MCP Selection Guide

OVERVIEW
MCP (microchannel plate) is a two-dimensional sensor that detects electrons, ions, vacuum UV rays, X-rays and gamma rays in a
vacuum, and amplifies the detected signals. Circular and rectangular MCPs are available in various dimensions, including easy-touse MCP assemblies with pre-mounted electrode leads and supports. These MCPs are widely used in many types of analytical
equipment such as for "mass spectroscopy", "semiconductor inspection" and "surface analysis".
The MCP assemblies are available with three different readout devices to meet application needs. The devices are of: (1) single
anode (electrical output signal measurement within effective area), (2) multianode (electrical output signal measurement corresponding to signal input positions), and (3) phosphor screen (optical imaging of output signal). Select the output device that best matches
your application.
From one to three stage MCPs can be selected for the assembly to obtain necessary gain, allowing uses in the analog mode (the
output signal is measured as a continuous electrical current) or the counting mode (the low level signal can be measured by a binary
processing).
OPERATING PRINCIPLE
As shown in the figure on the lower right, a potential gradient is established along the channel when the voltage VD is applied between the input and output sides of the MCP. Multiple secondary electrons are emitted when an electron enters a channel from the
input side and strikes its inner wall. These secondary electrons are accelerated by the potential gradient to draw parabolic trajectories that are determined by their initial velocities. They then strike the opposite wall in the channel causing further secondary electrons to be emitted. The electrons in this way travel towards the output end while striking the inner wall of the channel repeatedly. As
a result, a large number of exponentially increased electrons are extracted from the output side.
■Thickness
The thickness of an MCP is nearly equal to the channel length.
The ratio of the channel length (L) to the channel diameter (d) is
referred to as α (α=L/d), and this α and the secondary emission
factor inherent to the channel wall material determine the gain of
the MCP. Standard MCPs are fabricated so that α is 40 to 60.
The MCP thickness is therefore determined by the required channel diameter and the design value of this α.
Schematic structure of MCP
CHANNEL
DIAMETER: d
LENGTH: L
■Open Area Ratio: OAR
The OAR indicates the ratio of the channel open area to the entire effective area of and MCP.
■Bias angle
The bias angle is an angle formed by the channel axis and the
axis perpendicular to the plate surface. This angle is chosen by
considering the detection efficiency and spatial resolution as well
as the prevention of input signals from passing through the channels without colliding with the channel walls. The optimum value
is usually from 5° to 15°.
CHANNEL
WALL
INCIDENT
ELECTRON
INPUT SIDE
ELECTRODE
OUTPUT SIDE
ELECTRODE
OUTPUT
ELECTRONS
STRIP
CURRENT
VD
TMCPC0002EF
1
LARGE OAR: FUNNEL TYPE (OPTION)
The open area ratio (OAR) of standard MCPs is normally set to 60 %, but we also provide "funnel type" MCPs whose open area ratio
is improved up to 90 % in order to guide more signals into each channel. Please contact us if you are interested in funnel type
MCPs.
Standard
OAR 60 %
Ion
Chan
Funnel
OAR 90 %
Ion
nel
Chan
nel
12 µm
12 µm
Cross-sectional view
Cross-sectional view
▲Shape of channel entrance (SEM image)
▲Shape of channel entrance (SEM image)
CHARACTERISTICS
■MCP gain characteristics
■Pulse height distribution (PHD)
TMCPB0005EB
TMCPB0034ED
108
NUMBER OF COUNTS (S-1)
3 STAGE MCP
107
GAIN
106
2 STAGE MCP
105
2 STAGE MCP
3 STAGE MCP
104
PULSE HEIGHT (CHANNEL NUMBER)
1 STAGE MCP
103
0
1.0
2.0
3.0
SUPPLY VOLTAGE (kV)
■MCP saturation characteristics (output linearity)
Analog mode
Counting mode
TMCPB0072EA
TMCPB0042EE
150
108
NUMBER OF COUNTS (s-1)
RELATIVE GAIN (%)
F6584 WIDE DYNAMIC RANGE MCP
RESISTANCE : 7.5 MΩ
EFFECTIVE AREA: 20 mm
100
50
STANDARD MCP
RESISTANCE : 200 MΩ
EFFECTIVE AREA: 20 mm
0
10-8
STANDARD MCP
RESISTANCE: 400 MΩ / 2 STAGE MCP
GAIN : 5 × 106
EFFECTIVE AREA: 20 mm
107
106
105
F6584 WIDE DYNAMIC RANGE MCP
RESISTANCE: 22.4 MΩ / 2 STAGE MCP
GAIN : 8 × 106
EFFECTIVE AREA: 20 mm
104
10-7
10-6
10-5
OUTPUT CURRENT (A)
10-4
10-8
10-7
10-6
10-5
10-4
OUTPUT CURRENT (A)
2
MCP SPECIFICATIONS AND DIMENSIONAL OUTLINES
Circular MCP
MCPF0006
INPUT SIDE
D
C
A
θ
B
INDICATOR 1
OUTPUT SIDE
TMCPA0056EA
F1552
F1217
F1551
F1094
Type
F1208-01
F1942-04 F2395-04 Unit
Parameter
-015 -06 -011 -074 -015 -011 -074 -015 -011 -074
-015 -011
Outer size A
17.9
32.8
49.9
86.7 113.9 mm
24.8
38.4
Electrode area B
17
31.8
49
84.7 112 mm
23.9
36.5
Effective area C
14.5
27
42
77
105 mm
20
32
Thickness D
mm
0.48
0.48
0.3
0.48
0.3 0.48
1
0.48 0.2 0.48 0.3
Channel diameter
µm
12
12
4
12
6
12
6
12
6
25
12
Channel pitch
µm
15
15
5
15
7.5
15
7.5
15
7.5
31
15
Bias angle θ
8
12
8
8
8
8
12
12
8
12
degrees
Open area ratio
55
60
60
%
Electrode material
—
Inconel
Gain (Min.) 3
104
—
5×103
104
5×103
104
5×103
104
Resistance 3
100 to 700 10 to 100 20 to 100 20 to 200 50 to 500 10 to 50 10 to 100 15 to 200 6.7 to 33.3 6.7 to 66 20 to 100 10 to 200 4 to 20 10 to 100 5 to 50 MΩ
Dark current (Max.) 3
0.5
pA·cm-2
7 % of strip current 2
Maximum linear output 3
—
4
kV
Supply voltage
1.0
Operating ambient
°C
-50 to +70
temperature 4
NOTE: 1Indicates MCP input side. Shape varies depending on product type.
2Strip current is the current that flows through channel walls when a voltage is applied between MCP IN and OUT. It is given by dividing the
applied voltage by the MCP resistance.
3Supply voltage: 1.0 kV, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C
4Vacuum: 1.3×10-4 Pa
5The F1551-01, F1094-01, F1552-01, F1208-01 and F1217-01 are also available with a center through-hole (6 mm diameter).
3
Rectangular MCP
C’
A’
θ
B’
MCPF0011
C
D
INDICATOR 1
B
A
INPUT SIDE
Type
Parameter
Outer size A×A'
Electrode size B×B'
Effective area C×C'
Thickness D
Channel diameter
Channel pitch
Bias angle θ
Open area ratio
Electrode material
Gain (Min.) 3
Resistance 3
Dark current (Max.) 3
Maximum linear output 3
Supply voltage 4
Operating ambient
temperature 4
OUTPUT SIDE
TMCPA0057EA
F2370-01
F4772-01
F2806-01
F1943-02
F2805-03
F2396-04
Unit
15.9×9.4
15×8.5
13×6.5
61.9×13.9
61×13
55×8
0.48
12
15
49.9×39.9
49×39
45×35
87.9×37.9
87×37
81×31
0.60
15
19
59.9×59.9
58×58
53×53
0.80
20
25
96.9×78.9
95.6×77.3
90×72
1.00
25
31
20 to 120
10 to 50
0.5
7 % of strip current 2
1.0
mm
mm
mm
mm
µm
µm
degrees
%
—
—
MΩ
pA·cm-2
—
kV
-50 to +70
°C
8
60
Inconel
104
100 to 500
20 to 200
4
MCP ASSEMBLY SELECTION GUIDE BY PURPOSE
Target object
Electron
+/- Ion
VUV
X-ray
TOF
Signal Amount
Measurement
(Time of Flight)
Detection
Measures
the difference
in the arrival time
Measures
the signal amount
MCPF0081
MCPF0088
Demountable
SIGNAL READOUT LEAD
Up to 3 MCPs can be added according to level
of X-rays or electrons to be detected. The
screw mount allows easy replacement of the
MCP and readout device.
MCP
FLANGE
Standard
Center hole
Circular and rectangular types are
provided.
The circular type also includes an
even smaller device.
Fast response
ION, X-RAY, etc.
OUTPUT WAVEFORM
SAMPLE
This type of MCP assembly has a throughhole in the center that allows ions, X-rays
and so on to pass through it to irradiate a
sample. The signal from the sample can then
be detected effectively.
Page
5
Using an anode specially designed for
the high-speed signal readout, this type
of MCP assembly eliminates signal
distortions called "ringing" and ensures
an accurate signal output.
Circular
Rectangular
Compact
Standard
Fast time
response
Anode
ground
Floating
Compact
Compact and
4 µm MCP
P9
P.10
P.11
P.12
P.12
P.13
P.13
P.14
P.14
MCP
Readout device
1: Single anode
2: Multianode
3: Phosphor screen
Position
Detection
Image
Readout
Captures a
signal distribution
as an image
Measures
the signal amount and
position distribution
Thin
MCPF0077
Nondemountable
MCPF0082
Multianode
Phosphor screen output
ION, X-RAY, etc.
MCP
PHOSPHOR
SCREEN
MCP
(15.1)
MULTIANODE
ION or
ELECTRON
(5.6)
ELECTRON
TMCPC0104EA
SIGNAL
Its thin and flat shape
permits installation in
minimum spaces as add on
parts. Maintenance and
servicing of this MCP
assembly are quite easy
since there are only 2
wiring connections.
Fast
response
P.15
This type is
compact, light in
weight and
economical. Unlike
the demountable
type, however, the
assembled MCP
cannot be replaced.
NonNondemountable demountable
P.8
P.8
Features
•Wide room for choice of readout
patterns in one dimension (1×n)
or two dimensions (a×n)
•Simultaneous counting (parallel
counting)
•High counting efficiency
•Anode pitch: 3 mm or more
The phosphor screen coated on
the glass plate converts the output
charge distribution from the MCP
into a visible image. A resolution of
40 µm to 50 µm can be obtained
with a one-stage MCP, and that of
80 µm to 100 µm can be done with
a two-stage MCP. Select the desired phosphor screen among
three types of P43, P46 and P47.
(See page 9 for detailed specifications.)
Circular
Rectangular
Circular
Rectangular
Vacuum
flange
P.9
P.10
P.9
P.10
P.16
6
MCP ASSEMBLY SELECTION GUIDE BY APPLICATIONS
Major applications of MCP assemblies include "mass spectroscopy", "semiconductor inspection" and "surface analysis". The table
below gives you a quick reference for selecting the best MCP assembly in these major application fields. This table shows only
typical applications. Feel free to contact our sales office in your area if you do not find your specific application here.
: Best suited
Demountable, circular MCP assembly (single anode)
Total amount measurement, TOF
Demountable, rectangular MCP assembly (single anode)
Non-demountable, circular MCP assembly (single anode)
F2223-21SH
F4294-09
F4655/-14
F4655-10/-11
F4655-13
F9890-31/-32, F9892-31/-32
F9890-13/-14, F9892-13/-14
Image readout
Position detection
F12334-11, F12395-11, F12396-11
7
Demountable, circular MCP assembly (multi-anode)
Demountable, rectangular MCP assembly (multi-anode)
Non-demountable, circular MCP assembly (multi-anode)
Demountable, circular MCP assembly (phosphor screen)
Demountable, rectangular MCP assembly (phosphor screen)
F2225-21PGF
F6959
Positron detector
Soft X-ray microscope (SXM)
Tranmission electron microscope (TEM)
Field ion microscope (FIM)
Low energy electron diffraction (LEED)
Reflection medium energy electron diffraction (RMEED)
Soft X-ray spectroscopy (SXS)
Vacuum UV spectroscopy (VUVS)
Rutherford backscattering spectroscopy (RBS)
Electron spectroscopy for chemical analysis (ESCA)
Ion scattering spectroscopy (ISS)
Surface analysis
Auger electron spectroscopy (AES)
FIB system
Mask aligner
Electron or ion beam lithography
Electron beam measuring system (EBMS)
Scanning ion microscope (SIM)
Scanning electron microscope (SEM)
Secondary ion mass spectroscopy (SIMS)
Inductive-coupled plasma mass spectroscopy (ICP-MS)
Gas or liquidchromatographic mass spectroscopy (GC/LC-MS)
Double focusing mass spectroscopy (Sector-MS)
MCP assembly
Quadrupole mass spectroscopy (Q-MS)
Detection method
Application
Time-of-flight mass spectroscopy (TOF-MS) (LC-MS)
Mass spectroscopy Semiconductor inspection
Time-of-flight mass spectroscopy (TOF-MS) (MALDI)
Field
: Applicable
MCP ASSEMBLY SPECIFICATIONS AND DIMENSIONAL OUTLINES (Unit: mm)
1
Type No.
F1551
F1094
F1552
F1208
F1217
Channel
diameter
(µm)
12
1
Number
of MCPs
Gain
(Min.)
Puls height
resolution
(Max.)
(%)
1 to 3
1 stage MCP
: 1 × 104
2 stage MCP
: 1 × 106
3 stage MCP
: 1 × 107
2 stage MCP: 120
3 stage MCP: 80
1
2
2
Dark count
(Max.)
(s-1·cm-2)
MCP
supply voltage
(kV)
MCP-OUT to anode
supply voltage
(kV)
3
(2 or 3 stage MCP)
1 stage MCP: 1.0
2 stage MCP: 2.0
3 stage MCP: 3.0
Single anode: 0.5
Multianode: 0.5
NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C
2Vacuum: 1.3×10-4 Pa
Circular (Non-demountable)
MCP
B
EFFECTIVE AREA
A
ANODE
LEAD
8 × 0.5
SUS
Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa.
°
30
30°
1
2-EYELET
2
EYELET
3
D
1
1
EYELET
3
1MCP-IN LEAD (4)
2MCP-OUT LEAD (2)
3ANODE LEAD (2)
2
C
EYELET
30 MIN.
1
TMCPA0027EF
Anode type
Number of MCPs
Without readout device
Single anode
1 to 3
Symbol
Assembly outer size
B
Effective area
Multianode
Phosphor output type are not available.
C
D
F1551 F1094 F1552 F1208 F1217 Unit
Description
A
Assembly
No. of
height
MCPs
27
34
42
49
62
mm
14.5
20
27
32
42
mm
1
4.5
2
5.7
3
5.7
Lead pin circle
22.5
29.5
37.5
mm
44
56
mm
* Multianode types have different dimensions.
Types with no anode are also available.
TYPE NUMBER DESIGNATION FOR NON-DEMOUNTABLE TYPE
The following ordering information applies only to circular MCP assemblies (non-demountable type). When ordering other MCPs
(non-assembled MCPs) and MCP assemblies, use their type numbers as listed.
* When the customer prepares a read-out device, we supply MCP assemblies without readout devices.
F 1551-2 1S
Readout device
No suffix: Without readout device *
S: Single anode
Channel diameter
Type No. : Assembly type
1: 12 µm
Number of MCPs
1: 1-stage
2: 2-stage
3: 3-stage
8
MCP ASSEMBLY SPECIFICATIONS AND DIMENSIONAL OUTLINES (Unit: mm)
1
Channel
diameter
(µm)
Type No.
F2221
F2222
F2223
F2224
F2225
F2226
12
1
Number
of MCPs
Gain
(Min.)
Puls height
resolution
(Max.)
(%)
Refer to
"Anode Type"
below
1 stage MCP
: 1 × 104
2 stage MCP
: 1 × 106
3 stage MCP
: 1 × 107
2 stage MCP: 120
3 stage MCP: 80
25
1
2
2
Dark count
(Max.)
(s-1·cm-2)
MCP
supply voltage
(kV)
MCP-OUT to anode
supply voltage
(kV)
3
(2 or 3 stage MCP)
1 stage MCP: 1.0
2 stage MCP: 2.0
3 stage MCP: 3.0
Single anode: 0.5
Multianode: 0.5
Phosphor screen
: 3.0 to 4.0
NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C
2Vacuum: 1.3×10-4 Pa
Circular (Demountable)
Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa.
Anode type
ELECTRODE
LEAD
45°
NUT M2
MCP-OUT
LEAD
Single anode
G
INSULATOR
CHANNEL
BIAS
DIRECTION
D
C
B
A
H
1.0
DEGASSING
SPACE
READ-OUT
DEVICE
MCP
Phosphor screen
Symbol
20
F2221 F2222 F2223 F2224 F2225 F2226 Unit
Assembly outer size
54
61
69
75
86
123 mm
B
Mounting screw hole pitch
46
53
61
67
78
115 mm
C
Insulator outer size
34
41
49
55
66
103 mm
D
Effective area
14.5
20
27
32
42
77
mm
E
Effective area of readout device
10
17
24
30
40
75
mm
F
Maximum height
15
15
15
15
15
17
mm
Distance from
4 × 3.5
H
ANODE OR
PHOSHOR SCREEN LEAD
1 to 2
Description
A
G
4 × 4.5
1 to 3
Multianode
3 SUBSTRATE
E
3
MCP-IN LEAD
Number of MCPs
Without readout device
F
No. 1
bottom of substrate
10.9
12.9
2
11.9
14.4 mm
to insulator surface MCPs 3
11.9
15.9
Distance from MCP No. 1
2.8
3.8
input surface to
3.3
4.3
of
of
2
insulator surface
2.9
MCPs 3
Shape may differ depending on product type number.
mm
4.8
TMCPA0026EH
PHOSPHOR SCREEN
Select the desired phosphor screen by taking into account the decay time according to the readout method and application, and the
emission wavelength according to the readout device sensitivity.
Phosphor screen type
P43
P46
P47
Peak emission
wavelength (nm)
545
510
430
Emission color
Yellowish green
Yellowish green
Purplish blue
NOTE: 1Supply voltage: 6 kV. Value relative to P43 which is specified as 1.
■Spectral emission characteristics
TMCPB0090EA
RELATIVE INTENSITY (%)
P43
60
40
P46
20
450
500
550
600
WAVELENGTH (nm)
9
Standard type
Short decay
Very short decay
TMCPB0091EA
P43DC3
101
P46
100
P47
10-1
1 ms
100 ns
1 ms
400
1 ms
0.2 µs to 0.4 µs 2
0.11 µs
EYE
RESPONSE
80
0
350
Remarks
■Decay characteristics
102
P47
10 % decay time
2Varies depending on the input pulse width.
RELATIVE INTENSITY (%)
100
Relative energy
efficiency 1
1
0.3
0.3
650
700
100 ns
INPUT LIGHT
PULSE WIDTH
PHOSPHOR SCREEN PEAK CURRENT 8 nA/cm2
10-2
10-8
10-7
10-6
10-5
10-4
10-3
DECAY TIME (s)
10-2
3 Decay characteristics after removal
of continuous light input
1
Type No.
F2813
Gain
(Min.)
Puls height
resolution
(Max.)
(%)
Refer to
"Anode type"
below
1 stage MCP
: 1 × 104
2 stage MCP
: 1 × 106
3 stage MCP
: 1 × 107
2 stage MCP: 120
3 stage MCP: 80
15
F2814
20
F3490
12
1
Number
of MCPs
Channel
diameter
(µm)
1
2
2
Dark count
(Max.)
(s-1·cm-2)
MCP
supply voltage
(kV)
MCP-OUT to anode
Supply voltage
(kV)
3
(2 or 3 stage MCP)
1 stage MCP: 1.0
2 stage MCP: 2.0
3 stage MCP: 3.0
Single anode: 0.5
Multianode: 0.5
Phosphor screen
: 3.0 to 4.0
NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C
2Vacuum: 1.3×10-4 Pa
Rectangular (Demountable)
Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa.
MCP-OUT LEAD
3
CHANNEL BIAS DIRECTION
Anode type
Number of MCPs
Without readout device
Single anode
20
MCP-IN LEAD
1 to 3
Multianode
Phosphor screen
ANODE OR
PHOSPHOR
SCREEN
LEAD
E’
A’
B’
D’
Symbol
4 × 3.5
D
C
B
A
G
DEGASSING SPACE
E
A×A'
Assembly outer size
128×54
96×76
F3490
Unit
78×29.5 mm
B×B'
Mounting screw hole pitch
120×46
86×68
C×A'
Insulator outer size
104×54
76×76
D×D'
Effective area
81×31
53×53
55×8
mm
E×E'
Effective area of readout device
80×30
50×50
52×7
mm
11.9
mm
F
G
SCREW M2
INSULATOR
bottom of substrate
No.
1
10.9
10.9
of
2
11.9
11.9
to insulator surface MCPs 3
11.9
12.9
Distance from MCP
input surface to
insulator surface
72×18
mm
66×29.5 mm
No.
1
2.7
2.5
3.8
of
2
3.1
2.7
3.3
MCPs 3
2.5
2.9
2.9
mm
Shape may differ depending on product type number.
3
SUBSTRATE
F2814
F
MCP
F2813
Distance from
ELECTRODE
LEAD
1 to 2
Description
READ-OUT DEVICE
TMCPA0029EG
TYPE NUMBER DESIGNATION FOR DEMOUNTABLE TYPE
The following ordering information applies only to circular/rectangular MCP assemblies (demountable type). When ordering other MCPs
(non-assembled MCPs) and MCP assemblies, use their type numbers as listed.
* When the customer prepares a read-out device, we supply MCP assemblies without readout devices. If using a phosphor screen as
the readout device, there is a need to change some points, so please consult us in advance.
F 2224-2 1P
Readout device
No suffix: Without readout device *
S: Single anode
M: Multianode
P: Phosphor screen selectable from among P43, P46 and P47
see page 9
(
)
Channel diameter
Type No. : Assembly type
1: 12 µm
2: 15 µm (Only rectangular type)
3: 20 µm (Only rectangular type)
4: 25 µm (Only circular type)
Number of MCPs
1: 1-stage
2: 2-stage
3: 3-stage
10
MCP ASSEMBLY SPECIFICATIONS AND DIMENSIONAL OUTLINES (Unit: mm)
1
Type No.
Channel
diameter
(µm)
Number
of MCPs
Gain
(Min.)
Puls height
resolution
(Max.)
(%)
12
2
5 × 107
50
F4655
F4655-14
1
1
2
2
Dark count
(Max.)
(s-1·cm-2)
MCP
supply voltage
(kV)
MCP-OUT to anode
supply voltage
(kV)
3
2.5
0.5
NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C
2Vacuum: 1.3×10-4 Pa
F4655
Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa.
8.5
3
3 × 2.2
P.C.D.* 25.6
MCP-IN LEAD
0.5t
SUS
7.5
°
0°
6
60
* P.C.D. (Pitch Circle Diameter)
14.5
EFFECTIVE AREA
18
12
MCP (2-STAGE)
2
SUBSTRATE
ANODE
3.5
MCP-OUT LEAD
3.5
ANODE LEAD
PROTECTION ELECTRODE FOR CHARGING-UP
(SAME POTENTIAL AS SUBSTRATE)
TMCPA0001EJ
F4655-14
Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa.
3
3 × 2.2
P.C.D.* 25.6
MCP-IN LEAD
(8)
0.5t
SUS
7.5
(4.5)
6
°
12
0°
60
* P.C.D. (Pitch Circle Diameter)
14.5
EFFECTIVE AREA
18
FOR FIXING (M1.6)
2
MCP (2-STAGE)
SUBSTRATE
3.5
3 × M1.6 LENGTH 12
ANODE LEAD
3.5
ANODE
MCP-OUT LEAD
PROTECTION ELECTRODE FOR CHARGING-UP
(SAME POTENTIAL AS SUBSTRATE)
TMCPA0086EA
11
1
Type No.
Channel
diameter
(µm)
Number
of MCPs
12
2
F2223-21SH
F4294-09
MCP center
dead area
(mm)
8
12
Gain
(Min.)
Puls height
resolution
(Max.)
(%)
1 × 106
—
1
1
2
2
Dark count
(Max.)
(s-1·cm-2)
MCP
supply voltage
(kV)
MCP-OUT to anode
supply voltage
(kV)
3
2.0
0.5
NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C
2Vacuum: 1.3×10-4 Pa
F2223-21SH
* P.C.D. (Pitch Circle Diameter)
8.6
MESH
MCP (2-STAGE)
41
10
27
EFFECTIVE AREA
8
DEAD SPACE
4 × 2.6
P.C.D.* 50.8
56.5
45°
MCP CENTER HOLE 6
CENTER PIPE (OUTER 5)
CENTER PIPE (INNER 4)
Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa.
4× 1
6
1 234
3
SUBSTRATE
1.6
1MESH LEAD
2MCP-IN LEAD
3MCP-OUT LEAD
4ANODE LEAD
TMCPA0002EH
F4294-09
MCP-IN LEAD
4 × 3.5
P.C.D.* 61
17 (8.5)
14.6 5.3
3
ANODE
SUBSTRATE
MCP
(2-STAGE)
69
49
27
EFFECTIVE AREA
12
DEAD SPACE
45 °
20
3
MCP-OUT LEAD
MCP CENTER HOLE 10
CENTER PIPE (OUTER 8)
CENTER PIPE (INNER 6)
* P.C.D. (Pitch Circle Diameter)
INSULATOR
9.5
SMA CONNECTOR
TMCPA0042EF
12
MCP ASSEMBLY SPECIFICATIONS AND DIMENSIONAL OUTLINES (Unit: mm)
1
Type No.
F9890-13
F9890-14
F9890-31
F9890-32
F9892-13
F9892-14
F9892-31
F9892-32
Channel
diameter
(µm)
12
6
12
6
12
6
12
6
Number
of MCPs
Pulse width
(FWHM)
(ps)
Gain
(Min.)
Puls height
resolution
(Max.)
(%)
1 × 106
150
1
1
2
2
Dark count
(Max.)
(s-1·cm-2)
MCP
supply voltage
(kV)
MCP-OUT to anode
supply voltage
(kV)
3
2.0
0.5
900
450
2
1200
700
NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C
2Vacuum: 1.3×10-4 Pa
F9890-13/-14, F9892-13/-14
WIRING EXAMPLE
1.65
4 × 4.5
°
45
MCP-IN LEAD
ASSEMBLY
MCP (2-STAGE)
150 pF × 4 (3 kV)
SUBSTRATE
AMPLIFIER
SIGNAL
(BNC)
F
G
24
MCP-OUT
LEAD
B
C
A
EFFECTIVE AREA
D 21.3
E
3
IN
SIGNAL
BNC1
-2 kV
Max.
Power supply
capable of
floating operation
-500 V
Max.
(500 V operation
is recommended)
IN
1SMA connector type is also available.
A
B
C
D
E
F
G
50 Ω
INPUT
OUT
When divider
circuit is used
F9890-13 F9890-14 F9892-13 F9892-14
42
27
92
81
75
63
11.6
12
11.6
12
9.6
10
9.6
10
84
72
64
52
OUT
2 MΩ
0.5 MΩ
(3 W)
(1 W)
-2.5 kV
Max.
TMCPA0075EC
F9890-31/-32, F9892-31/-32
44.5
35
WIRING EXAMPLE
4 × 4.5
F
ASSEMBLY
45°
MCP-IN LEAD
MCP-OUT
LEAD
SIGNAL
(SMA)
50 Ω
INPUT
ANODE
OUT
H
I
G
IN
SIGNAL
SMA
ANODE LEAD
13
AMPLIFIER
150 pF(15 kV)
1 MΩ
F9890-31 F9890-32 F9892-31 F9892-32
A
42
27
B
92
81
C
75
63
D
20.2
19.9
20.2
19.9
E
18.2
17.9
18.2
17.9
MCP-IN LEAD
13.5
13.9
13.5
13.9
F MCP-OUT LEAD
15.2
15.2
ANODE LEAD
19.4
19.4
G
40
35
H
84
72
I
64
52
SUBSTRATE
MCP (2-STAGE) 150 pF × 4 (15 kV)
MESH
B
C
A
EFFECTIVE AREA
1.65
D
E
3
500 V (500 V operation is recommended)
2 kV
Max.
Max.
Power supply Power supply
capable of
capable of
floating
floating
operation
operation
-10 kV to +10 kV
IN
When divider
circuit is used
ANODE
OUT
2 MΩ 0.5 MΩ
(3 W)
(1 W)
2.5 kV Power supply capable
Max. of floating operation
-10 kV to +10 kV
TMCPA0082EC
1
Type No.
Channel
diameter
(µm)
F4655-10
F4655-11
F4655-13
Number
of MCPs
Pulse width
(FWHM)
(ps)
2
600
12
4
Gain
(Min.)
Puls height
resolution
(Max.)
(%)
5 × 107
1 × 106
1
1
2
Dark count
(Max.)
(s-1·cm-2)
MCP
supply voltage
(kV)
50
3
2.5
120
5
2.0
2
MCP-OUT to anode
supply voltage
(kV)
0.5
NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C
2Vacuum: 1.3×10-4 Pa
F4655-10/-13
* P.C.D. (Pitch Circle Diameter)
(31.9)
18.1
3
10.3
2 × 2.2
P.C.D.* 25.6 MCP (2-STAGE)
SUBSTRATE
3
0.5
ANODE
30°
MCP-OUT LEAD
BNC-R
A
38
14.5
EFFECTIVE AREA
3.5
18
30°
6
MCP-IN LEAD
3 × 3.5
P.C.D.* 32
PROTECTION ELECTRODE
FOR CHARGING-UP
(SAME POTENTIAL AS SUBSTRATE)
A
F4655-10 F4655-13
2
3
TMCPA0021EG
F4655-11
MCP-IN LEAD
7.5
(35.6)
BNC-R-S
70
MCP
(2-STAGE)
33
14.5
EFFECTIVE AREA
12
0°
MCP-OUT LEAD
ANODE
2-SHV-R
40
°
VACUUM FLANGE
(ICF 70)
TMCPA0085EB
14
MCP ASSEMBLY SPECIFICATIONS AND DIMENSIONAL OUTLINES (Unit: mm)
1
Type No.
F12334-11
F12395-11
F12396-11
Channel
diameter
(µm)
Number
of MCPs
Pulse width
(FWHM)
(ns)
Gain
(Min.)
Puls height
resolution
(Max.)
(%)
12
2
1.5
1 × 106
—
1
1
2
2
Dark count
(Max.)
(s-1·cm-2)
MCP
supply voltage
(kV)
MCP-OUT to anode
supply voltage
(kV)
33
—3
0.5
NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C
2Vacuum: 1.3×10-4 Pa
3A maximum of -2.1 kV is supplied to the HV electrode, depending on the built-in bleeder resistors.
F12334-11, F12395-11, F12396-11
D
C
(15.1)
B
4 × 3.5
EFFECTIVE AREA
A
(5.6)
SIGNAL
(SMA)
2
2 × M3
F
R1
C1
G
E
MCP
(2-STAGE)
C1
R2
C1
SUBSTRATE
R2
HV
WIRING EXAMPLE
A
B
C
D
E
F
G
F12334-11
20
36
46
54
30
36
38
F12395-11
27
40
51
61
30
40
41
F12396-11
42
51
62
72
40
51
52
ASSEMBLY
MCP (2-STAGE)
3 × C1
ANODE
HV
R1
-2.1 kV
Max.
R2
SUBSTRATE
SIGNAL (SMA)
50 Ω
INPUT
R1 : 20 MΩ
R2 : 1 MΩ
C1 : 150 pF (3 kV)
TMCPA0084EC
15
1
Type No.
F2225-21PGF
F6959
Channel
diameter
(µm)
Number
of MCPs
Gain
(Min.)
Puls height
resolution
(Max.)
(%)
12
2
1 × 106
—
1
1
2
Dark count
(Max.)
(s-1·cm-2)
MCP
supply voltage
(kV)
3
2.0
2
MCP-OUT to anode
supply voltage
(kV)
4.0
3.0
NOTE: 1Supply voltage: 1.0 kV/MCP, vacuum: 1.3×10-4 Pa, operating ambient temperature: +25 °C
2Vacuum: 1.3×10-4 Pa
F2225-21PGF
Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa.
See page 9 regarding the phosphor screen.
(60)
(14)
20
19
(21)
10.9
MCP-IN TERMINAL
(SHV)
(46)
42
66
150
MCP-OUT TERMINAL
(SHV)
40
EFFECTIVE AREA
MCP
(2-STAGE)
VIEWING PORT
(ICF114)
(21)
PHOSPHOR SCREEN TERMINAL
(SHV)
114
VACUUM FLANGE
(ICF152)
TMCPA0081ED
F6959
* P.C.D. (Pitch Circle Diameter)
See page 9 regarding the phosphor screen.
(7)
(30)
MCP-OUT TERMINAL
(SHV)
(36.1)
19.8
9.3
3-SHV
VACUUM FLANGE
(ICF152)
O-RING
28
55
102
150
MCP-OUT TERMINAL
(SHV)
2.8
FOP
28
EFFECTIVE
AREA
MCP
(2-STAGE)
PHOSPHOR
SCREEN TERMINAL
(SHV)
(30)
4 × M3 DEPTH 5
P.C.D.* 90
TMCPA0038EF
16
MCP ASSEMBLY WIRING EXAMPLES
Signal detection
Image detection
●Positive ion detection
(Anode ground)
ASSEMBLY
●Positive ion detection
(MCP-OUT: GND)
PHOSPHOR SCREEN
ASSEMBLY
SUBSTRATE
MCP (2-STAGE)
MCP (2-STAGE)
SUBSTRATE
AMPLIFIER
ANODE
IN
OUT
IN
OUT
PHOS
-0.5 kV Max.
-2 kV
Max.
-2.0 kV Max.
4 kV
Max.
Power supply capable
of floating operation
When divider
circuit is used
2 MΩ
0.5 MΩ
(3 W)
(1 W)
●Electron or positive ion detection
(MCP-IN: GND)
ASSEMBLY
MCP (2-STAGE)
-2.5 kV Max.
●Electron or negative ion detection
(Anode floating (MCP-IN: GND))
MCP (2-STAGE)
ASSEMBLY
IN
SUBSTRATE
OUT
COUPLING CIRCUIT
PHOS
4 kV Max.
AMPLIFIER
150 pF/3 kV
SIGNAL
OUTPUT
ANODE
PHOSPHOR SCREEN
SUBSTRATE
2 kV
Max.
Power supply capable
of floating operation
2 MΩ
4 MΩ
(3 W)
(5 W)
1 MΩ
IN
ANODE
OUT
When divider
circuit is used
+0.5 kV Max.
+2.0 kV Power supply capable
Max.
of floating operation
When divider
circuit is used
2 MΩ
0.5 MΩ
(3 W)
(1 W)
6 kV Max.
●Positive ion detection
(Phosphor screen: GND)
ASSEMBLY
MCP (2-STAGE)
+2.5 kV Max.
●Positive ion detection
(Anode floating (MCP-OUT: GND))
MCP (2-STAGE)
ASSEMBLY
IN
SUBSTRATE
ANODE
1 MΩ
IN
-2.0 kV
Max.
OUT
OUT
PHOS
-2 kV
Max.
COUPLING CIRCUIT
AMPLIFIER
150 pF/1 kV
PHOSPHOR SCREEN
SUBSTRATE
Power supply capable
of floating operation
SIGNAL
OUTPUT
ANODE
When divider
circuit is used
0.5 kV
Max.
-4 kV
Max.
2 MΩ
4 MΩ
(3 W)
(5 W)
-6 kV Max.
TMCPC0005EH
TMCPC0007EE
Using multiple high-voltage power supplies has an advantage that the MCP gain can be independently adjusted.
Using the divider circuit with a single high-voltage power supply offers low cost, but there is a disadvantage that the MCP gain varies
as the power supply voltage varies.
17
CUSTOMIZATION
●We also manufacture custom-designed MCPs and MCP assemblies not included in the standard product lineup. Please consult us
with your specific requirements for outside dimensions, effective dimensions, thickness, etc.
●Feel free to consult us on MCPs with a special aperture or through-hole (for use with reflection electron microscopes), CsI deposition (for higher quantum efficiency in the VUV to X-ray range), aluminum film coating (as a barrier to ions and radiation), MgO coating (for higher gain), electrodes made of Au (gold) and special-purpose MCPs.
●For multianodes, consult us on the desired anode pattern.
●Assemblies with a phosphor-coated fiber optic plate (FOP) are available to enable fiber-coupling to solid state imaging devices
(CCD, MOS linear image sensors), etc.
●Assemblies with an MCP, readout device and lead terminals mounted on a special vacuum flange or printed circuit board are also
available.
●Please consult us regarding funnel type MCPs with an OAR of 90 %.
18
HOW TO HANDLE
1. STORAGE
The MCP and the MCP assembly are shipped in packages that are evacuated to a vacuum or filled with dry nitrogen. These
packages are intended for use during shipping and not suited for long-term storage. When storing the MCP and MCP assemblies,
take them out of their packages and keep them in a clean case under either a) or b) of the following conditions.
a) At vacuum pressure below 13 Pa and no oil diffusion.
b) Under gentle constant flow of dry nitrogen passed through a 0.45 µm or smaller filter (humidity: 20 % or less).
2. HANDLING
Avoid touching the MCP and the MCP assembly with bare hand. If handled with bare hand, these might be contaminated by oil
and salt from it causing an increase in dark current, a loss of gain and an electrical discharge.
When handling them, always wear clean vinyl or polyethylene gloves. Even when you wear gloves, never touch the effective area
of the MCP and the MCP assembly.
3. ENVIRONMENTS
The MCP surface is processed to be electrically active and the components used for the assembly are also processed for high
vacuum use. So as much as possible, handle them in an environment conforming to clean-room (dust-proof room) specifications
where oily vapor, moisture and dust are minimized.
If dusts or debris get on the MCP surface, blow them off with dry clean air or nitrogen gas. When doing this, check the pressure
and surrounding area so as not to blow other dust into the air. Never use your own breath to blow off the dust from the MCP
surface.
4. DEGASSING BEFORE USE
Gas adsorption usually occurs on the surface of an MCP which has not yet been used after delivery or has been stored after use.
The MCP must be evacuated in a high vacuum below 1.3 × 10-4 Pa for more than 24 hours to perform degassing before using it
(before supplying a voltage).
5. VACUUM BAKING
Vacuum baking is effective in degassing when the MCP or the MCP assembly is to be used in a high vacuum.
Perform the vacuum baking under 150 °C while keeping the exhaust system at a vacuum pressure below 1.3 × 10-4 Pa.
Vacuum baking cannot be performed on some types of MCP assembly. Please consult us for details.
6. SUPPLY VOLTAGE
Always maintain the MCP and the MCP assembly high vacuum condition below 1.3 × 10-4 Pa in operation.
When supplying a voltage to the MCP or MCP assembly and to the output signal readout device (anode, phosphor screen), slowly
increase it at every 100 V step (approx. 5 seconds per 100 V).
7. DISPOSAL METHOD
The materials in these products contain lead and its compound. Please follow the applicable regulations regarding disposal of
hazardous materials and industrial wastes in your country, state, region or province.
WARRANTY PERIOD AND COVERAGE
This product is warranted for a period of one year from the date of shipment. If you find any failure or defect in the workmanship and
notify us within this warranty period, we will repair or replace it free of charge. The warranty is limited to replacement of the defective
product.
Even if within the warranty period, this warranty shall not apply to failures or damages that were caused by the product reaching the
end of its service life, incorrect operation, or accidents such as natural or man-made disasters.
Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult with our sales office.
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications are
subject to change without notice. No patent rights are granted to any of the circuits described herein. ©2015 Hamamatsu Photonics K.K.
HAMAMATSU PHOTONICS K.K.
www.hamamatsu.com
HAMAMATSU PHOTONICS K.K., Electron Tube Division
314-5, Shimokanzo, Iwata City, Shizuoka Pref., 438-0193, Japan, Telephone: (81)539/62-5248, Fax: (81)539/62-2205
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater. N.J. 08807-0910, U.S.A., Telephone: (1)908-231-0960, Fax: (1)908-231-1218 E-mail: [email protected]
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-2658 E-mail: [email protected]
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10 E-mail: [email protected]
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44)1707-294888, Fax: (44)1707-325777 E-mail: [email protected]
North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 SE-164 40 Kista, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01 E-mail: [email protected]
TMCP0002E04
Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39)02-93581733, Fax: (39)02-93581741 E-mail: [email protected]
China: Hamamatsu Photonics (China) Co., Ltd.: B1201 Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86)10-6586-6006, Fax: (86)10-6586-2866 E-mail: [email protected]
SEPT. 2015 IP