EL5129, EL5329 ® Data Sheet May 13, 2005 Multi-Channel Buffers Features The EL5129 and EL5329 integrate multiple gamma buffers and a single VCOM buffer for use in large panel LCD displays of 10” and greater. The EL5129 integrates 6 gamma channels and the EL5329 integrates 10 gamma channels. Half of the gamma channels in each device are designed to swing to the upper supply rail, with the other half designed to swing to the lower rail. The output capability of each channel is 10mA continuous, with 120mA peak. The gamma buffers feature a 10MHz 3dB bandwidth specification and a 9V/µs slew rate. • Multiple gamma buffers - 6 channels (EL5129) - 10 channels (EL5329) The VCOM amplifier is designed to swing from rail to rail. The output current capability of the VCOM in the EL5129 and EL5329 is 30mA continuous, 150mA peak and a slew rate of 10V/µs. Ordering Information PART NUMBER PACKAGE FN7430.1 • Single VCOM amplifier • Low supply current - 3.5mA (EL5129) - 5.5mA (EL5329) • For higher speed or higher output power, see the EL5x24 family • Pb-free available (RoHS compliant) Applications • TFT-LCD monitors • LCD televisions TAPE & REEL PKG DWG. # EL5129IRE 20-Pin HTSSOP - MDP0048 EL5129IRE-T7 20-Pin HTSSOP 7” MDP0048 EL5129IRE-T13 20-Pin HTSSOP 13” MDP0048 EL5129IREZ (See Note) 20-Pin HTSSOP (Pb-free) - MDP0048 EL5129IREZ-T7 (See Note) 20-Pin HTSSOP (Pb-free) 7” MDP0048 EL5129IREZ-T13 (See Note) 20-Pin HTSSOP (Pb-free) 13” MDP0048 EL5129IRZ (See Note) 20-Pin TSSOP (Pb-free) - MDP0044 EL5129IRZ-T7 (See Note) 20-Pin TSSOP (Pb-free) 7” MDP0044 EL5129IRZ-T13 (See Note) 20-Pin TSSOP (Pb-free) 13” MDP0044 EL5329IREZ (See Note) 28-Pin HTSSOP (Pb-free) - MDP0048 EL5329IREZ-T7 (See Note) 28-Pin HTSSOP (Pb-free) 7” MDP0048 EL5329IREZ-T13 (See Note) 28-Pin HTSSOP (Pb-free) 13” MDP0048 EL5329IRZ (See Note) 28-Pin TSSOP (Pb-free) - MDP0044 EL5329IRZ-T7 (See Note) 28-Pin TSSOP (Pb-free) 7” MDP0044 EL5329IRZ-T13 (See Note) 28-Pin TSSOP (Pb-free) 13” MDP0044 • Industrial flat panel displays NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-352-6832 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005. All Rights Reserved All other trademarks mentioned are the property of their respective owners. EL5129, EL5329 Pinouts EL5129 (20-PIN TSSOP, HTSSOP) TOP VIEW EL5329 (28-PIN TSSOP, HTSSOP) TOP VIEW 20 VS+ VS+ 1 28 VS+ OUT1 2 19 IN1 NC 2 27 NC OUT2 3 18 IN2 OUT1 3 26 IN1 OUT3 4 17 IN3 OUT2 4 25 IN2 16 IN4 OUT3 5 24 IN3 15 IN5 OUT4 6 23 IN4 OUT5 7 14 IN6 OUT5 7 NC 8 13 NC OUT6 8 12 INCOM OUT7 9 20 IN7 11 VS- OUT8 10 19 IN8 OUT9 11 18 IN9 OUT10 12 17 IN10 VS+ 1 OUT4 5 OUT5 6 THERMAL PAD* OUTCOM 9 VS- 10 * THERMAL PAD CONNECTED TO PIN 10 OR 11 (VS-) OUTCOM 13 VS- 14 THERMAL PAD* 22 IN5 21 IN6 16 INCOM 15 VS- * THERMAL PAD CONNECTED TO PIN 14 OR 15 (VS-) 2 FN7430.1 May 13, 2005 EL5129, EL5329 Absolute Maximum Ratings (TA = 25°C) Supply Voltage between VS+ and VS- . . . . . . . . . . . . . . . . . . . .+18V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . VS- -0.5V, VS+ +0.5V Maximum Continuous Output Current (VOUT0-9) . . . . . . . . . . 15mA Maximum Continuous Output Current (VOUTA). . . . . . . . . . . 100mA Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . +125°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications PARAMETER VS+ = +15V, VS- = 0, RL = 10kΩ, CL = 10pF to 0V, TA = 25°C unless otherwise specified DESCRIPTION CONDITIONS MIN TYP MAX UNIT 20 mV INPUT CHARACTERISTICS (REFERENCE BUFFERS) VOS Input Offset Voltage VCM = 0V 2 TCVOS Average Offset Voltage Drift (Note 1) 5 IB Input Bias Current VCM = 0V 2 RIN Input Impedance 10 MΩ CIN Input Capacitance 1.35 pF AV Voltage Gain 1V ≤ VOUT ≤ 14V CMIR Input Voltage Range µV/°C 50 nA 0.992 1.008 V/V EL5129, IN1 to IN3 1.5 VS+ V EL5329, IN1 to IN5 1.5 VS+ V EL5129, IN4 to IN6 0 VS+ -1.5 V EL5329, IN6 to IN10 0 VS+ -1.5 V INPUT CHARACTERISTICS (VCOM BUFFER) VOS Input Offset Voltage VCM = 7.5V 1 TCVOS Average Offset Voltage Drift (Note 1) 3 IB Input Bias Current VCM = 7.5V 2 RIN Input Impedance 10 MΩ CIN Input Capacitance 1.35 pF VREG Load Regulation CMIRCOM Input Voltage Range VCOM VCOM = 7.5V, -60mA < IL < 60mA 20 mV µV/°C 50 nA -20 +20 mV 0 VS+ V OUTPUT CHARACTERISTICS (REFERENCE BUFFERS) VOH High Output Voltage - EL5129 & EL5329 (Output 1) VIN = 15V, IO = 5mA High Output Voltage - EL5129 (Output 2, 3), EL5329 (Output 2-5) VOL 14.85 14.9 V 14.8 14.85 V 13.45 13.5 V High Output Voltage - EL5129 (Output 4-6), EL5329 (Output 6-10) VIN = 13.5V, IO = 5mA Low Output Voltage - EL5129 (Output 1-3), EL5329 (Output 1-5) VIN = 1.5V, IO = 5mA 1.5 1.55 V Low Output Voltage - EL5129 (Output 4-5), EL5329 (Output 6-9) VIN = 0V, IO = 5mA 150 200 mV 100 150 mV Low Output Voltage - EL5129 (Output 6), EL5329 (Output 10) ISC Short Circuit Current 3 100 120 mA FN7430.1 May 13, 2005 EL5129, EL5329 Electrical Specifications PARAMETER VS+ = +15V, VS- = 0, RL = 10kΩ, CL = 10pF to 0V, TA = 25°C unless otherwise specified (Continued) DESCRIPTION CONDITIONS MIN TYP 14.85 14.9 MAX UNIT OUTPUT CHARACTERISTICS (VCOM BUFFER) VOH High Level Saturated Output Voltage VS+ = 15V, IO = -5mA, VI = 15V VOL Low Level Saturated Output Voltage VS+ = 15V, IO = -5mA, VI = 0V ISC Short Circuit Current 0.1 V 0.15 V 150 170 mA Reference buffer VS from 5V to 15V 50 80 dB VCOM buffer, VS from 5V to 15V 55 80 dB POWER SUPPLY PERFORMANCE PSRR IS Power Supply Rejection Ratio Total Supply Current EL5129 3.5 4.5 mA EL5329 5.5 7 mA DYNAMIC PERFORMANCE (BUFFER AMPLIFIERS) SR Slew Rate (Note 2) tS Settling to +0.1% (AV = +1) BW -3dB Bandwidth CS Channel Separation 5 9 V/µs 500 ns RL = 10kΩ, CL = 10pF 10 MHz f = 5MHz 75 dB 10 V/µs (AV = +1), VO = 2V step EL5129 & EL5329 DYNAMIC PERFORMANCE (VCOM AMPLIFIERS) SR Slew Rate (Note 2) -4V ≤ VOUT ≤ 4V, 20% to 80% tS Settling to +0.1% (AV = +1) (AV = +1), VO = 2V step 350 ns BW -3dB Bandwidth RL = 10kΩ, CL = 10pF 15 MHz CS Channel Separation f = 5MHz 75 dB 7 NOTES: 1. Measured over operating temperature range 2. Slew rate is measured on rising and falling edges 4 FN7430.1 May 13, 2005 EL5129, EL5329 Pin Descriptions EL5129 EL5329 PIN NAME PIN FUNCTION 1, 20 1, 28 VS+ 2 3 OUT1 Output gamma channel 1 3 4 OUT2 Output gamma channel 2 4 5 OUT3 Output gamma channel 3 5 6 OUT4 Output gamma channel 4 6 7 OUT5 Output gamma channel 5 Output gamma channel 6 Positive supply voltage 7 8 OUT6 8, 13 2, 27 NC 9 13 OUTCOM 10, 11 14, 15 VS- 12 16 INCOM 14 21 IN6 Input gamma channel 6 15 22 IN5 Input gamma channel 5 16 23 IN4 Input gamma channel 4 17 24 IN3 Input gamma channel 3 18 25 IN2 Input gamma channel 2 19 26 IN1 Input gamma channel 1 No connect Output, VCOM Negative supply Input, VCOM 9 OUT7 Output gamma channel 7 10 OUT8 Output gamma channel 8 11 OUT9 Output gamma channel 9 12 OUT10 Output gamma channel 10 17 IN10 Input gamma channel 10 18 IN9 Input gamma channel 9 19 IN8 Input gamma channel 8 20 IN7 Input gamma channel 7 5 FN7430.1 May 13, 2005 EL5129, EL5329 Block Diagram VS+ EL5129 COLUMN DRIVER VCOM Typical Performance Curves 5 10 VS=±7.5V CL=10pF 6 1 RL=1kΩ -1 RL=562Ω -3 -5 100 10K 100K 1M 10M 100M FREQUENCY (Hz) FIGURE 1. FREQUENCY RESPONSE FOR VARIOUS RLOAD (BUFFER) 6 CL=47pF 2 -2 CL=12pF -6 RL=150Ω 1K CL=100pF RL=10kΩ GAIN (dB) GAIN (dB) 3 VS=±7.5V RL=10kΩ -10 1K 10K 100K 1M 10M 100M 1G FREQUENCY (Hz) FIGURE 2. FREQUENCY RESPONSE FOR VARIOUS CLOAD (BUFFER) FN7430.1 May 13, 2005 EL5129, EL5329 Typical Performance Curves (Continued) VS=±7.5V RL=10kΩ CL=8pF VS=±7.5V RL=10kΩ CL=8pF VIN 2V/DIV 50mV/DIV VOUT VOUT 1µs/DIV 100ns/DIV FIGURE 3. LARGE SIGNAL TRANSIENT RESPONSE (BUFFER) FIGURE 4. SMALL SIGNAL TRANSIENT RESPONSE (BUFFER) 20 VS=±7.5V RL=1kΩ 0 CL=1.5pF 100 PSRR (dB) VOLTAGE NOISE (nV/√Hz) VS=±7.5V -20 PSRR+ -40 PSRR-60 10 10K 100K 1M 10M -80 1K 100M 10K FREQUENCY (Hz) 100K 1M 10M FREQUENCY (Hz) FIGURE 5. INPUT NOISE SPECIAL DENSITY vs FREQUENCY (BUFFER) FIGURE 6. PSRR vs FREQUENCY (BUFFER) 5 60 VS=±7.5V RL=10kΩ 50 VOPP=1V VS=±7.5V CL=10pF 3 40 GAIN (dB) VOLTAGE NOISE (nV/√Hz) VIN 30 RL=10kΩ RL=1kΩ 1 RL=562Ω -1 20 -3 10 0 0 500 1K 1.5K 2K CLOAD (pF) FIGURE 7. OVERSHOOT vs CAPACITANCE LOAD (BUFFER) 7 -5 100 RL=150Ω 1K 10K 100K 1M 10M 100M FREQUENCY (Hz) FIGURE 8. FREQUENCY RESPONSE FOR VARIOUS RLOAD (VCOM) FN7430.1 May 13, 2005 EL5129, EL5329 Typical Performance Curves 10 (Continued) 10 VS=±7.5V RL=10kΩ CL=100pF 6 VS=±7.5V RL=1kΩ 6 2 -2 GAIN (dB) GAIN (dB) CL=47pF CL=47pF CL=12pF -6 -10 1K CL=100pF 2 -2 CL=12pF -6 10K 100K 1M 10M 100M -10 1K 1G 10K 100K FREQUENCY (Hz) 1M 10M 100M FREQUENCY (Hz) FIGURE 9. FREQUENCY RESPONSE FOR VARIOUS CLOAD (VCOM) VS=±7.5V RL=10kΩ CL=8pF FIGURE 10. FREQUENCY RESPONSE FOR VARIOUS CLOAD (VCOM) VS=±7.5V RL=10kΩ CL=8pF VIN 2V/DIV VOUT 1µs/DIV 100ns/DIV FIGURE 11. LARGE SIGNAL TRANSIENT RESPONSE (VCOM) FIGURE 12. SMALL SIGNAL TRANSIENT RESPONSE (VCOM) -20 VS=±7.5V VOLTAGE NOISE (nV/√Hz) VS=±7.5V RL=1kΩ 0 CL=1.5pF PSRR (dB) VIN 50mV/DIV VOUT -20 PSRR+ -40 PSRR-60 -80 1K 1G 10K 100K 1M FREQUENCY (Hz) FIGURE 13. PSRR vs FREQUENCY (VCOM) 8 10M 100 10 10K 100K 1M 10M 100M FREQUENCY (Hz) FIGURE 14. INPUT NOISE SPECIAL DENSITY vs FREQUENCY (VCOM) FN7430.1 May 13, 2005 EL5129, EL5329 Typical Performance Curves (Continued) 1K 50 OUTPUT IMPEDANCE (Ω) OVERSHOOT (%) VS=±7.5V RL=10kΩ 40 VOPP=1V 30 20 10 0 0 200 400 600 VS=±5V 100 10 BUFFER VCOM 1 0 1K 800 10K CLOAD (pF) 0 VS=±7.5V RL=10kΩ 700 CL=8pF VS=±5V -10 AV=+1 RL=1kΩ -20 FREQ=200kHz THD (dB) BUFFER 600 VCOM 500 400 -30 -40 BUFFER -50 -60 300 200 10M FIGURE 16. OUTPUT IMPEDANCE vs FREQUENCY 800 VCOM -70 2 3 4 5 -80 6 1 2 3 4 STEP SIZE (+V) 909mW 0.8 0.7 833mW θJA=110°C/W 800mW TSSOP28 θJA=120°C/W 0.6 HTSSOP20 0.5 0.4 θJA=125°C/W TSSOP20 0.3 θJA=140°C/W 0.2 0.1 0 0 25 75 85 100 50 125 150 AMBIENT TEMPERATURE (°C) FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE 9 9 8 10 3.5 HTSSOP28 714mW 7 JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD - HTSSOP EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 POWER DISSIPATION (W) 1 6 FIGURE 18. TOTAL HARMONIC DISTORTION vs OUTPUT VOLTAGE JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.9 5 VOPP (V) FIGURE 17. SETTLING TIME vs STEP SIZE POWER DISSIPATION (W) 1M FREQUENCY (Hz) FIGURE 15. OVERSHOOT vs CAPACITANCE LOAD (VCOM) SETTLING TIME (ns) 100K HTSSOP28 3.333W 3 θJA=30°C/W 2.5 2.857W HTSSOP20 θJA=35°C/W 2 1.5 1.333W TSSOP28 θJA=75°C/W 1 1.111W TSSOP20 θJA=90°C/W 0.5 0 0 25 50 75 85 100 125 150 AMBIENT TEMPERATURE (°C) FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FN7430.1 May 13, 2005 EL5129, EL5329 Description of Operation and Application Information Product Description The EL5129 and EL5329 are fabricated using a high voltage CMOS process. They exhibit rail to rail input and output capability and have very low power consumption. When driving a load of 10K and 12pF, the buffers have a -3dB bandwidth of 10MHz and exhibit 9V/µs slew rate. The VCOM amplifier has a -3dB bandwidth of 12MHz and exhibit 10V/µs slew rate. Input, Output, and Supply Voltage Range The EL5129 and EL5329 are specified with a single nominal supply voltage from 5V to 15V or a split supply with its total range from 5V to 15V. Correct operation is guaranteed for a supply range from 4.5V to 16.5V. The input common-mode voltage range of the EL5129 and EL5329 within 500mV beyond the supply rails. The output swings of the buffers and VCOM amplifier typically extend to within 100mV of the positive and negative supply rails with load currents of 5mA. Decreasing load currents will extend the output voltage even closer to each supply rails. maximum junction temperature for the application to determine if load conditions need to be modified for the buffer to remain in the safe operating area. The maximum power dissipation allowed in a package is determined according to: T JMAX - T AMAX P DMAX = -------------------------------------------Θ JA where: • TJMAX = Maximum junction temperature • TAMAX = Maximum ambient temperature • θJA = Thermal resistance of the package • PDMAX = Maximum power dissipation in the package The maximum power dissipation actually produced by an IC is the total quiescent supply current times the total power supply voltage, plus the power in the IC due to the loads, or: P DMAX = V S × I S + Σi × [ ( V S + – V OUT i ) × I LOAD i ] + ( V S + – V OUT ) × I LA when sourcing, and: Output Phase Reversal The EL5129 and EL5329 are immune to phase reversal as long as the input voltage is limited from VS- -0.5V to VS+ +0.5V. Although the device's output will not change phase, the input's over-voltage should be avoided. If an input voltage exceeds supply voltage by more than 0.6V, electrostatic protection diode placed in the input stage of the device begin to conduct and over-voltage damage could occur. Output Drive Capability The EL5129 and EL5329 do not have internal short-circuit protection circuitry. The buffers will limit the short circuit current to ±120mA and the VCOM amplifier will limit the short circuit current to ±170mA if the outputs are directly shorted to the positive or the negative supply. If the output is shorted indefinitely, the power dissipation could easily increase such that the part will be destroyed. Maximum reliability is maintained if the output continuous current never exceeds ±15mA for the buffers and ±100mA for the VCOM amplifier. These limits are set by the design of the internal metal interconnections. The Unused Buffers It is recommended that any unused buffers should have their inputs tied to ground plane. P DMAX = V S × I S + Σi × [ ( V OUT i – V S - ) × I LOAD i ] + ( V OUT – V S - ) × I LA when sinking. where: • i = 1 to total number of buffers • VS = Total supply voltage of buffer and VCOM • ISMAX = Total quiescent current • VOUTi = Maximum output voltage of the application • VOUT = Maximum output voltage of VCOM • ILOADi = Load current of buffer • ILA = Load current of VCOM If we set the two PDMAX equations equal to each other, we can solve for the RLOAD's to avoid device overheat. The package power dissipation curves provide a convenient way to see if the device will overheat. The maximum safe power dissipation can be found graphically, based on the package type and the ambient temperature. By using the previous equation, it is a simple matter to see if PDMAX exceeds the device's power derating curves. Power Dissipation With the high-output drive capability of the EL5129 and EL5329, it is possible to exceed the 125°C “absolutemaximum junction temperature” under certain load current conditions. Therefore, it is important to calculate the 10 FN7430.1 May 13, 2005 EL5129, EL5329 Power Supply Bypassing and Printed Circuit Board Layout As with any high frequency device, good printed circuit board layout is necessary for optimum performance. Ground plane construction is highly recommended, lead lengths should be as short as possible, and the power supply pins must be well bypassed to reduce the risk of oscillation. For normal single supply operation, where the VS- pin is connected to ground, one 0.1µF ceramic capacitor should be placed from the VS+ pin to ground. A 4.7µF tantalum capacitor should then be connected from the VS+ pin to ground. One 4.7µF capacitor may be used for multiple devices. This same capacitor combination should be placed at each supply pin to ground if split supplies are to be used. Important Note: The metal plane used for heat sinking of the device is electrically connected to the negative supply potential (VS-). If VS- is tied to ground, the thermal pad can be connected to ground. Otherwise, the thermal pad must be isolated from any other power planes. 11 FN7430.1 May 13, 2005 EL5129, EL5329 TSSOP Package Outline Drawing 12 FN7430.1 May 13, 2005 EL5129, EL5329 HTSSOP Package Outline Drawing NOTE: The package drawing shown here may not be the latest version. To check the latest revision, please refer to the Intersil website at <http://www.intersil.com/design/packages/index.asp> All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 13 FN7430.1 May 13, 2005