REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED 89-03-22 M. A. FRYE 94-06-24 M. A. FRYE Add device type 02, generic 1847. Add two packages, F-5 and C-2. Make changes to paragraphs 1.2.1, 1.2.2, 6.4, table I, and figures 1 and 2. Change drawing CAGE code to 67268 A TABLE I. Short circuit current test. Under the conditions column, add the following sentence; “Both negative and positive currents are considered to decrease towards 0”. Under the minimum limits column, delete “-1 mA dc” and substitute “-10 mA dc”. Under the maximum limits column, delete “-10 mA” entirely. TABLE I. Shutdown terminal section. Threshold voltage test. Under the conditions column, add the following condition: B “RL(CUR LIM/SS PIN) = 15 k at 2 V or equivalent.” Changes in accordance with NOR 5962-R080-94. C Make changes to latching and nonlatching current test in table I. Update boilerplate. Add class V for vendor CAGE 01295. Redrawn. -rrp 00-12-01 R. MONNIN D Drawing updated to reflect current requirements. - ro 03-03-04 R. MONNIN E Add device type 03. -rrp 08-12-15 R. HEBER F Make change to the Sync input current ( ISYNC ) test condition from “sync voltage = 5.25 V” to “sync voltage = 3.9 V”. - ro 10-10-20 C. SAFFLE G Update document paragraphs to current MIL-PRF-38535 requirements. - ro 14-03-10 C. SAFFLE H Add paragraph 3.1.1 and Appendix A for microcircuit die. - ro 15-10-16 C. SAFFLE CURRENT CAGE CODE 67268 THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV H H H H H H H H SHEET 15 16 17 18 19 20 21 22 REV STATUS REV H H H H H H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY DONALD R. OSBORNE STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil CHECKED BY D. A. DiCENZO APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A N. A. HAUCK DRAWING APPROVAL DATE 87-03-10 REVISION LEVEL H MICROCIRCUIT, LINEAR, CURRENT MODE PULSE WIDTH MODULATOR, MONOLITHIC SILICON SIZE CAGE CODE A 14933 SHEET DSCC FORM 2233 APR 97 5962-86806 1 OF 22 5962-E027-16 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device class M and Q: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) 86806 01 E A Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number For device class V: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) 01 V E A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) 86806 / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 1846 1847 1846-SP Controller, pulse-width modulator Controller, pulse-width modulator Controller, pulse-width modulator 01 02 03 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class M Q or V Device requirements documentation Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Certification and qualification to MIL-PRF-38535 STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 2 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter E F 2 Descriptive designator GDIP1-T16 or CDIP2-T16 GDFP2-F16 or CDFP3-F16 CQCC1-N20 Terminals 16 16 20 Package style Dual-in-line Flat pack Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage (VIN) ..................................................................................................... +40 V dc Collector supply voltage (VC) ........................................................................................ Output current, source or sink ...................................................................................... Analog inputs ................................................................................................................ Reference output current .............................................................................................. Sync output current ....................................................................................................... Error amplifier output current ........................................................................................ Soft start sink current .................................................................................................... Oscillator charging current ............................................................................................ Power dissipation at TA = +25C .................................................................................. +40 V dc 500 mA dc -0.3 V to +VIN -30 mA dc -5 mA dc -5 mA dc 50 mA dc 5 mA dc 1000 mW 2/ Power dissipation at TC = +25C .................................................................................. 2000 mW 3/ Junction temperature (TJ) ............................................................................................. +150C Lead temperature (soldering, 10 seconds) ................................................................... +300C Storage temperature range ........................................................................................... -65C to +150C Thermal resistance, junction-to-case (JC) ................................................................... See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case E ...................................................................................................................... 100C/W Case F ...................................................................................................................... 115C/W Case 2 ....................................................................................................................... 88C/W 1.4 Recommended operating conditions. Supply voltage range .................................................................................................... +8 V dc to +40 V dc Collector supply voltage range ..................................................................................... +4.5 V dc to +40 V dc Ambient operating temperature range (TA) .................................................................. -55C to +125C ______ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Derate at 10 mW/C for TA above +50C. 3/ Derate at 16 mW/C for TC above +25C. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1 3.2.3 Block diagram. The block diagram shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55°C TA +125°C Group A subgroups Device type Limits unless otherwise specified Unit Min Max 01, 02 5.05 5.15 03 5.04 5.16 1,2,3 All -20 20 mV dc mV dc Reference section. Output voltage VO 1 TA = +25C, IO = 1 mA V dc Line regulation R 8VV Load regulation RLOAD -10 mA I -1 mA L 1,2,3 All -15 15 Line, load, and temperature 1,2,3 All 5.00 5.20 V 1,2,3 All -10 4 All 39 47 kHz 4,5,6 All -2.0 2.0 % 3.9 Total output variation LINE 2/ Short circuit output --IOS IN REF 40 V = 0 V, V dc mA dc Both negative and positive currents are considered to decrease towards 0. Oscillator section. Initial accuracy --- TA = +25C, RT = 10 k , C = 4700 pF T Frequency change with voltage fOSC Sync output voltage high level VSOH 1,2,3 All Sync output voltage low level VSOL 1,2,3 01, 02 2.7 03 2.5 Sync input voltage high level VSIH Sync input voltage low level VSIL Sync input current ISYNC 8VV IN 40 V C =0V T Sync voltage = 3.9 V, CT = 0 V V dc 3.9 V dc 1,2,3 All V dc 1,2,3 All 2.5 V dc 1,2,3 All 1.5 mA dc See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 5 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C TA +125°C Group A subgroups Device type unless otherwise specified Limits Min Unit Max Error amplifier section. Input offset voltage VIO 1,2,3 All 5.0 mV dc Input bias current IIB 1,2,3 All -1.0 Input offset current IIO 1,2,3 All -250 250 Common mode range VCMR 8 V VIN 40 V 1,2,3 03 0 VIN - 2 Open loop voltage gain AVS VO = 1.2 V to 3 V, 4,5,6 All 80 dB 4 All 0.7 MHz 4,5,6 All 75 dB A dc nA dc V VCM = 2 V Unity gain bandwidth 2/ GBW TA = +25C Common mode rejection ratio CMRR 0 V VCM 38 V, Power supply rejection ratio PSRR 8 V VIN 40 V 4,5,6 All 80 dB Output sink current (COMPENSATION pin) ISINK -15 mV VID -5 V, 1,2,3 All 2.0 mA dc Output source current (COMPENSATION pin) ISOURCE 1,2,3 All High level output voltage VOH RL = (COMP) 15 k 1,2,3 All Low level output voltage VOL RL = (COMP) 15 k 1,2,3 All VIN = 40 V VCOMP pin = 1.2 V 15 mV VID 5 V, -0.4 mA dc VCOMP pin = 2.5 V 4.3 V dc 1.0 V dc See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55°C TA +125°C Group A subgroups Device type unless otherwise specified Limits Unit Min Max 01, 02 2.5 3.15 03 2.5 3.1 1,2,3 All 1.1 Current sense amplifier section. Amplifier gain 3/ 4/ AV 4,5,6 V(-CUR SENSE) pin = 0 V, V(CUR LIM/SS) pin open V dc Maximum differential input signal (pos and neg current sense pin voltages) VIDIFF Input offset voltage VIO V(CUR LIM/SS) pin = 0.5 V, COMP pin open 3/ 1,2,3 All -25 Common mode rejection ratio CMRR 1 V VCM 12 V 4,5,6 All 60 dB Power supply rejection ratio PSRR 8 V VIN 40 V 4,5,6 All 60 dB Input bias current IIB V(CUR LIM/SS) pin = 0.5 V, 3/ COMP pin open 1,2,3 All -10 A dc Input offset current IIO V(CUR LIM/SS) pin = 0.5 V, 3/ COMP pin open 1,2,3 All -1.0 1,2,3 03 VIN - 3 V 9 All 500 ns V(CUR LIM/SS) pin open, 3/ V dc RL = (COMP pin) = 15 k Input common mode range VCMR Delay to outputs 2/ --- TA= +25C 25 1.0 mV dc A dc See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55°C TA +125°C Group A subgroups Device type Limits unless otherwise specified Unit Min Max 01, 02 0.40 0.55 03 0.45 0.55 1,2,3 All -30 1,2,3 All 250 1,2,3 03 0 V 3 mA Current limit adjust section. Current limit offset --- 1,2,3 V(-CUR LIM/SS) pin = 0 V, 3/ V dc V(+CUR LIM/SS) pin = 0 V, COMP pin open Input bias current IIB V(+ERROR AMP) pin = VREF, A dc V(+ERROR AMP) pin = 0 V Shutdown terminal section. Threshold voltage --- Input voltage range --- Latching current --- Current into CUR LIM/SS 5/ 1,2,3 All Nonlatching current --- Current into CUR LIM/SS 6/ 1,2,3 All 0.8 mA Delay to outputs 2/ --- TA = +25C 9 All 600 ns 1,2,3 All VC = 40 V 1,2,3 01 200 A dc ISINK = 20 mA 1,2,3 All 0.4 V dc RL(CUR LIM/SS) pin = 15 k at 2 V or equivalent. 400 mV dc Output section. Collector-emitter voltage --- Collector leakage current --- Output low level VOL 40 2.1 ISINK = 100 mA Output high level VOL V dc 1,2,3 ISOURCE = 20 mA All 13 V dc 12 ISOURCE = 100 mA Rise time 2/ tR CL = 1,000 pF, TA = +25C 9 All 300 ns Fall time 2/ tF CL = 1,000 pF, TA = +25C 9 All 300 ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 8 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55°C TA +125°C Group A subgroups Device type unless otherwise specified Limits Min Unit Max Under-voltage lockout section. Start-up threshold --- 1,2,3 All 8.0 V dc 1,2,3 All 21 mA dc 3 All Total standby current section. Supply current ICC Cold start/PWM latch reset LRESET TJ = -55C, RT = 10 k, kHz 7/ CT = 4700 pF, SYNC IOUT = -1 mA 1/ Standard test conditions (unless otherwise specified): +VIN = 15 V dc, RT = 10 k, CT = 4,700 pF. 2/ If not tested, shall be guaranteed to specified limits. 3/ Parameter measured at trip point of latch with V+ERROR AMP = VREF; V-ERROR AMP = 0 V. 4/ Amplifier gain defined as: G = ( VCOMP pin / V+CURRENT SENSE pin ) ; V+CURRENT SENSE pin = 0 to 1.0 V 5/ Current into CUR LIM/SS pin guaranteed to latch circuit in shutdown state. 6/ Current into CUR LIM/SS pin guaranteed not to latch circuit in shutdown state. 7/ To verify that the PWM latch is resetting properly, the output stage must resume switching after the completion of a PWM latch Set command. To minimize the effects of self heating, the test must be completed within the first 50 milliseconds of applied power. The minimum limit shall be equal to 0.49 x the oscillator frequency. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 9 Device types 01, 02, and 03 01 and 02 01, 02, and 03 Case outlines E F 2 Terminal number Terminal symbol 1 CUR. LIMIT/SOFTSTART CUR. LIMIT/SOFTSTART NC 2 VREF VREF CUR. LIMIT/SOFTSTART 3 (-) CUR. SENSE (-) CUR. SENSE VREF 4 (+) CUR. SENSE (+) CUR. SENSE (-) CUR. SENSE 5 (+) ERROR AMP (+) ERROR AMP (+) CUR. SENSE 6 (-) ERROR AMP (-) ERROR AMP NC 7 COMPENSATION COMPENSATION (+) ERROR AMP 8 CT CT (-) ERROR AMP 9 RT RT COMPENSATION 10 SYNC SYNC CT 11 OUTPUT A OUTPUT A NC 12 GROUND GROUND RT 13 VC VC SYNC 14 OUTPUT B OUTPUT B OUTPUT A 15 VIN VIN GROUND 16 SHUTDOWN SHUTDOWN NC 17 ---- ---- VC 18 ---- ---- OUTPUT B 19 ---- ---- VIN 20 ---- ---- SHUTDOWN NC = No connection FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 10 FIGURE 2. Block diagram. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 11 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime 's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 110 (see MIL-PRF-38535, appendix A). 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 12 TABLE IIA. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MIL-PRF-38535, table III) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M 1 1 1,4 1,2,3,4,9 1/ 1,2,3,4,9 1/ 1,2,3,4,9 1/ 2/ 1,2,3,4,5,6,9 1,2,3,4,5,6,9 1,2,3,4,5,6,9 1,2,3 1,2,3 1,2,3,4 2/ 1,2,3 1,2,3 1,2,3 Device class Q --- Device class V --- --- 1/ PDA applies to subgroup 1. 2/ Delta limits as specified in table IIB shall be required where specified, and the delta limits shall be computed with reference to the previous interim electrical parameters. TABLE IIB. Burn-in and operating life test. 1/ 2/ Parameters Symbol Device type Delta limits Reference output voltage VO 03 50 mV Oscillator accuracy (RT = 10 k, CT = 4.7 nF) --- 03 4 kHz Error amp input bias current IIB 03 0.1 A Supply current ICC 03 1 mA 1/ These parameters shall be recorded before and after the required burn-in and life test to determine delta limits. 2/ Delta parameters measured at TA = +25C. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 13 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 7, 8, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. b. TA = +125C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 14 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25C 5C, after exposure, to the subgroups specified in table IIA herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108. 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in MIL-HDBK-103 and QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DLA Land and Maritime-VA. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 15 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-86806 A.1 SCOPE A.1.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QM plan for use in monolithic microcircuits, multi-chip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device class V) are reflected in the Part or Identification Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. A.1.2 PIN. The PIN is as shown in the following example: 5962 - Federal stock class designator \ RHA designator (see A.1.2.1) 86806 03 V 9 A Device type (see A.1.2.2) Device class designator (see A.1.2.3) Die code Die details (see A.1.2.4) / \/ Drawing number A.1.2.1 RHA designator. Device classes Q and V RHA identified die meet the MIL-PRF-38535 specified RHA levels. A dash (-) indicates a non-RHA die. A.1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 03 Generic number Circuit function 1846-SP Controller, pulse-width modulator A.1.2.3 Device class designator. Device class Q or V STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 Device requirements documentation Certification and qualification to the die requirements of MIL-PRF-38535 SIZE 5962-86806 A REVISION LEVEL H SHEET 16 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-86806 A.1.2.4 Die details. The die details designation is a unique letter which designates the die's physical dimensions, bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product and variant supplied to this appendix. A.1.2.4.1 Die physical dimensions. Die type Figure number 03 A-1 A.1.2.4.2 Die bonding pad locations and electrical functions. Die type Figure number 03 A-1 A.1.2.4.3 Interface materials. Die type Figure number 03 A-1 A.1.2.4.4 Assembly related information. Die type Figure number 03 A-1 A.1.3 Absolute maximum ratings. See paragraph 1.3 herein for details. A.1.4 Recommended operating conditions. See paragraph 1.4 herein for details. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 17 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-86806 A.2 APPLICABLE DOCUMENTS. A.2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARD MIL-STD-883 - Test Method Standard Microcircuits. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) A.2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. A.3 REQUIREMENTS A.3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. A.3.2 Design, construction and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein and the manufacturer’s QM plan for device classes Q and V. A.3.2.1 Die physical dimensions. The die physical dimensions shall be as specified in A.1.2.4.1 and on figure A-1. A.3.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be as specified in A.1.2.4.2 and on figure A-1. A.3.2.3 Interface materials. The interface materials for the die shall be as specified in A.1.2.4.3 and on figure A-1. A.3.2.4 Assembly related information. The assembly related information shall be as specified in A.1.2.4.4 and on figure A-1. A.3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this document. A.3.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing sufficient to make the packaged die capable of meeting the electrical performance requirements in table I. A.3.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN listed in A.1.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 18 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-86806 A.3.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see A.6.4 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply for this appendix shall affirm that the manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein. A.3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuit die delivered to this drawing. A.4 VERIFICATION A.4.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The modifications in the QM plan shall not affect the form, fit, or function as described herein. A.4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in the manufacturer’s QM plan. As a minimum, it shall consist of: a. Wafer lot acceptance for class V product using the criteria defined in MIL-STD-883, method 5007. b. 100% wafer probe (see paragraph A.3.4 herein). c. 100% internal visual inspection to the applicable class Q or V criteria defined in MIL-STD-883, method 2010 or the alternate procedures allowed in MIL-STD-883, method 5004. A.4.3 Conformance inspection. A.4.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see A.3.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing of packaged die shall be as specified in table II herein. Group E tests and conditions are as specified in paragraphs 4.4.4 herein. A.5 DIE CARRIER A.5.1 Die carrier requirements. The requirements for the die carrier shall be accordance with the manufacturer’s QM plan or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and electrostatic protection. A.6 NOTES A.6.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications, and logistics purposes. A.6.2 Comments. Comments on this appendix should be directed to DLA Land and Maritime -VA, Columbus, Ohio, 43218-3990 or telephone (614)-692-0540. A.6.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. A.6.4 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in MIL-HDBK-103 and QML-38535. The vendors listed within MIL-HDBK-103 and QML-38535 have submitted a certificate of compliance (see A.3.6 herein) to DLA Land and Maritime -VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 19 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-86806 FIGURE A-1. Die bonding pad locations and electrical functions. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 20 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-86806 Bond pad coordinates in microns Terminal symbol Pad number X min Y min X max Y max CUR. LIMIT/ SOFTSTART 1 2174.24 1661.16 2280.92 1767.84 VREF 2 2235.2 2026.92 2341.88 2133.6 (-) CUR. SENSE 3 1996.44 2219.96 2103.12 2326.64 (+) CUR. SENSE 4 1635.76 2219.96 1742.44 2326.64 (+) ERROR AMP 5 467.36 2219.96 574.04 2326.64 (-) ERROR AMP 6 289.56 2219.96 396.24 2326.64 COMPENSATION 7 142.24 1671.32 248.92 1778 CT 8 157.48 1270 264.16 1376.68 RT 9 157.48 939.8 264.16 1046.48 SYNC 10 157.48 172.72 264.16 279.4 OUTPUT A 11 772.16 213.36 889 350.52 GROUND 12 1346.2 81.28 1463.04 208.28 VC 13 1341.12 472.44 1468.12 645.16 OUTPUT B 14 1920.24 213.36 2037.08 350.52 VIN 15 2255.52 320.4 2362.2 426.72 SHUTDOWN 16 2214.88 1107.44 2321.56 1214.12 FIGURE A-1. Die bonding pad locations and electrical functions - Continued STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 21 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-86806 Die bonding pad locations and electrical functions Die physical dimensions. Die size: 2514.6 mils x 2413.0 mils Die thickness: 10.5 mils Interface materials. Top metallization: Backside metallization: AlCu2 Glassivation. Type: Thickness: Substrate: Single crystal silicon Assembly related information. Substrate potential: Special assembly instructions: None FIGURE A-1. Die bonding pad locations and electrical functions - Continued STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86806 A REVISION LEVEL H SHEET 22 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 15-10-16 Approved sources of supply for SMD 5962-86806 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8680601EA 01295 UC1846J883B 34333 SG1846J/883B 3/ LT1846J/883B 5962-8680601FA 34333 SG1846F/883B 5962-86806012A 01295 UC1846L/883B 34333 SG1846L/883B 5962-8680601VEA 01295 UC1846JQMLV 5962-8680601V2A 01295 UC1846LQMLV 5962-8680602EA 3/ UC1847J883B 3/ SG1847J/883 3/ LT1847J/883B 5962-8680602FA 3/ SG1847F/883B 5962-86806022A 3/ UC1847L/883B 3/ SG1847L/883B 1 of 2 STANDARD MICROCIRCUIT DRAWING BULLETIN – CONTINUED. DATE: 15-10-16 Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8680603VEA 01295 UC1846J-SP 5962-8680603VFA 01295 UC1846W-SP 5962-8680603V2A 01295 UC1846FK-SP 5962-8680603V9A 01295 UC1846KGD-SP 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number Vendor name and address 01295 Texas Instruments, Inc. Semiconductor Group 8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 34333 Microsemi Analog Mixed Signal Group 11861 Western Avenue Garden Grove, CA 92841-2119 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. 2 of 2