Application Note 1629 Author: Ajmal Godil ISL9492 Quick Start Guide 1. Install the ISL9492 Evaluation Board Installer from Intersil’s website ISL9492_eval_installer_1_0.exe. This program allows the USB bus to talk to Intersil's I2C evaluation board, which communicates to the ISL9492 LNB board. 2. Install the ISL9492 USB I2C Driver Installer islusbi2c_driver_installer_1_0.exe. This program provides the GUI (graphical user interface) to control the various commands on the ISL9492 via I2C. 3. After installing program, go to 'start' menu in Windows, 'all programs', 'Intersil', 'ISL9492', and select 'ISL9492 Eval'. The screen should look similar to Figure 1. FIGURE 1. CONTROL SOFTWARE WINDOW 4. Go to Device Select and choose ISL9492 from the dropdown menu. The screen should look like Figure 2. FIGURE 2. LNB CONTROLLER WINDOW March 21, 2011 AN1629.0 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2011. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. Application Note 1629 5. Apply a +12V supply to VCC and GND to the Return post on the ISL9492QFNEVAL1 evaluation board. Connect a USB connector and one end of the 4-wire connector to the I2C daughter board. The other end of the 4-wire connector goes to the ISL9492QFNEVAL1 evaluation board, jumper J1 as shown in Figure 3. 6. Choose 'Open Device' from the GUI. The "USB Attach" and "USB Device Handle" buttons should have turned green indicating that the GUI is communicating with the ISL9492QFNEVAL1 evaluation board. FIGURE 3. ISL9492QFNEVAL1 EVALUATION BOARD CONNECTION 2 AN1629.0 March 21, 2011 Application Note 1629 FIGURE 4. ISL9492 SINGLE LNB CONTROLLER 7. The green trace in Figure 5 shows the soft-start time of VLNB to be approximately 24ms after the EN and DLIN bits in register 4 were toggled high. For a comprehensive description of system registers and I2C commands, please refer to the ISL9492 datasheet. Figure 6 shows the 22kHz tone on VLNB output at 13.3V from 12VIN with 700mA of resistive load current after ENT and TTH bits in register 2 are toggled high. Use of active load during this test is not recommended due to high input capacitance, which could potentially distort the output tone signal. FIGURE 5. VLNB SOFT-START TIME FIGURE 6. 22kHz VLNB OUTPUT AT 13.3V 3 AN1629.0 March 21, 2011 Application Note 1629 ISL9492 Layout Guideline D3 SS25 R10 100 220NF/50V C18 D1 B230A 2 C9 5 1µF/25V L4 VSWSNS ABYP U1 VSW L3 1µH CPSWOUT 28 CPVOUT 27 C4 MMZ2012S102A VSW 26 0.047µF/50V 7 DRAIN 10µH L1 CDR7D43MN-100 P1 VCC 6 P2 RETURN +C1 100µF/35V VCC DGATE 23 LDO_SGND LDO_SGND 1µF/25V 10 C14 DBYPP ISL9492 8,9 PGND P9 SVTOP R11 0 TDIN 14 VOUT 24 TCAP ADDRO FLT 12 R8 0 13 R9 0 Middle or bottom GND layer Connects to top GND connection with 610 vias to form a star GND connection D4 SS25 22 ADDR1 VOUT C10 0.1µF/50V C8 0.22µF/10V R12 TDIN 100 L2 220µH R1 15 C11 R6 3.3k 5SMC22A(TVS) D2 OPEN 21 P5 R2 100k R3 100k P8 FLT TDOUT 15 EXTM 19 P6 EXTM TXT SCL 18 17 P7 TXT SDA 16 SVTOP 0.01µF/50V C7 LNB_POWER P3 R5 100 R4 100 TD_OUT LNB POWER SP1 SCOPEPROBE C12 0.01µF/50V 11 P16 ADDR_1 D NDS356AP Q1 25 20 Top GND connection ADDR_O G Drops into middle or bottom GND plane S C6 1µF/25V P15 C16 C3 0.1µF 10µF/35V CPVOUT C15 0.1µF/50V 100µF/ 35V 1 CPSWIN +C2 2200PF/50V C5 NC 4 NC 3 Open C17 P10 3.3V EXTERNAL C13 0.1µF/25V P11 GND 1 2 3 4 J1 SCL GND GND SDA I2C FIGURE 7. ISL9492 STAR GROUND CONNECTION ILLUSTRATION It is highly recommended to connect GND of C1, C6, C14, C2, C15, pins 8 and 9 in a tight formation on the top layer as shown in red circles in Figure 7 and needs to be returned back to the input power supply GND post, which is on the bottom left of ISL9492 board . The ground side of the components in green circles along with the epad can be dropped to the internal ground plane which connects to the top ground plane with 8-10 vias near C1 to form a star ground connection. 4 AN1629.0 March 21, 2011 Application Note 1629 Evaluation Board Schematic D3 SS25 4 NC 3 NC 7 P1 LDO_SGND LDO_SGND 25 20 TDIN 14 PGND ADDRO 12 R8 0 13 R9 0 ADDR1 TDOUT 24 21 15 TDIN 0.01µF/50V C7 LNB_POWER P3 LNB POWER R6 SP1 D2 3.3k C12 SCOPEPROBE P4 5SMC22A(TVS) GND 100 L2 220µH R1 15 C11 OPEN P5 R2 100k R3 100k FLT P8 TD_OUT EXTM 19 P6 EXTM TXT SCL 18 17 P7 TXT SDA 16 SVTOP R5 100 R4 100 0.01µF/50V 11 ISL9492 DBYPP VOUT FLT P9 NDS356AP R12 VOUT C10 D4 0.1µF/ SS25 50V 22 TCAP C8 0.22µF/10V BST_SGND 10 R11 0 P1 6 Q1 G S 9 C14 1µF/25V DGATE 23 VCC C6 1µF/25V 8 SVTOP 26 C16 C3 0.1µF 10µF/35V DRAIN P2 ADDR_1 C4 D 6 +C1 100µF/35V P15 ADDR_O 27 CPVOUT 10µH L1 CDR7D43MN-100 VCC RETURN 28 CPSWOUT VSW VSW L3 1µH CPVOUT C15 0.1µF/50V 100µF/ 35V U1 0.047µF/50V +C2 R10 2 VSWSNS 100 C9 5 ABYP 220NF/50V C18 1µF/25V L4 D1 B230A MMZ2012S102A C5 2200PF/50V 1 CPSWIN OPEN C17 3.3V P10 EXTERNAL C13 0.1µF/25V P11 GND 1 2 3 4 J1 SCL GND GND SDA I2C FIGURE 8. ISL9492QFNEVAL1 EVALUATION BOARD SCHEMATIC Layout Guidelines Since the ISL9492 has an integrated high power boost, careful attention has to be paid to the layout which are outlined as follows for a 4-layer and a 2-layer board: 1. Boost input capacitor (C1, C6), output boost capacitors (C2, C15), inductor (L1), Schottky diode D1 should be placed together in a nice tight layout. The ground connection of C1, C2, C15, C6, ISL9492 pins 8, 9 and C14 should go directly to the GND input supply as shown in Figure 9. 5. The bottom layer is used to connect output power post to D3, which connects back to C2 (see Figure 12). 6. C1, C2, C15, C6 and pins 8 and 9 are in a tight configuration with GNDs connected to input power post GND. All other components going to GND are dropped directly to the second GND plane. The second layer is connected to the top GND layer right next to C1 ground connection as shown in Figures 13 and 14. 2. C3, C16 and C10 ground connection is returned directly to pin 25, LDO-SGND (see Figure 9). Ground connection of L4, C18, C8, C4, and pin 20, are dropped directly to an internal ground island (see Figure 10). This layer is connected to the ground plane at C1 ground connection. 3. D4 is connected directly across pins 23 and 25. D2 and VLNB return post are returned back to the internal ground island as described in point 2. 4. ISL9492's EPAD is connected to an internal ground plane. This ground plane is connected to the top layer with multiple vias right under C1 and C2 ground connection (see Figure 11). 5 AN1629.0 March 21, 2011 Application Note 1629 4 and 2 Layer Demo Board Layout Examples FIGURE 9. 4 LAYER - TOP C18 L4 C8 FIGURE 10. 4 LAYER - INNER GROUND 6 AN1629.0 March 21, 2011 Application Note 1629 4 and 2 Layer Demo Board Layout Examples (Continued) EPAD FIGURE 11. 4 LAYER - INTERNAL LAYER 3 SHOWING EPAD CONNECTION FIGURE 12. LAYER 4 7 AN1629.0 March 21, 2011 Application Note 1629 4 and 2 Layer Demo Board Layout Examples (Continued) FIGURE 13. 2 LAYER - TOP FIGURE 14. 2 LAYER - BOTTOM 8 AN1629.0 March 21, 2011 Application Note 1629 ISL9492QFNEVAL1 Bill of Materials PART TYPE DESIGNATOR FOOTPRINT 0.01µF/50V C12 603 0.01µF/50V C7 603 0.047µF/50V C4 805 0.1µF/25V C13 603 0.1µF/25V C16 603 0.1µF/50V C10 603 0.1µF/50V C15 603 0.22µF/10V C8 603 100µF/35V C2 11.5x8 Aluminum 100µF/35V C1 11.5x8 Aluminum 10µF/35V C3 1210 10µH L1 CDR7D43 1µF/25V C14 805 1µF/25V C6 805 1µF/25V C9 805 1µH L3 1008PS 2200PF/50V C5 603 220NF/50V C18 805 220µH L2 DS3316 5SMC22A(TVS) D2 DO-403A B230A D1 DO-214 LNB P3 POWERPOST MMZ1608S102AT L4 603 NDS356AP Q1 SOT-23 Open C11 603 Open C17 805 SS25 D3 DO-214 SS25 D4 DO-214 0 R11 603 0 R8 603 0 R9 603 15 R1 603 100 R10 603 100 R12 603 100 R4 603 100 R5 603 100k R2 603 100k R3 603 3.3k R6 1210 Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that the Application Note or Technical Brief is current before proceeding. For information regarding Intersil Corporation and its products, see www.intersil.com 9 AN1629.0 March 21, 2011