2016 Edition Optical Gauge Series Optical NanoGauge / Optical MicroGauge Optical NanoGauge NEW C13027 C11295 P6 Ultrathin film measurement with high speed 10 nm C10178 P14 P12 Extensibility type for research laboratory Multipoint measurement Glass 100 μm 20 nm Glass 100 μm 20 nm Glass 50 μm 0.5 μm 300 μm Glass 25 μm Glass 2900 μm Sample thickness 100 nm 1 μm 10 μm Optical NanoGauge C10323 Microscope type NanoGauge P16 100 μm 1 mm Optical MicroGauge C12562 Embedded type in 1Box unit P10 C11011 P18 Thick film measurement with high speed * The refractive indices in this catalog are 1.5 for glass and 3.67 for silicon. Roll-to-roll film production Example: In-line measurement settings for film coating system Optical MicroGauge Thickness measurement system C11011 Optical NanoGauge Thickness measurement system C12562/C13027 Multipoint NanoGauge Thickness measurement system C11295 Cutting, Roll-up Coating layer Plastic film, Bonding layer, ITO, Wet film Measurement after drying and curing Drying, Curing Coating, Deposition (PVD/CVD) Film thickness, Coated layer thickness, Total thickness Let-off Example: In-line measurement settings for PVD/CVD system Multipoint NanoGauge Thickness measurement system C11295 Flange Reflectivity measurement Transmission measurement Chromaticity Film thickness measurement Evaporation film (PVD/CVD) ITO, SiOx, NbO Both surface analysis Vacuum chamber Inside/outside of vacuum chamber is isolated by vacuum flange. Inside vacuum chamber, up to 15 vacuum fibers with 3 m max length can be installed. Max. 15 points * Please consult us for more details. Vacuum conditions - Vacuum level: 10-5 Pa - Environment temp: Less than +80 ˚C Transmittance measurement is available. * The bending radius of the fiber in a vacuum is R100 mm or more. High measurement stability for focus and angular fluctuations No difficulty involved in designing a measurement system Short down time for maintenance No adjustment jig necessary Angular fluctuation Defocus Stability for focus Stability for angular fluctuations 700 nm SiO2 film measurement example 700 nm SiO2 film measurement example Focus dependence versus reference point: ±3 mm (1 mm pitch), WD of reference point: 10 mm Position Optical NanoGauge Typical thickness measuring device -3 mm 701.59 nm 698.39 nm -2 mm 701.63 nm 699.92 nm -1 mm 701.66 nm 701.13 nm Reference point 701.65 nm 702.37 nm +1 mm 701.66 nm 703.51 nm +2 mm 701.67 nm 704.74 nm +3 mm 701.65 nm 705.91 nm Angular dependence versus reference point: 0 degrees to 5 degrees, WD of reference point: 10 mm Variation amount (nm) Variation amount (nm) 3 2 1 Amount of vertical movement (mm) 0 -3 -2 -1 0 1 2 3 -1 -2 -3 Optical NanoGauge Typical thickness measuring device At a vertical movement of 6 mm, the Optical NanoGauge has variations below Cost reduction 0.1 nm, while a typical thickness measuring device exhibits variations up to 8 nm. Incident angle Optical NanoGauge Typical thickness measuring device 0 degrees 702.23 nm 702.47 nm 3 degrees 702.29 nm 703.70 nm 5 degrees 702.62 nm 709.38 nm 10 8 6 Optical NanoGauge Typical thickness measuring device 4 2 0 -2 0 3 5 Incident angle (degrees) During angular movement from 0 degrees to 5 degrees, the Optical NanoGauge has variations 0.39 nm (0.047 %) while a typical thickness measuring device exhibits variations up to 5 nm or more. 3 Example applications The Optical Gauge series can be used in each process in a variety of manufacturing settings. Highly functional films are becoming ever more essential to cutting-edge industries that make liquid crystal displays, rechargeable batteries, solar panels, and a host of other products. To boost the performance and productivity of those products Hamamatsu offers a full line-up of inspection and testing equipment. Touch panel A touch panel is the key factor in today's hottest digital products such as smart phones, tablets, digital cameras' liquid crystal displays, and advanced gaming systems. Although there are various detection schemes for touch panels, the resistive film manufacturing process is used here as an example to show how the Optical Gauge series is used in such a process. Semiconductor Film production pre-process Dissolving raw materials Flow casting Longitudinal stretching Transverse stretching Thermal treatment and Roll-up C11011 C11011 C11011 C11011 C12562 C12562 C11011 Glass substrate production process (Electrostatic Capacitive touch panel) Receiving substrate ITO Patterning Etching Backside ITO Patterning Neighboring circuit making C11011 C13027/C11295 C13027/C11295 C13027/C11295 Wafer production process Ingot production Cut ingot Pre-process Photoresist coating Wafer polishing Wafer oxidizing The Optical Gauge series is used in the various manufacturing processes of semiconductor devices in which metal wiring is more multilayered, processes are increasingly miniaturized, and lower voltage is used. This contributes to improvement in the yield and shortens the time required to start a process. Lithography Etching C13027/C11295 C13027/C11295 Silicon Oxidizing, planarization Diffusion, Coating Repeat C11011 Ion implantation Cleaning Repeat Film C13027/C11295 Secondary battery Electrode plate production Electrode coil winding Coating The demand for secondary batteries, such as lithium ion, is rapidly increasing not only due to their use in personal computers and cell phones, but also with the development of electric vehicles and hybrid electric vehicles. The research and development of more efficient products are ongoing. The Optical Gauge series can be used in a wide range of processes in the manufacture of secondary batteries, contributing to promoting shorter tact time. FPD Roll press Crush/mixture Slitter Drying C10178 C10178 C11011 For NIR model C10178 C11011 For NIR model Color filter process Glass substrate Coating Inspection, Repair Resist coating Cleaning C11011 C11011 For NIR model Array process The Optical Gauge series can be used in a wide range of processes in the manufacture of FPD(flat-panel display) such as liquid crystal, LED, organic EL, VFD fluorescent display tube and plasma display. Separator Drying Color filter substrate Alignment film production process coating Rubbing Etching C10323 C13027/C11295 C13027/C11295 For transmission measurement model PV Solar power generation is expanding continuously as a growing industry for the reduction of greenhouse gas emissions and other features. Also, many companies are engaging in research for improving the conversion efficiency of the solar cell or modules used in power generation. The Optical Gauge series can be used in a wide range of processes in the manufacture of solar cell or modules. Crystalline silicon PV production process Silicon ingot Texture formation C11011 AR coat formation Electrode formation Heat sintering C13027/C11295 CIGS PV production process Glass substrate C11011 4 Silicon slice Cleaning MO electrode formation Patterning Cu-Ga film formation In film formation Film Coating film Plastic film Object color Film production back end process Preprocessing for coatings Coating Drying and Curing Let-off Cutting and Roll-up C13027/C12562/C11295 C11011 AR coating, PET, Coating layer, PE, PMMA Coating film, Evaporation film, Functionality film, Ag Nanowire Acrylic resin, Video head C11011 C12562 C12562 Etching Semiconductor material Production process Glass substrate production process Heat-sealing Neighboring circuit making Film on a wafer Thin film Bonding film Inspection C13027/C11295 C11011 C12562 Metal-oxide coating such as SiO2, SiC, Si and TiO2 Nitride coating, Wet film, Resist coating Polished silicon, Optical disk, DLC, Carbon Flexible printed substrate Back end process Electrode formation Wafer inspection Wafer polishing Wafer dicing Wire bonding Product inspection Multipoint measurement Simultaneous measurement in multiple chamber In-line, in-situ measurement of APC Mold Tester Stealth dicing C11011 C11011 C12562 Assembly process Stacking Micro measurement Inspection process Discharge and charge Patterned semiconductor Patterned FPD MEMS Sorting Metal-oxide coating such as TiO2 Film with filler Resist coating, Oxide film, Nitrogen film Cell process Module process Alignment film Spacer coating spraying Seal material coating C13027/C11295 Sealing Bonding LC implantation Sealing Bonding polarizing plate Mount backlight Dynamic operating inspection FPD Film thickness and color measurement of flat panel C11011 Mapping measurement Quality control inspection Cell gap, Organic EL film, Alignment film, TFT, Ag Nanowire ITO, MgO, Resist film on glass substrate Polyimide, High-functioning film and Color film for FPD Modularization In-situ measurement Film formation process monitor Dry and wet etching measurement Process feed gas C13027/C11295 CIGS film formation CdS buffer layer formation Patterning Transparent electrode formation Patterning Sealing Quality control inspection Film formation process Process exhaust gas Metal-oxide coating such as SiO2 and Si C13027/C11295 C13027/C11295 5 NEW Optical NanoGauge Thickness measurement system C13027 This new model supports connections to a PLC and easily installs in production equipment Ultrathin film measurement with high speed The Optical NanoGauge Thickness measurement system C13027 is a non-contact film thickness measurement system utilizing spectral interferometry. The C13207 not only supports PLC connections but is also designed more compact than our other models for easy installation into equipment. Our Optical Gauge series is capable of measuring the thickness of extremely thin films down to 10 nm as well as covering a wide range of film thickness from 10 nm up to 100 μm. The Optical Gauge series also makes rapid measurements up to 200 Hz and so is ideal for measurements on high-speed production lines. 10 nm 100 μm Glass Measurable range 100 nm 1 μm 10 μm 100 μm 1 mm 10 nm to 100 μm thin film high speed measurement Feature 1 Feature 2 Feature 3 Feature 4 Feature 5 Feature 6 Supports PLC connections Shortening of cycle time (max. 200 Hz) Capable of measuring 10 nm thin films Simultaneously measure thickness and color Downsized (footprint reduced by 30 % compared to C12562) Covers broad wavelength range (400 nm to 1100 nm) Feature 7 Feature 8 Feature 9 Feature 10 Feature 11 Simplified measurement is added to the software Capable of both surface analysis Precise measurement of fluctuating film Analyze optical constants (n, k) Mapping function Specification Type number Measurement film thickness range (glass) *1 Measurement reproducibility (glass) *2 *3 Measurement accuracy *3 *4 0.02 nm ±0.4 % Light source Halogen light source Measurement wavelength range 400 nm to 1100 nm Spot size *3 Approx. φ1 mm Working distance *3 Number of measurable layers Analysis External communication interface Analog output Output signal Alarm output Warning output Input signal 10 mm Max. 10 layers FFT analysis, Fitting analysis, Optical constant analysis, Color analysis Measurement time *5 Measurement start signal Power supply voltage Power consumption Light guide connector shape 6 C13027-11 10 nm to 100 μm 3 ms/point RS-232C or Ethernet 0 V to 10 V / High impedance 3-channel (up to 3 layers) TTL / High impedance 1-channel TTL / High impedance 1-channel TTL / High impedance 1-channel AC 100 V to AC 240 V, 50 Hz/60 Hz Approx. 80 VA FC *1: When converted with the refractive index of glass = 1.5. *2: Standard deviation (tolerance) when measuring 400 nm thick glass film. *3: Depending on optical system or objective lens magnification to be used. *4: Range of measurement guarantee as recorded in the VLSI Standards measurement guarantee document. *5: Shortest exposure time Configuration example C13027 standard system (Off-line) C13027 standard system (In-line) Optical NanoGauge Thickness measurement system C13027 Standard Option Standard Option Data analyzer Film thickness measurement software Sample Film thickness measurement software RS-232C/Ethernet Sample Sample stage Monitor, keyboard and mouse Manufacturing equipment (i.e., etching or film forming equipment) Optical NanoGauge Thickness measurement system C13027 Option Sample stage for Optical NanoGauge A10192-10 Data analyzer Laptop type C10471-21 Sample stage FC connector type for VIS A10192-05 Mapping stage φ200 mm C8126-31 Mapping stage φ300 mm C8126-32 This stage accommodates samples up to φ200 mm in diameter. Light condenser not included. This is a pen type model of the A10192-04, designed to view samples more easily. WD: approx. 10 mm Measurement spot diameter: φ1 mm Conventional model A10192-04 is available. (Refer to page 11) This stage accommodates samples up to φ200 mm in diameter. It comes with a visible-light condenser lens with corrected chromatic aberration. WD: approx. 35 mm Measurement spot diameter: φ1.5 mm Macro optics FC connector type for VIS A10191-03 Laptop type data analyzer is available as an option. Measurement time: 2 s/point Measurement area: Up to 140 mm square (C8126-31) <4 inch to 8 inch wafer> : Up to 200 mm square (C8126-32) <4 inch to 12 inch wafer> Stage movement resolution: 0.1 mm Stage movement repeatability: ±0.01 mm FC Receptacle A12187-02 This receptacle is a tool for setting a fiber probe in a mount. Visible light condenser lens for A10192-05. WD: approx. 35 mm Measurement spot diameter: φ1.5 mm Lamp unit L12839-01 This receptacle lamp unit for C12562 and C13027. Film thickness measurement software for both surface U12708-01 Analysis software for both surface. (Unit: mm) Main unit (Approx. 4.7 kg) Two split light guide * The bending radius of the fiber is R75 mm or more. 123.5±1 D95P connector 6 φ20 SUS-acceptable light tube 333±1 202±1 FC connector φ12 Sample stage for Optical NanoGauge A10192-10 φ10 Dimensional outline +50 +200 5000 -0 10±1 8±1 148±1 200 -0 75±1 150±1 130±1 280±1 7 Principle Spectral interferometry is used to measure film thickness. When light enters a thin film sample, multiple reflections occur inside the thin film. These multiple-reflection light waves boost or weaken each other along with their phase difference. The phase difference of each multiple-reflection light is determined by the light wavelength and optical path length (= distance that light moves back and forth in the thin film multiplied by the film refractive index). The number of signals is increased as the film thickness becomes thick. The signal intervals in short wavelength range appears more often than those in the long wavelength range. Reflected light Phase difference Incident light This phase difference allows the spectrum reflected from or transmitted through the sample to produce a unique spectrum that depends on the film thickness. Spectral interferometry is a technique for measuring film thickness by analyzing that particular spectrum. The Optical NanoGauge utilizes spectral interferometry to analyze a target spectrum by the curve-fitting or FFT (Fast Fourier Transform) method that matches your application. Thin film Intensity Wavelength Intensity Wavelength Film Number of signal interval increased. Intensity Substrate Wavelength Analysis by curve fitting Thick film For measuring less than1 μm film thickness Interference spectrum measurement of transparent electrode (ITO film: 350 nm) Reflectivity (%) 80 Spectral reflection factor (measurable quantity) 60 Theoretical wave pattern The analyzed film thickness is the theoretical value, which is the least RMS (Root Mean Square) value of the theoretical wave pattern and measurement reflection pattern. 40 20 500 400 600 700 Wavelength (nm) 800 Analysis by FFT (Fast Fourier Transform) For measuring more than 1 μm film thickness 30 μm 25 22.5 Fourier transform 20 Intensity Reflectivity (%) Measurement of etalon (30 μm) 17.5 15 12.5 4.00 2.00 0.00 500 600 700 800 Wavelength (nm) 8 6.00 900 1000 0.1 1.0 10 Optical film thickness (μm) 100 Both surface analysis The analysis is performed using the film thickness measurement software for both surface U12708-01. (Patent pending) Both surface analysis for both-side-coated samples In some cases, a coating film is applied to the back side of thin film samples. If such both-side-coated samples are measured by an ordinary method, the fitting cannot be consistent as the effect of the film on the back side is not taken into account, and therefore accurate values cannot be obtained. In addition, if the thickness of the film on the back side changes, the system cannot follow the change during the measurement and this may largely affect measured values. Both-side-coated samples *For Optical NanoGauge Thickness measurement system C13027 and C12562 Film thickness Coating film on the surface: first layer 1 150 nm (n=2.0) 2 100 nm (n=1.5) 3 1000 nm (n=1.5) Coating film on the surface: second layer 100 μm (n=1.7) Coating film on the bottom surface Both side analysis Reflectivity Film thickness analysis result 1 150 nm 2 100 nm 3 1000 nm 600 800 Wavelength (nm) Standard measurement Measurable wave pattern (simulation) Theoretical wave pattern Film thickness analysis result Reflectivity Board 400 Since the Optical Gauge is equipped with the both surface analysis function as an option, which makes it possible to measure bothside-coated samples accurately measurement of both-side-coated samples. 1000 1 143.69 nm 2 119.25 nm 3 1120.00 nm 400 600 800 Wavelength (nm) Thickness of coating film not only on the surface but also on the back side is measured with high accuracy. 1000 Errors in measured values are large. *This is the result of a simulation using an analysis model. When the thickness of the coating film on the back side is increased by 100 nm 1 150 nm 2 100 nm 3 1100 nm 400 600 800 Wavelength (nm) 1000 Film thickness analysis result Reflectivity Reflectivity Film thickness analysis result 1 2 3 400 Thickness is measured with high accuracy, even back side film thickness is changed. 600 800 Wavelength (nm) 147.28 nm 120.06 nm 960.00 nm 1000 Measurement errors are large, and the values are inaccurate as changes in the coating film on the back side cannot be followed. *This is the result of a simulation using an analysis model. 9 Optical NanoGauge Thickness measurement system C12562 An integrated type designed for installation into equipment and ideal for measuring a wide diverse range of objects from thin films to substrates and more Embedded type in 1Box unit The Optical NanoGauge Thickness measurement system C12562 is a compact, space-saving, non-contact film thickness measurement system designed to easily install in equipment where needed. In the semiconductor industry, measuring silicon thickness is essential due to the spread of through-silicon via technology; and in the film production industry, adhesion layer films are being made ever thinner to meet product specifications. So these industries now require even higher accuracy in thickness measurements ranging from 1 μm to 300 μm. The C12562 allows making accurate measurements across a wide thickness range from 0.5 μm to 300 μm that include the thin film coating and film substrate thickness as well as the total thickness. The C12562 also offers rapid measurements up to 100 Hz making it ideal for measurements on high-speed production lines. 0.5 μm 300 μm Glass Measurable range 100 nm 1 μm 10 μm 100 μm 1 mm One unit measures a wide variety of materials from thin films to silicon substrates in thicknesses from 0.5 μm to 300 μm Feature 1 Feature 2 Feature 3 Feature 4 Makes measurement ranging from thin film thickness to the total thickness Shortening of cycle time (max. 100 Hz) Enhanced external triggers (accommodates high-speed measurement) Simplified measurement is added to the software Feature 5 Feature 6 Feature 7 Feature 8 Capable of both surface analysis Precise measurement of fluctuating film Analyze optical constants (n, k) External control available Specification Type number Measurement film thickness range (glass) *1 Measurement reproducibility (glass) *2 *3 0.2 nm Measurement accuracy *3 *4 ±0.4 % Light source Halogen light source Spot size *3 Approx. φ1 mm Working distance *3 Number of measurable layers Analysis Measurement time *5 External communication interface Power supply voltage Power consumption Light guide connector shape 10 C12562-04 500 nm to 300 μm 10 mm Max. 10 layers FFT analysis, Fitting analysis, Optical constant analysis 3 ms/point RS-232C, Ethernet AC 100 V to AC 240 V, 50 Hz/60 Hz Approx. 80 VA FC *1: When converted with the refractive index of glass = 1.5. *2: Standard deviation (tolerance) when measuring 1 μm thick glass film. *3: Depending on optical system or objective lens magnification to be used. *4: Range of measurement guarantee as recorded in the VLSI Standards measurement guarantee document. *5: Shortest exposure time Configuration example C12562 standard system (Off-line) C12562 standard system (In-line) Optical NanoGauge Thickness measurement system C12562 Standard Option OPTICAL NANO GAUGE USB3.0 USB2.0 LAN1 LAN2 Standard Option Film thickness measurement software Data analyzer C12562-01 MONITOR LIGHT POWER AUDIO LINE TRIG. IN SENSOR Film thickness measurement software Sample RS-232C/Ethernet OPTICAL NANO GAUGE Sample USB3.0 Sample stage USB2.0 LAN1 C12562-01 LAN2 MONITOR POWER AUDIO LIGHT LINE TRIG. IN SENSOR Manufacturing equipment (i.e., etching or film forming equipment) Monitor, keyboard and mouse Optical NanoGauge Thickness measurement system C12562 Option Sample stage FC connector type for VIS A10192-04 Macro optics FC connector type for VIS A10191-03 Sample stage FC connector type for VIS A10192-05 This receptacle is a tool for setting a fiber probe in a mount. Visible light condenser lens for A10192-05 WD: approx. 35 mm Measurement spot diameter: φ1.5 mm This stage accommodates samples up to φ200 mm in diameter. Light condenser not included. WD: approx. 10 mm Measurement spot diameter: φ1 mm Pen type model A10192-10 is available. (Refer to page 7) FC Receptacle A12187-02 This stage accommodates samples up to φ200 mm in diameter. It comes with a visible-light condenser lens with corrected chromatic aberration. WD: approx. 35 mm Measurement spot diameter: φ1.5 mm Lamp unit L12839-01 This receptacle lamp unit for C12562 and C13027. Film thickness measurement software for both surface U12708-01 Analysis software for both surface. (Unit: mm) Two split light guide USB3.0 USB2.0 LAN1 LAN2 MONITOR POWER AUDIO LIGHT 98.5±1 Optical NanoGauge C12562 LINE TRIG. IN SENSOR 408±1 150±1 10±1 FC connector φ12 183+30 (MAX) 53 (MIN) 27 2 (MIN) 52+30 (MAX) 8±1 Sample stage FC connector type for VIS A10192-04 75±1 SUS-acceptable light tube 6±2 292±1 D95P connector φ10 Main unit (Approx. 7.0 kg) φ20 Dimensional outline +50 200 -0 +200 5000 -0 * The bending radius of the fiber is R75 mm or more. 130±1 280±1 11 Optical NanoGauge Thickness measurement system Versatile standard type for basic research C10178 Extensibility type for research laboratory The Optical NanoGauge Thickness measurement system C10178 is a non-contact film thickness measurement system utilizing spectral interferometry. Film thickness is measured quickly with high sensitivity and high accuracy through spectral interferometry. As our photonic multichannel analyzer (PMA) is used as the detector, a variety of measurement items such as quantum yield, reflectance, transmittance and absorption can also be measured simultaneously while measuring film thickness of various optical filters, coating, etc. 50 μm 20 nm Glass Measurable range 100 nm 1 μm 10 μm 100 μm 1 mm Highly accurate and real time measurement of thin film from 20 nm to 50 μm thickness Feature 1 Feature 2 Feature 3 Feature 4 High speed and high accuracy 5 Real time measurement 6 Precise measurement of fluctuating film Analyze optical constants (n, k) Feature Feature External control available Quantum yield, reflectance, transmittance and absorption can be measured with specific accessories. Specification Type number visible absorption samples) Measurement film thickness range (glass) *1 20 nm to 50 μm 150 nm to 50 μm Measurement reproducibility (glass) *2 *3 0.01 nm 0.05 nm Measurement accuracy *3 *4 ±0.4 % ±0.4 % Light source Halogen light source Halogen light source Measurement wavelength range 400 nm to 1100 nm 900 nm to 1650 nm Spot size *3 Working distance *3 Number of measurable layers Analysis 10 mm Max. 10 layers FFT analysis, Fitting analysis, Optical constant analysis Measurement time *5 19 ms/point Yes (Option) Interface Power supply voltage Power consumption Light guide connector shape Spectral interferometry is used to measure film thickness. When light enters a thin film sample, the sample produces a unique spectrum that depends on the film thickness. Spectral interferometry is a technique for measuring film thickness by analyzing that particular spectrum. Reflected light Incident light Phase difference Intensity Thin film Wavelength Intensity Wavelength Approx. φ1 mm External control function External communication interface 12 C10178-03 (NIR: supports C10178-01 Film Substrate Number of signal interval increased. Intensity Wavelength Thick film RS-232C, PIPE, Ethernet USB 2.0 AC 100 V to AC 120 V/AC 200 V to AC 240 V, 50 Hz/60 Hz Approx. 230 VA Approx. 250 VA φ12 sleeve shape *1: When converted with the refractive index of glass = 1.5. *2: Standard deviation (tolerance) when measuring 400 nm thick glass film. *3: Depending on optical system or objective lens magnification to be used. *4: Range of measurement guarantee as recorded in the VLSI Standards measurement guarantee document. *5: Shortest exposure time Configuration example C10178 standard system Standard Option PMA-12 Photonic multichannel analyzer Two branch light guide VIS to NIR 2 m A10193-02 C10027 PHOTONIC MULTI-CHANNEL ANALYZER SIGNAL INPUT Data analyzer Laptop type C10471-01 Sample Halogen lamp L6758-11 Film thickness measurement software U10339-01 Sample stage Option Sample stage Sleeve type A10192-01 Macro optics This stage accommodates samples up to φ200 mm in diameter. Light condenser not included. Sleeve type for VIS A10191-01 Visible light condenser lens for A10192-02 Sleeve type for NIR A10191-02 IR condenser lens for A10192-03. Sample stage Sleeve type for VIS A10192-02 LED light source L11693-01 This stage accommodates samples up to φ200 mm in diameter. It comes with a visible-light condenser lens with corrected chromatic aberration. WD: approx. 35 mm, Measurement spot diameter: φ1.5 mm Wavelength: 420 nm to 720 nm Sample stage for NIR A10192-03 Data analyzer Laptop type C10471-01 This stage accommodates samples up to φ200 mm in diameter. It comes with a condenser lens covering the UV to near infrared light range. WD: approx. 35 mm, Measurement spot diameter: φ1.5 mm Dimensional outline Laptop type data analyzer is available as an option. (Unit: mm) Halogen lamp L6758-11 (Approx. 2.6 kg) PMA-12 Photonic multichannel analyzer (Approx. 5 kg) C10027 9.7±0.5 262±1 383±2 80 SIGNAL INPUT 130 99±1 C10028-01 (NIR model) 20 188 0 φ10 -0.1 φ7 50±0.2 0 φ10 -0.1 50±0.2 5 300 +100 0 5 +100 0 0.0 2000 50±0.2 5 05 0. 0.0 80±0.2 0.0 05 0. *Please refer to page 7 the dimensional outline of sample stage. φ18±0.2 0 433±2 φ12-0.05 262±1 85 Two split light guide VIS to NIR 2 m A10193-02 124±1 SIGNAL INPUT 15 C10028 9.7±0.5 PHOTONIC MULTI-CHANNEL ANALYZER φ9.2 PHOTONIC MULTI-CHANNEL ANALYZER 231 115 57.5 C10027-02 (Extensibility model for research laboratory) * The bending radius of the fiber is R150 mm or more. 13 Multipoint NanoGauge Thickness measurement system C11295 Multipoint measurement model for real time simultaneous measurements Multipoint measurement The Multipoint NanoGauge Thickness measurement system C11295 is a film thickness measurement system utilizing spectral interferometry. It is designed to measure film thickness as part of the semiconductor manufacturing process, as well as for quality control of the APC and films that are mounted on semiconductor manufacturing equipment. The C11295 performs real time multipoint measurements, and enabled simultaneous measurements in multiple chambers and multipoint measurement on the surface of a film. The C11295 can also measure the reflectance (transmittance), the color of the object, and the temporal change simultaneously with film thickness measurement. 20 nm 100 μm Glass Measurable range 100 nm 1 μm 10 μm 100 μm 1 mm Enables simultaneous measurements in multiple chambers in thin film production lines and multipoint measurements in film production lines Feature 1 Feature 2 Feature 3 Feature 4 Simultaneous film thickness measurement up to 15 points Reference-free operation Stable long-term measurement by correction of light intensity fluctuation Alarm and warning function (pass/fail) Feature 5 Feature 6 Feature 7 Feature 8 Feature 9 Feature 10 Specification Type number 20 nm to 100 μm Measurement reproducibility (glass) *3 *4 0.02 nm Measurement accuracy *4 *5 ±0.4 % Light source *6 Xenon light source Measurement wavelength range 320 nm to 1000 nm Spot size *4 Working distance *4 Number of measurable layers Analysis Measurement time *7 External interface Interface Power supply voltage Power consumption Light guide connector shape Measurement points 14 C11295-XX *1 Measurement film thickness range (glass) *2 Reflectance (transmittance) and spectrum measurements High speed and high accuracy Real time measurement Precise measurement of fluctuating film Analyze optical constants (n, k) External control available Spectral interferometry is used to measure film thickness. When light enters a thin film sample, the sample produces a unique spectrum that depends on the film thickness. Spectral interferometry is a technique for measuring film thickness by analyzing that particular spectrum. Reflected light Incident light Phase difference Intensity Approx. φ1 mm Intensity Wavelength 10 mm Max. 10 layers FFT analysis, Fitting analysis 19 ms/point Thin film Wavelength Film Substrate Number of signal interval increased. Intensity Wavelength Thick film Ethernet USB 2.0 (Main unit - Computer) RS-232C (Light source - Computer) AC 100 V to AC 240 V, 50 Hz/60 Hz Approx. 330 VA (2 ch) to Approx. 450 VA (15 ch) SMA 2 to 15 *1: -XX indicates the number of measurement points. *2: When converted with the refractive index of glass = 1.5. *3: Standard deviation (tolerance) when measuring 400 nm thick glass film. *4: Depending on optical system or objective lens magnification to be used. *5: Range of measurement guarantee as recorded in the VLSI Standards measurement guarantee document. *6: The halogen light source model is C11295-XXH. *7: Shortest exposure time Multipoint measurement method Concept view comparing multidetector and fiber branch method Multipoint NanoGauge Bifurcated fiber Typical thickness measuring device Light Multidetector method source Fiber branching method Analyzer Light source Analyzer Simultaneous measurement Multibranching fiber Measurement time difference occurs Measurement screen Film thickness monitor Color monitor Measurement mode selection film thickness / reflectance / transmittance Monitor screen Alarm and warning can be set to appear during monitoring Warning screen Measuring data Measurement value trend data Configuration example Option Data analyzer Laptop type C10471-21 C11295-03 standard system Laptop type data analyzer is available as an option. Standard Option Xenon Light source* POWER Data analyzer Laptop type C10471-21 Multipoint NanoGauge Thickness measurement system C11295 Film thickness measurement software Sample SMA Receptacle A12187-01 This receptacle is a tool for setting a fiber probe in a mount. * Available using halogen light model. Dimensional outline (Unit: mm) Light source light guide 308 (50.3) 20.3 30 4 500 +30 0 50 +50 0 1000 SMA connector Xenon Light source (Approx. 6.4 kg) φ8 φ4.8 * The bending radius of the fiber is R100 mm or more 12.7 30 Measurement light guide SMA connector 1000 +100 0 100 10 000 +200 0 SMA connector 110 142 16 39.5 232 311 39.5 φ4.8 φ4.8 16 5 158 227 φ20 36 φ6 -0.02 φ15 -0.10 123.5 0 442 φ26 -0.1 Main unit (Approx. 6 kg) * The bending radius of the fiber is R100 mm or more 15 Optical NanoGauge Thickness measurement system Microscopic type for measuring thin film in small area C10323 Microscope type NanoGauge The Optical NanoGauge Thickness measurement system C10323 is a microscopic thickness measurement systems. Objects with irregular surfaces that would produce high level of scattered light cannot be measured at the macro level. For these types of objects, measuring a small area reduces scattered light making measurement possible. Feature 1 Feature 2 Feature 3 Feature 4 Thickness measurement in micro field of view High speed and high accuracy Analyze optical constants (n, k) External control available 20 nm 50 μm Glass Measurable range 100 nm 1 μm 10 μm 100 μm 1 mm Highly accurate and real time measurement of thin film in micro field of view through microscope Specification Type number C10323-01 Measurement film thickness range (glass) *1 20 nm to 50 μm Measurement reproducibility (glass) *2 *3 0.02 nm Measurement accuracy *3 *4 Halogen light source Measurement wavelength range 400 nm to 1100 nm Working distance Number of measurable layers Analysis External control function External communication interface Interface Power supply voltage Power consumption When light enters a thin film sample, the sample produces a unique spectrum that depends on the film thickness. Spectral interferometry is a technique for measuring film thickness by analyzing that particular spectrum. ±0.4 % Light source Spot size *3 Spectral interferometry is used to measure film thickness. Reflected light Incident light Phase difference Intensity Intensity φ8 μm to φ80 μm Refer to objective lens list Max. 10 layers FFT analysis, Fitting analysis, Optical constant analysis Thin film Wavelength Wavelength Number of signal interval increased. Film Substrate Intensity Wavelength Thick film Yes (Option) RS-232C, PIPE or Ethernet USB 2.0 AC 100 V to AC 120 V/AC 200 V to AC 240 V, 50 Hz/60 Hz Approx. 265 VA *1: When converted with the refractive index of glass = 1.5. *2: Standard deviation (tolerance) when measuring 400 nm thick glass film. *3: Depending on optical system or objective lens magnification to be used. *4: Range of measurement guarantee as recorded in the VLSI Standards measurement guarantee document. Principle and advantages of microscopic system Samples which are difficult to measure with the conventional macro system, such as a wafer with irregular patterns and MEMS, can be measured with a microscopic system. Samples with irregular surfaces may not be able to be measured at the macro level due to high level of scattered light. In the micro measurement with a microscopic system, the measurement point can be narrowed down to a flat area with little scattered light, that makes measurement possible. Microscopic objective lens Scattered Scattered light light Scattered light Macro measurement 16 Micro measurement with microscope Configuration example Option Data analyzer Laptop type C10471-01 C10323-01 standard system Standard Option Monitor Laptop type data analyzer is available as an option. PMA-12 Photonic multichannel analyzer C10027-02 PMA-11 PHOTONIC MULTI-CHANNEL ANALYZER SIGNAL INPUT POWER Data analyzer Laptop type C10471-01 Objective lens 5× to 50× Microscopic sample stage A10407-01 Halogen lamp L6758-11 Film thickness measurement software Objective lens Lens 5× Measurement spot size φ80 μm NA 0.14 Working distance 37.5 mm 10× φ40 μm 0.26 30.5 mm 20× φ20 μm 0.40 20.0 mm 50× φ8 μm 0.42 17.0 mm Microscopic sample stage A10407-01 (Stage moving area: 75 mm × 50 mm) Microscopic sample stage for 6 inch wafer A10407-02 (Stage moving area: 150 mm × 150 mm) (Unit: mm) 227 181 140.5 25.5 Microscopic sample stage for 6 inch wafer A10407-02 205 129 362±5 251±5 111 186 174 A10406 630±10 Optical NanoGauge φ34 167±50 114±5 317 40 φ34 40±5 Microscopic sample stage A10407-01 84 134 262±5 (Approx. 15 kg) 134 Microscopic optics A10406-01 174 Dimensional outline 45 *Please refer to page 13 the dimensional outline of PMA-12 Photonic multichannel analyzer C10027-02 and halogen lamp L6758-11. Related products Micro optics A13097 Spot size can be narrowed down to cope with interface roughness, scattering samples, and uneven film thickness Specifications when C13027 Micro optics A13097-01 The A13097 is a micro-optical system for in-line film thickness measurement, designed to measure samples that are difficult or impossible to measure by a wide field of view. When used in combination with an Optical NanoGauge Thickness measurement system C13027 or C12562, the spot diameter can be narrowed down to 100 μm in diameter to allow measuring interface roughness as well as samples with high scattering and very small areas on patterns, which up until now have been difficult to measure. The A13097 is quite stable even when there are variations in height, and so gives reliable measurements at diverse manufacturing sites. A sample stage type is also provided for off-line applications. and A13097 are combined Measurement film thickness range (glass) *1 Measurement reproducibility (glass) *2 *3 Measurement accuracy *3 *4 0.1 μm to 100 μm 0.2 nm ±0.4% Light source Halogen light source Measurement wavelength range 700 nm to 1100 nm Spot size *3 Working distance *3 φ100 μm 32 mm Height fluctuation ±2 mm Maximum repetition frequency 200 Hz Measurement time *4 Light guide connector shape 3 ms/point FC *1: When converted with the refractive index of glass = 1.5. *2: Standard deviation (tolerance) when measuring 400 nm thick glass film. *3: Depending on optical system or objective lens magnification to be used. *4: With C13027 Micro optics A13097-11 17 Optical MicroGauge Thickness measurement system C11011 High speed measurement model compatible with in-line systems, capable of measuring up to 2.9 mm Thick film measurement with high speed The Optical MicroGauge Thickness measurement system C11011 series is a film thickness measurement system utilizing laser interferometry. High speed measurement at 60 Hz, applicable to in-line measurement in production. In addition, an optional mapping system can measure the thickness distribution of a given specimen. The C11011 can be used in a wide range of applications, such as product manufacture process monitoring or quality control. 25 μm 10 μm Measurable range 1 μm 10 μm 2200 μm 2900 μm Glass 900 μm 1200 μm Silicon 100 μm 1 mm High speed measurement of film, glass and wafer Feature 1 Feature 2 Feature 3 Measurement of non-transparent (white color) sample by infrared photometry High speed measurement at 60 Hz Measurement of pattern-formed wafer or wafer with protective film Feature 4 Feature 5 Feature 6 Long working distance Mapping function External control available Specification Type number C11011-01 C11011-01W Measurement film thickness range (glass) *1 25 μm to 2200 μm 25 μm to 2900 μm Measurement film thickness range (silicon) *2 10 μm to 900 μm Measurement reproducibility (silicon) *3 Measurement accuracy *3 Light source 10 μm to 1200 μm < 500 μm: ±0.5 μm, ≥ 500 μm: ±0.1 % Infrared LD (1300 nm) φ60 μm Working distance *4 155 mm Number of measurable layers Analysis Wafer 1-layer (Multilayer measurement possible) SiC coat, Si coat, Wet coat, Polished Si, Optical disk FPD Peak detection *5 External communication interface Interface Power supply voltage Power consumption 16.7 ms/point 22.2 ms/point Panel RS-232C or PIPE USB 2.0 (Main unit - Computer) AC 100 V to AC 240 V, 50 Hz/60 Hz Approx. 50 VA *1: Glass refractive index equivalent. *2: Silicon refractive index equivalent. *3: Standard deviation when measuring Silicon *4: Optional model with 1000 mm working distance is available. (Type number C11011-01WL) *5: Shortest exposure time 18 Film Optical film 100 nm Spot size Measurement time Semiconductor Wafer Si for PV panel Cell gap, Glass thickness, DLC, High-function film AR coating, PET, Coating layer, Coating film, Evaporation film, Functionality film Acrylic resin, Video head Configuration example C11011-01, -01W standard system Standard Option Optical fiber Probe head Standard C11011-01, -01W mapping system for measuring thickness distribution Wafer mapping software Optical MicroGauge Thickness measurement system C11011-01, -01W USB 2.0 Sample Etcher or Grinder Optical fiber Wafer mapping software Optical MicroGauge Thickness measurement system C11011-01, -01W Probe head Standard USB 2.0 Data analyzer C9025-02 RS-232C / PIPE Standard Option Data analyzer C9025-11 USB 2.0 Analysis method Use laser interferometry to measure film thickness. The probe head irradiates sample with near infrared light which reflects back from the film front surface. Some of the light transmits through the film and reflects back from the boundary on the opposite side. The controller internally processes each reflected light to detect the position where light was reflected or in other words the position on the film boundary. The controller then calculates the film thickness from the distance between the detected peaks. In-situ monitoring of thickness (during wet etching) Measurement data Thickness measurement data Thickness (μm) Principle Mapping stage C8126-21,-22 400 300 200 100 0 OPTICAL MICRO GAUGE C11011 Measurement of bonded wafer (multilayer) Power Probe head Incident light Reflected light from the boundary Distance between the peaks indicates film thickness Film Substrate 0 100 200 300 400 500 Time (second) Thickness distribution of a wafer Display from 70 μm to 76 μm Sample: 8-inch Si bare wafer (Protective film / after grinding process) Option Mapping stage φ200 mm C8126-21 Mapping stage φ300 mm C8126-22 Probe head Acid resistance A8653-02 Measurement time: 1 s/point Measurement area: to 140 mm square (C8126-21) (4 inch wafer to 8 inch wafer) : to 200 mm square (C8126-22) (4 inch wafer to 12 inch wafer) Stage movement resolution: 0.1 mm Stage movement repeatability: ±0.01 mm This probe head is surface-treated to make it acid-resistant and is recommended for use while mounted in wet etching equipment. Horizontal setting optics A9925-01 This optical system is designed to connect to the probe head and is useful when installing the probe head in narrow locations with little working distance. Data analyzer C9025-01 Desktop type data analyzer for the standard system Data analyzer C9025-02 Data analyzer for Mapping system C9025-11 Laptop type data analyzer for the standard system Desktop type data analyzer for the wafer mapping system Data analyzer for Mapping system C9025-12 Laptop type data analyzer for the wafer mapping system Dimensional outline (Unit: mm) Probe head Standard A8653-01 Main unit (Approx. 8.5 kg) WD=155±0.2 13.9 95.8±0.2 φ34±0.5 383±1 φ15±0.3 412±1 φ19±0.3 POWER 5.9±1 123.5±1 OPTICAL MICRO GAUGE C11011 Optical fiber (4 m) * The bending radius of the fiber is R30 mm or more. 19 Option Mapping stage C8126 series Mapping thickness distribution of wafer and thin film Compatible with Optical NanoGauge or Optical MicroGauge The Mapping Stage C8126 series is a mapping system that performs wafer and film in-plane thickness distribution measurement when combined with any one of the various Optical Gauge series. The C8126 can be used for examination of in-plane uniformity of etching and grinding property and for quality control purpose. Feature Type number Mapping stage φ200 mm C8126-21 Mapping stage φ300 mm C8126-22 Mapping stage φ200 mm C8126-31 Mapping stage φ300 mm C8126-32 Measurable range Wafer (inch) 1 Compatible with NanoGauge / MicroGauge Film (mm) Feature 2 4 to 8 < 140 × 140 4 to 12 < 200 × 200 4 to 8 < 140 × 140 4 to 12 < 200 × 200 C11011-01 C11011-01W Feature 3 C13027-11 Thickness distribution measurement Mapping thickness distribution of patternformed wafer Mapping thickness distribution of patternformed wafer with protective film *For more details of the specification, please contact us. C8126-21, -22 (For C11011 series) Standard Option Probe head Standard A8653-01 C8126-31, -32 (C13027-11 supported) Data analyzer Laptop type C10471-21 Optical MicroGauge Thickness measurement system C11011-01, -01W USB 2.0 Wafer mapping software Power Optical fiber Wafer mapping software RS-232C/Ethernet Wafer Stage unit Interface (USB 2.0) Data analyzer C9025-11 Stage unit Standard Option Optical NanoGauge Thickness measurement system C13027-11 Specification Type number C8126-21, -31 Stage movement resolution C8126-22, -32 0.1 mm Stage movement repeatability ±0.01 mm Power requirement *1 AC100 V to AC117 V, AC200 V to AC240 V , 50 Hz/60 Hz Power consumption 120 VA (at 100 V), 160 VA (at 200 V) 820 mm(W) × 550 mm(H) × 600 mm(D) Approx. 67 kg 940 mm(W) × 595 mm(H) × 750 mm(D) Approx. 82 kg Dimensional outline / Weight *For more details of the specification, please contact us. *1: Either 100 V system or 200 V system can be selected. ★ Product and software package names noted in this documentation are trademarks or registered trademarks of their respective manufacturers. ● Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult your local sales representative. ● Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications and external appearance are subject to change without notice. © 2016 Hamamatsu Photonics K.K. HAMAMATSU PHOTONICS K.K. www.hamamatsu.com HAMAMATSU PHOTONICS K.K., Systems Division 812 Joko-cho, Higashi-ku, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-435-1574, E-mail: [email protected] U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, NJ 08807, U.S.A., Telephone: (1)908-231-0960, Fax: (1)908-231-1218 E-mail: [email protected] Germany: Hamamatsu Photonics Deutschland GmbH.: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-265-8 E-mail: [email protected] France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10 E-mail: [email protected] United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court,10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, UK, Telephone: (44)1707-294888, Fax: (44)1707-325777 E-mail: [email protected] North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 16440 Kista, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01 E-mail: [email protected] Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39)02-935-81-733, Fax: (39)02-935-81-741 E-mail: [email protected] China: Hamamatsu Photonics (China) Co., Ltd.: 1201 Tower B, Jiaming Center, 27 Dongsanhuan Beilu, Chaoyang District, 100020 Beijing, China, Telephone: (86)10-6586-6006, Fax: (86)10-6586-2866 E-mail: [email protected] Taiwan: Hamamatsu Photonics Taiwan Co., Ltd.: 8F-3, No.158, Section2, Gongdao 5th Road, East District, Hsinchu, 300, Taiwan R.O.C. Telephone: (886)03-659-0080, Fax: (886)07-811-7238 E-mail: [email protected] Cat. No. SSMS0043E08 APR/2016 AK Created in Japan