ONSEMI CS8363YDPS7

CS8363
3.3 V Dual Micropower
Low Dropout Regulator
with ENABLE and RESET
The CS8363 is a precision Micropower dual voltage regulator with
ENABLE and RESET.
The 3.3 V standby output is accurate within ±2% while supplying
loads of 100 mA. Quiescent current is low, typically 140 A with a
300 A load. The active RESET output monitors the 3.3 V standby
output and is low during power−up and regulator dropout conditions.
The RESET circuit includes hysteresis and is guaranteed to operate
correctly with 1.0 V on the standby output.
The second output tracks the 3.3 V standby output through an
external adjust lead, and can supply loads of 250 mA with a typical
dropout voltage of 400 mV. The logic level lead ENABLE is used to
control this tracking regulator output.
Both outputs are protected against overvoltage, short circuit, reverse
battery and overtemperature conditions. The robustness and low
quiescent current of the CS8363 makes it not only well suited for
automotive microprocessor applications, but for any battery powered
microprocessor applications.
http://onsemi.com
1
D2PAK−7
DPS SUFFIX
CASE 936AB
Pin 1. VSTBY
2. VIN
3. VTRK
4. GND
5. Adj
6. ENABLE
7. RESET
MARKING DIAGRAM
CS8363
AWLYWW
Features
• 2 Regulated Outputs
− Standby Output 3.3 V ± 2%; 100 mA
− Adjustable Tracking Output; 250 mA
• Low Dropout Voltage
• RESET for VSTBY
• ENABLE for VTRK
• Low Quiescent Current
• Protection Features
− Independent Thermal Shutdown
− Short Circuit
− 60 V Load Dump
− Reverse Battery
1
A
WL, L
YY, Y
WW, W
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION*
Package
Shipping†
CS8363YDPS7
D2PAK−7
50 Units/Rail
CS8363YDPSR7
D2PAK−7
750 Tape & Reel
Device
*Contact your local sales representative for SO−16L
package option.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
 Semiconductor Components Industries, LLC, 2005
March, 2005 − Rev. 10
1
Publication Order Number:
CS8363/D
CS8363
VSTBY
3.3 V, 100 mA, 2.0%
VIN
Overvoltage
Shutdown
Current
Limit
Bandgap
RESET
BG
+
OVSD
BG
−
TSD OVSD
VIN
VTRK
250 mA
Current
Limit
Thermal
Shutdown
TSD
−
Adj
+
ENABLE
VSTBY
−
+
TSD OVSD
BG
RESET
+
GND
−
RESET
Figure 1. Block Diagram. Consult Your Local Sales Representative for Positive ENABLE Option
ABSOLUTE MAXIMUM RATINGS*
Rating
Value
Unit
−16 to 26
V
Positive Transient Input Voltage, tr > 1.0 ms
60
V
Negative Transient Input Voltage, T < 100 ms, 1.0 % Duty Cycle
−50
V
−0.3 to 10
V
Junction Temperature
−40 to +150
°C
Storage Temperature Range
−55 to +150
°C
2.0
kV
260 peak
230 peak
°C
°C
Supply Voltage, VIN
Input Voltage Range (ENABLE, RESET)
ESD Susceptibility (Human Body Model)
Lead Temperature Soldering
Wave Solder (through hole styles only) Note 1
Reflow (SMD styles only) Note 2
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. 10 seconds max.
2. 60 seconds max above 183°C
*The maximum package power dissipation must be observed.
http://onsemi.com
2
CS8363
ELECTRICAL CHARACTERISTICS (6.0 V ≤ VIN ≤ 26 V, IOUT1 = IOUT2 = 100 A, −40°C ≤ TA ≤ +125°C;
unless otherwise stated.)
Characteristic
Test Conditions
Min
Typ
Max
Unit
−25
−
+25
mV
Tracking Output (VTRK)
VTRK Tracking Error (VSTBY − VTRK)
6.0 V ≤ VIN ≤ 26 V, 100 A ≤ ITRK ≤ 250 mA.
Note 3
Adjust Pin Current, IAdj
Loop in Regulation
−
1.5
5.0
A
Line Regulation
6.0 V ≤ VIN ≤ 26 V. Note 3
−
5.0
50
mV
Load Regulation
100 A ≤ ITRK ≤ 250 mA. Note 3
−
5.0
50
mV
Dropout Voltage (VIN − VTRK)
ITRK = 100 A.
ITRK = 250 mA
−
−
100
400
150
700
mV
mV
Current Limit
VIN = 12 V, VTRK = 3.0 V
275
500
−
mA
Quiescent Current
VIN = 12 V, ITRK = 250 mA, No Load on VSTBY
VIN = 12 V, ITRK = 500 A, ISTBY = 100 A
−
−
25
145
50
220
mA
A
Reverse Current
VTRK = 3.3 V, VIN = 0 V
−
200
1500
A
Ripple Rejection
f = 120 Hz, ITRK = 250 mA, 7.0 V ≤ VIN ≤ 17 V
60
70
−
dB
Output Voltage, VSTBY
4.5 V ≤ VIN ≤ 26 V, 100 A ≤ ISTBY ≤ 100 mA.
3.234
3.3
3.366
V
Line Regulation
6.0 V ≤ VIN ≤ 26 V.
−
5.0
50
mV
Load Regulation
100 A ≤ ISTBY ≤ 100 mA.
−
5.0
50
mV
Dropout Voltage (VIN − VSTBY)
ISTBY = 100 A, VIN = 4.2 V
ISTBY = 100 mA, VIN = 4.2 V
−
−
−
−
1.0
1.0
V
V
Current Limit
VIN = 12 V, VSTBY = 3.0 V
125
200
−
mA
Short Circuit Current
VIN = 12 V, VSTBY = 0 V
10
100
−
mA
Quiescent Current
VIN = 12 V, ISTBY = 100 mA, ITRK = 0 mA
VIN = 12 V, ISTBY = 300 A, ITRK = 0 mA
−
−
10
140
20
200
mA
A
Reverse Current
VSTBY = 3.3 V, VIN = 0 V
−
100
200
A
Ripple Rejection
f = 120 Hz, ISTBY = 100 mA, 7.0 V ≤ VIN ≤ 17 V
60
70
−
dB
−
0.8
1.2
2.0
V
−10
0
10
A
10
50
100
mV
92.5
95
97.5
%VSTBY
−
−
25
A
Standby Output (VSTBY)
RESET ENABLE Functions
ENABLE Input Threshold
ENABLE Input Bias Current
VENABLE = 0 V to 10 V
RESET Hysteresis
RESET Threshold Low (VRL)
−
VSTBY Decreasing, VIN > 4.5 V
RESET Leakage
−
Output Voltage, Low (VRLO)
1.0 V ≤ VSTBY ≤ VRL, RRST = 10 k
−
0.1
0.4
V
Output Voltage, Low (VRPEAK)
VSTBY, Power Up, Power Down
−
0.6
1.0
V
VIN (VRST Low)
VSTBY = 3.3 V
−
4.0
4.5
V
150
150
180
165
−
−
°C
°C
30
34
38
V
Protection Circuitry (Both Outputs)
Independent Thermal Shutdown
Overvoltage Shutdown
VSTBY
VTRK
−
3. VTRK connected to Adj lead. VTRK can be set to higher values by using an external resistor divider.
http://onsemi.com
3
CS8363
PACKAGE PIN DESCRIPTION
PACKAGE PIN #
D2PAK−7
PIN SYMBOL
1
VSTBY
2
VIN
3
VTRK
Tracking output voltage controlled by ENABLE delivering 250 mA.
4
GND
Reference ground connection.
5
Adj
6
ENABLE
7
RESET
FUNCTION
Standby output voltage delivering 100 mA.
Input voltage.
Resistor divider from VTRK to Adj. Sets the output voltage on VTRK. If tied to
VTRK, VTRK will track VSTBY.
Provides on/off control of the tracking output, active LOW.
CMOS compatible output lead that goes low whenever VSTBY falls out of
regulation.
CIRCUIT DESCRIPTION
ENABLE Function
VTRK Output Voltage
The ENABLE function switches the output transistor for
VTRK on and off. When the ENABLE lead voltage exceeds
1.4 V (Typ), VTRK turns off. This input has several hundred
millivolts of hysteresis to prevent spurious output activity
during power−up or power−down.
This output uses the same type of output device as VSTBY,
but is rated for 250 mA. The output is configured as a
tracking regulator of the standby output. By using the
standby output as a voltage reference, giving the user an
external programming lead (Adj lead), output voltages from
3.3 V to 20 V are easily realized. The programming is done
with a simple resistor divider, and following the formula:
RESET Function
The RESET is an open collector NPN transistor,
controlled by a low voltage detection circuit sensing the
VSTBY (3.3 V) output voltage. This circuit guarantees the
RESET output stays below 1.0 V (0.1 V Typ) when VSTBY
is as low as 1.0 V to ensure reliable operation of
microprocessor−based systems.
VTRK VSTBY (1 R1R2) IAdj R1
If another 3.3 V output is needed, simply connect the Adj
lead to the VTRK output lead.
3.3 V, 100 mA
B+
C1*
0.1 F
VSTBY
VIN
CS8363
C2**
10 F
ESR < 8.0 R3
RESET
VDD
MCU
RESET
I/O
ENABLE
R2
Adj
R1
GND
SW 5.0 V,
250 mA
C3**
10 F
ESR < 8.0 VTRK
VTRK ∼ VSTBY(1 + R1/R2)
For VTRK ∼ 5.0 V, R1/R2 ∼ 0.5
*C1 is required if regulator is located far from power supply filter.
**C2 and C3 are required for stability.
Figure 2. Test and Application Circuit, 3.3 V, 5.0 V Regulator
http://onsemi.com
4
GND
CS8363
3.3 V, 100 mA
B+
C1*
0.1 F
VSTBY
VIN
CS8363
VDD
C2**
10 F
ESR < 8.0 R3
RESET
MCU
RESET
I/O
ENABLE
Adj
GND
SW 3.3 V,
250 mA
C3**
10 F
ESR < 8.0 VTRK
GND
*C1 is required if regulator is located far from power supply filter.
**C2 and C3 are required for stability.
Figure 3. Test and Application Circuit, Dual 3.3 V Regulator
APPLICATION NOTES
External Capacitors
IOUT1(max) is the maximum output current, for the
application,
IOUT2(max) is the maximum output current, for the
application, and
IQ is the quiescent current the regulator consumes at both
IOUT1(max) and IOUT2(max).
Once the value of PD(max) is known, the maximum
permissible value of RJA can be calculated:
Output capacitors for the CS8363 are required for
stability. Without them, the regulator outputs will oscillate.
Actual size and type may vary depending upon the
application load and temperature range. Capacitor effective
series resistance (ESR) is also a factor in the IC stability.
Worst−case is determined at the minimum ambient
temperature and maximum load expected.
Output capacitors can be increased in size to any desired
value above the minimum. One possible purpose of this
would be to maintain the output voltages during brief
conditions of negative input transients that might be
characteristic of a particular system.
Capacitors must also be rated at all ambient temperatures
expected in the system. To maintain regulator stability down
to −40°C, capacitors rated at that temperature must be used.
More information on capacitor selection for SMART
REGULATORs is available in the SMART REGULATOR
application note, “Compensation for Linear Regulators,”
document number SR003AN/D, available through the
Literature Distribution Center or via our website at
http://www.onsemi.com.
RJA 150°C TA
PD
(2)
The value of RJA can be compared with those in the
package section of the data sheet. Those packages with
RJA’s less than the calculated value in equation 2 will keep
the die temperature below 150°C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
IIN
VIN
Calculating Power Dissipation in a
Dual Output Linear Regulator
SMART
REGULATOR
Control
Features
The maximum power dissipation for a dual output
regulator (Figure 4) is
PD(max) VIN(max) VOUT1(min)IOUT1(max) VIN(max) VOUT2(min)IOUT2(max) VIN(max)IQ (1)
IOUT1
VOUT1
IOUT2
VOUT2
IQ
where:
VIN(max) is the maximum input voltage,
VOUT1(min) is the minimum output voltage from VOUT1,
VOUT2(min) is the minimum output voltage from VOUT2,
Figure 4. Dual Output Regulator With Key
Performance Parameters Labeled.
http://onsemi.com
5
CS8363
Heat Sinks
where:
RJC = the junction−to−case thermal resistance,
RCS = the case−to−heatsink thermal resistance, and
RSA = the heatsink−to−ambient thermal resistance.
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of RJA:
RJA RJC RCS RSA
RJC appears in the package section of the data sheet. Like
RJA, it too is a function of package type. RCS and RSA are
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
(3)
http://onsemi.com
6
CS8363
PACKAGE DIMENSIONS
D2PAK−7 (SHORT LEAD)
DPS SUFFIX
CASE 936AB−01
ISSUE A
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
TERMINAL 8
A
K
U
E
S
B
DIM
A
B
C
D
E
G
H
K
L
M
N
P
R
S
U
V
V
M
H
L
P
G
D
N
R
INCHES
MIN
MAX
0.396
0.406
0.326
0.336
0.170
0.180
0.026
0.036
0.045
0.055
0.050 REF
0.539
0.579
0.055
0.066
0.000
0.010
0.100
0.110
0.017
0.023
0.058
0.078
0°
8°
0.095
0.105
0.256 REF
0.305 REF
C
SOLDERING FOOTPRINT*
9.5
0.374
2.16
0.085
1.27
0.050
3.25
0.128
CL
10.54
0.415
CL
3.8
0.150
1
0.96
0.038
8.26
0.325
SCALE 3:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
PACKAGE THERMAL DATA
Parameter
D2PAK−7
Unit
RJC
Typical
3.5
°C/W
RJA
Typical
10−50*
°C/W
*Depending on thermal properties of substrate. RJA = RJC + RCA.
http://onsemi.com
7
MILLIMETERS
MIN
MAX
10.05
10.31
8.28
8.53
4.31
4.57
0.66
0.91
1.14
1.40
1.27 REF
13.69
14.71
1.40
1.68
0.00
0.25
2.54
2.79
0.43
0.58
1.47
1.98
0°
8°
2.41
2.67
6.50 REF
7.75 REF
CS8363
SMART REGULATOR is a registered trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
http://onsemi.com
8
For additional information, please contact your
local Sales Representative.
CS8363/D