DATASHEET

NS
W DESIG
E
N
R
O
F
RT
ENDED ACEMENT PA
M
M
O
C
L
D REP
N OT R E
MENDE
A
RECOM
ISL9005
Datasheet
ISL9005
May 5, 2008
LDO with Low ISUPPLY, High PSRR
Features
ISL9005 is a high performance Low Dropout linear regulator
capable of sourcing 300mA current. It has a low standby
current and high-PSRR and is stable with output capacitance
of 1µF to 10µF with ESR of up to 200m.
• 300mA high performance LDO
The ISL9005 has a high PSRR of 75dB and output noise
less than 45µVRMS. When coupled with a no load quiescent
current of 50µA (typical), and 0.1µA shutdown current, the
ISL9005 is an ideal choice for portable wireless equipment.
FN9234.2
• Excellent transient response to large current steps
• Excellent load regulation: <0.1% voltage change across
full range of load current
• High PSRR: 75dB @ 1kHz
• Wide input voltage capability: 2.3V to 6.5V
• Very low quiescent current: 50µA
Several different fixed voltage outputs are standard. Output
voltage options for each LDO range are from 1.5V to 3.3V.
Other output voltage options may be available upon request.
• Low dropout voltage: typically 200mV @ 300mA
Pinout
• Soft-start to limit input current surge during enable
ISL9005
(8 LD 2x3 DFN)
TOP VIEW
• Low output noise: typically 45µVRMS @ 100µA (1.5V)
• Stable with 1µF to 10µF ceramic capacitors
• Current limit and overheat protection
• ±1.8% accuracy over all operating conditions
• Tiny 2mmx3mm 8 Ld DFN package
VIN
1
8 VO
EN
2
7 NC
NC
3
6 NC
NC
4
5 GND
• -40°C to +85°C operating temperature range
• Pb-free (RoHS compliant)
Applications
• PDAs, cell phones and smart phones
• Portable instruments, MP3 players
• Handheld devices including medical handhelds
Ordering Information
PART NUMBER
(Notes 1, 2)
PART MARKING
VO VOLTAGE
(V) (Note 3)
TEMP RANGE (°C)
PACKAGE
Tape and Reel
(Pb-Free)
PKG. DWG. #
ISL9005IRNZ-T
ETA
3.3V
-40 to +85
8 Ld 2x3 DFN
L8.2x3
ISL9005IRMZ-T
ESA
3.0V
-40 to +85
8 Ld 2x3 DFN
L8.2x3
ISL9005IRLZ-T
ERA
2.9V
-40 to +85
8 Ld 2x3 DFN
L8.2x3
ISL9005IRKZ-T
EPA
2.85V
-40 to +85
8 Ld 2x3 DFN
L8.2x3
ISL9005IRJZ-T
ENA
2.8V
-40 to +85
8 Ld 2x3 DFN
L8.2x3
ISL9005IRRZ-T
EVA
2.6V
-40 to +85
8 Ld 2x3 DFN
L8.2x3
ISL9005IRFZ-T
EMA
2.5V
-40 to +85
8 Ld 2x3 DFN
L8.2x3
ISL9005IRCZ-T
ELA
1.8V
-40 to +85
8 Ld 2x3 DFN
L8.2x3
ISL9005IRBZ-T
EKA
1.5V
-40 to +85
8 Ld 2x3 DFN
L8.2x3
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte
tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC
J STD-020.
2. Please refer to TB347 for details on reel specifications.
3. For other output voltages, contact Intersil Marketing.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2005, 2007, 2008. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL9005
Absolute Maximum Ratings
Thermal Information
Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.1V
VO Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.6V
All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VIN + 0.3)V
Thermal Resistance (Notes 4, 5)
JA (°C/W)
JC (°C/W)
8 Ld 2x3 DFN Package . . . . . . . . . . . .
69
10
Junction Temperature Range . . . . . . . . . . . . . . . . .-40°C to +125°C
Operating Temperature Range . . . . . . . . . . . . . . . . .-40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Ambient Temperature Range (TA) . . . . . . . . . . . . . . .-40°C to +85°C
Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3V to 6.5V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
4. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
5. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature
range of the device as follows: TA = -40°C to +85°C; VIN = (VO + 0.5V) to 5.5V with a minimum VIN of 2.3V;
CIN = 1µF; CO = 1µF.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
MAX
(Note 8) TYP (Note 8)
UNITS
DC CHARACTERISTICS
Supply Voltage
2.3
VIN
Ground Current
6.5
V
Quiescent condition: IO = 0µA
IDD
LDO active
50
75
µA
LDO disabled @ +25°C
0.1
1.0
µA
Shutdown Current
IDDS
UVLO Threshold
VUV+
1.9
2.1
2.3
V
VUV-
1.6
1.8
2.0
V
Regulation Voltage Accuracy
Maximum Output Current
IMAX
Internal Current Limit
ILIM
Dropout Voltage (Note 7)
Thermal Shutdown Temperature
Initial accuracy at VIN = VO + 0.5V, IO = 10mA, TJ = +25°C
-0.7
+0.7
%
VIN = VO + 0.5V to 5.5V, IO = 10µA to 300mA, TJ = +25°C
-0.8
+0.8
%
VIN = VO + 0.5V to 5.5V, IO = 10µA to 300mA, TJ = -40°C to
+125°C
-1.8
+1.8
%
Continuous
300
350
mA
475
600
mA
VDO1
IO = 300mA; VO  2.5V
300
500
mV
VDO2
IO = 300mA; 2.5V  VO  2.8V
250
400
mV
VDO3
IO = 300mA; VO > 2.8V
200
325
mV
TSD+
145
°C
TSD-
110
°C
@ 1kHz
75
dB
@ 10kHz
60
dB
@ 100kHz
40
dB
IO = 100µA, VO = 1.5V, TA = +25°C
BW = 10Hz to 100kHz
45
µVRMS
AC CHARACTERISTICS
Ripple Rejection (Note 6)
IO = 10mA, VIN = 2.8V (min), VO = 1.8V
Output Noise Voltage (Note 6)
2
FN9234.2
May 5, 2008
ISL9005
Electrical Specifications
Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature
range of the device as follows: TA = -40°C to +85°C; VIN = (VO + 0.5V) to 5.5V with a minimum VIN of 2.3V;
CIN = 1µF; CO = 1µF. (Continued)
PARAMETER
MIN
MAX
(Note 8) TYP (Note 8)
UNITS
Time from assertion of the ENx pin to when the output voltage
reaches 95% of the VO (nom)
250
500
µs
Slope of linear portion of LDO output voltage ramp during
start-up
30
60
µs/V
SYMBOL
TEST CONDITIONS
DEVICE START-UP CHARACTERISTICS
Device Enable Time
tEN
LDO Soft-start Ramp Rate
tSSR
EN PIN CHARACTERISTICS
Input Low Voltage
VIL
-0.3
0.5
V
Input High Voltage
VIH
1.4
VIN + 0.3
V
0.1
µA
Input Leakage Current
IIL, IIH
Pin Capacitance
CPIN
Informative
5
pF
NOTES:
6. Limits established by characterization and are not production tested.
7. VOx = 0.98*VOx(NOM); Valid for VOx greater than 1.85V.
8. Parts are 100% tested at +25°C. Temperature limits established by characterization and are not production tested.
3
FN9234.2
May 5, 2008
ISL9005
Typical Performance Curves
0.10
0.8
VO = 3.3V
ILOAD = 0mA
0.4
0.2
-40°C
0.0
+25°C
-0.2
+85°C
-0.4
VIN = 3.8V
VO = 3.3V
0.08
OUTPUT VOLTAGE CHANGE (%)
OUTPUT VOLTAGE, VO (%)
0.6
-0.6
0.06
0.04
-40°C
0.02
+25°C
0.00
-0.02
+85°C
-0.04
-0.06
-0.08
-0.8
3.4
3.8
4.6
4.2
5.0
5.4
5.8
6.2
-0.10
6.6
0
100
50
FIGURE 1. OUTPUT VOLTAGE vs INPUT VOLTAGE (3.3V
OUTPUT)
250
300
400
350
FIGURE 2. OUTPUT VOLTAGE CHANGE vs LOAD CURRENT
0.10
3.4
VIN = 3.8V
VO = 3.3V
ILOAD = 0mA
0.08
0.06
0.04
0.02
0.00
-0.02
-0.04
-0.06
VO = 3.3V
IO = 0mA
3.3
OUTPUT VOLTAGE, VO (V)
OUTPUT VOLTAGE CHANGE (%)
200
150
LOAD CURRENT - IO (mA)
INPUT VOLTAGE (V)
3.2
IO = 150mA
3.1
IO = 300mA
3.0
2.9
-0.08
-0.10
-40
2.8
-25
5
-10
20 35 50 65
TEMPERATURE (°C)
80
95
110 125
DROPOUT VOLTAGE, VDO (mV)
OUTPUT VOLTAGE, VO (V)
2.7
IO = 150mA
2.6
IO = 300mA
2.5
2.4
3.6
4.1
4.6
5.1
5.6
6.1
INPUT VOLTAGE (V)
FIGURE 5. OUTPUT VOLTAGE vs INPUT VOLTAGE (2.8V
OUTPUT)
4
4.6
5.1
5.6
6.1
6.5
350
VO = 2.8V
2.8
3.1
4.1
FIGURE 4. OUTPUT VOLTAGE vs INPUT VOLTAGE (3.3V
OUTPUT)
2.9
2.3
2.6
3.6
INPUT VOLTAGE (V)
FIGURE 3. OUTPUT VOLTAGE CHANGE vs TEMPERATURE
IO = 0mA
3.1
6.5
300
250
VO = 2.8V
200
VO = 3.3V
150
100
50
0
0
50
100
150
200
250
OUTPUT LOAD (mA)
300
350
400
FIGURE 6. DROPOUT VOLTAGE vs LOAD CURRENT
FN9234.2
May 5, 2008
ISL9005
Typical Performance Curves
(Continued)
80
350
VO = 3.3V
70
GROUND CURRENT (µA)
DROPOUT VOLTAGE, VDO (mV)
300
250
+85°C
+25°C
-40°C
200
150
100
+125°C
60
+25°C
50
-40°C
40
VO = 3.3V
30
50
0
0
50
100
150
200
250
OUTPUT LOAD (mA)
300
350
20
400
3.0
3.5
4.0
4.58
5.0
5.5
6.5
6.0
INPUT VOLTAGE (V)
FIGURE 7. DROPOUT VOLTAGE vs LOAD CURRENT
FIGURE 8. GROUND CURRENT vs INPUT VOLTAGE
80
200
180
70
140
GROUND CURRENT (µA)
GROUND CURRENT (µA)
160
+25°C
+85°C
120
-40°C
100
80
60
40
50
40
VIN = 3.8V
VO = 3.3V
20
0
60
0
50
100
150
200
250
300
350
VIN = 3.8V
VO = 3.3V
ILOAD = 0µA
30
20
-40 -25
400
-10
5
LOAD CURRENT (mA)
FIGURE 9. GROUND CURRENT vs LOAD
20 35 50 65
TEMPERATURE (°C)
5
110 125
VIN = 5.0V
VO = 2.85V
IL = 150mA
CL = 1µF
3
4
VO (V)
2
VIN
3
VO
2
1
0
0.5
1
0
VEN (V)
VOLTAGE (V)
95
FIGURE 10. GROUND CURRENT vs TEMPERATURE
VO = 2.85V
IL = 150mA
0
80
1.0
1.5
2.0 2.5
TIME (s)
3.0
3.5
4.0
FIGURE 11. POWER-UP/POWER-DOWN
5
4.5
5.0
5
0
0
0.2
0.4
0.6
0.8
1.0
1.2
TIME (ms)
1.4
1.6
1.8
2.0
FIGURE 12. TURN-ON/TURN-OFF RESPONSE
FN9234.2
May 5, 2008
ISL9005
Typical Performance Curves
(Continued)
VO = 3.3V
ILOAD = 300mA
VO = 2.8V
ILOAD = 300mA
CLOAD = 1µF
CLOAD = 1µF
4.3V
4.2V
3.6V
3.5V
10mV/DIV
10mV/DIV
400µs/DIV
400µs/DIV
FIGURE 13. LINE TRANSIENT RESPONSE, 3.3V OUTPUT
FIGURE 14. LINE TRANSIENT RESPONSE, 2.8V OUTPUT
VO (25mV/DIV)
VO = 1.8V
VIN = 2.8V
300mA
ILOAD
SPECTRAL NOISE DENSITY (µV/Hz)
10
1
0.1
VIN = 3.6V
VO = 1.8V
ILOAD = 10mA
CIN = 1µF
CLOAD = 1µF
0.01
100µA
0.001
10
100
1k
10k
FREQUENCY (Hz)
100µs/DIV
FIGURE 15. LOAD TRANSIENT RESPONSE
100k
1M
FIGURE 16. SPECTRAL NOISE DENSITY vs FREQUENCY
100
VIN = 3.6V
VO = 1.8V
IO = 10mA
CLOAD = 1µF
90
80
PSRR (dB)
70
60
50
40
30
20
10
0
100
1k
10k
FREQUENCY (Hz)
100k
1M
FIGURE 17. PSRR vs FREQUENCY
6
FN9234.2
May 5, 2008
ISL9005
Pin Description
PIN
NUMBER
PIN NAME
1
VIN
Supply Voltage/LDO Input:
Connect a 1µF capacitor to GND.
2
EN
LDO Enable.
3
NC
Do not connect.
4
NC
Do not connect.
5
GND
6
NC
Do not connect.
7
NC
Do not connect.
8
VO
LDO Output:
Connect capacitor of value 1µF to 10µF to GND (1µF recommended).
DESCRIPTION
GND is the connection to system ground. Connect to PCB Ground plane.
Typical Application
ISL9005
VIN (2.3 TO 5V)
1
ON
2
ENABLE
OFF
3
C1
4
VIN
VO
EN
NC
NC
NC
NC
GND
8
VOUT
7
6
5
C2
C1, C2: 1µF X5R CERAMIC CAPACITOR
7
FN9234.2
May 5, 2008
ISL9005
During operation, whenever the VIN voltage drops below
about 1.84V, the ISL9005 immediately disables the LDO
output. When VIN rises back above 2.1V, the device
re-initiates its start-up sequence and LDO operation will
resume automatically.
Block Diagram
VIN
VO
UVLO
CONTROL
LOGIC
Reference Generation
The reference generation circuitry includes a trimmed
bandgap, a trimmed voltage reference divider, a trimmed
current reference generator, and an RC noise filter.
SHORT CIRCUIT,
THERMAL PROTECTION,
SOFT-START
The bandgap generates a zero temperature coefficient (TC)
voltage for the reference divider. The reference divider
provides the regulation reference and other voltage
references required for current generation and overtemperature detection.
+
EN
The current generator outputs references required for
adaptive biasing as well as references for LDO output
current limit and thermal shutdown determination.
LDO Regulation and Programmable Output Divider
GND
BANDGAP AND
TEMPERATURE
SENSOR
VOLTAGE AND
REFERENCE
GENERATOR
1.0V
0.94V
0.9V
GND
Functional Description
The ISL9005 contains all circuitry required to implement a
high performance LDO. High performance is achieved
through a circuit that delivers fast transient response to
varying load conditions. In a quiescent condition, the
ISL9005 adjusts its biasing to achieve the lowest standby
current consumption.
The device also integrates current limit protection, smart
thermal shutdown protection, and soft-start. Smart Thermal
shutdown protects the device against overheating.
Power Control
The ISL9005 has an enable pin (EN) to control power to the
LDO output. When EN is low, the device is in shutdown
mode. During this condition, all on-chip circuits are off, and
the device draws minimum current, typically less than 0.1µA.
When the enable pin is asserted, the device first polls the
output of the UVLO detector to ensure that VIN voltage is at
least about 2.1V. Once verified, the device initiates a start-up
sequence. During the start-up sequence, trim settings are
first read and latched. Then, sequentially, the bandgap,
reference voltage and current generation circuitry power-up.
Once the references are stable, a fast-start circuit powers up
the LDO.
8
The LDO Regulator is implemented with a high-gain
operational amplifier driving a PMOS pass transistor. The
design of the ISL9005 provides a regulator that has low
quiescent current, fast transient response, and overall
stability across all operating and load current conditions.
LDO stability is guaranteed for a 1µF to 10µF output
capacitor that has a tolerance better than 20% and ESR less
than 200m. The design is performance-optimized for a 1µF
capacitor. Unless limited by the application, use of an output
capacitor value above 4.7µF is not recommended as LDO
performance improvement is minimal.
Soft-start circuitry integrated into each LDO limits the initial
ramp-up rate to about 30µs/V to minimize current surge. The
ISL9005 provides short-circuit protection by limiting the
output current to about 425mA.
The LDO uses an independently trimmed 1V reference as its
input. An internal resistor divider drops the LDO output
voltage down to 1V. This is compared to the 1V reference for
regulation. The resistor division ratio is programmed in the
factory.
Overheat Detection
The bandgap outputs a proportional-to-temperature current
that is indicative of the temperature of the silicon. This
current is compared with references to determine if the
device is in danger of damage due to overheating. When the
die temperature reaches about +140°C, if the LDO is
sourcing more than 50mA it shuts down until the die cools
sufficiently. Once the die temperature falls back below about
+110°C, the disabled LDO is re-enabled and soft-start
automatically takes place.
FN9234.2
May 5, 2008
ISL9005
Dual Flat No-Lead Plastic Package (DFN)
L8.2x3
2X
8 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
0.15 C A
A
D
2X
0.15 C B
E
MILLIMETERS
SYMBOL
MIN
A
0.80
A1
-
6
A3
INDEX
AREA
b
TOP VIEW
D2
//
0.10
A
SIDE VIEW
C
SEATING
PLANE
D2
(DATUM B)
C
0.08 C
0.20
A3
7
8
0.90
1.00
-
-
0.05
-
0.25
0.32
1
5,8
1.50
1.65
1.75
7,8
3.00 BSC
1.65
e
1.80
1.90
7,8
0.50 BSC
-
k
0.20
-
-
-
L
0.30
0.40
0.50
8
N
8
Nd
4
D2/2
6
INDEX
AREA
NOTES
2.00 BSC
E
E2
MAX
0.20 REF
D
B
NOMINAL
2
3
Rev. 0 6/04
2
NX k
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd refers to the number of terminals on D.
(DATUM A)
E2
4. All dimensions are in millimeters. Angles are in degrees.
E2/2
5. Dimension b applies to the metallized terminal and is measured
between 0.25mm and 0.30mm from the terminal tip.
NX L
N N-1
NX b
e
8
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
5
0.10
(Nd-1)Xe
REF.
M C A B
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
BOTTOM VIEW
CL
(A1)
NX (b)
L
5
SECTION "C-C"
C C
e
TERMINAL TIP
FOR EVEN TERMINAL/SIDE
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9001 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
9
FN9234.2
May 5, 2008