ISL9001A ® Data Sheet January 18, 2007 LDO with Low ISUPPLY, High PSRR Features ISL9001A is a high performance Low Dropout linear regulator capable of sourcing 300mA current. It has a low standby current and high-PSRR and is stable with output capacitance of 1μF to 10μF with ESR of up to 200mΩ. • 300mA high performance LDO The ISL9001A has a very high PSRR of 90dB and output noise less than 30μVRMS. A reference bypass pin allows connection of a noise-filtering capacitor for low-noise and high-PSRR applications. When coupled with a no load quiescent current of 25μA (typical), and 0.1μA shutdown current, the ISL9001A is an ideal choice for portable wireless equipment. The ISL9001A provides a PGOOD signal with delay time programmable through an external capacitor. FN6433.0 • Excellent transient response to large current steps • Excellent load regulation: <0.1% voltage change across full range of load current • High PSRR: 90dB @ 1kHz • Wide input voltage capability: 2.3V to 6.5V • Extremely low quiescent current: 25μA • Low dropout voltage: typically 200mV @ 300mA • Low output noise: typically 30μVRMS @ 100µA (1.5V) • Stable with 1μF to 10μF ceramic capacitors • Soft-start to limit input current surge during enable Several different fixed voltage outputs are standard. Other output voltage options for the LDO are available on request and range from 1.3V to 3.6V. • Current limit and overheat protection Pinout • Tiny 2mmx3mm 8 Ld DFN package • Delayed POR, programmable with external capacitor • ±1.8% accuracy over all operating conditions • -40°C to +85°C operating temperature range ISL9001A (8 LD DFN) TOP VIEW • Pb-free plus anneal available (RoHS compliant) Applications VIN 1 8 VO EN 2 7 POR CBYP 3 6 NC • Portable instruments, MP3 players CPOR 4 5 GND • Handheld devices including medical handhelds • PDAs, cell phones and smart phones Ordering Information PART NUMBER (Note 1) ISL9001AIRBZ-T PART MARKING EBB VO VOLTAGE (V) (Note 2) TEMP RANGE (°C) 3.3 -40 to +85 PACKAGE (Pb-free) PKG. DWG. # 8 Ld DFN 2x3 Tape and Reel L8.2x3 ISL9001AIRCZ-T EBC 3.0 -40 to +85 8 Ld DFN 2x3 Tape and Reel L8.2x3 ISL9001AIRFZ-T EBD 2.9 -40 to +85 8 Ld DFN 2x3 Tape and Reel L8.2x3 ISL9001AIRJZ-T EBE 2.85 -40 to +85 8 Ld DFN 2x3 Tape and Reel L8.2x3 ISL9001AIRKZ-T EBF 2.8 -40 to +85 8 Ld DFN 2x3 Tape and Reel L8.2x3 ISL9001AIRLZ-T EBG 2.6 -40 to +85 8 Ld DFN 2x3 Tape and Reel L8.2x3 ISL9001AIRMZ-T EBH 2.5 -40 to +85 8 Ld DFN 2x3 Tape and Reel L8.2x3 ISL9001AIRNZ-T EBJ 1.8 -40 to +85 8 Ld DFN 2x3 Tape and Reel L8.2x3 ISL9001AIRRZ-T EBK 1.5 -40 to +85 8 Ld DFN 2x3 Tape and Reel L8.2x3 NOTES: 1. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2. For other output voltages, contact Intersil Marketing. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2007. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL9001A Absolute Maximum Ratings Thermal Information Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.1V All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VIN+0.3)V ESD Rating Human Body Model (Per MIL-STD-883 Method 3015.7) . . .2500V Machine Model (Per EIAJ ED-4701 Method C-111) . . . . . . . .200V Thermal Resistance (Notes 3, 4) θJA (°C/W) θJC (°C/W) 8 Ld DFN 2x3 Package . . . . . . . . . . . . 69 10 Junction Temperature Range . . . . . . . . . . . . . . . . .-40°C to +125°C Operating Temperature Range . . . . . . . . . . . . . . . . .-40°C to +85°C Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C Recommended Operating Conditions Ambient Temperature Range (TA) . . . . . . . . . . . . . . .-40°C to +85°C Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3 to 6.5V CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 3. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 4. θJC, “case temperature” location is at the center of the exposed metal pad on the package underside. See Tech Brief TB379. Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature range of the device as follows: TA = -40°C to +85°C; VIN = (VO+0.5V) to 5.5V with a minimum VIN of 2.3V; CIN = 1µF; CO = 1µF; PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS 6.5 V DC CHARACTERISTICS Supply Voltage VIN Ground Current 2.3 Quiescent condition: IO = 0μA IDD LDO active 25 32 μA LDO disabled @ +25°C 0.1 1.0 μA Shutdown Current IDDS UVLO Threshold VUV+ 1.9 2.1 2.3 V VUV- 1.6 1.8 2.0 V Regulation Voltage Accuracy Maximum Output Current IMAX Internal Current Limit ILIM Dropout Voltage (Note 5) Thermal Shutdown Temperature Initial accuracy at VIN = VO+0.5V, IO = 10mA, TJ = +25°C -0.7 +0.7 % VIN = VO+0.5V to 5.5V, IO = 10μA to 300mA, TJ = +25°C -0.8 +0.8 % VIN = VO+0.5V to 5.5V, IO = 10μA to 300mA, TJ = -40°C to +125°C -1.8 +1.8 % Continuous 300 350 mA 475 600 mA VDO1 IO = 300mA; VO < 2.5V 300 500 mV VDO2 IO = 300mA; 2.5V ≤ VO ≤ 2.8V 250 400 mV VDO3 IO = 300mA; VO > 2.8V 200 325 mV TSD+ 145 °C TSD- 110 °C @ 1kHz 90 dB @ 10kHz 70 dB @ 100kHz 50 dB IO = 100µA, VO = 1.5V, TA = +25°C, CBYP = 0.1µF BW = 10Hz to 100kHz 30 µVRMS AC CHARACTERISTICS Ripple Rejection IO = 10mA, VIN = 2.8V (min), VO = 1.8V, CBYP = 0.1µF Output Noise Voltage 2 FN6433.0 January 18, 2007 ISL9001A Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature range of the device as follows: TA = -40°C to +85°C; VIN = (VO+0.5V) to 5.5V with a minimum VIN of 2.3V; CIN = 1µF; CO = 1µF; (Continued) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS DEVICE START-UP CHARACTERISTICS Device Enable Time TEN Time from assertion of the ENx pin to when the output voltage reaches 95% of the VO (nom) 250 500 μs LDO Soft-Start Ramp Rate TSSR Slope of linear portion of LDO output voltage ramp during start-up 30 60 μs/V EN PIN CHARACTERISTICS Input Low Voltage VIL -0.3 0.5 V Input High Voltage VIH 1.4 VIN+0.3 V 0.1 μA Input Leakage Current IIL, IIH Pin Capacitance CPIN Informative 5 pF POR PIN CHARACTERISTICS POR Thresholds VPOR+ As a percentage of nominal output voltage VPORPOR Delay TPLH CPOR = 0.01μF 91 94 97 % 87 90 93 % 100 200 300 ms TPHL POR Pin Output Low Voltage VOL POR Pin Internal Pull-up Resistance μs 25 @ IOL = 1.0mA RPOR 78 100 0.2 V 180 kΩ NOTES: 5. VOx = 0.98 * VOx(NOM); Valid for VOx greater than 1.85V. EN TEN VPOR+ VPOR- VPOR+ VPOR- <tPHL VO tPLH tPHL POR FIGURE 1. TIMING PARAMETER DEFINITION 3 FN6433.0 January 18, 2007 ISL9001A Typical Performance Curves 0.8 0.10 VO = 3.3V ILOAD = 0mA 0.4 0.2 -40°C 0.0 +25°C -0.2 85°C -0.4 VIN = 3.8V VO = 3.3V 0.08 OUTPUT VOLTAGE CHANGE (%) OUTPUT VOLTAGE, VO (%) 0.6 -0.6 0.06 0.04 -40°C 0.02 +25°C 0.00 -0.02 +85°C -0.04 -0.06 -0.08 -0.8 3.4 3.8 4.6 4.2 5.0 5.4 5.8 6.2 6.6 -0.10 50 0 200 250 300 350 400 LOAD CURRENT - IO (mA) FIGURE 2. OUTPUT VOLTAGE vs INPUT VOLTAGE (3.3V OUTPUT) FIGURE 3. OUTPUT VOLTAGE CHANGE vs LOAD CURRENT 3.4 0.10 VIN = 3.8V VO = 3.3V ILOAD = 0mA 0.08 0.06 0.04 0.02 0.00 -0.02 -0.04 -0.06 VO = 3.3V IO = 0mA 3.3 OUTPUT VOLTAGE, VO (V) OUTPUT VOLTAGE CHANGE (%) 150 100 INPUT VOLTAGE (V) 3.2 IO = 150mA 3.1 IO = 300mA 3.0 2.9 -0.08 2.8 -0.10 -40 -25 5 -10 20 35 50 65 TEMPERATURE (°C) 80 95 3.1 110 125 4.1 4.6 5.1 5.6 6.1 6.5 INPUT VOLTAGE (V) FIGURE 4. OUTPUT VOLTAGE CHANGE vs TEMPERATURE FIGURE 5. OUTPUT VOLTAGE vs INPUT VOLTAGE (3.3V OUTPUT) 350 2.9 VO = 2.8V IO = 0mA 300 DROPOUT VOLTAGE, VDO (mV) 2.8 OUTPUT VOLTAGE, VO (V) 3.6 2.7 IO = 150mA 2.6 IO = 300mA 2.5 2.4 2.3 2.6 250 VO = 2.8V 200 VO = 3.3V 150 100 50 0 3.1 3.6 4.1 4.6 5.1 5.6 6.1 6.5 INPUT VOLTAGE (V) FIGURE 6. OUTPUT VOLTAGE vs INPUT VOLTAGE (2.8V OUTPUT) 4 0 50 100 150 200 250 OUTPUT LOAD (mA) 300 350 400 FIGURE 7. DROPOUT VOLTAGE vs LOAD CURRENT FN6433.0 January 18, 2007 ISL9001A Typical Performance Curves (Continued) 350 40 VO = 3.3V 35 GROUND CURRENT (µA) DROPOUT VOLTAGE, VDO (mV) 300 250 +25°C +85°C 200 -40°C 150 100 +125°C 30 +25°C 25 -40°C 20 VO = 3.3V 15 50 0 10 0 50 100 150 200 250 OUTPUT LOAD (mA) 300 350 400 3.0 3.5 4.0 4.58 5.0 5.5 6.5 6.0 INPUT VOLTAGE (V) FIGURE 8. DROPOUT VOLTAGE vs LOAD CURRENT FIGURE 9. GROUND CURRENT vs INPUT VOLTAGE 40 200 180 35 GROUND CURRENT (µA) GROUND CURRENT (µA) 160 +85°C 140 120 +25°C 100 -40°C 80 60 40 25 20 VIN = 3.8V VO = 3.3V 20 0 30 0 50 100 150 200 250 300 350 VIN = 3.8V VO = 3.3V ILOAD = 0µA 15 10 -40 -25 400 -10 5 LOAD CURRENT (mA) FIGURE 10. GROUND CURRENT vs LOAD 20 35 50 65 TEMPERATURE (°C) 4 2 VO (V) 3 VIN 2 VIN = 5.0V VO = 2.85V IL = 150mA CL = 1µF CBYP = 0.01µF 1 0 POR 1 VO VEN (V) VOLTAGE (V) 5 0 0 110 125 95 FIGURE 11. GROUND CURRENT vs TEMPERATURE VO = 2.85V IL = 150mA 3 80 0.5 1.0 1.5 2.0 2.5 TIME (s) 3.0 3.5 4.0 FIGURE 12. POWER-UP/POWER-DOWN 5 4.5 5.0 5 0 0 0.2 0.4 0.6 0.8 1.0 1.2 TIME (ms) 1.4 1.6 1.8 2.0 FIGURE 13. TURN ON/TURN OFF RESPONSE FN6433.0 January 18, 2007 ISL9001A Typical Performance Curves (Continued) VO = 3.3V ILOAD = 300mA CLOAD = 1µF CBYP = 0.01µF VO = 2.8V ILOAD = 300mA CLOAD = 1µF CBYP = 0.01µF 4.3V 4.2V 3.6V 3.5V 10mV/DIV 10mV/DIV 400µs/DIV 400µs/DIV FIGURE 14. LINE TRANSIENT RESPONSE, 3.3V OUTPUT FIGURE 15. LINE TRANSIENT RESPONSE, 2.8V OUTPUT VO (25mV/DIV) VO = 1.8V VIN = 2.8V 300mA ILOAD SPECTRAL NOISE DENSITY (nV/√Hz) 1000 100 10 VIN = 3.6V VO = 1.8V ILOAD = 10mA CBYP = 0.1µF 1 CIN = 1µF CLOAD = 1µF 100µA 0.1 10 100 100µs/DIV FIGURE 16. LOAD TRANSIENT RESPONSE 1k 10k FREQUENCY (Hz) 100k 1M FIGURE 17. SPECTRAL NOISE DENSITY vs FREQUENCY 100 VIN = 3.6V VO = 1.8V IO = 10mA CBYP = 0.1µF CLOAD = 1µF 90 80 PSRR (dB) 70 60 50 40 30 20 10 0 100 1k 10k FREQUENCY (Hz) 100k 1M FIGURE 18. PSRR vs FREQUENCY 6 FN6433.0 January 18, 2007 ISL9001A Pin Description PIN # PIN NAME DESCRIPTION 1 VIN Supply Voltage/LDO Input: Connect a 1µF capacitor to GND. 2 EN LDO Enable. 3 CBYP Reference Bypass Capacitor Pin: Optionally connect capacitor of value 0.01µF to 0.1µF between this pin and GND to achieve lowest noise and highest PSRR. 4 CPOR POR Delay Setting Capacitor Pin: Connect a capacitor between this pin and GND to delay the POR output release after the output reaches 94% of its specified voltage level. (200ms delay per 0.01µF). 5 GND 6 NC 7 POR 8 VO GND is the connection to system ground. Connect to PCB Ground plane. Do not connect. Open-drain POR Output (active-low): Internally connected to VO through 100kΩ resistor. LDO Output: Connect capacitor of value 1µF to 10µF to GND (1µF recommended). Typical Application ISL9001A VIN (2.3-5V) 1 ON 2 ENABLE OFF 3 C1 C2 8 VIN EN POR VOUT OK 7 VOUT TOO LOW CBYP 5 4 C4 VO CPOR GND VOUT (200ms DELAY, C4 = 0.01µF) C3 C1, C3: 1µF X5R CERAMIC CAPACITOR C2: 0.1µF X7R CERAMIC CAPACITOR C4: 0.01µF X7R CERAMIC CAPACITOR 7 FN6433.0 January 18, 2007 ISL9001A Block Diagram VIN VO UVLO CONTROL LOGIC SHORT CIRCUIT, THERMAL PROTECTION, SOFT-START EN 1.0V 100K VO GND POR BANDGAP AND TEMPERATURE SENSOR VOLTAGE AND REFERENCE GENERATOR CBYP Functional Description The ISL9001A contains all circuitry required to implement a high performance LDO. High performance is achieved through a circuit that delivers fast transient response to varying load conditions. In a quiescent condition, the ISL9001A adjusts its biasing to achieve the lowest standby current consumption. The device also integrates current limit protection, smart thermal shutdown protection, and soft-start. Smart thermal shutdown protects the device against overheating. Power Control The ISL9001A has an enable pin (EN) to control power to the LDO output. When EN is low, the device is in shutdown mode. During this condition, all on-chip circuits are off, and the device draws minimum current, typically less than 0.1μA. When the enable pin is asserted, the device first polls the output of the UVLO detector to ensure that VIN voltage is at least about 2.1V. Once verified, the device initiates a start-up sequence. During the start-up sequence, trim settings are first read and latched. Then, sequentially, the bandgap, reference voltage and current generation circuitry power up. Once the references are stable, a fast-start circuit quickly charges the external reference bypass capacitor (connected to the CBYP pin) to the proper operating voltage. Once the bypass capacitor has been charged, the LDO powers up. 8 POR DELAY 1.0V 0.94V 0.9V CPOR GND During operation, whenever the VIN voltage drops below about 1.84V, the ISL9001A immediately disables the LDO output. When VIN rises back above 2.1V, the device reinitiates its start-up sequence and LDO operation will resume automatically. Reference Generation The reference generation circuitry includes a trimmed bandgap, a trimmed voltage reference divider, a trimmed current reference generator, and an RC noise filter. The filter includes the external capacitor connected to the CBYP pin. A 0.01μF capacitor connected CBYP implements a 100Hz lowpass filter, and is recommended for most high performance applications. For the lowest noise application, a 0.1μF CBYP capacitor should be used. This filters the reference noise to below the 10Hz to 1kHz frequency band, which is crucial in many noise-sensitive applications. The bandgap generates a zero temperature coefficient (TC) voltage for the reference divider. The reference divider provides the regulation reference, POR detection thresholds, and other voltage references required for current generation and over-temperature detection. The current generator outputs references required for adaptive biasing as well as references for LDO output current limit and thermal shutdown determination. FN6433.0 January 18, 2007 ISL9001A LDO Regulation and Programmable Output Divider The LDO Regulator is implemented with a high-gain operational amplifier driving a PMOS pass transistor. The design of the ISL9001A provides a regulator that has low quiescent current, fast transient response, and overall stability across all operating and load current conditions. LDO stability is guaranteed for a 1μF to 10μF output capacitor that has a tolerance better than 20% and ESR less than 200mΩ. The design is performance-optimized for a 1μF capacitor. Unless limited by the application, use of an output capacitor value above 4.7μF is not recommended as LDO performance improvement is minimal. Soft-start circuitry integrated into each LDO limits the initial ramp-up rate to about 30μs/V to minimize current surge. The ISL9001A provides short-circuit protection by limiting the output current to about 425mA. The LDO uses an independently trimmed 1V reference as its input. An internal resistor divider drops the LDO output voltage down to 1V. This is compared to the 1V reference for regulation. The resistor division ratio is programmed in the factory. Power-On Reset Generation The power-good state is exited when the LDO output falls below 90% of the expected output voltage for a period longer than the PGOOD exit delay time. While power-good is false, the ISL9001A pulls the POR pin low. The PGOOD entry and exit delays are determined by the value of an external capacitor connected to the CPOR pin. For a 0.01μF capacitor, the entry and exit delays are 200ms and 25μs respectively. Larger or smaller capacitor values will yield proportionately longer or shorter delay times. The POR exit delay should never be allowed to be less than 10μs to ensure sufficient immunity against transient induced false POR triggering. Overheat Detection The bandgap outputs a proportional-to-temperature current that is indicative of the temperature of the silicon. This current is compared with references to determine if the device is in danger of damage due to overheating. When the die temperature reaches about +140°C, if the LDO is sourcing more than 50mA, it shuts down until the die cools sufficiently. Once the die temperature falls back below about +110°C, the disabled LDO is re-enabled and soft-start automatically takes place. The ISL9001A has a Power-on Reset signal generation circuit which indicates that output power is good. The POR signal is generated as follows: A POR comparator continuously monitors the output of the LDO. The LDO enters a power-good state when the output voltage is above 94% of the expected output voltage for a period exceeding the LDO PGOOD entry delay time (see below). In the power-good state, the open-drain POR output is in a high-impedance state. An internal 100kΩ pull-up resistor pulls the pin up to the LDO output voltage. An external resistor can be added between the POR output and the LDO output for a faster rise time, however, the POR output should not connect through an external resistor to a supply greater than the LDO voltage. 9 FN6433.0 January 18, 2007 ISL9001A Dual Flat No-Lead Plastic Package (DFN) L8.2x3 2X 0.15 C A A D 8 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE 2X MILLIMETERS 0.15 C B SYMBOL E MIN A 0.80 A1 - 6 A3 INDEX AREA b TOP VIEW D2 0.20 0.10 SIDE VIEW C SEATING PLANE D2 (DATUM B) 0.08 C A3 7 0.90 1.00 - - 0.05 - 0.25 0.32 1.50 1.65 1.75 1 7,8 3.00 BSC - 8 1.65 e 1.80 1.90 7,8 0.50 BSC - k 0.20 - - - L 0.30 0.40 0.50 8 N 8 Nd 4 D2/2 6 INDEX AREA 5,8 C E2 A NOTES 2.00 BSC E // MAX 0.20 REF D B NOMINAL 2 3 Rev. 0 6/04 2 NX k NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd refers to the number of terminals on D. (DATUM A) E2 4. All dimensions are in millimeters. Angles are in degrees. E2/2 5. Dimension b applies to the metallized terminal and is measured between 0.25mm and 0.30mm from the terminal tip. NX L 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. N N-1 NX b e 8 5 0.10 (Nd-1)Xe REF. M C A B 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. BOTTOM VIEW CL (A1) NX (b) L 5 SECTION "C-C" C C TERMINAL TIP e FOR EVEN TERMINAL/SIDE All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 10 FN6433.0 January 18, 2007