MATERIAL DECLARATION SHEET Material Number CRL2010 series Product Line Thick Film Chip Resistors Compliance Date 04-01-2003 RoHS Compliant Yes MSL 1 No. Construction Element (subpart) Homogeneous Material Material weight [g] 1 Ceramic Substrate Ceramic 0.02036 2 Conductor Layer Thick Film Conductor 0.00034 3 Resistive Element Thick Film Resistor 0.00027 4 Over Coating Epoxy 5 Marking Epoxy 0.0004 0.00002 End Terminal NI-CR 0.00001 7 Ni Plating Nickel 8 Sn Plating Tin 0.00058 0.00052 0.0225 6 Total weight Homogeneous Material\Substances CASRN Materials Mass % Material Mass % of total unit wt. Aluminum oxide Silicon dioxide Silver Bismuth Barium Silicon Boron Ruthenium dioxide Silver Palladium Lead Epoxy 1344-28-1 14808-60-7 7440-22-4 7440-69-9 7440-39-3 7440-21-3 7440-42-8 12036-10-1 7440-22-4 7440-05-3 7439-92-1 29690-82-2 96% 4% 96% 1% 1% 1% 1% 25% 40% 15% 20% 100% 86.85 3.62 1.43 0.02 0.02 0.02 0.02 0.3 0.48 0.18 0.24 1.75 Epoxy Nickel Chromium Nickel 25085-99-8 7440-02-0 7440-47-3 7440-02-0 100% 80% 20% 100% 0.11 0.03 0.01 2.59 0.11 Tin 7440-31-5 100% 2.32 2.32 Subpart mass of total wt. (%) 90.47 1.51 1.21 1.75 0.04 2.59 This Document was updated on: 2014/Feb/5 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1