MATERIAL DECLARATION SHEET Material Number CR0402 Series Product Line Thick Film Chip Resistors Compliance Date 04-01-2003 RoHS Compliant Yes MSL 1 No. Construction Element(subpart) Homogeneous Material Material weight [mg] 1 Ceramic Substrate Ceramic 0.42805 2 Conductor Layer Thick Film 0.01078 3 Resistive Element Thick Film Resistor 0.00842 4 Over Coating Epoxy 0.01043 5 End Terminal NI-CR 0.00185 6 7 Ni Plating Sn Plating Nickel Tin Total weight 0.02855 0.02547 0.51355 This Document was updated on: 2016-2-4 Homogeneous Material\ CASRN Substances if applicable Aluminum oxide Silicon dioxide Silver Bismuth Barium Silicon Boron Ruthenium oxide Silver Palladium Lead Epoxy Nickel Chromium Nickel Tin 1344-28-1 14808-60-7 7440-22-4 7440-69-9 7440-39-3 7440-21-3 7440-42-8 12036-10-1 7440-22-4 7440-05-3 7439-92-1 29690-82-2 7440-02-0 7440-47-3 7440-02-0 7440-31-5 Materials Mass % 96% 4% 96% 1% 1% 1% 1% 25% 40% 15% 20% 100% 80% 20% 100% 100% Material Mass % of total unit wt. 80.02 3.33 2.02 0.02 0.02 0.02 0.02 0.41 0.66 0.24 0.33 2.03 0.29 0.07 5.56 4.96 Subpart mass of total wt. (%) 83.35 2.1 1.64 2.03 0.36 5.56 4.96 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1