89636.pdf

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Changes in accordance with N.O.R. 5962-R163-92.
92-03-26
M. A. FRYE
B
Changes in accordance with N.O.R. 5962-R228-94.
94-07-27
M. A. FRYE
C
Drawing updated to reflect current requirements. - ro
01-04-11
R. MONNIN
D
Update boilerplate paragraphs to current MIL-PRF-38535 requirements. -rrp
10-02-16
C. SAFFLE
E
Update drawing to current MIL-PRF-38535 requirements. -rrp
16-05-04
C. SAFFLE
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
REV
E
E
E
E
E
E
E
E
E
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
PMIC N/A
PREPARED BY
CHARLES E. BESORE
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
CHECKED BY
CHARLES E. BESORE
APPROVED BY
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
MICHAEL A. FRYE
DRAWING APPROVAL DATE
90-04-18
REVISION LEVEL
E
MICROCIRCUIT, LINEAR, BUFFER AMPLIFIER,
WIDEBAND, HIGH SLEW RATE / OUTPUT
CURRENT, MONOLITHIC SILICON
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
5962-89636
1 OF 9
5962-E314-16
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-89636
01
G
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
Circuit function
HA-5002
Wideband, high output current buffer
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
G
P
2
Descriptive designator
MACY1-X8
GDIP1-T8 or CDIP2-T8
CQCC1-N20
Terminals
Package style
8
8
20
Can
Dual-in-line
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings. (Unless otherwise specified, TA = +25°C)
Voltage between +VS and –VS terminals ............................
Input voltage ........................................................................
Peak output current (50 ms on 1.0 second off) ...................
Continuous output current ...................................................
Storage temperature range .................................................
Maximum power dissipation (PD): 1/
Case G ............................................................................
Case P .............................................................................
Case 2 .............................................................................
Lead temperature (soldering, 10 seconds) ..........................
Junction temperature (TJ) ...................................................
44 V dc
Equal to supplies
±400 mA
200 mA RMS
-65°C to +150°C
0.93 W
0.88 W
1.20 W
+275°C
+175°C
Thermal resistance, junction-to-case (θJC) ......................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (θJA):
Case G ............................................................................ 108°C/W
Case P ............................................................................. 114°C/W
Case 2 ............................................................................. 83°C/W
1/
Derate linearly above TA = +75°C as follows: case G = 9.3 mW/°C, case P = 8.8 mW/°C, and case 2 = 12.0 mW/°C.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89636
A
REVISION LEVEL
E
SHEET
2
1.4 Recommended operating conditions.
Positive supply voltage range (+VS) .................................... +12 V dc to +15 V dc
Negative supply voltage range (-VS) ................................... -12 V dc to –15 V dc
Load resistance (RL) ........................................................... ≥ 100 Ω
Ambient operating temperature (TA) ................................... -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil/ or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MILPRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MILPRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89636
A
REVISION LEVEL
E
SHEET
3
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
VIO
VIN = 0.0 V
Group A
subgroups
Device
type
1
01
Limits
Min
Input offset voltage
IB
1
RS = 1.0 kΩ
±7
01
+AV
-AV
Output voltage swing
+VOUT
mV
µA
±10
2,3
Voltage gain
Max
±20
±30
2,3
Input bias current
Unit
VIN = 10 V, RL = 1.0 kΩ
1,2,3
01
0.98
VIN = 10 V, RL = 100 Ω
1
0.96
VIN = -10 V, RL = 1.0 kΩ
1,2,3
0.98
VIN = -10 V, RL = 100 Ω
1
0.96
VIN = 15 V, VS = ±15 V,
1,2,3
01
V/V
10
V
RL = 1.0 kΩ
10
VIN = 15 V, VS = ±15 V,
RL = 100 Ω
10
VIN = 12 V, VS = ±12 V,
RL = 1.0 kΩ
-VOUT
-10
VIN = -15 V, VS = ±15 V,
RL = 1.0 kΩ
-10
VIN = -15 V, VS = ±15 V,
RL = 100 Ω
-10
VIN = -12 V, VS = ±12 V,
RL = 1.0 kΩ
Output current
+IOUT
VOUT = 10 V
-IOUT
VOUT = -10 V
1,2,3
01
100
mA
-100
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89636
A
REVISION LEVEL
E
SHEET
4
TABLE I. Electrical performance characteristics – Continued.
Test
Power supply rejection
ratio
Symbol
+PSRR1
Conditions 1/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
1,2,3
01
+VS = +20 V and +10 V,
Limits
Min
54
Unit
Max
dB
-VS = -15 V
-PSRR1
54
-VS = -20 V and -10 V,
+VS = +15 V
+PSRR2
54
+VS = +17 V and +7.0 V,
-VS = -12 V
-PSRR2
54
-VS = -17 V and –7.0 V,
+VS = +12 V
Power supply current
+ICC
1,2,3
VIN = 0.0 V
01
10
-10
-ICC
Input resistance 2/
RIN
mA
VIN = -10 V, 0 V, 10 V
1
01
1.5
MΩ
4
01
1.0
V/ns
TA = +25°C
Slew rate 2/
+SR
VOUT = -5.0 V to +5.0 V
-SR
VOUT = +5 V to -5 V
Rise time 2/ 3/
tr
VOUT = 0.0 mV to +500 mV
9,10,11
01
10
ns
Fall time 2/ 3/
tf
VOUT = 0.0 mV to -500 mV
9,10,11
01
10
ns
Quiescent power 4/
consumption
PC1
VIN = 0.0 V,
1,2,3
01
300
mW
1.0
IOUT = 0 mA, VS = ±15 V
PC2
240
VIN = 0.0 V,
IOUT = 0 mA, VS = ±12 V
Overshoot 2/
+OS
VOUT = 0.0 mV to 500 mV
-OS
VOUT = 0.0 mV to -500 mV
9,10,11
01
30
%
30
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89636
A
REVISION LEVEL
E
SHEET
5
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions 1/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
ROUT
VIN = 10 V, VS = ±15 V,
Group A
subgroups
Device
type
1
01
Limits
Min
Output resistance 2/
Unit
Max
5
Ω
IOUT = -100 mA and
–10 mA, TA = +25°C
5
VIN = -10 V, VS = ±15 V,
IOUT = 100 mA and
10 mA, TA = +25°C
1/
Unless otherwise specified, measurements apply at both +VS = ±12 V, ±VS = ±15 V, RS = 50 Ω, RL = 1.0 kΩ,
CL = 10 pF, and VOUT = 0.0 V.
2/
If not tested, shall be guaranteed to the limits specified in table I herein.
3/
Rise and fall times measured between 10 % and 90 % points.
4/
Quiescent power consumption based on quiescent supply current test maximum (no load outputs).
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and
Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the
requirements of MIL-PRF-38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that
affects this drawing.
3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89636
A
REVISION LEVEL
E
SHEET
6
Device type
Case outlines
01
P
G
2
Terminal
number
1
Terminal symbol
+V1
+V1
NC
2
-V2
+V2
+V1
3
NC
NC
NC
4
INPUT
OUTPUT
NC
5
-V1
NC
-V2
6
NC
-V2
NC
7
+V2
-V1
NC
8
OUTPUT
INPUT
NC
9
---
---
NC
10
---
---
INPUT
11
---
---
NC
12
---
---
-V1
13
---
---
NC
14
---
---
NC
15
---
---
NC
16
---
---
NC
17
---
---
+V2
18
---
---
NC
19
---
---
NC
20
---
---
OUTPUT
NC = No connection
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89636
A
REVISION LEVEL
E
SHEET
7
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a.
Tests shall be as specified in table II herein.
b.
Subgroups 5, 6, 7, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.
4.3.2 Groups C and D inspections.
a.
End-point electrical parameters shall be as specified in table II herein.
b.
Steady-state life test conditions, method 1005 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1005 of MIL-STD-883.
(2)
TA = +125°C, minimum.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89636
A
REVISION LEVEL
E
SHEET
8
TABLE II. Electrical test requirements.
MIL-STD-883 test requirements
Subgroups
(in accordance with
MIL-STD-883, method 5005,
table I)
----
Interim electrical parameters
(method 5004)
1*, 2, 3, 4
Final electrical test parameters
(method 5004)
Group A test requirements
(method 5005)
1, 2, 3, 4, 5, 6, 9**, 10**, 11**
Groups C and D end-point
electrical parameters
(method 5005)
1
* PDA applies to subgroup 1.
** Subgroups 9, 10, and 11, if not tested, shall be guaranteed to the limits
specified in table I herein.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires
configuration control and the applicable SMD to that system. DLA Land and Maritime will maintain a record of users and this
list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics
devices (FSC 5962) should contact DLA Land and Maritime -VA, telephone (614) 692-8108.
6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 432183990, or telephone (614) 692-0540.
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103 and QML-38535. The vendors
listed in MIL-HDBK-103 and QML-38535 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DLA Land and Maritime -VA.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89636
A
REVISION LEVEL
E
SHEET
9
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 16-05-04
Approved sources of supply for SMD 5962-89636 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information
bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime
maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-8963601GC
34371
HA2-5002
5962-8963601PA
34371
HA7-5002
5962-89636012A
34371
HA4-5002
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE
number
34371
Vendor name
and address
Intersil Corporation
1650 Robert J. Conlan Blvd. NE
Palm Bay, FL 32905-3406
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.