936AB

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
D2PAK−7 (SHORT LEAD)
CASE 936AB−01
ISSUE B
DATE 08 SEP 2009
A
1
SCALE 1:1
E
L1
B
A
0.10
A
E/2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH AND GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.005 MAXIMUM PER SIDE. THESE DIMENSIONS
TO BE MEASURED AT DATUM H.
4. THERMAL PAD CONTOUR OPTIONAL WITHIN
DIMENSIONS E, L1, D1, AND E1. DIMENSIONS
D1 AND E1 ESTABLISH A MINIMUM MOUNTING
SURFACE FOR THE THERMAL PAD.
SEATING
PLANE
M
B A
M
E1
c2
D1
D
7X
H
e
b
0.13
DETAIL C
M
B A
VIEW A−A
c
A
M
B
H
A1
RECOMMENDED
SOLDERING FOOTPRINT*
0.424
SEATING
PLANE
L
INCHES
MIN
MAX
0.170
0.180
0.000
0.010
0.026
0.036
0.017
0.026
0.045
0.055
0.325
0.368
0.270
−−−
0.380
0.420
0.245
−−−
0.050 BSC
0.539
0.579
0.058
0.078
−−−
0.066
0.010 BSC
0°
8°
MILLIMETERS
MIN
MAX
4.32
4.57
0.00
0.25
0.66
0.91
0.43
0.66
1.14
1.40
8.25
9.53
6.86
−−−
9.65
10.67
6.22
−−−
1.27 BSC
13.69
14.71
1.47
1.98
−−−
1.68
0.25 BSC
0°
8°
GENERIC
MARKING DIAGRAM*
M
L3
DIM
A
A1
b
c
c2
D
D1
E
E1
e
H
L
L1
L3
M
GAUGE
PLANE
XX
XXXXXXXXX
AWLYWWG
DETAIL C
0.310
0.584
1
0.136
7X
0.050
PITCH
0.040
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON14119D
ON SEMICONDUCTOR STANDARD
http://onsemi.com
D2PAK−7 (SHORT LEAD)
1
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
XXXXX
A
WL
Y
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON14119D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. LAMBERT
17 DEC 2003
A
ADDED FOOTPRINT, UPDATED MARKING. REQ. BY F. KOLANKO
17 MAR 2005
B
CHANGES RELATED TO CARSEM TO SEREMBAN TRANSFER. REDREW TO
JEDEC STANDARDS. REDREW SOLDER FOOTPRINT. REQ. BY B. FONTES.
08 SEP 2009
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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© Semiconductor Components Industries, LLC, 2009
September, 2009 − Rev. 01B
Case Outline Number:
936AB