MATERIAL DECLARATION SHEET Material Number CRL1206 series Product Line Thick Film Low Ohmic Chip Resistors Compliance Date 04-01-2003 RoHS Compliant Yes MSL 1 No. Construction Element(subpart) Homogeneous Material Material weight [g] 1 Ceramic Substrate Ceramic 0.00779 2 Conductor Layer Thick Film Conductor 0.00015 3 Resistive Element Thick Film Resistor 0.0001 4 5 Over Coating Marking Epoxy Epoxy 0.00011 0.000013 6 End Terminal NI-CR 0.000007 7 Ni Plating Nickel 8 Sn Plating 0.00023 0.00019 0.00859 Tin Total weight Homogeneous Material\ Substances Aluminum oxide Silicon dioxide Silver Bismuth Barium Silicon Boron Ruthenium dioxide Silver Palladium Lead Epoxy Epoxy Nickel Chromium Nickel 1344-28-1 14808-60-7 7440-22-4 7440-69-9 7440-39-3 7440-21-3 7440-42-8 12036-10-1 7440-22-4 7440-05-3 7439-92-1 29690-82-2 25085-99-8 7440-02-0 7440-47-3 7440-02-0 Tin 7440-31-5 CASRN if applicable 96% 4% 96% 1% 1% 1% 1% 25% 40% 15% 20% 100% 100% 80% 20% 100% Material Mass % of total unit wt. 87.04 3.63 1.63 0.02 0.02 0.02 0.02 0.28 0.44 0.17 0.22 1.32 0.15 0.06 0.02 2.7 Subpart mass of total wt. (%) 100% 2.26 2.26 Materials Mass % This Document was updated on: 2016-2-5 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1 90.67 1.71 1.11 1.32 0.15 0.08 2.7