MATERIAL DECLARATION SHEET Material Number CR0402-LF Product Line Chip Resistor Compliance Date 2010/08/16 RoHS Compliant YES No. Construction Element(subpart) 1 Ceramic Substrate 2 Conductor Layer 3 Resistive Element 4 MSL Homogeneous Material Ceramic 1 Material weight [g] 0.00043 Conductor glass 0.000012 Homogeneous Material\ Substances Aluminum oxide Silicon dioxide Silver Bismuth trioxide Barium oxide Silicon dioxide Boron oxide Ruthenium dioxide Silver Palladium Lead oxide glass 1303-86-2 96% 4% 96% 1% 1% 1% 1% Material Mass % of total unit wt. 80.02% 3.33% 2.00% 0.0275% 0.0275% 0.0275% 0.0275% 12036-10-1 25% 0.41% 7440-22-4 7440-05-3 1317-36-8 40% 15% 20% 0.66% 0.25% 0.33% 1.64% Epoxy 29690-82-2 100% 2.03% 2.03% Nickel 7440-02-0 80% 0.29% 7440-47-3 7440-02-0 20% 100% 0.07% 5.56% 7440-31-5 100% 4.96% Resistor glass 0.000008 Over-Coating Epoxy 0.00001 5 End Terminal Nickel Chromium 0.000002 6 Ni Plating Nickel 0.00003 Chromium III Nickel 7 Sn Plating Tin 0.00002 Tin Total weight This Document was updated on: Headquarters Riverside CA CASRN if applicable 1344-28-1 14808-60-7 7440-22-4 1304-76-3 1304-28-5 7631-86-9 Materials Mass % Subpart mass of total wt. (%) 83.35% 2.10% 0.36% 5.56% 4.96% 0.000512 05.18.2010 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET Important remarks: 1. 2. It is the responsibility of the user to verify they are accessing the latest version. RoHS exemption 5 – lead in ... glass ... of electronic components. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2