IDT 8344AY-01

ICS8344-01
LOW SKEW, 1-TO-24 DIFFERENTIALTO-LVCMOS/LVTTL FANOUT BUFFER
GENERAL DESCRIPTION
FEATURES
The ICS8344-01 is a low voltage, low skew
ICS
fanout buffer and a member of the HiPerClockS ™
HiPerClockS™ family of High Performance Clock Solutions from
IDT. The ICS8344-01 has two selectable clock inputs. The CLKx, nCLKx pairs can accept most
standard differential input levels. The ICS8344-01 is designed
to translate any differential signal level to LVCMOS/LVTTL levels. The low impedance LVCMOS/LVTTL outputs are designed
to drive 50Ω series or parallel terminated transmission lines.
The effective fanout can be increased to 48 by utilizing the
ability of the outputs to drive two series terminated lines.
Redundant clock applications can make use of the dual clock
inputs which also facilitate board level testing. The clock
enable is internally synchronized to eliminate runt pulses on
the outputs during asynchronous assertion/deassertion of the
clock enable pin. The outputs are driven low when disabled.
The ICS8344-01 is characterized at full 3.3V, full 2.5V and mixed
3.3V input and 2.5V output operating supply modes.
• Twenty-four LVCMOS/LVTTL outputs,
7Ω typical output impedance
• Two selectable differential CLKx, nCLKx inputs
• CLK0, nCLK0 and CLK1, nCLK1 pairs can accept the
following input levels: LVDS, LVPECL, LVHSTL, SSTL, HCSL
• Output frequency up to 250MHz
• Translates any single ended input signal to LVCMOS/LVTTL
with resistor bias on nCLK input
• Synchronous clock enable
• Additive phase jitter RMS: 0.21ps (typical)
• Output skew: 200ps (maximum)
• Part-to-part skew: 900ps (maximum)
• Bank skew: 85ps (maximum)
• Propagation delay: 5ns (maximum)
Guaranteed output and part-to-part skew characteristics make
the ICS8344-01 ideal for those clock distribution applications
demanding well defined performance and repeatability.
• Output supply modes:
Core/Output
3.3V/3.3V
2.5V/2.5V
3.3V/2.5V
• 0°C to 70°C ambient operating temperature
• Available in both standard (RoHS 5) and lead-free (RoHS 6)
packages
BLOCK DIAGRAM
PIN ASSIGNMENT
Q8
Q9
VDDO
GND
Q10
Q11
Q12
Q13
VDDO
GND
Q14
Q15
CLK_SEL Pulldown
CLK0 Pulldown
nCLK0 Pullup
CLK1 Pulldown
nCLK1 Pullup
0
Q16
Q17
VDDO
GND
Q18
Q19
Q20
Q21
VDDO
GND
Q22
Q23
1
Q0:Q7
Q8:Q15
Q16:Q23
LE
Q
OE
nD
Pullup
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
ICS8344-01
Q7
Q6
VDDO
GND
Q5
Q4
Q3
Q2
VDDO
GND
Q1
Q0
nc
OE
CLK_EN
CLK0
nCLK0
VDD
GND
CLK1
nCLK1
VDD
GND
CLK_SEL
CLK_EN Pullup
48 47 46 45 44 43 42 41 40 39 38 37
1
36
2
35
3
34
4
33
5
32
48-Lead LQFP
6
31
7mm x 7mm x 1.4mm
7
30
package body
8
29
Y Package
9
28
Top View
10
27
11
26
12
25
13 14 15 16 17 18 19 20 21 22 23 24
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ICS8344AY-01 REV. C SEPTEMBER 9, 2008
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LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
TABLE 1. PIN DESCRIPTIONS
Number
Name
1, 2, 5, 6
7, 8, 11, 12
Q16, Q17, Q18, Q19
Q20, Q21, Q22, Q23
Output
Q16 thru Q23 outputs. 7Ω typical output impedance.
VDDO
Power
Output supply pins. Connect 3.3V or 2.5V.
GND
Power
Power supply ground. Connect to ground.
13
CLK_SEL
Input
15, 19
VDD
Power
3, 9, 28,
34, 39, 45
4, 10, 14,18,
27, 33, 40, 46
Type
16
nCLK1
Input
17
CLK1
Input
20
nCLK0
Input
21
CLK0
Input
22
CLK_EN
Input
23
OE
Input
Description
Clock select input. When HIGH, selects CLK1, nCLK inputs,
Pulldown When LOW, selects CLK0, nCLK0 inputs.
LVCMOS / LVTTL interface levelss.
Positive supply pins. Connect 3.3V or 2.5V.
Pullup
Inver ting differential LVPECL clock input.
Pulldown Non-inver ting differential LVPECL clock input.
Pullup
Inver ting differential LVPECL clock input.
Pulldown Non-inver ting differential LVPECL clock input.
Synchronizing control for enabling and disabling clock outputs.
Pullup
LVCMOS interface levels.
Output enable. Controls enabling and disabling of outputs
Pullup
Q0 thru Q23.
No connect.
24
nc
Unused
25, 26, 29, 30
Q0, Q1, Q2, Q3
Output
Q0 thru Q7 outputs. 7Ω typical output impedance.
31, 32, 35, 36
Q4, Q5, Q6, Q7
37, 38, 41, 42
Q8, Q9, Q10, Q11
Output
Q8 thru Q15 outputs. 7Ω typical output impedance.
43, 44, 47, 48 Q12, Q13, Q14, Q15
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
CIN
Parameter
Input Capacitance
Test Conditions
Minimum
Typical
CLK0, nCLK0,
CLK1, nCLK1
CLK_SEL,
CLK_EN, OE
Maximum
Units
4
pF
4
pF
VDDO = 3.465V
23
VDDO = 2.675V
16
pF
51
kΩ
Input Pulldown Resistor
51
kΩ
Output Impedance
7
Ω
CPD
Power Dissipation Capacitance
(per output)
RPULLUP
Input Pullup Resistor
RPULLDOWN
ROUT
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
2
pF
ICS8344AY-01 REV. C SEPTEMBER 9, 2008
ICS8344-01
LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
TABLE 3A. OUTPUT ENABLE FUNCTION TABLE
Banks 1, 2, 3
Inputs
Outputs
OE
CLK_EN
Q0-Q23
0
X
Hi-Z
1
0
Disabled in logic LOW state. NOTE 1
1 (default)
1 (default)
Enabled. NOTE 1
NOTE 1: The clock enable and disable function is synchronous to the falling
edge of the selected reference clock.
TABLE 3B. CLOCK SELECT FUNCTION TABLE
Control Input
Clock
CLK_SEL
CLK0, nCLK0
CLK1, nCLK1
0 (default)
Selected
De-selected
1
De-selected
Selected
TABLE 3C. CLOCK INPUT FUNCTION TABLE
Inputs
Outputs
OE
CLK0, CLK1
nCLK0, nCLK1
Q0 thru Q23
1 (default)
0 (default)
1 (default)
LOW
Input to Output Mode
Polarity
Differential to Single Ended
Non Inver ting
1
1
0
HIGH
Differential to Single Ended
Non Inver ting
1
0
Biased; NOTE 1
LOW
Single Ended to Differential
Non Inver ting
1
1
Biased; NOTE 1
HIGH
Single Ended to Differential
Non Inver ting
1
Biased; NOTE 1
0
HIGH
Single Ended to Differential
Inver ting
1
Biased; NOTE 1
1
LOW
Single Ended to Differential
Inver ting
NOTE 1: Please refer to the Application Information section on page 8, Figure 1, which discusses Wiring the Differential
Input to Accept Single-Ended Levels.
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
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LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VDD
4.6V
Inputs, VI
-0.5V to VDD + 0.5 V
Outputs, VO
-0.5V to VDDO + 0.5V
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.
Package Thermal Impedance, θJA 47.9°C/W (0 lfpm)
Storage Temperature, TSTG
-65°C to 150°C
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDO = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
VDD
Test Conditions
Minimum
Typical
Maximum
Units
Positive Supply Voltage
3.135
3.3
3.465
V
VDDO
Output Supply Voltage
3.135
3.3
3.465
V
IDD
Quiescent Power Supply Current
95
mA
TABLE 4B. POWER SUPPLY DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 2.5V±5%, TA = 0°C TO 70°C
Symbol
Parameter
Minimum
Typical
Maximum
Units
VDD
Positive Supply Voltage
Test Conditions
3.135
3.3
3.465
V
VDDO
Output Supply Voltage
2.375
2.5
2.625
V
IDD
Quiescent Power Supply Current
95
mA
Maximum
Units
TABLE 4C. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDO = 2.5V±5%, TA = 0°C TO 70°C
Symbol
Parameter
Test Conditions
Minimum
Typical
VDD
Positive Supply Voltage
2.375
2.5
2.625
V
VDDO
Output Supply Voltage
2.375
2.5
2.625
V
IDD
Quiescent Power Supply Current
95
mA
Maximum
Units
2
3.8
V
-0.3
0.8
V
5
µA
TABLE 4D. LVCMOS/LVTTL DC CHARACTERISTICS, VDD = VDDO = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
VIH
Input High Voltage
VIL
Input Low Voltage
IIH
Input High Current
IIL
Input Low Current
Test Conditions
CLK_SEL, CLK_EN,
OE
CLK_SEL, CLK_EN,
OE
CLK_EN, OE
CLK_SEL
Minimum
VDD = VIN = 3.465V
VDD = VIN = 3.465V
Typical
150
µA
CLK_EN, OE
VDD = 3.465, VIN = 0V
-150
µA
CLK_SEL
VDD = 3.465, VIN = 0V
-5
µA
2.7
V
VOH
Output High Voltage
VDD = VDDO = 3.135V
IOH = -36mA
VOL
Output Low Voltage
VDD = VDDO = 3.135V
IOL = 36mA
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
4
0.5
V
ICS8344AY-01 REV. C SEPTEMBER 9, 2008
ICS8344-01
LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
TABLE 4E. LVCMOS/LVTTL DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 2.5V±5%, TA = 0°C TO 70°C
Symbol
Parameter
VIH
Input High Voltage
VIL
Input Low Voltage
IIH
Input High Current
IIL
Input Low Current
Test Conditions
CLK_SEL, CLK_EN,
OE
CLK_SEL, CLK_EN,
OE
CLK_EN, OE
CLK_SEL
Minimum
Typical
Maximum
Units
2
3.8
V
-0.3
0.8
V
5
µA
VDD = VIN = 3.465V
VDD = VIN = 3.465V
150
µA
CLK_EN, OE
VDD = 3.465, VIN = 0V
-150
µA
CLK_SEL
VDD = 3.465, VIN = 0V
-5
µA
1.9
V
VOH
Output High Voltage
VDD = 3.135V
VDDO = 2.375V
IOH = -27mA
VOL
Output Low Voltage
VDD = 3.135V
VDDO = 2.375V
IOL = 27mA
0.4
V
Maximum
Units
2
2.9
V
-0.3
0.8
V
5
µA
TABLE 4F. LVCMOS/LVTTL DC CHARACTERISTICS, VDD = VDDO = 2.5V±5%, TA = 0°C TO 70°C
Symbol
Parameter
VIH
Input High Voltage
VIL
Input Low Voltage
IIH
Input High Current
IIL
Input Low Current
Test Conditions
CLK_SEL, CLK_EN,
OE
CLK_SEL, CLK_EN,
OE
CLK_EN, OE
CLK_SEL
Minimum
VDD = VIN = 2.625V
VDD = VIN = 2.625V
Typical
150
µA
CLK_EN, OE
VDD = 2.625, VIN = 0V
-150
µA
CLK_SEL
VDD = 2.625, VIN =0V
-5
µA
1.9
V
VOH
Output High Voltage
VDD = VDDO = 2.375V
IOH = -27mA
VOL
Output Low Voltage
VDD = VDDO = 2.375V
IOL = 27mA
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
5
0.4
V
ICS8344AY-01 REV. C SEPTEMBER 9, 2008
ICS8344-01
LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
TABLE 4G. DIFFERENTIAL DC CHARACTERISTICS, VDD = VDDO = 3.3V±5%, TA = 0°C TO 70°C
Symbol Parameter
Maximum
Units
nCLK0, nCLK1
VDD = VIN = 3.465V
Test Conditions
Minimum
Typical
5
µA
CLK0, CLK1
VDD = VIN = 3.465V
150
µA
IIH
Input High Current
IIL
Input Low Current
VPP
Peak-toPeak Input Voltage
0.3
1.3
V
VCMR
Common Mode Input Voltage: NOTE 1, 2
0.9
2
V
nCLK0, nCLK1
VDD = 3.465V, VIN = 0V
-150
µA
CLK0, CLK1
VDD = 3.465V, VIN = 0V
-5
µA
NOTE 1: For single ended applications, the maximum input voltage for CLK0, nCLK0 and CLK1, nCLK1 is VDD + 0.3V.
NOTE 2: Common mode voltage is defined as VIH.
TABLE 4H. DIFFERENTIAL DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 2.5V±5%, TA = 0°C TO 70°C
Symbol Parameter
IIH
Input High Current
Test Conditions
Maximum
Units
nCLK0, nCLK1
VDD = VIN = 3.465V
5
µA
CLK0, CLK1
VDD = VIN = 3.465V
150
µA
nCLK0, nCLK1
IIL
Minimum Typical
Input Low Current
CLK0, CLK1
VDD = 3.465V,
VIN = 0V
VDD = 3.465V,
VIN = 0V
-150
µA
-5
µA
VPP
Peak-to-Peak Input Voltage
0.3
1.3
V
VCMR
Common Mode Input Voltage; NOTE 1, 2
0.9
2
V
NOTE 1: For single ended applications, the maximum input voltage for CLK0, nCLK0 and CLK1, nCLK1 is VDD + 0.3V.
NOTE 2: Common mode voltage is defined as VIH.
TABLE 4I. DIFFERENTIAL DC CHARACTERISTICS, VDD = VDDO = 2.5V±5%, TA = 0°C TO 70°C
Symbol Parameter
Test Conditions
Minimum Typical
Maximum
Units
nCLK0, nCLK1
VDD = VIN = 2.625V
5
µA
CLK0, CLK1
VDD = VIN = 2.625V
150
µA
IIH
Input High Current
IIL
Input Low Current
VPP
Peak-to-Peak Input Voltage
0.3
1.3
V
VCMR
Common Mode Input Voltage; NOTE 1, 2
0.9
2
V
nCLK0, nCLK1
VDD = 2.625V, VIN = 0V
-150
µA
CLK0, CLK1
VDD = 2.625V, VIN = 0V
-5
µA
NOTE 1: For single ended applications, the maximum input voltage for CLK0, nCLK0 and CLK1, nCLK1 is VDD + 0.3V.
NOTE 2: Common mode voltage is defined as VIH.
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
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LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
TABLE 5. AC CHARACTERISTICS, VDD = VDDO = 3.3V±5%; VDD = 3.3V ± 5%, VDDO = 2.5V ± 5%;
VDD = VDDO = 2.5V ± 5%, TA = 0°C
TO
70°C
Symbol Parameter
Test Conditions
fMAX
Maximum Output Frequency
tPD
Propagation Delay, NOTE 1
f ≤ 200MHz
t jit
Buffer Additive Phase Jitter,
RMS; refer to Additive Phase
Jitter Section
155.52MHz, Integration Range:
12kHz - 20MHz
t sk(b)
Bank Skew;
NOTE 2, 6
Minimum
Typical
2.5
Q[16:23]
Units
250
MHz
5
ns
0.21
Q[0:7]
Q[8:15]
Maximum
Measured on the rising edge
of VDDO/2
ps
85
ps
180
ps
100
ps
t sk(o)
Output Skew; NOTE 3, 6
Measured on the rising edge
of VDDO/2
200
ps
t sk(pp)
Par t-to-Par t Skew; NOTE 4, 6
Measured on the rising edge
of VDDO/2
900
ps
tR
Output Rise Time; NOTE 5
30% to 70%
200
800
ps
tF
Output Fall Time; NOTE 5
30% to 70%
200
800
ps
odc
Output Duty Cycle
f ≤ 200MHz
tCYCLE/2 - 0.25
tCYCLE/2
tCYCLE/2 + 0.25
%
f = 200MHz
2.25
2.5
2.75
ns
tEN
Output Enable Time; NOTE 5
f = 10MHz
5
ns
tDIS
Output Disable TIme; NOTE 5
f = 10MHz
4
ns
All parameters measured at 200MHz and VPPtyp unless noted otherwise.
NOTE 1: Measured from the differential input crossing point to VDDO/2.
NOTE 2: Defined as skew within a bank of outputs at the same voltage and with equal load conditions.
NOTE 3: Defined as skew across banks of outputs at the same supply voltage and with equal load conditions.
NOTE 4: Defined as between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.
NOTE 5: These parameters are guaranteed by characterization. Not tested in production.
NOTE 6: This parameter is defined in accordance with JEDEC Standard 65.
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
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LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
ADDITIVE PHASE JITTER
band to the power in the fundamental. When the required offset
is specified, the phase noise is called a dBc value, which simply
means dBm at a specified offset from the fundamental. By
investigating jitter in the frequency domain, we get a better
understanding of its effects on the desired application over the
entire time record of the signal. It is mathematically possible to
calculate an expected bit error rate given a phase noise plot.
The spectral purity in a band at a specific offset from the
fundamental compared to the power of the fundamental is called
the dBc Phase Noise. This value is normally expressed using a
Phase noise plot and is most often the specified plot in many
applications. Phase noise is defined as the ratio of the noise power
present in a 1Hz band at a specified offset from the fundamental
frequency to the power value of the fundamental. This ratio is
expressed in decibels (dBm) or a ratio of the power in the 1Hz
SSB PHASE NOISE dBc/HZ
Additive Phase Jitter @
155.52MHz (12kHz to 20MHz) = 0.21ps typical
OFFSET FROM CARRIER FREQUENCY (HZ)
As with most timing specifications, phase noise measurements
has issues relating to the limitations of the equipment. Often the
noise floor of the equipment is higher than the noise floor of the
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
device. This is illustrated above. The device meets the noise floor
of what is shown, but can actually be lower. The phase noise is
dependent on the input source and measurement equipment.
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LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
PARAMETER MEASUREMENT INFORMATION
1.65V±5%
2.05V±5%
1.25V±5%
SCOPE
VDD,
VDDO
SCOPE
VDD
Qx
VDDO
LVCMOS
Qx
GND
GND
LVCMOS
-1.65V±5%
-1.25V±5%
3.3V OUTPUT LOAD AC TEST CIRCUIT
3.3V CORE/2.5V OUTPUT LOAD AC TEST CIRCUIT
1.25V±5%
VDD
SCOPE
VDD,
VDDO
nCLK0,
nCLK1
V
Qx
Cross Points
PP
LVCMOS
V
CMR
CLK0,
CLK1
GND
GND
-1.25V±5%
2.5V OUTPUT LOAD AC TEST CIRCUIT
PART 1
Qx
PART 2
DIFFERENTIAL INPUT LEVEL
V
V
DDO
DDO
Qx
2
V
V
DDO
Qy
DDO
Qy
2
tsk(pp)
PART-TO-PART SKEW
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
2
2
tsk(o)
OUTPUT SKEW
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LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
nCLK0,
nCLK1
V
DDO
CLK0,
CLK1
2
Q0:Q23
t PW
t
PERIOD
Q0:Q23
t
PD
odc =
t PW
x 100%
t PERIOD
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
PROPAGATION DELAY
Clock
Outputs
80%
80%
tR
tF
20%
20%
OUTPUT RISE/FALL TIME
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
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ICS8344AY-01 REV. C SEPTEMBER 9, 2008
ICS8344-01
LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
APPLICATION INFORMATION
WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS
Figure 1 shows how the differential input can be wired to accept
single ended levels. The reference voltage V_REF = VDD/2 is
generated by the bias resistors R1, R2 and C1. This bias circuit
should be located as close as possible to the input pin. The ratio
of R1 and R2 might need to be adjusted to position the V_REF in
the center of the input voltage swing. For example, if the input
clock swing is only 2.5V and VDD = 3.3V, V_REF should be 1.25V
and R2/R1 = 0.609.
VDD
R1
1K
Single Ended Clock Input
CLKx
V_REF
nCLKx
C1
0.1u
R2
1K
FIGURE 1. SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT
RECOMMENDATIONS FOR UNUSED INPUT AND OUTPUT PINS
INPUTS:
OUTPUTS:
CLK/nCLK INPUT:
For applications not requiring the use of the differential input,
both CLK and nCLK can be left floating. Though not required, but
for additional protection, a 1kΩ resistor can be tied from CLK to
ground.
LVCMOS OUTPUT:
All unused LVCMOS output can be left floating. There should be
no trace attached.
LVCMOS CONTROL PINS:
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional
protection. A 1kΩ resistor can be used.
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
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LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
DIFFERENTIAL CLOCK INPUT INTERFACE
The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, SSTL, HCSL
and other differential signals. Both VSWING and VOH must meet the
VPP and VCMR input requirements. Figures 2A to 2E show interface
examples for the HiPerClockS CLK/nCLK input driven by the most
common driver types. The input interfaces suggested here are
examples only. Please consult with the vendor of the driver
component to confirm the driver termination requirements. For
example in Figure 2A, the input termination applies for IDT
HiPerClockS LVHSTL drivers. If you are using an LVHSTL driver
from another vendor, use their termination recommendation.
3.3V
3.3V
3.3V
1.8V
Zo = 50 Ohm
CLK
Zo = 50 Ohm
CLK
Zo = 50 Ohm
nCLK
Zo = 50 Ohm
LVPECL
nCLK
HiPerClockS
Input
LVHSTL
ICS
HiPerClockS
LVHSTL Driver
R1
50
R1
50
HiPerClockS
Input
R2
50
R2
50
R3
50
FIGURE 2A. HIPERCLOCKS CLK/nCLK INPUT DRIVEN
IDT HIPERCLOCKS LVHSTL DRIVER
FIGURE 2B. HIPERCLOCKS CLK/nCLK INPUT DRIVEN
3.3V LVPECL DRIVER
BY
3.3V
3.3V
3.3V
3.3V
3.3V
R3
125
BY
R4
125
Zo = 50 Ohm
LVDS_Driv er
Zo = 50 Ohm
CLK
CLK
R1
100
Zo = 50 Ohm
nCLK
LVPECL
R1
84
HiPerClockS
Input
nCLK
Receiv er
Zo = 50 Ohm
R2
84
FIGURE 2C. HIPERCLOCKS CLK/nCLK INPUT DRIVEN
3.3V LVPECL DRIVER
FIGURE 2D. HIPERCLOCKS CLK/nCLK INPUT DRIVEN
3.3V LVDS DRIVER
BY
BY
3.3V
3.3V
3.3V
LVPECL
Zo = 50 Ohm
C1
Zo = 50 Ohm
C2
R3
125
R4
125
CLK
nCLK
R5
100 - 200
R6
100 - 200
R1
84
HiPerClockS
Input
R2
84
R5,R6 locate near the driver pin.
FIGURE 2E. HIPERCLOCKS CLK/NCLK INPUT DRIVEN
3.3V LVPECL DRIVER WITH AC COUPLE
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
BY
12
ICS8344AY-01 REV. C SEPTEMBER 9, 2008
ICS8344-01
LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
RELIABILITY INFORMATION
TABLE 6. θJAVS. AIR FLOW TABLE
FOR
48 LEAD LQFP
θJA by Velocity (Linear Feet per Minute)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
67.8°C/W
47.9°C/W
55.9°C/W
42.1°C/W
50.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for ICS8344-01 is: 1503
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
13
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PACKAGE OUTLINE - Y SUFFIX FOR 48 LEAD LQFP
TABLE 7. PACKAGE DIMENSIONS
JEDEC VARIATION
ALL DIMENSIONS IN MILLIMETERS
SYMBOL
BBC
MINIMUM
NOMINAL
MAXIMUM
48
N
A
--
--
1.60
A1
0.05
--
0.15
A2
1.35
1.40
1.45
b
0.17
0.22
0.27
c
0.09
--
0.20
D
9.00 BASIC
D1
7.00 BASIC
D2
5.50 Ref.
E
9.00 BASIC
E1
7.00 BASIC
E2
5.50 Ref.
e
0.50 BASIC
L
0.45
0.60
0.75
θ
0°
--
7°
ccc
--
--
0.08
Reference Document: JEDEC Publication 95, MS-026
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
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TABLE 8. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
8344AY-01
ICS8344AY-01
48 Lead LQFP
tray
0°C to 70°C
8344AY-01T
ICS8344AY-01
48 Lead LQFP
1000 tape & reel
0°C to 70°C
8344AY-01LF
ICS8344AY0lL
48 lead "Lead-Free" LQFP
tray
0°C to 70°C
8344AY-01LFT
ICS8344AY0lL
48 lead "Lead-Free" LQFP
1000 tape & reel
0°C to 70°C
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology, Incorporated (IDT) assumes no responsibility for either its use or for
infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial
applications. Any other applications such as those requiring extended temperature ranges, high reliability or other extraordinary environmental requirements are not recommended without additional
processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical
instruments.
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
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REVISION HISTORY SHEET
Rev
B
B
Table
4A
4D
4G
5A
B
B
1
8
14
1
10
11
14
B
B
3A
C
T3A - T3C
5
C
Page
4
5
6
7
8-10
8
3
1
1
2
3
7
8
15
T2
2
Description of Change
Revised IDD row from 60mA Max. to 95mA Max.
Revised IDD row from 60mA Max. to 95mA Max.
Revised IDD row from 60mA Max. to 95mA Max.
Revised Note 1 and Note 4.
Updated Parameter Measurement Figures.
Deleted Power Consideration notes.
Updated Block Diagram.
On April 18, 2001 a typo was corrected in the Ordering Information Table.
The correction was ICS8344AY-01 from ICS8344BY-01.
Features Section - added lead-free bullet.
Added Recommendations for Unused Input and Output Pins.
Added Differential Clock Input Interface.
Ordering Information Table - added lead-free par t number, marking and note.
Updated datasheet format.
Output Enable Function Table - updated table.
Added Pullup and Pulldown to Block Diagram.
Features Section - added Additive Phase Jitter bullet.
Pin Characteristics Table - add CPD specs.
Function Tables - added default to conditions.
AC Characteristics Table - added Additive Phase Jitter row.
Added Additive Phase Jitter Plot.
Ordering Information Table - removed ICS prefix from par t/order number
column.
In CIN row, replaced CLK-SEL with CLK_SEL.
IDT ™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
16
Date
8/6/01
12/13/01
12/18/01
7/24/02
10/26/06
5/10/07
9/8/08
9/9/08
ICS8344AY-01 REV. C SEPTEMBER 9, 2008
ICS8344-01
LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
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800-345-7015 (inside USA)
+408-284-8200 (outside USA)
© 2008 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT, the IDT logo, ICS and HiPerClockS are trademarks
of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be
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