PANASONIC AN7396K

ICs for Audio Common Use
AN7396K
Sound signal processing with built-in Spatializer IC
■ Overview
30
1.778
26.7±0.3
0.9±0.25
1
0.5±0.1
Unit: mm
Spatializer Audio Processor is a signal processing
technology, monopolized by Desper Products, Inc., that
was developed for commercial electronics and multimedia markets, and is based on Desper's “PRO Spatializer”
that is a 3-D audio production system for business use.
The AN7396K utilizes the innovative technology adopted
in that system. It provides sound enhancement effect and
sound expansion with the conventional 2-speaker stereo
system. Moreover, the AN7396K is a sound processing IC
which incorporates the I2C Bus-controllable mute, sound
AGC, bass reinforcement, tone (bass and treble), balance,
and volume circuits.
15
16
1.0±0.25
8.6±0.3
4.7±0.25 3.3±0.25
10.16±0.25
■ Features
+0.1
0.35–0.05
3° to 15°
• Provides deep 3-D sound with conventional 2-speaker
system.
• Performs optimal processing to the sound source recorded with surround-effect so as not to give double
effects.
• Provides the functions of muting, AGC, bass reinforcement, tone, balance, and volume control.
• Supports I2C Bus controls.
SDIP030-P-0400
Note) The package of this product will be changed
to lead-free type (SDIP030-P-0400B). See the
new package dimensions section later of this
datasheet.
■ Applications
• Televisions, videos, audio equipment, and game machines
16
SCL
SDA
17
R-out
18
T.D.
19
BL.D.
20
21
R.T.
R.B.
22
BB
R-in
VREF
23
24
25
VCC
26
F-out
27
F-in
28
29
30
VCA
Space
■ Block Diagram
Bass reinforcement
15
L-out
14
V.D.
B.D.
12
L.B.
11
L.T.
10
GND
9
Mode
8
Note) Spatializer and the device trademark of circle-in-square
13
Balance control/
Mute
Volume control 2.2 kΩ
TIM1
TIM2
7
6
Tone control
L-in
5
AGC
4
BR
3
BL
2
Spatializer
L-ret.
R-ret.
1
AGC
are owned by Desper Products Inc.
This product can be used with the consent of the Desper Products Inc.
Under the terms of the agreement between Matsushita Electric and Desper Products Inc., no technical information on the
Spatializer, which is applied to this product, shall be provided.
Publication date: November 2001
SDC00026BEB
1
AN7396K
■ Pin Descriptions
Pin No.
Description
1
Pin No.
R-ret.
Description
16
I2C
communication clock
communication data
2
L-ret.
17
I2C
3
BL out
18
R-ch. output
4
BR out
19
Treble DAC output
5
AGC
20
Balance DAC output
6
L-ch. input
21
R-ch. treble FC set
7
TIM2
22
R-ch. bass FC set
8
TIM1
23
Bass MIX FC adjustment
9
Mode DAC output
24
1/2 VCC
10
GND
25
R-ch. input
11
L-ch. treble FC set
26
Power supply
12
L-ch. bass FC set
27
F-out
13
Bass DAC output
28
F-in
14
Volume DAC output
29
Space
15
L-ch. output
30
VCA
■ Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Supply voltage
VCC
11.0
V
Supply current
ICC
90
mA
PD
990
mW
Topr
−25 to +75
°C
Tstg
−55 to +150
°C
Power dissipation
Operating ambient temperature
Storage temperature
*
*
Note) *: Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25°C.
■ Recommended Operating Range
Parameter
Supply voltage
2
Symbol
Range
Unit
VCC
6.0 to 10.0
V
SDC00026BEB
AN7396K
■ Electrical Characteristics at VCC = 9 V, Ta = 25°C ± 2°C
Parameter
Volume max. level
Volume 1/2 level
Symbol
*1
*1
Conditions
VVmax
VIN = 1 V[rms], f = 1 kHz
VV1/2
VIN = 1 V[rms], f = 1 kHz
Min
Typ
Max
Unit
−1
0
1
dB
−14.5 −12.5 −10.5
dB
VVmin
VIN = 1 V[rms], f = 1 kHz

−100
−90
dB
Balance max. level
*1
VBmax
VIN = 1 V[rms], f = 1 kHz
−1
0
1
dB
Balance min. level
*1
VBmin
VIN = 1 V[rms], f = 1 kHz

−82
−80
dB
10
12.5
15
dB
−8.5
dB
15
dB
−8.5
dB
Volume min. level
*1
Bus bootstrap level
VBB
VIN = 400 mV[rms], f = 50 Hz
Bus cut level
VBC
VIN = 400 mV[rms], f = 50 Hz
Treble bootstrap level
VTB
VIN = 400 mV[rms], f = 20 kHz
Treble cut level
VTC
VIN = 400 mV[rms], f = 20 kHz
ICCT
VIN = 0 mV
45
65
90
mA
VIN = 1 V[rms], f = 1 kHz

0.1
0.3
%
THD = 1%, f = 1 kHz
2.0
2.2

V[rms]
VMUTE VIN = 1 V[rms], f = 1 kHz

−100
−90
dB
Circuit current
*1
Total harmonic distortion max.
*1
Maximum input voltage
Muting level
*1
THDmax
VImax
*1
−13.5 −11.0
10
12.5
−13.5 −11.0
Noise level at volume max.
*2
VNmax
VIN = 0 mV, RG = 4.7 kΩ

82
120
µV[rms]
Noise level at volume min.
*2
VNmin
VIN = 0 mV, RG = 4.7 kΩ

4
10
µV[rms]
Bass reinforcement max. level
VXBmax
VIN = 400 mV[rms], f = 50 Hz
7
9
11
dB
Bass reinforcement min. level
VXBmin
VIN = 400 mV[rms], f = 50 Hz
2
4
6
dB
VSU1
VIN = 50 mV[rms], f = 1 kHz
415
600
750
mV[rms]
VSN
VIN = 0 mV, RG = 4.7 kΩ

110
150
µV[rms]
VIN = 50 mV[rms], f = 1 kHz

0.1
0.3
%
CT
VIN = 1 V[rms], f = 1 kHz

−78
−66
dB
CBmax
VIN = 1 V[rms], f = 1 kHz
−1
0
1
dB
CB1/4
VIN = 1 V[rms], f = 1 kHz
−2
0
2
dB
AGC gain 1 *1
VAGC1
VIN = 50 mV[rms], f = 1 kHz
77
110
150
mV[rms]
*1
VAGC2
VIN = 1 V[rms], f = 1 kHz
230
345
470
mV[rms]
The maximum value of sink current
of pin 17 at ACK
2.0
10

mA
Level at surround max.
*1
Noise level at surround max.
*2
Total harmonic distortion at
surround max. *1
Crosstalk *2
Channel balance (max.)
Channel balance (1/4)
*1
*1
THDSU
AGC
AGC gain 2
I2C
interface
Sink current at ACK
IACK
SCL, SDA signal input
high-level
VIHI
3.5

5.0
V
SCL, SDA signal input
low-level
VILO
0

0.5
V
Maximum input frequency
fImax


100
Kbit/s
Note) *1: The DIN audio filter is used.
*2: The A-curve filter is used.
SDC00026BEB
3
AN7396K
■ Electrical Characteristics at VCC = 9 V, Ta = 25°C ± 2°C (continued)
• Design reference data
Note) The characteristics listed below are theoretical values based on the IC design and are not guaranteed.
Parameter
Min
Typ
Max
Unit
tBUF
4.0


µs
Start condition set-up time
tSU, STA
4.0


µs
Start condition hold time
tHD, STA
4.0


µs
SCL/SDA low period
tLO
4.0


µs
SCL high period
tHI
4.0


µs
SCL/SDA rise time
tR


1.0
µs
SCL/SDA fall time
tF


0.35
µs
Data set-up time (write)
tSU, DAT
0.25


µs
Data hold time (write)
tHD, DAT
0


µs
Acknowledge set-up time
tSU, ACK


3.5
µs
Acknowledge hold time
tHD, ACK
0


µs
Stop condition set-up time
tSU, STO
4.0


µs
1 LSB = (Data(max.) − Data(00))/63
0.1
1.0
1.9
LSB
step
I2C
Symbol
Conditions
Interface
Bus free before start
DAC
6-bit DAC DNLE
L6
AGC gain 3
(Sub address 04H: 05H) *1
VAGC3
VIN = 100 mV[rms], f = 1 kHz

150

mV[rms]
AGC gain 4
(Sub address 04H: 03H) *1
VAGC4
VIN = 140 mV[rms], f = 1 kHz

200

mV[rms]
AGC gain 5
(Sub address 04H: 01H) *1
VAGC5
VIN = 200 mV[rms], f = 1 kHz

250

mV[rms]
AGC gain 6
(Sub address 04H: 07H) *1
VAGC6
VIN = 280 mV[rms], f = 1 kHz

350

mV[rms]
AGC gain 7
(Sub address 04H: 03H) *1
VAGC7
VIN = 500 mV[rms], f = 1 kHz
180
290
430
mV[rms]
Note) *1: The DIN audio filter is used.
• DAC timing chart
Start
condition
Slave
address
Sub
address
ACK
ACK
Data
byte
Stop
ACK condition
SDA
tBUF
tSU.DAT
tLO
tSU.STO
tHD.DAT
SCL
tSU.STA
4
tHD.STA
tR
tF
tHI
tLO
SDC00026BEB
AN7396K
■ Terminal Equivalent Circuits at VCC = 9 V, Ta = 25°C
Pin No. Pin name
Equivalent circuit
Description
Voltage (V)
1
R-ret.

R return
4.5
2
L-ret.

L return
4.5
3
BL out
L-ch. Spatializer output
4.5
R-ch. Spatializer output
4.5
3
4
BR out
4
5
AGC
Level 2 Level 1
AGC level sensor
This parameter
fluctuates with
the input level.
0.5 to 2.0
430 Ω 50 kΩ
5
6
L-in
L-ch. input
4.5
6
50 kΩ
1/2 VCC
SDC00026BEB
5
AN7396K
■ Terminal Equivalent Circuits at VCC = 9 V, Ta = 25°C (continued)
Pin No. Pin name
7
Equivalent circuit
Description
TIM2
Voltage (V)
RMS detector 2
0.6
RMS detector 1
0.6
7
8
TIM1
8
9

MD
Mode DAC output
This parameter
fluctuates with
I2C data.
0.7 to 2.4
10
GND
11
L.T.

Ground
3
0
L-ch. treble FC set
4.5
L-ch. bass FC set
4.5
5.7 kΩ
11
1.5 kΩ
1.5 kΩ
12
8 kΩ
L.B.
8.64 kΩ
12
1.36 kΩ
6
SDC00026BEB
AN7396K
■ Terminal Equivalent Circuits at VCC = 9 V, Ta = 25°C (continued)
Pin No. Pin name
13
Equivalent circuit
B.D.
Description
Bass DAC output
13
250 Ω
Voltage (V)
This parameter
fluctuates with
I2C data.
250 Ω
1.1 to 2.3
9.4 kΩ
1.62 V
14
V.D.
Volume DAC output
3V
This parameter
fluctuates with
I2C data.
5 kΩ
14
250 Ω
2 to 3.8
11 kΩ
15
L-out
L-ch. output
4.5
I2C Bus clock input

I2C Bus data input

15
16
SCL
1 kΩ
16
17
SDA
17
1 kΩ
SDC00026BEB
7
AN7396K
■ Terminal Equivalent Circuits at VCC = 9 V, Ta = 25°C (continued)
Pin No. Pin name
18
Equivalent circuit
R-out
Description
R-ch. output
Voltage (V)
4.5
18
19
T.D.
Treble DAC output
19
250 Ω
This parameter
fluctuates with
I2C data.
250 Ω
1.1 to 2.3
9.4 kΩ
1.62 V
20
BL.D.
Balance DAC output
3V
This parameter
fluctuates with
I2C data.
5 kΩ
20
250 Ω
2 to 3
250 Ω
21
R.T.
R-ch. treble FC set
4
5.7 kΩ
21
1.5 kΩ
1.5 kΩ
8
8 kΩ
SDC00026BEB
4.5
AN7396K
■ Terminal Equivalent Circuits at VCC = 9 V, Ta = 25°C (continued)
Pin No. Pin name
22
Equivalent circuit
Description
R.B.
8.64 kΩ
Voltage (V)
R-ch. bass FC set
4.5
Bass MIX gain adjustment
4.5
22
1.36 kΩ
23
BB
23
2.2 kΩ
24
VREF
Reference voltage
stabilization
4.5
50 kΩ
24
50 kΩ
25
R-in
25
R-ch. input
4.5
Power supply
VCC
200 Ω
50 kΩ
1/2 VCC
26
VCC
None
27
F-out

F out
4.5
28
F-in

F in
4.5
SDC00026BEB
9
AN7396K
■ Terminal Equivalent Circuits at VCC = 9 V, Ta = 25°C (continued)
Pin No. Pin name
29
Space
Equivalent circuit
VCC
VCC
Description
VCC
Space
Voltage (V)
This parameter
fluctuates with
I2C data.
2 to 3
29
30
VCA

VCA
This parameter
fluctuates with
I2C data.
2 to 3
■ Conceptual Explanation of Spatializer Operation
• Normal stereo
All sounds are heard from only between two speakers, right
and left.
• Conventional surround
The sound expands toward the outside of the speaker
system, but the sound position comes apart mostly in the conventional systems.
• Spatializer
The sound expands toward the outside of the two speakers,
and yet their positions are stable and an expanded, deep sound
are gotten.
10
SDC00026BEB
AN7396K
■ Precautions in Use and Application Method
• Method of setting AGC control
Turning on AGC, AGC is set to 0 dB for small signals, “Bootstrap” for medium signals, and “Gain Reduction” for
large signals. The AGC input-output characteristics can be controlled by I2C as follows.
AGC characteristic
1 000
AGC = Off
"11"
"00"
AGC = On
Output level (mV[rms])
"01"
"10"
100
Data of sub address 04H
D2 D1
10
1
1 mV
10 mV
100 mV
1V
10 V
Input level (RMS)
SDC00026BEB
11
12
47 nF
47 nF
SDC00026BEB
L-out
10 µF
15
2.2 kΩ
14
16
SCL
10 µF
T.D.
19
10 µF
18
R-out
10 µF
17
SDA
L-out
10 µF
L.T.
10 nF
L.B.
0.1 µF
B.D.
10 µF
V.D.
10 µF
15
14
13
12
11
10
9
8
7
6
2.2 kΩ
13
12
Volume control
11
10 µF
L+R-out
10 µF
22 R.B.
0.1 µF
21 R.T.
10 nF
20 BL.D.
23 BB
R-in
Volume control
L.T.
10 nF
L.B.
0.1 µF
B.D.
10 µF
V.D.
10 µF
Tone control
10
10 µF
24 VREF
25
AGC 5
10 µF
L-in
10 µF
TIM2
10 µF
TIM1
10 µF
Mode
10 µF
GND
220 kΩ
Tone control
9
8
7
Spatializer
6
VCC
100 nF
BR 4
BL 3
Spatializer
10 µF
L-in
10 µF
TIM2
10 µF
TIM1
10 µF
Mode
10 µF
GND
26
47 nF
AGC 5
10 nF
1 µF
Non-polarity
L-ret. 2
R-ret. 1
47 nF
220 kΩ
AGC
27 F-out
28 F-in
150 kΩ 22 µF
29 Space
30 VCA
AGC
BR 4
BL 3
L-ret. 2
R-ret. 1
10 nF
1 µF
Non-polarity
10 µF
10 µF
16
17
18
10 µF
SCL
SDA
R-out
10 µF
0.68 µF
22 R.B.
0.1 µF
21 R.T.
10 nF
20 BL.D.
10 µF
19 T.D.
23 BB
R-in
VCC
100 nF
24 VREF
25
26
27 F-out
28 F-in
150 kΩ 22 µF
29 Space
30 VCA
AN7396K
■ Application Circuit Examples
• Bass reinforcement circuit example
Bass reinforcement
Balance control/
Mute
• Application circuit example of obtaining L+R output instead of bass reinforcement
Bass reinforcement
Balance control/
Mute
AN7396K
■ New Package Dimensions (Unit: mm)
• SDIP030-P-0400B (Lead-free package)
26.68±0.30
16
15
(0.894)
1.778
0.50+0.10
-0.05
0.70+0.10
-0.05
0.90+0.10
-0.05
1.13±0.25
3.30±0.25
1
4.83±0.25
8.60±0.20
30
10.16
+0.10
3° to 15°
0.30 -0.05
Seating plane
SDC00026BEB
13
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the
"Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial
property, the granting of relative rights, or the granting of any license.
(3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(4) The products and product specifications described in this material are subject to change without
notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to
make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, redundant design is recommended,
so that such equipment may not violate relevant laws or regulations because of the function of our
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(6) When using products for which dry packing is required, observe the conditions (including shelf life
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Please read the following notes before using the datasheets
A. These materials are intended as a reference to assist customers with the selection of Panasonic
semiconductor products best suited to their applications.
Due to modification or other reasons, any information contained in this material, such as available
product types, technical data, and so on, is subject to change without notice.
Customers are advised to contact our semiconductor sales office and obtain the latest information
before starting precise technical research and/or purchasing activities.
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2001 MAR