MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS D2PAK−7 (SHORT LEAD) CASE 936AB−01 ISSUE B DATE 08 SEP 2009 A 1 SCALE 1:1 E L1 B A 0.10 A E/2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH AND GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.005 MAXIMUM PER SIDE. THESE DIMENSIONS TO BE MEASURED AT DATUM H. 4. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS E, L1, D1, AND E1. DIMENSIONS D1 AND E1 ESTABLISH A MINIMUM MOUNTING SURFACE FOR THE THERMAL PAD. SEATING PLANE M B A M E1 c2 D1 D 7X H e b 0.13 DETAIL C M B A VIEW A−A c A M B H A1 RECOMMENDED SOLDERING FOOTPRINT* 0.424 SEATING PLANE L INCHES MIN MAX 0.170 0.180 0.000 0.010 0.026 0.036 0.017 0.026 0.045 0.055 0.325 0.368 0.270 −−− 0.380 0.420 0.245 −−− 0.050 BSC 0.539 0.579 0.058 0.078 −−− 0.066 0.010 BSC 0° 8° MILLIMETERS MIN MAX 4.32 4.57 0.00 0.25 0.66 0.91 0.43 0.66 1.14 1.40 8.25 9.53 6.86 −−− 9.65 10.67 6.22 −−− 1.27 BSC 13.69 14.71 1.47 1.98 −−− 1.68 0.25 BSC 0° 8° GENERIC MARKING DIAGRAM* M L3 DIM A A1 b c c2 D D1 E E1 e H L L1 L3 M GAUGE PLANE XX XXXXXXXXX AWLYWWG DETAIL C 0.310 0.584 1 0.136 7X 0.050 PITCH 0.040 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: STATUS: NEW STANDARD: 98AON14119D ON SEMICONDUCTOR STANDARD http://onsemi.com D2PAK−7 (SHORT LEAD) 1 © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 XXXXX A WL Y WW G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON14119D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY D. LAMBERT 17 DEC 2003 A ADDED FOOTPRINT, UPDATED MARKING. REQ. BY F. KOLANKO 17 MAR 2005 B CHANGES RELATED TO CARSEM TO SEREMBAN TRANSFER. REDREW TO JEDEC STANDARDS. REDREW SOLDER FOOTPRINT. REQ. BY B. FONTES. 08 SEP 2009 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2009 September, 2009 − Rev. 01B Case Outline Number: 936AB