ISL55100B ® Data Sheet November 24, 2008 Quad 18V Pin Electronics Driver/Window Comparator The ISL55100B is a Quad pin driver and window comparator fabricated in a wide voltage CMOS process. It is designed specifically for Test During Burn-In (TDBI) applications, where cost, functional density, and power are all at a premium. This IC incorporates four channels of programmable drivers and window comparators into a small 72 Ld QFN package. Each channel has independent driver levels, data, and high impedance control. Each receiver has dual comparators which provide high and low threshold levels. The ISL55100B uses differential mode digital inputs, and can therefore mate directly with LVDS or CML outputs. Single-ended logic families are handled by connecting one of the digital input pins to an appropriate threshold voltage (e.g., 1.4V for TTL compatibility). The comparator outputs are single-ended, and the output levels are user defined to mate directly with any digital technology. The 18V driver output and receiver input ranges allow this device to interface directly with TTL, ECL, CMOS (3V, 5V, and 7V), LVCMOS, and custom level circuitry, as well as the high voltage (Super Voltage) level required for many special test modes for Flash Devices. FN6229.1 Features • Low Driver Output Resistance - ROUT Typical: 9.0Ω • 18V I/O Range • 50MHz Operation • 4 Channel Driver/Receiver Pairs with Per Pin Flexibility • Dual Level - Per Pin - Input Thresholds • Differential or Single-Ended Digital Inputs • User Defined Comparator Output Levels • Low Channel to Channel Timing Skew • Small Footprint (72 Ld QFN) • Pb-Free (RoHS Compliant) Applications • Burn In ATE • Wafer Level Flash Memory Test • LCD Panel Test • Low Cost ATE • Instrumentation • Emulation Functional Block Diagram • Device Programmers QUAD - WIDE RANGE, LOW ROUT, TRI-STATEABLE - DRIVERS Ordering Information VH(0-3) DATA+(0-3) DATA-(0-3) PART NUMBER (Note) DOUT(0-3) + VL(0-3) DRVEN+(0-3) DRVEN-(0-3) VCC QA(0-3) COMP LOW COMP HIGH TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # ISL55100BIRZ* ISL55100 BIRZ -40 to +85 72 Ld QFN L72.10x10 + - QUAD - DUAL LEVEL COMPARATOR - RECEIVERS COMP HIGH PART MARKING CVA(0-3) VEE VCC *Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. VINP(0-3) QB(0-3) COMP LOW CVB(0-3) VEE 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2006, 2008. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL55100B Pinout DRV EN+ 0 DRV EN- 0 QA 0 QB 0 VEE VCC NC NC NC NC VEE VCC VEE VCC NC NC NC NC ISL55100B (72 LD QFN) TOP VIEW 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 6 49 VH 1 DATA+ 1 7 48 DOUT 1 DATA- 1 8 47 NC QA 2 9 46 VL 1 QB 2 10 45 VH 2 DRV EN+ 2 11 44 DOUT 2 DRV EN- 2 12 43 NC DATA+ 2 13 42 VL 2 DATA- 2 14 41 VH 3 QA 3 15 40 DOUT 3 QB 3 16 39 NC DRV EN+ 3 17 38 VL 3 DRV EN- 3 18 37 LOWSWING 20 21 22 23 24 25 26 27 28 29 30 31 2 32 VINP 2 DATA+ 3 19 33 34 35 36 VINP 3 DRV EN- 1 CVB 3 50 VL 0 CVA 3 5 CVB 2 DRV EN+ 1 CVA 2 51 NC CVB 1 4 VINP 1 QB 1 CVA 1 52 DOUT 0 VCC 3 VEE QA 1 COMP LOW 53 VH 0 COMP HIGH 2 CVB 0 DATA- 0 VINP 0 54 VEXT CVA 0 1 DATA- 3 DATA+ 0 FN6229.1 November 24, 2008 ISL55100B Pin Descriptions PIN FUNCTION DATA+(0:3) Positive differential digital input that determines the driver output state when it is enabled. DATA-(0:3) Negative differential digital input that determines the driver output state when it is enabled. DRV EN+(0:3) Positive differential digital input that enables or disables the corresponding driver. DRV EN-(0:3) Negative differential digital input that enables or disables the corresponding driver. QA (0:3) Comparator digital outputs. QA(X) is high when VINP(X) exceeds CVA(X). QB (0:3) Comparator digital outputs. QB(X) is high when VINP(X) exceeds CVB(X). DOUT (0:3) Driver outputs. VINP (0:3) Comparator inputs. VH (0:3) Unbuffered analog inputs that set each individual driver’s “high” voltage level. VL (0:3) Unbuffered analog inputs that set each individual driver’s “low” voltage level. VL must be a lower voltage than VH. NC No internal connection. CVA (0:3) Analog inputs that set the threshold for the corresponding Channel A comparators. CVB (0:3) Analog inputs that set the threshold for the corresponding Channel B comparators. COMP HI Supply voltage, unbuffered input that sets the high output level of all comparators. Must be greater than COMP LO. COMP LO Supply voltage, unbuffered input that sets the low output level of all comparators. Must be less than COMP HI. VCC Positive power supply (5% tolerance). VEE Negative power supply (5% tolerance). VEXT External 5.5VDC power supply (5.5VDC to 6.0VDC as referenced to VEE, NOT GND. Recommended VEXT = 5.5V) for internal logic. Connect pin to VEE when not using an external supply. LOWSWING Input that selects driver output configurations optimized to yield minimum overshoots for low level swings (VH < VEE +5V), or optimized for large output swings. Connect LOWSWING to VEE to select low swing circuitry, or connect it to VCC to select high swing circuitry. Truth Tables RECEIVERS DRIVERS INPUTS INPUT OUTPUT OUTPUTS VINP QA QB DATA DRV EN DOUT <CVA <CVB 0 0 X +>- Hi - Z <CVA >CVB 0 1 +>- +<- VH >CVA <CVB 1 0 +<- +<- VL >CVA >CVB 1 1 X = DON’T CARE 3 FN6229.1 November 24, 2008 ISL55100B Absolute Maximum Ratings Thermal Information VCC to VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 19V VEXT to VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V Input Voltages DATA, DRV EN, CVX, VH, VL, VINP, COMPX, LOWSWING . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VEE - 0.5V) to (VCC + 0.5V) Output Voltages DOUT . . . . . . . . . . . . . . . . . . . . . . . (VEE - 0.5V) to (VCC + 0.5V) QX . . . . . . . . . . . . (COMP LOW - 0.5V) to (COMP HIGH + 0.5V) Thermal Resistance (Typical, Notes 1, 2) θJA (°C/W) θJC (°C/W) 72 Ld QFN Package. . . . . . . . . . . . . . . 23 2.0 Maximum Junction Temperature (Plastic Package) . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 1. θJA is measured in free air with the component mounted on high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379 and Tech Brief TB389 for details. Device temperature is closely tied to data-rates, driver loads and overall pin activity. Review “Power Dissipation Considerations” on page 9 for more information. 2. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Recommended Operating Conditions PARAMETER SYMBOL MIN (Note 9) TYP MAX (Note 9) UNITS Device Power-(VEXT = VEE) VEXT not used VCC - VEE 12 (Note 6) 15 18 V Device Power-(VEXT = VEE + 5.5V) VCC - VEE 9 (Note 6) 15 18 V VEXT Optional External Logic Power VEXT - VEE 5.5 (Note 6) 5.75 6.0 V Driver Output High Rail VH VEE + 1 - VCC - 0.5 V Driver Output Low Rail VL VEE + 0.5 - VEE + 6 V Comparator Output High Rail COMP-High VEE + 1 - VCC - 0.5 V Comparator Output Low Rail COMP-Low VEE + 0.5 - VEE + 6 V Ambient Temperature TA -40 - +85 °C Junction Temperature TJ - - +150 °C Electrical Specifications Test Conditions: VCC = 12V, VEE = -3V, VH = 6V, VL = 0V, Comp-High = 5V, Comp Low = 0V, VEXT = VEE and LOWSWING = VCC, +25°C; Unless Otherwise specified. PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS 6 9 14 Ω ±125 - - mA DRIVER DC CHARACTERISTICS ISL55100B Output Resistance ROUTD ISL55100B DC Output Current Iout D ISL55100B AC Output Current (Note 3) ISL55100A Minimum Output Swing Disabled HIZ Leakage Current IO = ±125mA, data not toggling Per Individual driver IOUTDAC Per Individual driver VOMIN VH = 200mV, VL = 0V - 600 - mA 185 - - mV HIZ VOUT = VCC with VH = VL + VEE or VOUT = VEE with VH = VL = VCC -1 0 1 µA tPD Lowswing Disabled (Note 5) 5 12 16 ns Lowswing Enabled (Note 5) 6 13 17 ns DRIVER TIMING CHARACTERISTICS Data± to DOUT Propagation Delay Driver Timing Skew, All Edges (Note 3) - <1 - ns Disable (HIZ) Time tDIS DVREN± Transition from Enable to Disable 15 18 26 ns Enable Time tEN DVREN± Transition from Disable to Enable: Lowswing Disabled (Note 5) 13 15 23 ns DVREN± Transition from Disable to Enable: Lowswing Enabled (Note 5) 13 18 23 ns 4 FN6229.1 November 24, 2008 ISL55100B Electrical Specifications Test Conditions: VCC = 12V, VEE = -3V, VH = 6V, VL = 0V, Comp-High = 5V, Comp Low = 0V, VEXT = VEE and LOWSWING = VCC, +25°C; Unless Otherwise specified. (Continued) PARAMETER SYMBOL ISL55100B Rise/Fall Times (Note 3) ISL55100B Rise/Fall Times (Note 3) ISL55100B Maximum Toggle Frequency tR, tF tR, tF FMAXD TEST CONDITIONS 100pF Load 1000pF Load MIN TYP MAX UNITS DV = 0.4V (20% to 80%) - 2.5 - ns DV = 1V (20% to 80%) - 2.5 - ns DV = 5V (10% to 90%) - 3.0 - ns DV = 10V (10% to 90%) - 3.5 - ns DV = 14V (10% to 90%) - 3.5 - ns DV = 1V (20% to 80%) - 9 - ns DV = 5V (10% to 90%) - 11 - ns DV = 10V (10% to 90%) - 14 - ns 50 65 - MHz No Load, 50% Symmetry Standard Load, 1k/100pF (Note 4) - 7.7 - ns OS Lowswing Enabled, (VH-VL<2V) - 20mV+ 10% of output swing - %+V Input Offset Voltage VOS CVA = CVB = 1.5V -200 - 200 mV Input Bias Current IBIAS VINP - CV(A/B) = ±5V - 10 30 nA Output Resistance RoutR 18 25 35 Ω tPP 7 12 18 ns 50 65 - MHz - 7.7 - ns - <1 - ns ISL55100B Min Driver Pulse Width ISL55100B Overshoot Lowswing Mode (Note 3) tWIDD RECEIVER DC CHARACTERISTICS RECEIVER TIMING CHARACTERISTICS Propagation Delay Maximum Operating Frequency FMAXR Min Pulse Width tWIDR Under No Load, PWOUT Symmetry 50% Rcvr Channel-to-Channel Skew (Note 3) DIGITAL INPUTS Differential Input High Voltage VDIFFH VDIG+ - VDIG- 200 - - mV Differential Input Low Voltage VDIFFL VDIG+ - VDIG- - - -200 mV -50 0 Input Current IIN Common Mode Input Voltage Range VCM VIN = VCC or VEE VDIFFL not greater than VDIFFH - 0.2V VDIFFH not less than VDIFFL + 0.2V VEE + 0.2V - 50 nA VCC - 5V V - V POWER SUPPLIES, DRIVER/RECEIVER STATIC CONDITIONS VEXT = VEE, EXTERNAL LOGIC POWER OPTION NOT USED. (Note 7) Positive Supply Current ICC VCC = VH = 12V, VEE = VL = -3V, VEXT = VEE, Outputs Unloaded - 65 85 mA Negative Supply Current IEE VCC = VH = 12V, VEE = VL = -3V, VEXT = VEE, Outputs Unloaded -85 -65 - mA VEXT Supply Current IEXT VCC = VH = 12, VEE = VL = -3V, VEXT = VEE, Outputs Unloaded - <1 - mA 5 FN6229.1 November 24, 2008 ISL55100B Electrical Specifications Test Conditions: VCC = 12V, VEE = -3V, VH = 6V, VL = 0V, Comp-High = 5V, Comp Low = 0V, VEXT = VEE and LOWSWING = VCC, +25°C; Unless Otherwise specified. (Continued) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS POWER SUPPLIES, DRIVER/RECEIVER STATIC CONDITIONS VEXT = VEE + 5.5V, EXTERNAL LOGIC POWER OPTION USED. (Note 8) Positive Supply Current ICC VCC = VH = 12V, VEE = VL = -3V, VEXT = VEE + 5.5V, Outputs Unloaded - 35 50 mA Negative Supply Current IEE VCC = VH = 12V, VEE = VL = -3V, VEXT = VEE + 5.5V, Outputs Unloaded -50 -35 - mA VEXT Supply Current IEXT VCC = VH = 12, VEE = VL = -3V, VEXT = VEE + 5.5V, Outputs Unloaded - 25 40 mA NOTES: 3. Lab characterization, room temp, Timing Parameters Matched Stimulus/Loads, Channel-to-Channel Skew < 500ps, 1ns Max by design. 4. Measured across 100pF/1k lump sum load + 15pF PCB/Scope Probe. Cap and Resistor Surface Mount/Stacked ~0.5” from Pin. 5. To Enable LOWSWING, connect LOWSWING to VEE and keep VH < VEE + 5. To disable LOWSWING, connect it to VCC. 6. When VEXT is connected to VEE (External Device Power not used) then the Minimum VCC - VEE is 12V. When VEXT is connected to an external 5.5V supply, then the minimum VCC - VEE voltage is 9V. Recommended VEXT = 5.5V as referenced to VEE. 7. ICC and IEE values are based on static conditions and will increase with pattern rates. ICC and IEE reach 400mA to 500mA at maximum data rates (provided sufficient device cooling is employed). These currents can be reduced by 1) Reducing the VCC - VEE operating voltage 2) Utilizing the VEXT option. 8. When using VEXT = 5.5V, current requirements of the VEXT input can approach 100mA at maximum pattern rates. 9. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. Test Circuits and Waveforms VH VL DATA+ (NOTE 3) DATA- VO DRV EN+ DOUT DRV EN- 100pF 1kΩ FIGURE 1. DRIVER SWITCHING TEST CIRCUIT DATA = 1 DATA- DATA = 0 400mV DATA+ 0V tPDLH tPDHL VOH (≈VH) 50% VO 50% VOL (≈VL) tR tF FIGURE 2. DRIVER PROPAGATION DELAY AND TRANSITION TIME MEASUREMENT POINTS 6 FN6229.1 November 24, 2008 ISL55100B Test Circuits and Waveforms (Continued) DIS EN DRV EN- 400mV DRV EN+ 0V tDISL tENH VREF VO (FOR DATA = 0) 1V 10% tDISH VOL (≈VL) tENL VOH (≈VH) 90% VO (FOR DATA = 1) 2V VREF FIGURE 3. DRIVER ENABLE AND DISABLE TIME MEASUREMENT POINTS COMP HI CVA + QA 5V VINP CVB + - QB COMP LO FIGURE 4. RECEIVER SWITCHING TEST CIRCUIT 500mV VINP 0V 0V -500mV tPDLH tPDHL VOH (≈5V) QX 50% 50% VOL (≈0V) FIGURE 5. RECEIVER PROPAGATION DELAY MEASUREMENT POINTS Application Information Receiver Features The ISL55100B provides Quad pin drivers and Quad dual level comparator receivers in a small footprint. The four channels may be used as bidirectional or split channels. Drivers have per channel level, data, and high impedance controls, while comparators have per channel high and low threshold levels. The receivers are four independent window comparators that feature high output current capability, and user defined high and low output levels to interface with a wide variety of logic families. Each receiver comprises two comparators and each comparator has an independent threshold level input, making it easy to implement window comparator functions. The CVA and CVB pins set the threshold levels of the A and B 7 FN6229.1 November 24, 2008 ISL55100B comparators respectively. COMP HIGH and COMP LOW set all the comparator output levels, and COMP HIGH must be more positive than COMP LOW. These two inputs are unbuffered supply pins, so the sources driving these pins must provide adequate current for the expected load. COMP HIGH and COMP LOW typically connect to the power supplies of the logic device driven by the comparator outputs. The truth table for the receivers is given on page 3. Receiver outputs cannot be placed in a HIZ state, and do not incorporate any on-chip short circuit current protection. Momentary short circuits to GND, or any supply voltage, won’t cause permanent damage, but care must be taken to avoid longer duration short circuits. If tolerable to the application, current limiting resistors can be inserted in series with the QA(0-3) and QB(0-3) outputs to protect the receiver outputs from damage due to overcurrent conditions. Driver Features The drivers are single-ended outputs featuring a wide voltage range, an output stage capable of delivering 125mA while providing a low out resistance and HIZ capability. The driver output can be toggled to drive one of two user defined output levels High (VH) or Low (VL). Driver waveforms are greatly affected by load characteristics. The ISL55100B actually double bonds the VH(0-3) and VL(0-3) supply pins for each channel. The Driver Output Pins (DOUT(0-3)) are triple bonded. Multiple bond wires help reduce the effects of Inductance between the IC Die (Wafer) and the packaging. Also the QFN style of packaging reduces inductance over other types of packaging. While the inductance of a bond wire might seem insignificant, it can reduce high-frequency waveform fidelity. So this should be borne in mind when doing PCB layout and DUT interconnect. Lead lengths should be kept as short as possible, maintaining as much decoupling on the drive rails as possible and make sure scope measurements are made properly. Often the inductance of a scope probe ground can be the actual cause of the waveform distortion. VH and VL (Driver Output Rails) Sets of VH and VL pins are designated for each Driver. These are unbuffered analog inputs that determine the Drive High (VH) and Drive Low (VL) Voltages that the drivers will deliver. These inputs are double bonded to reduce inductance and decrease AC Impedance. Each VH and VL should be decoupled with 4.7µF and 0.1µF capacitors to ground. If all four Driver VH/VLs are bussed, then one 4.7µF can be used. Layouts should also accommodate the placement of capacitance “across” VH and VL. So in addition to decoupling the VH/VL pins to ground, they are also decoupled to each other. 8 Logic Inputs The ISL55100B uses differential mode digital inputs, and can therefore mate directly with LVDS or CML outputs. Single ended logic families are handled by connecting one of the digital input pins to an appropriate threshold voltage (e.g., 1.4V for TTL compatibility). LOWSWING Circuit Option The drivers include switchable circuitry that is optimized for either low (VH-VL < 3V) or high output swings. Configuring the part is accomplished via the LOWSWING pin. Connecting LOWSWING to VEE selects the circuits optimized for low overshoots at low swing operation. Connecting the pin to VCC enables the large signal circuitry (see Figure 6). With LOWSWING = VEE, the low swing circuitry activates whenever VH < VEE + 5V. Set LOWSWING = VEE only if the output swing (VH-VL) is less than 3V, and better than 10% overshoots are required. For the best small (low swing) signal performance, the VH/VL common mode voltage [(VH + VL)/2] must be VEE + 1.5V. So if VEE = 0V, and the desired swing is 500mV, set VH = 1.75V, and VL = 1.25V. Driver and Receiver Overload Protection The ISL55100B is designed to provide minimum and balanced Driver ROUT. Great care should be taken when making use of the ISL55100B low ROUT drivers as there is no internal protection. There is no short circuit protection built into either the driver or the receiver/comparator outputs. Also there are no junction temperature monitors or thermal shutdown features. The driver or receiver outputs may be damaged by more than a momentary short circuit directly to any low impedance voltage. Driver Protection can be obtained with a 50Ω Series Termination Resistor that is properly rated. External Logic Supply Option (VEXT) Connection of the VEXT Pin to a 5.5V DC Source (referenced to VEE) will reduce the VCC-VEE current drain. Current drain is directly proportional to Data Rate. This option will help with Power Supply/Dissipation should heat distribution become an issue. Power Supply Bypassing and Printed Circuit Board Layout As with any high frequency device, good printed circuit board layout is necessary for optimum performance. Ground plane construction is highly recommended, lead lengths should be as short as possible, and the power supply pins must be well bypassed to reduce the risk of oscillation. For normal single supply operation, where the VEE pin is connected to ground, one 0.1µF ceramic capacitor should be placed from the VCC pin to ground. A 4.7µF tantalum capacitor should then be connected from the VCC pin to FN6229.1 November 24, 2008 ISL55100B ground. This same capacitor combination should be placed at each supply pin to ground if split supplies are to be used. Power Dissipation Considerations the ambient temperature part of the equation. This is especially true if the users applications require continuous, high speed operation. Specifying continuous data rates, driver loads and driver level amplitudes are key in determining power supply requirements as well as dissipation/cooling necessities. Driver Output patterns also impact these needs. The faster the pin activity, the greater the need to supply current and remove heat. The reader is cautioned against assuming the same level of thermal performance in actual applications. A careful inspection of conditions in your application should be conducted. Great care must be taken to ensure Die Temperature does not exceed the +150°C Absolute Maximum Thermal Limits. Figures 17 and 18 address power consumption relative to frequency of operation. These graphs are based on driving 6.0/0.0V out into a 1kΩ load. Theta JA for the device package is 23.0, 16.6 and 14.9°C/W based on Airflows of 0, 1 and 2.5 meters per second. The device is mounted per Note 1 under “Thermal Information” on page 4. With the high speed data rate capability of the ISL55100B, it is possible to exceed the +150°C “ absolute maximum junction temperature” as operating conditions and frequencies increase. Therefore, it is important to calculate the maximum junction temperature for the application to determine if operating conditions need to be modified for the device to remain in the safe operating area. Important Note: The ISL55100B package metal plane is used for heat sinking of the device. It is electrically connected to the negative supply potential (VEE). If VEE is tied to ground, the thermal pad can be connected to ground. Otherwise, the thermal pad (VEE) must be isolated from other power planes. The maximum power dissipation allowed in a package is determined according to Equation 1: T JMAX - T AMAX P DMAX = --------------------------------------------Θ JA (EQ. 1) Power Supply Sequencing The ISL55100B references every supply with respect to VEE. Therefore apply VEE, then VCC followed by the VH,VL busses, then the COMP High and Comp Low followed by the CVA and CVB Supplies. Digital Inputs should be set with a differential bias as soon as possible. In cases where VEXT is being utilized (VEXT = VEE + 5.5V), it should be powered up immediately after VCC. Basically, no pin should be biased above VCC or below VEE. Data Rates • TAMAX = Maximum ambient temperature Please note that the Frequency (MHz) in Figures 17 and 18 contain two transitions within each period. A digital application that requires a new test pattern every 50ns would be running at a 20MHz Data Rate. Figure 19 reveals 100ns period, in 10MHz frequency parlance, results in two 50ns digital patterns. • θJA = Thermal resistance of the package ESD Protection where: • TJMAX = Maximum junction temperature • PDMAX = Maximum power dissipation in the package The maximum power dissipation actually produced by an IC is the total quiescent supply current times the total power supply voltage, plus the power in the IC due to the loads. Power also depends on number of channels changing state, frequency of operation. The extent of continuous active pattern generation/reception will greatly effect dissipation requirements. Figure 6 is the block diagram depicting the ESD protection networks and the VOH upper FET body diode. The power dissipation curves (Figure 17), provide a way to see if the device will overheat. The maximum safe power temperature vs operating frequency can be found graphically in Figure 18. This graph is based on the package type Theta JA ratings and actual current/wattage requirements of the ISL55100B when driving a 1k load with a 6V High Level and a 0V Low Rail. The temperatures are indicated as calculated junction temperature over the ambient temperature of the user’s system. Plots indicate temperature change as operating frequency increases (the graph assumes continuous operation). The user should evaluate various heat sink/cooling options in order to control 9 FN6229.1 November 24, 2008 ISL55100B VCC VCC VCC VOH VCC VEE DATA+ DOUT DATA- VCC VEE VOL VEE VCC VEE DRVEN+ VEXT DRVEN5.5V TO 6.0V ISL55100 VEE COMP HIGH VEE VCC VCC QA CVA COMP LOW COMP HIGH VEE VEE VINP VCC CMV > VEE +0.3 TO < VCC – 5.0V VCC QB CVB COMP LOW VEE VEE VEE FIGURE 6. ESD STRUCTURE BLOCK DIAGRAM 10 FN6229.1 November 24, 2008 ISL55100B Typical Performance Curves Device installed on Intersil ISL55100B Evaluation Board. VCC 12.0 DH 6.0 VEE - 3.0 DL 0.0 0.5V/DIV VCC 12.0 DH 6.0 VEE - 3.0 DL 0.0 0 0.5V/DIV 1k100pF 2V/DIV LOWSWING OFF 0 DATA IN 680pF LOWSWING ON 2200pF 0 1000pF 0 10ns/DIV 10ns/DIV FIGURE 7. LOWSWING EFFECTS ON DRIVER SHAPE AND TPD (100pF-1k LOAD) FIGURE 8. DRIVER WAVEFORMS UNDER VARIOUS LOADS VH (6V) ROUT : DRIVER SOURCES 125mA DRVEN 0 DATA IN 0 2V/DIV 10 ROUT @ 125mA DC 2V/DIV TRISTATE/DATA/DOUT TIMING 5 VL (0.0V) ROUT: DRIVER SINKS 125mA DRIVER OUT 0 0 12 13 20ns/DIV 8.0 17 18 5.6 4.8 VL (0.0V FIXED) ROUT: DRIVER SINKS 125mA 3.2 2.4 1.6 0.8 18 PROPAGATION DELAY ROUT @ 125mA DC 6.4 0.0 16 20 VH (1V TO 15V) ROUT: DRIVER SOURCES 125mA 4.0 15 FIGURE 10. ROUT vs DEVICE VOLTAGE FIGURE 9. DATA/HIZ/DRIVER OUT TIMING 7.2 14 VCC-VEE VOLTS (VEE -3.0 FIXED) 2200pF 16 1000pF 14 12 680pF 10 1k 100pF 8 6 4 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 VH VOLTS (VL = 0.0) FIGURE 11. ROUT vs VH RAIL 11 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 VH VOLTS (VL = 0.0) FIGURE 12. PROPAGATION DELAY vs VH RAIL, VARIOUS LOADS FN6229.1 November 24, 2008 ISL55100B Typical Performance Curves Device installed on Intersil ISL55100B Evaluation Board. (Continued) 45.0 20 40.5 18 16 2200pF 31.5 14 TPD IN (ns) FALL TIME (ns) 36.0 27.0 22.5 1000pF 18.0 13.5 DRIVER TPD .. NO LOAD 10 8 COMPARATOR TPD .. NO LOAD 6 680pF 4 9.0 1k 100pF 4.5 0.0 12 1 2 3 4 5 6 7 8 9 10 11 12 13 2 0 11 14 12 13 FIGURE 13. DRIVER FALL TIME vs VH RAIL, VARIOUS LOADS 16 17 18 19 100 31.5 90 2200pF 28.0 80 24.5 70 21.0 60 ICC (mA) RISE TIME (ns) 15 FIGURE 14. DRIVER AND RECEIVER TPD VARIANCE vs VCC 35.0 17.5 1000pF 14.0 10.5 50 40 ICC STATIC CONDITIONS 30 680pF 7.0 20 3.5 0.0 14 VCC-VEE (VEE = -3.0) VH VOLTS (VL = 0.0) 1k 100pF 1 2 3 4 5 6 7 8 9 10 11 12 13 10 0 11 14 12 VH VOLTS (VL = 0.0) 13 14 15 16 VCC-VEE (VEE = -3.0) 17 18 19 FIGURE 16. STATIC ICC vs VCC FIGURE 15. DRIVER RISE TIME vs VH RAIL, VARIOUS LOADS 150 9 135 8 120 12V VCC 7 6 5 4 18V VCC 3 2 9V VCC AND VEXT = 5.5V 1 0 5M 10M 15M 20M 25M 30M 35M 40M 45M 50M 55M 60M FREQUENCY (Hz) FIGURE 17. DEVICE POWER DISSIPATION WITH VCC-VEE = 18, 12 AND 9.0 (VEXT = 5.5V) VOLTS. All FOUR PINS MAKING TWO TRANSITIONS PER PERIOD 12 TEMPERATURE (°C) POWER DISSIPATION (W) AIRFLOW LEGEND A = 0m/s: B = 1.0m/s: C = 2.5m/s 10 A B C 12V VCC 105 90 A B C 18V VCC A B C 75 60 45 30 15 0 9V VCC AND VEXT = 5.5V 5M 10M 15M 20M 25M 30M 35M 40M 45M 50M 55M 60M FREQUENCY (Hz) FIGURE 18. CALCULATED JUNCTION TEMP ABOVE AMBIENT WITH VCC-VEE = 18, 12 AND 9.0 (VEXT = 5.5V) VOLTS. ALL FOUR PINS MAKING TWO TRANSITIONS PER PERIOD FN6229.1 November 24, 2008 ISL55100B Typical Performance Curves Device installed on Intersil ISL55100B Evaluation Board. (Continued) VCC 12.0 DH 6.0 VEE - 3.0 DL 0.0 2V/DIV 1V/DIV 2V/DIV VCC 12.0 DH 6.0 VEE - 3.0 DL 0.0 0 0 0 10ns/DIV FIGURE 19. FREQUENCY OF 10MHz = 50ns PATTERN RATE 13 FIGURE 20. MINIMUM PULSE WIDTH VH 6/8/10V FN6229.1 November 24, 2008 ISL55100B Quad Flat No-Lead Plastic Package (QFN) Micro Lead Frame Plastic Package (MLFP) L72.10x10 72 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80 0.90 1.00 - A1 - 0.02 0.05 - A2 - 0.65 1.00 9 0.30 5, 8 A3 b 0.20 REF 0.18 0.25 9 D 10.00 BSC - D1 9.75 BSC 9 D2 5.85 E E1 E2 6.00 6.15 7, 8 10.00 BSC - 9.75 BSC 5.85 e 6.00 9 6.15 7, 8 0.50 BSC - k 0.20 - - - L 0.30 0.40 0.50 8, 10 N 72 2 Nd 18 3 Ne 18 3 P - - 0.60 9 θ - - 12 9 Rev. 1 11/04 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd and Ne refer to the number of terminals on each D and E. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. 9. Features and dimensions A2, A3, D1, E1, P & θ are present when Anvil singulation method is used and not present for saw singulation. 10. Compliant to JEDEC MO-220VNND-3 except for the "L" min dimension. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 14 FN6229.1 November 24, 2008