1.3×10-4 Pa F9890-13/-14, F9892-13/-14 WIRING EXAMPLE 1.65 4 × 4.5 ° 45 MCP-IN LEAD ASSEMBLY MCP (2-STAGE) 150 pF × 4 (3 kV) SUBSTRATE AMPLIFIER SIGNAL (BNC) F G 24 MCP-OUT LEAD B C A EFFECTIVE AREA D 21.3 E 3 IN SIGNAL BNC1 -2 kV Max. Power supply capable of floating operation -500 V Max. (500 V operation is recommended) IN 1SMA connector type is also available. A B C D E F G 50 Ω INPUT OUT When divider circuit is used F9890-13 F9890-14 F9892-13 F9892-14 42 27 92 81 75 63 11.6 12 11.6 12 9.6 10 9.6 10 84 72 64 52 OUT 2 MΩ 0.5 MΩ (3 W) (1 W) -2.5 kV Max. TMCPA0075EC F9890-31/-32, F9892-31/-32 44.5 35 WIRING EXAMPLE 4 × 4.5 F ASSEMBLY 45° MCP-IN LEAD MCP-OUT LEAD SIGNAL (SMA) 50 Ω INPUT ANODE OUT H I G IN SIGNAL SMA ANODE LEAD 13 AMPLIFIER 140 pF(40 kV) 1 MΩ F9890-31 F9890-32 F9892-31 F9892-32 A 42 27 B 92 81 C 75 63 D 20.2 19.9 20.2 19.9 E 18.2 17.9 18.2 17.9 MCP-IN LEAD 13.5 13.9 13.5 13.9 F MCP-OUT LEAD 15.2 15.2 ANODE LEAD 19.4 19.4 G 40 35 H 84 72 I 64 52 SUBSTRATE MCP (2-STAGE) 150 pF × 4 (15 kV) MESH B C A EFFECTIVE AREA 1.65 D E 3 500 V (500 V operation is recommended) 2 kV Max. Max. Power supply Power supply capable of capable of floating floating operation operation -10 kV to +10 kV IN When divider circuit is used ANODE OUT 2 MΩ 0.5 MΩ (3 W) (1 W) 2.5 kV Power supply capable Max. of floating operation -10 kV to +10 kV TMCPA0082ED 1 Type No. Channel diameter (µm) F4655-10 F4655-11 F4655-13 Number of MCPs Pulse width (FWHM) (ps) 2 600 12 4 Gain (Min.) Puls height resolution (Max.) (%) 5 × 107 1 × 106 1 1 2 Dark count (Max.) (s-1·cm-2) MCP supply voltage (kV) 50 3 2.5 120 5 2.0 2 MCP-OUT to anode supply voltage (kV) 0.5 NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C 2Vacuum: 1.3×10-4 Pa F4655-10/-13 * P.C.D. (Pitch Circle Diameter) (31.9) 18.1 3 10.3 2 × 2.2 P.C.D.* 25.6 MCP (2-STAGE) SUBSTRATE 3 0.5 ANODE 30° MCP-OUT LEAD BNC-R A 38 14.5 EFFECTIVE AREA 3.5 18 30° 6 MCP-IN LEAD 3 × 3.5 P.C.D.* 32 PROTECTION ELECTRODE FOR CHARGING-UP (SAME POTENTIAL AS SUBSTRATE) A F4655-10 F4655-13 2 3 TMCPA0021EG F4655-11 MCP-IN LEAD 7.5 (35.6) BNC-R-S 70 MCP (2-STAGE) 33 14.5 EFFECTIVE AREA 12 0° MCP-OUT LEAD ANODE 2-SHV-R 40 ° VACUUM FLANGE (ICF 70) TMCPA0085EB 14 MCP ASSEMBLY SPECIFICATIONS AND DIMENSIONAL OUTLINES (Unit: mm) 1 Type No. F12334-11 F12395-11 F12396-11 Channel diameter (µm) Number of MCPs Pulse width (FWHM) (ns) Gain (Min.) Puls height resolution (Max.) (%) 12 2 1.5 1 × 106 — 1 1 2 2 Dark count (Max.) (s-1·cm-2) MCP supply voltage (kV) MCP-OUT to anode supply voltage (kV) 33 —3 0.5 NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C 2Vacuum: 1.3×10-4 Pa 3A maximum of -2.1 kV is supplied to the HV electrode, depending on the built-in bleeder resistors. F12334-11, F12395-11, F12396-11 D C (15.1) B 4 × 3.5 EFFECTIVE AREA A (5.6) SIGNAL (SMA) 2 2 × M3 F R1 C1 G E MCP (2-STAGE) C1 R2 C1 SUBSTRATE R2 HV WIRING EXAMPLE A B C D E F G F12334-11 20 36 46 54 30 36 38 F12395-11 27 40 51 61 30 40 41 F12396-11 42 51 62 72 40 51 52 ASSEMBLY MCP (2-STAGE) 3 × C1 ANODE HV R1 -2.1 kV Max. R2 SUBSTRATE SIGNAL (SMA) 50 Ω INPUT R1 : 20 MΩ R2 : 1 MΩ C1 : 150 pF (3 kV) TMCPA0084EC 15 1 Type No. F2225-21PGF F6959 Channel diameter (µm) Number of MCPs Gain (Min.) Puls height resolution (Max.) (%) 12 2 1 × 106 — 1 1 2 Dark count (Max.) (s-1·cm-2) MCP supply voltage (kV) 3 2.0 2 MCP-OUT to anode supply voltage (kV) 4.0 3.0 NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C 2Vacuum: 1.3×10-4 Pa F2225-21PGF Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa. See page 9 regarding the phosphor screen. (60) (14) 20 19 (21) 10.9 MCP-IN TERMINAL (SHV) (46) 42 66 150 MCP-OUT TERMINAL (SHV) 40 EFFECTIVE AREA MCP (2-STAGE) VIEWING PORT (ICF114) (21) PHOSPHOR SCREEN TERMINAL (SHV) 114 VACUUM FLANGE (ICF152) TMCPA0081ED F6959 * P.C.D. (Pitch Circle Diameter) See page 9 regarding the phosphor screen. (7) (30) MCP-OUT TERMINAL (SHV) (36.1) 19.8 9.3 3-SHV VACUUM FLANGE (ICF152) O-RING 28 55 102 150 MCP-OUT TERMINAL (SHV) 2.8 FOP 28 EFFECTIVE AREA MCP (2-STAGE) PHOSPHOR SCREEN TERMINAL (SHV) (30) 4 × M3 DEPTH 5 P.C.D.* 90 TMCPA0038EF 16 MCP ASSEMBLY WIRING EXAMPLES Signal detection Image detection ●Positive ion detection (Anode ground) ASSEMBLY ●Positive ion detection (MCP-OUT: GND) PHOSPHOR SCREEN ASSEMBLY SUBSTRATE MCP (2-STAGE) MCP (2-STAGE) SUBSTRATE AMPLIFIER ANODE IN OUT IN OUT PHOS -0.5 kV Max. -2 kV Max. -2.0 kV Max. 4 kV Max. Power supply capable of floating operation When divider circuit is used 2 MΩ 0.5 MΩ (3 W) (1 W) ●Electron or positive ion detection (MCP-IN: GND) ASSEMBLY MCP (2-STAGE) -2.5 kV Max. ●Electron or negative ion detection (Anode floating (MCP-IN: GND)) MCP (2-STAGE) ASSEMBLY IN SUBSTRATE OUT COUPLING CIRCUIT PHOS 4 kV Max. AMPLIFIER 150 pF/3 kV SIGNAL OUTPUT ANODE PHOSPHOR SCREEN SUBSTRATE 2 kV Max. Power supply capable of floating operation 2 MΩ 4 MΩ (3 W) (5 W) 1 MΩ IN ANODE OUT When divider circuit is used +0.5 kV Max. +2.0 kV Power supply capable Max. of floating operation When divider circuit is used 2 MΩ 0.5 MΩ (3 W) (1 W) 6 kV Max. ●Positive ion detection (Phosphor screen: GND) ASSEMBLY MCP (2-STAGE) +2.5 kV Max. ●Positive ion detection (Anode floating (MCP-OUT: GND)) MCP (2-STAGE) ASSEMBLY IN SUBSTRATE ANODE 1 MΩ IN -2.0 kV Max. OUT OUT PHOS -2 kV Max. COUPLING CIRCUIT AMPLIFIER 150 pF/1 kV PHOSPHOR SCREEN SUBSTRATE Power supply capable of floating operation SIGNAL OUTPUT ANODE When divider circuit is used 0.5 kV Max. -4 kV Max. 2 MΩ 4 MΩ (3 W) (5 W) -6 kV Max. TMCPC0005EH TMCPC0007EE Using multiple high-voltage power supplies has an advantage that the MCP gain can be independently adjusted. Using the divider circuit with a single high-voltage power supply offers low cost, but there is a disadvantage that the MCP gain varies as the power supply voltage varies. 17 CUSTOMIZATION ●We also manufacture custom-designed MCPs and MCP assemblies not included in the standard product lineup. Please consult us with your specific requirements for outside dimensions, effective dimensions, thickness, etc. ●Feel free to consult us on MCPs with a special aperture or through-hole (for use with reflection electron microscopes), CsI deposition (for higher quantum efficiency in the VUV to X-ray range), aluminum film coating (as a barrier to ions and radiation), MgO coating (for higher gain), electrodes made of Au (gold) and special-purpose MCPs. ●For multianodes, consult us on the desired anode pattern. ●Assemblies with a phosphor-coated fiber optic plate (FOP) are available to enable fiber-coupling to solid state imaging devices (CCD, MOS linear image sensors), etc. ●Assemblies with an MCP, readout device and lead terminals mounted on a special vacuum flange or printed circuit board are also available. ●Please consult us regarding funnel type MCPs with an OAR of 90 %. 18 HOW TO HANDLE 1. STORAGE The MCP and the MCP assembly are shipped in packages that are evacuated to a vacuum or filled with dry nitrogen. These packages are intended for use during shipping and not suited for long-term storage. When storing the MCP and MCP assemblies, take them out of their packages and keep them in a clean case under either a) or b) of the following conditions. a) At vacuum pressure below 13 Pa and no oil diffusion. b) Under gentle constant flow of dry nitrogen passed through a 0.45 µm or smaller filter (humidity: 20 % or less). 2. HANDLING Avoid touching the MCP and the MCP assembly with bare hand. If handled with bare hand, these might be contaminated by oil and salt from it causing an increase in dark current, a loss of gain and an electrical discharge. When handling them, always wear clean vinyl or polyethylene gloves. Even when you wear gloves, never touch the effective area of the MCP and the MCP assembly. 3. ENVIRONMENTS The MCP surface is processed to be electrically active and the components used for the assembly are also processed for high vacuum use. So as much as possible, handle them in an environment conforming to clean-room (dust-proof room) specifications where oily vapor, moisture and dust are minimized. If dusts or debris get on the MCP surface, blow them off with dry clean air or nitrogen gas. When doing this, check the pressure and surrounding area so as not to blow other dust into the air. Never use your own breath to blow off the dust from the MCP surface. 4. DEGASSING BEFORE USE Gas adsorption usually occurs on the surface of an MCP which has not yet been used after delivery or has been stored after use. The MCP must be evacuated in a high vacuum below 1.3 × 10-4 Pa for more than 24 hours to perform degassing before using it (before supplying a voltage). 5. VACUUM BAKING Vacuum baking is effective in degassing when the MCP or the MCP assembly is to be used in a high vacuum. Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa. Vacuum baking cannot be performed on some types of MCP assembly. Please consult us for details. 6. SUPPLY VOLTAGE Always maintain the MCP and the MCP assembly high vacuum condition below 1.3 × 10-4 Pa in operation. When supplying a voltage to the MCP or MCP assembly and to the output signal readout device (anode, phosphor screen), slowly increase it at every 100 V step (approx. 5 seconds per 100 V). 7. DISPOSAL METHOD The materials in these products contain lead and its compound. Please follow the applicable regulations regarding disposal of hazardous materials and industrial wastes in your country, state, region or province. WARRANTY PERIOD AND COVERAGE This product is warranted for a period of one year from the date of shipment. If you find any failure or defect in the workmanship and notify us within this warranty period, we will repair or replace it free of charge. The warranty is limited to replacement of the defective product. Even if within the warranty period, this warranty shall not apply to failures or damages that were caused by the product reaching the end of its service life, incorrect operation, or accidents such as natural or man-made disasters. Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult with our sales office. Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. ©2016 Hamamatsu Photonics K.K. HAMAMATSU PHOTONICS K.K. www.hamamatsu.com HAMAMATSU PHOTONICS K.K., Electron Tube Division 314-5, Shimokanzo, Iwata City, Shizuoka Pref., 438-0193, Japan, Telephone: (81)539/62-5248, Fax: (81)539/62-2205 U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater. N.J. 08807-0910, U.S.A., Telephone: (1)908-231-0960, Fax: (1)908-231-1218 E-mail: [email protected] Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-2658 E-mail: [email protected] France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10 E-mail: [email protected] United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44)1707-294888, Fax: (44)1707-325777 E-mail: [email protected] North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 SE-164 40 Kista, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01 E-mail: [email protected] TMCP0002E05 Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39)02-93581733, Fax: (39)02-93581741 E-mail: [email protected] China: Hamamatsu Photonics (China) Co., Ltd.: B1201 Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86)10-6586-6006, Fax: (86)10-6586-2866 E-mail: [email protected] JAN. 2016 IP