New Product SiA461DJ Vishay Siliconix P-Channel 20-V (D-S) MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) () Max. - 20 ID (A)a 0.033 at VGS = - 4.5 V - 12 0.042 at VGS = - 2.5 V - 12 0.055 at VGS = - 1.8 V - 12 • TrenchFET® Power MOSFET • Thermally Enhanced PowerPAK® SC-70 Package - Small Footprint Area - Low On-Resistance • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 Qg (Typ.) 18 nC APPLICATIONS • Smart Phones, Tablet PCs, Mobile Computing - Battery Switch - Charger Switch - Load Switch PowerPAK SC-70-6L-Single 1 D 2 (4) S D 3 6 G D 5 (3) G BVX S D 2.05 mm Marking Code Part # code S XXXX 2.05 mm Lot Traceability and Date code 4 (1, 2, 5, 6) D Ordering Information: SiA461DJ-T1-GE3 (Lead (Pb)-free and Halogen free) P-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) Parameter Symbol VDS VGS Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 °C) TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C IDM Pulsed Drain Current (t = 300 µs) Continuous Source-Drain Diode Current Maximum Power Dissipation ID TC = 25 °C TA = 25 °C TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)d, e IS PD TJ, Tstg Limit - 20 ±8 Unit V - 12a - 12a - 8.3b, c - 6.6b, c - 20 - 12a - 2.8b, c 17.9 11.4 3.4b, c 2.2b, c - 55 to 150 260 A W °C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit RthJA t5s 29 37 Maximum Junction-to-Ambientb, f °C/W RthJC Steady State Maximum Junction-to-Case (Drain) 5.5 7 Notes: a. Package limited. b. Surface mounted on 1" x 1" FR4 board. c. t = 5 s. d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components. f. Maximum under steady state conditions is 80 °C/W. Document Number: 63838 S12-0539-Rev. A, 12-Mar-12 For more information please contact: [email protected] www.vishay.com 1 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 New Product SiA461DJ Vishay Siliconix SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) Parameter Symbol Test Conditions Min. VDS VGS = 0 V, ID = - 250 µA - 20 Typ. Max. Unit Static Drain-Source Breakdown Voltage VDS/TJ VDS Temperature Coefficient VGS(th) Temperature Coefficient VGS(th)/TJ Gate-Source Threshold Voltage ID = - 250 µA VGS(th) VDS = VGS , ID = - 250 µA Gate-Source Leakage IGSS VDS = 0 V, VGS = ± 8 V Zero Gate Voltage Drain Current IDSS On-State Drain Currenta ID(on) Drain-Source On-State Resistancea Forward Transconductancea V - 18 mV/°C 3 - 0.4 -1 V ± 100 nA VDS = - 20 V, VGS = 0 V -1 VDS = - 20 V, VGS = 0 V, TJ = 85 °C - 10 VDS - 5 V, VGS = - 4.5 V - 20 µA A VGS - 4.5 V, ID = - 5.2 A 0.025 0.033 RDS(on) VGS - 2.5 V, ID = - 4.8 A 0.030 0.042 VGS - 1.8 V, ID = - 2 A 0.040 0.055 gfs VDS = - 6 V, ID = - 5.2 A 20 S Dynamicb Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss Total Gate Charge Qg Gate-Source Charge Qgs Gate-Drain Charge Qgd Gate Resistance Rg 1300 VDS = - 10 V, VGS = 0 V, f = 1 MHz VDS = - 10 V, VGS = - 8 V, ID = - 5.2 A VDS = - 10 V, VGS = - 4.5 V, ID = - 5.2 A tr Rise Time td(off) Turn-Off Delay Time Fall Time Turn-On Delay Time 45 18 27 2.1 nC VDD = - 10 V, RL = 2.4 ID - 4.2 A, VGEN = - 4.5 V, Rg = 1 6 20 30 22 35 75 tf 20 30 td(on) 10 15 12 25 50 75 15 25 td(off) VDD = - 10 V, RL = 2.4 ID - 4.2 A, VGEN = - 8 V, Rg = 1 tf Fall Time 30 50 tr Rise Time Turn-Off Delay Time pF 4.8 f = 1 MHz td(on) Turn-On Delay Time 210 180 ns Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current Pulse Diode Forward Currenta IS TC = 25 °C - 12 ISM VSD Body Diode Voltage - 20 IS = - 4.2 A - 0.8 - 1.2 A V Body Diode Reverse Recovery Time trr 45 70 ns Body Diode Reverse Recovery Charge Qrr 40 60 nC Reverse Recovery Fall Time ta Reverse Recovery Rise Time tb IF = - 4.2 A, dI/dt = 100 A/µs, TJ = 25 °C 23 22 ns Notes: a. Pulse test; pulse width 300 µs, duty cycle 2 % b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com 2 For more information please contact: [email protected] Document Number: 63838 S12-0539-Rev. A, 12-Mar-12 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 New Product SiA461DJ Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 20 10 VGS = 5 V thru 2 V 8 ID - Drain Current (A) ID - Drain Current (A) 16 VGS = 1.5 V 12 8 4 6 TC = 25 °C 4 TC = 125 °C 2 VGS = 1 V TC = - 55 °C 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 VDS - Drain-to-Source Voltage (V) 0.0 0.3 0.6 0.9 1.2 VGS - Gate-to-Source Voltage (V) Output Characteristics Transfer Characteristics 1.5 2500 0.08 C - Capacitance (pF) RDS(on) - On-Resistance (Ω) 2000 0.06 VGS = 1.8 V 0.04 VGS = 2.5 V Ciss 1500 1000 0.02 VGS = 4.5 V 500 Coss Crss 0 0.00 0 4 8 12 ID - Drain Current (A) 16 20 0 4 On-Resistance vs. Drain Current and Gate Voltage 12 16 20 Capacitance 8 1.5 R DS(on) - On-Resistance (Normalized) ID = 5.2 A VGS - Gate-to-Source Voltage (V) 8 VDS - Drain-to-Source Voltage (V) 6 VDS = 10 V VDS = 16 V 4 2 0 0 5 10 15 20 Qg - Total Gate Charge (nC) Gate Charge Document Number: 63838 S12-0539-Rev. A, 12-Mar-12 25 30 1.4 VGS = 4.5 V; 2.5 V; ID = 5.2 A 1.3 1.2 1.1 VGS = 1.8 V; ID = 2 A 1.0 0.9 0.8 0.7 - 50 - 25 0 25 50 75 100 TJ - Junction Temperature (°C) 125 150 On-Resistance vs. Junction Temperature For more information please contact: [email protected] www.vishay.com 3 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 New Product SiA461DJ Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 100 0.08 RDS(on) - On-Resistance (Ω) I S - Source Current (A) ID = 5.2 A 10 TJ = 150 °C TJ = 25 °C 1 0.1 0.0 0.06 0.04 TJ = 125 °C TJ = 25 °C 0.02 0.00 0.2 0.4 0.6 0.8 1.0 1.2 VSD - Source-to-Drain Voltage (V) 0 1 2 3 4 VGS - Gate-to-Source Voltage (V) Source-Drain Diode Forward Voltage On-Resistance vs. Gate-to-Source Voltage 0.9 5 30 0.8 25 0.7 Power (W) VGS(th) (V) 20 0.6 ID = 250 µA 0.5 15 10 0.4 5 0.3 0.2 - 50 - 25 0 25 50 75 100 125 0 0.001 150 0.01 0.1 TJ - Temperature (°C) Threshold Voltage 1 Time (s) 10 100 1000 Single Pulse Power 100 Limited by RDS(on)* ID - Drain Current (A) 10 100 μs 1 ms 1 10 ms 100 ms 1s 10 s DC 0.1 TA = 25 °C BVDSS Limited 0.01 0.1 1 10 VDS - Drain-to-Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified 100 Safe Operating Area www.vishay.com 4 For more information please contact: [email protected] Document Number: 63838 S12-0539-Rev. A, 12-Mar-12 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 New Product SiA461DJ Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 25 24 20 16 15 Power (W) ID - Drain Current (A) 20 Package Limited 10 12 8 5 4 0 0 0 25 50 75 100 125 150 0 25 50 75 100 TC - Case Temperature (°C) TC - Case Temperature (°C) Current Derating* Power, Junction-to-Case 125 150 * The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. Document Number: 63838 S12-0539-Rev. A, 12-Mar-12 For more information please contact: [email protected] www.vishay.com 5 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 New Product SiA461DJ Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) Normalized Effective Transient Thermal Impedance 1 Duty Cycle = 0.5 0.1 0.2 Notes: Notes: Notes: 0.1 P PDM DM DM P DM 0.05 tt1111 tt2222 tt1111 1. Duty Duty Cycle, Cycle, D D == 1. tt2222 80 °C/W °C/W 2. 2. Per Per Unit Unit Base Base = = R R thJA thJA = == 80 80 °C/W 2. Per Unit Base = RthJA 0.02 thJA (t) (t) 3. TTJM TA = PDM ZthJA (t) 3. JM -- T DMZ thJA(t) JM A thJA JM AA = PDM DM thJA 4. 4. Surface Surface Mounted Mounted 4. Surface Mounted Single Pulse 0.01 0.0001 0.001 0.01 0.1 1 10 100 1000 Square Wave Pulse Duration (s) Normalized Effective Transient Thermal Impedance Normalized Thermal Transient Impedance, Junction-to-Ambient 1 Duty Cycle = 0.5 0.2 0.1 0.05 0.02 Single Pulse 0.1 0.0001 0.001 0.01 0.1 1 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Case Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?63838. www.vishay.com 6 For more information please contact: [email protected] Document Number: 63838 S12-0539-Rev. A, 12-Mar-12 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Package Information Vishay Siliconix b e PIN1 PIN3 PIN1 PIN2 PIN3 PIN5 K1 E1 E1 K PIN6 K3 D1 D1 K D2 D1 E3 E1 E2 K4 K L PIN2 b e L PowerPAK® SC70-6L PIN6 PIN4 K2 PIN5 K1 K2 BACKSIDE VIEW OF SINGLE PIN4 K2 BACKSIDE VIEW OF DUAL A D C A1 E Notes: 1. All dimensions are in millimeters 2. Package outline exclusive of mold flash and metal burr 3. Package outline inclusive of plating Z z DETAIL Z SINGLE PAD DIM A MILLIMETERS DUAL PAD INCHES MILLIMETERS INCHES Min Nom Max Min Nom Max Min Nom Max Min Nom Max 0.675 0.75 0.80 0.027 0.030 0.032 0.675 0.75 0.80 0.027 0.030 0.032 A1 0 - 0.05 0 - 0.002 0 - 0.05 0 - 0.002 b 0.23 0.30 0.38 0.009 0.012 0.015 0.23 0.30 0.38 0.009 0.012 0.015 C 0.15 0.20 0.25 0.006 0.008 0.010 0.15 0.20 0.25 0.006 0.008 0.010 D 1.98 2.05 2.15 0.078 0.081 0.085 1.98 2.05 2.15 0.078 0.081 0.085 D1 0.85 0.95 1.05 0.033 0.037 0.041 0.513 0.613 0.713 0.020 0.024 0.028 D2 0.135 0.235 0.335 0.005 0.009 0.013 E 1.98 2.05 2.15 0.078 0.081 0.085 1.98 2.05 2.15 0.078 0.081 0.085 E1 1.40 1.50 1.60 0.055 0.059 0.063 0.85 0.95 1.05 0.033 0.037 0.041 E2 0.345 0.395 0.445 0.014 0.016 0.018 E3 0.425 0.475 0.525 0.017 0.019 0.021 e 0.65 BSC 0.026 BSC 0.65 BSC 0.026 BSC K 0.275 TYP 0.011 TYP 0.275 TYP 0.011 TYP K1 0.400 TYP 0.016 TYP 0.320 TYP 0.013 TYP K2 0.240 TYP 0.009 TYP 0.252 TYP 0.010 TYP K3 0.225 TYP 0.009 TYP K4 L 0.355 TYP 0.175 0.275 0.014 TYP 0.375 T 0.007 0.011 0.015 0.175 0.275 0.375 0.007 0.011 0.015 0.05 0.10 0.15 0.002 0.004 0.006 ECN: C-07431 − Rev. C, 06-Aug-07 DWG: 5934 Document Number: 73001 06-Aug-07 www.vishay.com 1 Application Note 826 Vishay Siliconix RECOMMENDED PAD LAYOUT FOR PowerPAK® SC70-6L Single 0.300 (0.012) 0.650 (0.026) 0.350 (0.014) 0.275 (0.011) 0.550 (0.022) 0.475 (0.019) 2.200 (0.087) 1.500 (0.059) 0.870 (0.034) 0.235 (0.009) 0.355 (0.014) 0.350 (0.014) 1 0.650 (0.026) 0.300 (0.012) 0.950 (0.037) Dimensions in mm/(Inches) Return to Index APPLICATION NOTE Document Number: 70486 Revision: 21-Jan-08 www.vishay.com 11 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000