Thick Film Chip Resistors Thick Film Chip Resistors 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512 Type: ERJ 1G, 2G, 3G, 6G, 8G, 14, 12, 12Z, 1T ■ Features ● Small size and lightweight For PCB size reduction and lightweight products ● High reliability Metal glaze thick film resistive element and three layers of electrodes result in high reliability ● Matching with placement machine Taping and bulk case packagings for automatic placement machine ● Solderability Suitable for both reflow soldering and flow soldering ● Reference Standards IEC 60115-8, JIS C 5201-8, EIAJ RC-2134A ■ Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 E R J 3 G E Y J 1 0 2 V Product Code Thick Film Chip Resistors Size, Power Rating Type : inches Power R. 0.05 W 1GE : 0201 0.063 W 2GE : 0402 0.1 W 3GE : 0603 0.125 W 6GE : 0805 0.25 W 8GE : 1206 0.25 W 14 : 1210 0.5 W 12 : 1812 0.5 W 12Z : 2010 1W 1T : 2512 Code Y ]Nil Marking Marking Value Marking on black side No marking Resistance Tolerance Code J 0 Tolerance ±5% Jumper Resistance Value The first two digits are significant figures of resistance and the third one denotes number of zeros following. Decimal Point is expressed by R as 4.7 = 4R7. Jumper is expressed by R00. Packaging Methods Packaging Punched (Paper) Taping V (Only 3G, 6G, 8G type) Code U Embossed Taping (Only 14, 12, 12Z, 1T type) B Bulk case (Only 2G, 3G, 6G type) X Punched (Paper) Taping 2 mm pitch, 10000 pcs. Y Punched (Paper) Taping 2 mm pitch, 20000 pcs. C Punched (Paper) Taping 2 mm pitch, 15000 pcs. ✽ When omitted, all the rest P/N factors shall be moved up respectively. Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. (Only 2G, 3G type) (Only 2G type) (Only 1G type) Thick Film Chip Resistors ■ Dimensions in mm (not to scale) ■ Construction L a W Protective coating High purity alumina Termination (Inner) t substrate b Dimensions (mm) Type (inches) Termination ERJ1G (0201) ERJ2G (0402) ERJ3G (0603) ERJ6G (0805) ERJ8G (1206) ERJ14 (1210) ERJ12 (1812) ERJ12Z (2010) ERJ1T (2512) (Between) Resistive element Termination (Outer) L W a b Weight (1000 pcs.) t 0.60±0.03 0.30±0.03 0.12±0.05 0.15±0.05 0.25±0.05 0.15 g 1.00±0.05 0.50±0.05 0.20±0.10 0.25±0.05 0.35±0.05 0.8 g 1.60±0.15 0.80+0.15 0.30±0.20 0.30±0.15 0.45±0.10 Ð0.05 2g 2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10 4g 3.20 +0.05 Ð0.20 3.20 ±0.20 1.60 +0.05 Ð0.15 2.50 ±0.20 0.50 ±0.20 0.50 ±0.20 0.50 ±0.20 0.60 ±0.10 0.50 ±0.20 10 g 0.60 ±0.10 16 g 4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10 27 g 5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10 27 g 6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10 45 g ■ Ratings Type (inches) ERJ1G (0201) ERJ2G (0402) ERJ3G (0603) ERJ6G (0805) ERJ8G (1206) ERJ14 (1210) ERJ12, 12Z (1812, 2010) ERJ1T (2512) Jumper Power Rating Limiting Element Maximum Overload Resistance Voltage (Maximum Voltage(2) at 70 ¡C Tolerance(%) RCWV)(1) (V) (W) (V) Resistance Range (W) min. max. 0.05 15 30 ±5 10 1 M 0.063 50 100 ±5 1 2.2 M 0.1 50 100 ±5 1 10 M 0.125 150 200 ±5 1 10 M 0.25 200 400 ±5 1 10 M 0.25 200 400 ±5 1 10 M 0.5 200 400 ±5 1 10 M 1 200 400 ±5 1 1 M 1G 2G á 3G 6Gá8Gá14á12á12Zá1T Rated Current Maximum Overload Current 0.5 A 1 A 2 A 1A 2A 4A T.C.R. Standard ´10-6/¡C Resistance Values (ppm/¡C) <10 W: Ð100 to +600 E24 E24 E24 10 W to 1 MW: ±200 E24 E24 E24 1 MW<: Ð400 to +150 E24 E24 (1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= ÖPower Rating ´ Resistance Values, or Limiting Element Voltage (max. RCWV) listed above, whichever less. (2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 ´ Power Rating or max. Overload Voltage listed above whichever less. 70 ¡C 100Ð55 ¡C 80 60 3G, 6G, 8G 40 1G,2G,14,12,12Z,1T 155 ¡C 20 0Ð60 Ð40 Ð20 0 20 40 60 80125100¡C120 140 160 180 Ambient Temperature (¡C) Rated Load (%) Power Derating Curve For resistors operated in ambient temperatures above 70 ¡C, power rating shall be derated in accordance with the right figure. Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. Thick Film Chip Resistors ■ Packaging Methods ● Standard Quantity Type (inches) Thickness (mm) Punched (Paper) Taping ERJ1G (0201) ERJ2G (0402) ERJ3G (0603) ERJ6G (0805) ERJ8G (1206) ERJ14 (1210) ERJ12,12Z (1812, 2010) ERJ1T (2512) 0.25 15000 pcs./reel (2 mm pitch) 10000 20000 10000 5000 0.35 0.45 pcs./reel pcs./reel pcs./reel pcs./reel Embossed Taping (4 mm pitch) Bulk Case (2 mm pitch) (2 mm pitch) (2 mm pitch) (4 mm pitch)✽ 0.6 5000 pcs./reel (4 mm pitch)✽ 0.6 5000 pcs./reel (4 mm pitch)✽ 50000 pcs./case 25000 pcs./case 10000 pcs./case 0.6 5000 pcs./reel 0.6 5000 pcs./reel 0.6 4000 pcs./reel ✽ Please ask us when resistors except standard specification shown above talde are needed. ● Taping Reel ● Bulk Case (mm) T Slider 12 Shutter 38 fB fC fA fA Type 110 W fB fC W T Dimensions 1G,2G,3G 9.0±1.0 11.4±2.0 0 (mm) 6G,8G,14 180.0Ð3.0 60 min. 13.0±1.0 12,12Z,1T 13.0±1.0 15.4±2.0 ● Punched (Paper) Taping Compartment Chip component Type 1G 2G Dimensions 3G (mm) 6G 8G P1 P2 A B 0.38±0.05 0.70±0.05 1.10±0.10 1.65±0.15 2.00±0.15 0.68±0.05 1.20±0.05 1.90±0.10 2.50±0.20 3.60±0.20 8.00±0.20 3.50±0.05 1.75±0.10 P2 P0 fD0 2.00±0.05 4.00±0.10 1.50+0.10 0 T 0.47±0.05 0.52±0.05 0.70±0.05 Type P1 1G 2.00±0.10 Dimensions 2G (mm) 3G 6G 4.00±0.10 8G W F E F W A Tape running direction P0 Compartment B B A T Sprocket hole fD0 F E W Sprocket hole fD0 ● Embossed Taping E 0.84±0.05 t Chip component Type 14 Dimensions 12 (mm) 12Z 1T A 2.80±0.20 3.50±0.20 2.80±0.20 3.60±0.20 Type P2 14 Dimensions 12 2.00±0.05 (mm) 12Z 1T P1 P2 B fD1 Tape running direction P0 W F E P1 3.50±0.20 8.00±0.30 3.50±0.05 4.80±0.20 1.75±0.10 4.00±0.10 5.30±0.20 12.00±0.30 5.50±0.05 6.90±0.20 P0 fD0 t 4.00±0.10 1.50+0.10 0 1.00±0.10 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. fD1 1 min. 1.5 min. Thick Film Chip Resistors ■ Recommended Land Pattern In the case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In the case of reflow soldering, solder amount can be adjusted, therefor the land width should be set to 1.0 to 1.3 times chip resistor width (W). Type (inches) ERJ1G(0201) ERJ2G(0402) ERJ3G(0603) ERJ6G(0805) ERJ8G(1206) ERJ14(1210) ERJ12(1812) ERJ12Z(2010) ERJ1T(2512) c Chip Resistor a b Dimensions (mm) a b c 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 0.7 to 0.9 2 to 2.2 0.8 to 1 1 to 1.4 3.2 to 3.8 0.9 to 1.4 2 to 2.4 4.4 to 5 1.2 to 1.8 2 to 2.4 4.4 to 5 1.8 to 2.8 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5 3.6 to 4 6.2 to 7 1.8 to 2.8 5 to 5.4 7.6 to 8.6 2.3 to 3.5 ■ Recommended Soldering Conditions Recommendations and precautions are described below. ● Recommended soldering conditions for reflow áReflow soldering shall be two times maximum. áPlease contact us for additional information when you use in conditions other than those specified. áPlease measure a temperature of terminations and study solderability every kind of solder and board, before actual use. For solder (Example : Sn/Pb) Preheating Main heating Peak Peak Time 140 ¡C to 160 ¡C 60 s to 120 s Above 200 ¡C 30 s to 40 s 235 ± 5 ¡C max. 10 s For lead-free solder (Example : Sn/Ag/Cu) Temperature Time Preheating Temperature Temperature Preheating Heating Main heating Peak 150 ¡C to 180 ¡C 60 s to 120 s Above 230 ¡C 30 s to 40 s max. 260 ¡C max. 10 s Time ● Recommended soldering conditions for flow For solder For lead-free solder Temperature Time Temperature Time Preheating 140 ¡C to 160 ¡C 60 s to 120 s 150 ¡C to 180 ¡C 60 s to 120 s Soldering 245±5 ¡C 20 s to 30 s max. 260 ¡C max. 10 s Cautions for Safety 1. If transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and confirmation test with the resistors actually mounted on your own board. When the load of more than rated power is applied under the load condition at steady state, it may impair performance and/or reliability of resistor. Never exceed the rated power. 2. Chlorine type or other high-activity flux is not recommended as the residue may affect performance or reliability of resistors. 3. When soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. When using a soldering iron with a tip at high temperature, solder for a time as short as possible (three seconds or less up to 350 ¡C). 4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may damage protective film or the body of resistor and may affect resistorÕs performance. Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.