PANASONIC MN101E29G

MN101E29G
MN101E29G
Type
MN101EF29G
Mask ROM
Internal ROM type
FLASH
ROM (byte)
128K
RAM (byte)
6K
Package (Lead-free)
Minimum Instruction
Execution Time
QFP100-P-1818B (Under development)
50 ns (at 2.2 V to 5.5 V, 20 MHz)
50 ns (at 2.2 V to 5.5 V, 20 MHz)
* at internal 2 , 3 , 4 , 5 , 6 , 8 , 10 times oscillation used
 Interrupts
6 external interrupts, 28 internal interrupts
RESET, Watchdog, External 0 to 4, Timer 0 to 4, Timer 6, Timer 7 (2 systems), Timer 8 (2 systems), Timer 9 (2 systems), Time
base, Serial 0 (2 systems), Serial1 (2 systems), Serial 2 (2 systems), Serial 3 (2 systems), Serial 4, Serial 5, A/ D conversion finish,
Automatic transfer (2 systems), Key interrupts
 Timer Counter
Timer counter 0 : 8-bit × 1
(timer pulse output, event count, added pulse (2-bit) system PWM output, generation of remote control carrier, simple
pulse measurement, real time output control)
Timer counter 1 : 8-bit × 1
(timer pulse output, event count, 16-bit cascade connected (timer 0, 1) timer synchronous output event)
Timer counter 2 : 8-bit × 1
(timer pulse output, event count, added pulse (2-bit) system PWM output, simple pulse measurement, 24-bit cascade
connected (timer 0, 1, 2), timer synchronous output event, real timer output control)
Timer counter 3 : 8-bit × 1
(timer pulse output, event count, generation of remote control carrier, 16-bit cascade connected (timer 2, 3), 32-bit
cascade connected (timer 0, 1, 2, 3))
Timer counter 4 : 8-bit × 1
(timer pulse output, added pulse (2-bit) system PWM output, event count, serial transfer clock, simple pulse measurement)
Timer counter 6 : 8-bit free run timer, time base timer
Timer counter 7 : 16-bit × 1
(timer pulse output, event count, High accuracy PWM, High performance IGBT output (cycle/duty continuous variable) timer
synchronous output event, input capture (Both edge available), real timer output control), double buffer compare register
Timer counter 8 : 16-bit × 1
(timer pulse output, event count, High accuracy PWM output (cycle/duty continuous variable) pulse width measurement,
input capture (Both edge available), 32-bit cascade connected (Timer 7 , 8), 32-bitPWM output, synchronous output
event), double buffer compare register
Timer counter 9 : 16-bit × 1
(timer pulse output, event count, High accuracy PWM output (cycle/duty continuous variable), pulse width
measurement, input capture (Both edge available), real timer output control), double buffer compare register
Timer counter A : 8-bit × 1 (event count, Serial transfer clock timer, clock for function (timer, serial, LCD))
Watchdog timer
 Serial interface
Serial 0 ~ 3 : UART (full duplex) / synchronous × 1
Serial 4 : multi master I²C / synchronous × 1
Serial 5 : I²C slave × 1
 DMA controller
2 systems (External request/internal event request/software request maximum transfer cycles are 255)
 I/O Pins
I/O
90
common use, Specified pull-up/pull-down resistor available, Input/output selectable (bit-unit)
MAD00062AEM
MN101E29G
 A/D converter
10-bit × 16-ch.
 D/A converter
8-bit × 4-ch.
 Display control function
LCD
55 segments × 4 commons (static, 1/2, 1/3, 1/4 duty) 1/3 bias, Usable if VLC1 ≤ VDD
 Special Ports
Buzzer output, remote control carrier signal output, high-current drive port
 ROM Correction
Correcting address designation : up to 7 addresses possible
 Development tools
In-circuit Emulator
PX-ICE101E + PRBV101E29-QFP100-P-1818B (Under development)
P46, SDA5B, SEG29
P45, SBT0B, SEG30
P44, SBI0B, RXD0B, SEG31
P43, SBO0B, TXD0B, SEG32
P42, SBT3B, SEG33
53
52
51
P47, SCL5B, SEG28
56
54
P57, KEY7, D7, SEG27
57
55
P55, KEY5, D5, SEG25
P54, NBUZZERA, KEY4, D4, SEG24
60
P56, KEY6, D6, SEG26
P53, BUZZERA, KEY3, D3, SEG23
61
58
P52, SBT0A, KEY2, D2, SEG22
62
59
P51, SBI0A, RXD0A, KEY1, D1, SEG21
63
P61, DA_B, SEG18
66
P60, SEG19
P62, TM1IOB, A0, SEG17
67
P50, SBO0A, TXD0A, KEY0, D0, SEG20
P63, TM3IOB, A1, SEG16
68
64
P64, TM4IOB, A2, SEG15
69
65
P66, SBO4A, SDA4A, A4, SEG13
P67, SBT4A, SCL4A, A5, SEG12
72
P65, SBI4A, A3, SEG14
P70, SBO2A, TXD2A, A6, SEG11
73
70
P71, SBI2A, RXD2A, A7, SEG10
74
71
P72, SBT2A, NWE, SEG9
75
 Pin Assignment
P73, SDA5A, NRE, SEG8
76
50
P74, SCL5A, NCS, SEG7
77
49
P40, SBO3B, TXD3B, SEG35
P75, SBO1B, TXD1B, A8, SEG6
78
48
P36, SEG36
P76, SBI1B, RXD1B, A9, SEG5
79
47
P35, SBI4B, SEG37
P77, SBT1B, A10, SEG4
80
46
P34, SBT4B, SCL4B, SEG38
P41, SBI3B, RXD3B, SEG34
P80, TM9OD0, PWM00, SDO0, A11, SEG3
81
45
P33, SBO4B, SDA4B, SEG39
P81, TM9OD1, PWMN00, SDO1, A12, SEG2
82
44
P32, SBT2B, SEG40
P82, TM9OD2, PWM01, SDO2, A13, SEG1
83
43
P31, SBI2B, RXD2B, SEG41
P83, TM9OD3, PWMN01, SDO3, A14, SEG0
84
42
P30, SBO2B, TXD2B, SEG42
P84, TM9OD4, PWM02, SDO4, A15, COM0
85
41
P16, TM8IOC, NBUZZERB, SEG43
P85, TM9OD5, PWMN02, SDO5, A16, COM1
86
40
P15, TM7IOC, BUZZERB, SEG44
P86, SDO6, A17, COM2
87
39
P14, TM4IOC, SEG45
P87, SDO7, A18, COM3
88
38
P13, TM3IOC, SEG46
P92, A19, VLC3
89
37
P12, TM1IOC, SEG47
P93, NDK, VLC2
90
36
P11, TM2IOC, SEG48
P94, DA_C, SYSCLK, VLC1
91
35
P10, TM0IOC, RMOUTC, SEG49
P95, DA_D
92
34
P24, IRQ4, SEG50
PB7, AN15
93
33
P23, IRQ3, SEG51
PB6, AN14
94
32
P22, IRQ2, SEG52
PB5, AN13
95
31
P21, IRQ1, ACZ1, SEG53
PB4, AN12
96
30
P20, IRQ0, ACZ0, SEG54
PB3, AN11
97
29
P07, LED7, DA_A
PB2, AN10
98
28
P06, LED6, SBT3A
PB1, AN9
99
27
P05, LED5, SBI3A, RXD3A
PB0, AN8
100
26
P04, LED4, SBO3A, TXD3A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
PA0, AN0, TM0IOA, RMOUTA
PA1, AN1, TM1IOA
PA2, AN2, TM2IOA
PA3, AN3, TM3IOA
PA4, AN4, TM4IOA
PA5, AN5, TM7IOA
PA6, AN6, TM8IOA
PA7, AN7, TM9IOA
VREF+
MMOD
ATRST
P27, NRST
P91, XO
P90, XI
VSS
OSC1
OSC2
VDD5
VDD18
P96
DMOD
P00, LED0, TM7IOB, SBI1A, RXD1A
P01, LED1, TM8IOB, SBO1A, TXD1A
P02, LED2, TM9IOB, SBT1A
P03, LED3, TM0IOB, TM2IOB, RMOUTB
MN101E29G
QFP100-P-1818B
MAD00062AEM
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
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