SiHP12N50E www.vishay.com Vishay Siliconix E Series Power MOSFET FEATURES PRODUCT SUMMARY VDS (V) at TJ max. • Low figure-of-merit (FOM) Ron x Qg 550 RDS(on) max. at 25 °C (Ω) VGS = 10 V Qg max. (nC) • • • • • 0.380 50 Qgs (nC) 6 Qgd (nC) 10 Configuration Single Low input capacitance (Ciss) Reduced switching and conduction losses Low gate charge (Qg) Avalanche energy rated (UIS) Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS D • Computing - PC silver box / ATX power supplies • Lighting - Two stage LED lighting • Consumer electronics TO-220AB G G D • Applications using hard switched topologies - Power factor correction (PFC) - Two switch forward converter - Flyback converter • Switch mode power supplies (SMPS) S S N-Channel MOSFET ORDERING INFORMATION Package TO-220AB Lead (Pb)-free and Halogen-free SiHP12N50E-GE3 ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER SYMBOL LIMIT Drain-Source Voltage VDS 500 Gate-Source Voltage VGS ± 30 Continuous Drain Current (TJ = 150 °C) VGS at 10 V TC = 25 °C TC = 100 °C Pulsed Drain Current a UNIT V 10.5 ID A 6.6 IDM 21 Linear Derating Factor 0.91 W/°C Single Pulse Avalanche Energy b EAS 103 mJ Maximum Power Dissipation PD 114 W TJ, Tstg -55 to +150 °C Operating Junction and Storage Temperature Range Drain-Source Voltage Slope VDS = 0 V to 80 % VDS Reverse Diode dV/dt d Soldering Recommendations (Peak Temperature) c 70 dV/dt V/ns 27 for 10 s 300 °C Notes a. Repetitive rating; pulse width limited by maximum junction temperature. b. VDD = 50 V, starting TJ = 25 °C, L = 28.2 mH, Rg = 25 Ω, IAS = 2.7 A. c. 1.6 mm from case. d. ISD ≤ ID, dI/dt = 100 A/μs, starting TJ = 25 °C. THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYP. Maximum Junction-to-Ambient RthJA - 62 Maximum Junction-to-Case (Drain) RthJC - 1.1 S15-0278-Rev. B, 23-Feb-15 MAX. UNIT °C/W Document Number: 91617 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiHP12N50E www.vishay.com Vishay Siliconix SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static Drain-Source Breakdown Voltage VDS Temperature Coefficient Gate-Source Threshold Voltage (N) Gate-Source Leakage Zero Gate Voltage Drain Current VDS VGS = 0 V, ID = 250 μA 500 - - V ΔVDS/TJ Reference to 25 °C, ID = 1 mA - 0.60 - V/°C VGS(th) VDS = VGS, ID = 250 μA 2.0 - 4.0 V VGS = ± 20 V - - ± 100 nA μA IGSS IDSS VGS = ± 30 V - - ±1 VDS = 500 V, VGS = 0 V - - 1 VDS = 400 V, VGS = 0 V, TJ = 125 °C - - 10 μA - 0.330 0.380 Ω gfs VDS = 30 V, ID = 6 A - 3.1 - S Input Capacitance Ciss 886 - Coss - 52 - Reverse Transfer Capacitance Crss VGS = 0 V, VDS = 100 V, f = 1 MHz - Output Capacitance - 6 - Effective Output Capacitance, Energy Related a Co(er) - 45 - Effective Output Capacitance, Time Related b Co(tr) - 131 - - 25 50 - 6 - - 10 - Drain-Source On-State Resistance Forward Transconductance RDS(on) VGS = 10 V ID = 6 A Dynamic pF VDS = 0 V to 400 V, VGS = 0 V Total Gate Charge Qg Gate-Source Charge Qgs Gate-Drain Charge Qgd Turn-On Delay Time td(on) - 13 26 tr - 16 32 - 29 58 - 12 24 - 0.92 - - - 10.5 S - - 21 TJ = 25 °C, IS = 7.5 A, VGS = 0 V - - 1.2 - 244 - ns - 2.5 - μC - 19 - A Rise Time Turn-Off Delay Time td(off) Fall Time tf Gate Input Resistance Rg VGS = 10 V ID = 6 A, VDS = 400 V VDD = 400 V, ID = 6 A, VGS = 10 V, Rg = 9.1 Ω f = 1 MHz, open drain nC ns Ω Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current IS Pulsed Diode Forward Current ISM Diode Forward Voltage VSD Reverse Recovery Time trr Reverse Recovery Charge Qrr Reverse Recovery Current IRRM MOSFET symbol showing the integral reverse p - n junction diode D A G TJ = 25 °C, IF = IS = 6 A, dI/dt = 100 A/μs, VR = 25 V V Notes a. Coss(er) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 % to 80 % VDSS. b. Coss(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 % to 80 % VDSS. S15-0278-Rev. B, 23-Feb-15 Document Number: 91617 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiHP12N50E www.vishay.com Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 30 15 V 14 V 13 V 12 V 11 V 10 V 9V 8V 7V 6V BOTTOM 5 V 24 18 3.0 TJ = 25 °C ID = 6 A RDS(on), Drain-to-Source On-Resistance (Normalized) 12 6 0 2.0 1.5 1.0 VGS = 10 V 0.5 0 0 5 10 15 20 25 VDS, Drain-to-Source Voltage (V) 30 - 60 - 40 - 20 Fig. 1 - Typical Output Characteristics TOP 15 V 14 V 13 V 12 V 11 V 10 V 9V 8V 7V 6V BOTTOM 5 V 12 10 000 TJ = 150 °C 8 VGS = 0 V, f = 1 MHz Ciss = Cgs + Cgd, Cds shorted Crss = Cgd Coss = Cds + Cgd Ciss 1000 C, Capacitance (pF) 16 0 20 40 60 80 100 120 140 160 TJ, Junction Temperature (°C) Fig. 4 - Normalized On-Resistance vs. Temperature 20 ID, Drain-to-Source Current (A) 2.5 100 Coss Crss 10 4 0 1 0 5 10 15 20 25 VDS, Drain-to-Source Voltage (V) 30 Fig. 2 - Typical Output Characteristics 0 100 200 300 400 VDS, Drain-to-Source Voltage (V) 500 Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage 30 6 5000 5 TJ = 25 °C 20 4 Coss (pF) ID, Drain-to-Source Current (A) 25 15 TJ = 150 °C Eoss Coss 3 500 10 Eoss (μJ) ID, Drain-to-Source Current (A) TOP 2 VDS = 30.4 V 5 1 0 50 0 5 10 15 20 VGS, Gate-to-Source Voltage (V) Fig. 3 - Typical Transfer Characteristics S15-0278-Rev. B, 23-Feb-15 25 0 0 100 200 300 400 500 VDS Fig. 6 - Coss and Eoss vs. VDS Document Number: 91617 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiHP12N50E www.vishay.com Vishay Siliconix 12 VDS = 400 V VDS = 250 V VDS = 100 V 20 9 ID, Drain Current (A) VGS, Gate-to-Source Voltage (V) 24 16 12 8 3 4 0 0 0 10 20 30 40 Qg, Total Gate Charge (nC) 50 Fig. 7 - Typical Gate Charge vs. Gate-to-Source Voltage 25 50 75 100 125 TC, Case Temperature (°C) 150 Fig. 10 - Maximum Drain Current vs. Case Temperature 650 VDS, Drain-to-Source Breakdown Voltage (V) 100 ISD, Reverse Drain Current (A) 6 TJ = 150 °C 10 TJ = 25 °C 1 VGS = 0 V 0.1 0.2 0.4 0.6 0.8 1.0 VSD, Source-Drain Voltage (V) 1.2 1.4 600 575 550 525 500 ID = 250 μA 475 - 60 - 40 - 20 0 20 40 60 80 100 120 140 160 TJ, Junction Temperature (°C) Fig. 8 - Typical Source-Drain Diode Forward Voltage 100 625 Fig. 11 - Temperature vs. Drain-to-Source Voltage Operation in this Area Limited by RDS(on) ID, Drain Current (A) IDM Limited 10 100 μs Limited by RDS(on)* 1 1 ms 0.1 10 ms TC = 25 °C TJ = 150 °C Single Pulse BVDSS Limited 0.01 1 10 100 1000 VDS, Drain-to-Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified Fig. 9 - Maximum Safe Operating Area S15-0278-Rev. B, 23-Feb-15 Document Number: 91617 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiHP12N50E www.vishay.com Vishay Siliconix 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.05 0.1 0.02 Single Pulse 0.01 0.0001 0.001 0.01 Pulse Time (s) 0.1 1 Fig. 12 - Normalized Thermal Transient Impedance, Junction-to-Case RD VDS VDS tp VGS VDD D.U.T. RG + - VDD VDS 10 V Pulse width ≤ 1 µs Duty factor ≤ 0.1 % IAS Fig. 13 - Switching Time Test Circuit Fig. 16 - Unclamped Inductive Waveforms VDS QG 10 V 90 % QGS 10 % VGS QGD VG td(on) td(off) tf tr Charge Fig. 14 - Switching Time Waveforms Fig. 17 - Basic Gate Charge Waveform L Vary tp to obtain required IAS Current regulator Same type as D.U.T. VDS 50 kΩ D.U.T RG + - IAS 12 V 0.2 µF 0.3 µF V DD + D.U.T. 10 V tp 0.01 Ω - VDS VGS 3 mA Fig. 15 - Unclamped Inductive Test Circuit IG ID Current sampling resistors Fig. 18 - Gate Charge Test Circuit S15-0278-Rev. B, 23-Feb-15 Document Number: 91617 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiHP12N50E www.vishay.com Vishay Siliconix Peak Diode Recovery dV/dt Test Circuit + D.U.T. Circuit layout considerations • Low stray inductance • Ground plane • Low leakage inductance current transformer + - - Rg • • • • + dV/dt controlled by Rg Driver same type as D.U.T. ISD controlled by duty factor “D” D.U.T. - device under test + - VDD Driver gate drive P.W. Period D= P.W. Period VGS = 10 Va D.U.T. lSD waveform Reverse recovery current Body diode forward current dI/dt D.U.T. VDS waveform Diode recovery dV/dt Re-applied voltage Inductor current VDD Body diode forward drop Ripple ≤ 5 % ISD Note a. VGS = 5 V for logic level devices Fig. 19 - For N-Channel Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91617. S15-0278-Rev. B, 23-Feb-15 Document Number: 91617 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Package Information www.vishay.com Vishay Siliconix TO-220-1 A E DIM. Q H(1) D 3 2 L(1) 1 M* L b(1) INCHES MIN. MAX. MIN. MAX. A 4.24 4.65 0.167 0.183 b 0.69 1.02 0.027 0.040 b(1) 1.14 1.78 0.045 0.070 F ØP MILLIMETERS c 0.36 0.61 0.014 0.024 D 14.33 15.85 0.564 0.624 E 9.96 10.52 0.392 0.414 e 2.41 2.67 0.095 0.105 e(1) 4.88 5.28 0.192 0.208 F 1.14 1.40 0.045 0.055 H(1) 6.10 6.71 0.240 0.264 0.115 J(1) 2.41 2.92 0.095 L 13.36 14.40 0.526 0.567 L(1) 3.33 4.04 0.131 0.159 ØP 3.53 3.94 0.139 0.155 Q 2.54 3.00 0.100 0.118 ECN: X15-0364-Rev. C, 14-Dec-15 DWG: 6031 Note • M* = 0.052 inches to 0.064 inches (dimension including protrusion), heatsink hole for HVM C b e J(1) e(1) Package Picture ASE Revison: 14-Dec-15 Xi’an Document Number: 66542 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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