MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC 16 LEAD WIDE BODY, EXPOSED PAD CASE 751R−02 ISSUE B DATE 18 JUL 2005 −U− SCALE 1:1 A M 16 P 0.25 (0.010) M W B 1 M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751R−01 OBSOLETE, NEW STANDARD 751R−02. 9 R x 45_ 8 −W− G PIN 1 I.D. 14 PL DETAIL E TOP SIDE C F −T− 0.10 (0.004) T K D 16 PL 0.25 (0.010) T U M SEATING PLANE W S S J DETAIL E H EXPOSED PAD 1 8 DIM A B C D F G H J K L M P R L 16 BACK SIDE xxxxxxxxxx xxxxxxxxxx xxxxxxxxxx AWLYYWW SOLDERING FOOTPRINT* .350 Exposed Pad .050 CL .200 INCHES MIN MAX 0.400 0.411 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.130 0.138 0.010 0.012 0.004 0.009 0.180 0.188 0_ 7_ 0.395 0.415 0.010 0.029 MARKING DIAGRAM 9 .175 MILLIMETERS MIN MAX 10.15 10.45 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 3.31 3.51 0.25 0.32 0.10 0.25 4.58 4.78 0_ 7_ 10.05 10.55 0.25 0.75 .188 CL xxx A WL YY WW = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week .376 .074 .024 .145 SCALE 2:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: 98AON10370D Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com SOIC−16, WB EXPOSED PAD 1 DESCRIPTION: October, 2002 − Rev. 0 PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON10370D PAGE 2 OF 2 ISSUE B REVISION ADDED SOLDERING FOOTPRINT. REQ. BY F. KOLANKO. FIXED EXPOSED PAD AND CHANGED DIM H. REQ. BY P. CELAYA. DATE 18 JUL 2005 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2005 July, 2005 − Rev. 02B Case Outline Number: 751R