7.0V to 26V Input, 1.0A, Integrated MOSFET Single Synchronous Buck DC/DC Converter BD9E102FJ General Description The BD9E102FJ is a synchronous buck switching regulator with low on-resistance built-in power MOSFETs. High efficiency at light load with a SLLMTM. It is most suitable for use in the equipment to reduce the standby power is required. It is a current mode control DC/DC converter and features high-speed transient response. Phase compensation can also be set easily. Key Specifications Input voltage range: 7.0V to 26V Adjustable output voltage range: 1.0V to VIN x 0.7V Maximum output current: 1.0 A (Max.) Switching frequency: 570 kHz (Typ.) High-Side MOSFET on-resistance: 250 mΩ (Typ.) Low-Side MOSFET on-resistance: 200 mΩ (Typ.) Shutdown current: 0 μA (Typ.) Features Synchronous single DC/DC converter TM SLLM control (Simple Light Load Mode) Efficiency = 80% (@IOUT=10mA) Over current protection Short circuit protection Thermal shutdown protection Undervoltage lockout protection Soft start Reduce external diode SOP-J8 package Package SOP-J8 W (Typ.) x D (Typ.) x H (Max.) 4.90 mm x 6.00 mm x 1.65 mm Applications Consumer applications such as home appliance Secondary power supply and Adapter equipments Telecommunication devices SOP-J8 Typical Application Circuit Figure 1. Application circuit ○Product structure：Silicon monolithic integrated circuit. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed for protection against radioactive rays. 1/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ Pin Configuration (TOP VIEW) BOOT 1 8 SW VIN 2 7 PGND EN 3 6 COMP AGND 4 5 FB Figure 2. Pin assignment Pin Descriptions Pin No. Pin Name Description 1 BOOT 2 VIN Power supply terminal for the switching regulator and control circuit. Connecting a 10 µF ceramic capacitor is recommended. 3 EN Turning this terminal signal low-level (0.8 V or lower) forces the device to enter the shut down mode. Turning this terminal signal high-level (2.0 V or higher) enables the device. This terminal must be terminated. 4 AGND 5 FB Connect a bootstrap capacitor of 0.1 µF between this terminal and SW terminals. The voltage of this capacitor is the gate drive voltage of the high-side MOSFET. Ground terminal for the control circuit. Inverting input node for the gm error amplifier. See page 22 for how to calculate the resistance of the output voltage setting. 6 COMP Input terminal for the gm error amplifier output and the output switch current comparator. Connect a frequency phase compensation component to this terminal. See page 22 for how to calculate the resistance and capacitance for phase compensation. 7 PGND Ground terminals for the output stage of the switching regulator. 8 SW Switch node. This terminal is connected to the source of the high-side MOSFET and drain of the low-side MOSFET. Connect a bootstrap capacitor of 0.1 µF between these terminals and BOOT terminals. In addition, connect an inductor of 6.8 µH with attention paid to theconsidering the direct current superimposition characteristic. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 2/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ Block Diagram EN 3 VREG3 3V VREG 5V 1 BOOTREG BOOT SCP UVLO OSC VIN OVP TSD 2 OCP VIN S SLLMTM DRIVER 8 ERR SW VOUT LOGIC FB 5 SLOPE COMP PWM R 6 7 PGND SOFT START 4 AGND Figure 3. Block diagram www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 3/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ Description of Blocks VREG3 Block creating internal reference voltage 3V (typ.). VREG Block creating internal reference voltage 5V (typ.). BOOTREG Block creating gate drive voltage. TSD This is thermal shutdown block. Thermal shutdown circuit shuts down when inner part of IC becomes more than 175℃ (typ.). Also when the temperature degrease it returns with hysteresis of 25℃(typ.). UVLO This is under voltage lockout block. IC shuts down with VIN under 6.4V (typ.). Still the threshold voltage has hysteresis of 200mV (typ.). ERR Circuit to compares the feedback voltage of standard and output voltage. Switching duty is settled by this compared result and COMP terminal voltage. Also, because soft start occurs at activation, COMP terminal voltage is controlled by internal slope voltage. OSC Block generating oscillation frequency. SLOPE Creates delta wave from clock, generated by OSC, and sends voltage composed by current sense signal of high side MOSFET and delta wave to PWM comparator. PWM Settles switching duty by comparing output COMP terminal voltage of error amplifier and signal of SLOPE part. DRIVER LOGIC This is DC/DC driver block. Input signal from PWM and drives MOSFET. SOFT START By controlling current output voltage starts calmly preventing over shoot of output voltage and inrush current. OCP Current flowing in high side MOSFET is controlled one circle each of switching frequency when over current occurs. SCP The short circuit protection block compares the FB terminal voltage with the internal standard voltage VREF. When the FB terminal voltage has fallen below 0.56 V (typ.) and remained there for 0.9 msec (typ.), SCP stops the operation for 14.4 msec (typ.) and subsequently initiates a restart. OVP Over voltage protection function (OVP) compares FB terminal voltage with the internal standard voltage VREF. When the FB terminal voltage exceeds 1.04V (typ.) it turns MOSFET of output part MOSFET OFF. After output voltage drop it returns with hysteresis. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 4/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ Absolute Maximum Ratings (Ta = 25C) Parameter Symbol Rating Unit Supply Voltage VIN -0.3 to +30 V EN Input Voltage VEN -0.3 to +30 V VBOOT -0.3 to +35 V ⊿VBOOT -0.3 to +7 V VFB -0.3 to +7 V VCOMP -0.3 to +7 V SW Input Voltage VSW -0.5 to +30 V Output Current IOUT 1.0 A Pd 0.675*1 W Operating Ambient Temperature Range Topr -40 to +85 C Storage Temperature Range Tstg -55 to +150 C Voltage from GND to BOOT Voltage from SW to BOOT FB Input Voltage COMP Input Voltage Allowable Power Dissipation *1 When mounted on a 70 mm x 70 mm x 1.6 mm 1-layer glass epoxy board Derated by 5.4 mW/C for Ta 25C. Recommended Operating Ratings Parameter Rating Symbol Min Typ Max Unit Supply Voltage VIN 7.0 - 26 V Output Current IOUT - - 1.0 A VRANGE 1.0*2 - VIN × 0.7 V Output Voltage Range *2 Please use it in I/O voltage setting of which output pulse width does not become 250nsec (typ.) or less. See the page 22 for how to calculate the resistance of the output voltage setting. Electrical Characteristics (Ta = 25C, VIN = 12 V, VEN = 3 V unless otherwise specified) Parameter Symbol Limits Min Typ Max Unit Conditions Supply Current in Operating Iopr - 250 500 µA VFB = 0.9V Supply Current in Standby Istby - 0 10 µA VEN = 0V Reference Voltage VFB 0.784 0.800 0.816 V FB Input Current IFB -1 0 1 µA Switching frequency FOSC 484 570 656 kHz Maximum Duty ratio Maxduty 88 93 98 % High-side FET on-resistance RONH - 250 - mΩ ISW = 100mA Low-side FET on-resistance RONL - 200 - mΩ ISW = 100mA Over Current limit ILIMIT 1.9 2.2 2.5 A UVLO detection voltage VUVLO 6.1 6.4 6.7 V UVLO hysteresis voltage VUVLOHYS 100 200 300 mV EN high-level input voltage VENH 2.0 - VIN V EN low-level input voltage VENL - - 0.8 V EN Input current IEN 2 4 8 µA Soft Start time TSS 1.2 2.5 5.0 msec ● ● VFB = 0V VIN falling VEN = 3V VFB : FB Input Voltage. VEN : EN Input Voltage. Pd should not be exceeded. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 5/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ Typical Performance Curves 1.0 500 450 0.8 VIN =26V 350 Standby Current[µA] Operating Current[µA] 400 VIN=12V 300 250 200 0.6 VIN =26V VIN =12V 0.4 VIN =7V 150 0.2 VIN =7V 100 50 0.0 -40 -20 0 20 40 60 80 100 120 -40 -20 0 Temperature[℃] 40 60 80 100 120 Temperature[℃] Figure 4. Operating Current - Temperature Figure 5. Stand-by Current - Temperature 1.0 816 812 VIN =12V 0.8 VIN =26V 0.6 808 VIN =12V 804 VIN =7V 800 796 FB Input Current[µA] Voltage Reference[mV] 20 792 0.4 0.2 0.0 -0.2 -0.4 -0.6 788 -0.8 784 -1.0 -40 -20 0 20 40 60 80 100 120 -40 Temperature[℃] 0 20 40 60 80 100 120 Temperature[℃] Figure 6. FB Voltage Reference - Temperature www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 -20 Figure 7. FB Input Current - Temperature 6/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ 656 98 97 96 613 VIN =7V 95 VIN =12V Maximum Duty[%] Switching Frequency[kHz] VIN =7V 570 94 93 92 VIN =12V 91 527 VIN =26V 90 VIN =26V 89 484 88 -40 -20 0 20 40 60 80 100 120 -40 -20 0 20 Temperature[℃] 60 80 100 120 Temperature[℃] Figure 8. Switching Frequency - Temperature Figure 9. Maximum Duty - Temperature 400 450 VIN =12V VIN =12V 350 Low Side MOSFET On-Resistance[mΩ] 400 High Side MOSFET On-Resistance[mΩ] 40 350 300 250 200 150 100 50 -40 -20 0 20 40 60 80 250 200 150 100 50 0 -40 100 120 -20 0 20 40 60 80 100 120 Temperature[℃] Temperature[℃] Figure 10. High Side MOSFET On-ResistanceTemperature www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 300 Figure 11. Low Side MOSFET On-ResistanceTemperature 7/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ 2.5 6.9 VIN =12V 6.8 2.4 6.7 VIN Input Voltage[V] Current Limit[A] VOUT =3.3V 2.3 2.2 VOUT =5.0V 2.1 VIN Sweep up 6.6 6.5 6.4 6.3 2.0 VIN Sweep down VIN Sweep down 6.2 6.1 1.9 -40 -20 0 20 40 60 80 100 120 -40 -20 0 Temperature[℃] 20 40 60 80 100 120 Temperature[℃] Figure 12. Current Limit - Temperature Figure 13. UVLO Threshold - Temperature 300 2.0 275 EN Sweep up 1.8 VEN Input Voltage[V] UVLO Hysteresis[mV] 250 225 200 175 1.6 EN Sweep down 1.4 1.2 150 1.0 125 0.8 100 -40 -20 0 20 40 60 80 -40 100 120 0 20 40 60 80 100 120 Temperature[℃] Temperature[℃] Figure 14. UVLO Hysteresis- Temperature www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 -20 Figure 15. EN Threshold - Temperature 8/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ 8.0 5.0 EN=3V 7.0 6.0 Soft Start Time[ms] EN Input Current[µA] 4.0 5.0 4.0 VIN =12V VIN =7V 3.0 2.0 VIN =26V 3.0 1.0 2.0 -40 -20 0 20 40 60 80 -40 100 120 0 20 40 60 80 100 120 Temperature[℃] Temperature[℃] Figure 16. EN Input Current - Temperature www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 -20 Figure 17. Soft Start Time - Temperature 9/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ Typical Performance Curves (Application) 100 100 90 90 80 80 70 VIN =7V 60 Efficiency[%] Efficiency[%] 70 VIN =12V 50 VIN =18V 40 VIN =24V 30 VIN =7V 60 VIN =12V 50 VIN =18V 40 30 20 20 EN=3V VOUT =5.0V 10 EN=3V VOUT =3.3V 10 0 0 1 10 100 1000 1 10 100 1000 Output Current[mA] Output Current[mA] Figure 18. Efficiency - Output Current (VOUT = 5.0V) Figure 19. Efficiency - Output Current (VOUT = 3.3V) 100 90 80 Efficiency[%] 70 60 VIN =7V 50 VIN =12V 40 VIN =18V 30 20 EN=3V VOUT=1.8V 10 0 1 10 100 1000 Output Current[mA] Figure 20. Efficiency - Output Current (VOUT = 1.8V) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 10/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ VIN=7V/div VIN=7V/div EN=7V/div EN=7V/div VOUT=2V/div VOUT=2V/div Time=2ms/div Time=2ms/div SW=5V/div SW=5V/div Figure 21. Power Up (VIN = EN) Figure 22. Power Down (VIN = EN) VIN=7V/div VIN=7V/div EN=2V/div EN=2V/div VOUT=2V/div VOUT=2V/div Time=2ms/div Time=2ms/div SW=5V/div SW=5V/div Figure 23. Power Up (EN = 0V→5V) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 Figure 24. Power Down (EN = 5V→0V) 11/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ VOUT=20mV/div SW=5V/div VOUT=20mV/div Time=20ms/div SW=5V/div Figure 25. VOUT Ripple (VIN = 12V, VOUT = 5V, IOUT = 0A) Figure 26. VOUT Ripple (VIN = 12V, VOUT = 5V, IOUT = 1A) VIN=50mV/div SW=5V/div VIN=50mV/div SW=5V/div Time=20ms/div Figure 27. VIN Ripple (VIN = 12V, VOUT = 5V, IOUT = 0A) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 Time=1µs/div Time=1µs/div Figure 28. VIN Ripple (VIN = 12V, VOUT = 5V, IOUT = 1A) 12/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ IL=1A/div IL=1A/div SW=5V/div Time=1µs/div Time=1µs/div SW=5V/div Figure 29. Switching Waveform (VIN = 12V, VOUT = 5V, IOUT = 1A) Figure 30. Switching Waveform (VIN = 24V, VOUT = 5V, IOUT = 1A) IL=500mA/div Time=10µs/div SW=5V/div SLLMTM control Figure 31. Switching Waveform (VIN = 12V, VOUT = 5V, IOUT = 20mA) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 13/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet 2.0 2.0 1.5 1.5 1.0 1.0 Output Voltage Change[%] Output Voltage Change[%] BD9E102FJ 0.5 0.0 -0.5 -1.0 VOUT=5.0V IOUT=1A -1.5 0.5 0.0 -0.5 -1.0 VOUT=3.3V IOUT=1A -1.5 -2.0 -2.0 6 8 10 12 14 16 18 20 22 24 26 VIN Input Voltage[V] 6 8 10 12 14 16 18 20 22 24 26 VIN Input Voltage[V] Figure 33. VOUT Line Regulation (VOUT = 3.3V) Figure 32. VOUT Line Regulation (VOUT = 5.0V) 2.0 Output Voltage Change[%] 1.5 1.0 0.5 0.0 -0.5 -1.0 VOUT=1.8V IOUT=1A -1.5 -2.0 6 8 10 12 14 16 18 20 22 24 26 VIN Input Voltage[V] Figure 34. VOUT Line Regulation (VOUT = 1.8V) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 14/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet 2.0 2.0 1.5 1.5 1.0 1.0 Output Voltage Change[%] Output Voltage Change[%] BD9E102FJ 0.5 0.0 -0.5 -1.0 VIN=12V VOUT=5.0V -1.5 0.5 0.0 -0.5 -1.0 VIN=12V VOUT=3.3V -1.5 -2.0 -2.0 0 200 400 600 800 1000 Output Current[mA] 0 200 400 600 800 1000 Output Current[mA] Figure 36. VOUT Load Regulation (VOUT = 3.3V) Figure 35. VOUT Load Regulation (VOUT = 5.0V) 2.0 Output Voltage Change[%] 1.5 1.0 0.5 0.0 -0.5 -1.0 VIN=12V VOUT=1.8V -1.5 -2.0 0 200 400 600 800 1000 Output Current[mA] Figure 37. VOUT Load Regulation (VOUT = 1.8V) ) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 15/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ 180 VIN=12V VOUT=5V 90 40 20 45 20 45 0 0 0 0 phase -20 -45 gain Gain[dB] 60 40 Gain[dB] 180 VIN=12V VOUT=3.3V 135 Phase[deg] 60 80 135 90 phase -20 -45 gain -40 -90 -40 -90 -60 -135 -60 -135 -80 -180 -80 -180 1K 10K 100K 1K 1M 10K 100K 1M Frequency[Hz] Frequency[Hz] Figure 38. Loop Response IOUT=1A (VIN=12V, VOUT=5V, COUT=Ceramic10μF×3) Figure 39. Loop Response IOUT=1A (VIN=12V, VOUT=3.3V, COUT=Ceramic10μF×3) VOUT=100mV/div VOUT=100mV/div Time=1ms/div Time=1ms/div IOUT=400mA/div IOUT=400mA/div Figure 40. Load Transient Response IOUT=10mA - 1A (VIN=12V, VOUT=5V, COUT=Ceramic10μF×3) Figure 41. Load Transient Response IOUT=10mA - 1A (VIN=12V, VOUT=3.3V, COUT=Ceramic10μF×3) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 Phase[deg] 80 16/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ Function Description 1) DC/DC converter operation BD9E102FJ is a synchronous rectifying step-down switching regulator that achieves faster transient response by employing current mode PWM control system. It utilizes switching operation in PWM (Pulse Width Modulation) mode for heavier load, while it utilizes SLLM (Simple Light Load Mode) control for lighter load to improve efficiency. Efficiency η[%] ① SLLMTM control ② PWM control Output current IOUT[A] Figure 42. Efficiency (SLLMTM control and PWM control) ①SLLMTM control ②PWM control VOUT =50mV/div VOUT =50mV/div Time=5µs/div Time=5µs/div SW=5V/div SW=5V/div Figure 43. SW Waveform (①SLLMTM control) (VIN = 12V, VOUT = 5.0V, IOUT = 50mA) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 Figure 44. SW Waveform (②PWM control) (VIN = 12V, VOUT = 5.0V, IOUT = 1A) 17/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ 2) Enable Control The IC shutdown can be controlled by the voltage applied to the EN terminal. When EN voltage reaches 2.0 V (typ.), the internal circuit is activated and the IC starts up. To enable shutdown control with the EN terminal, set the shutdown interval (Low level interval of EN) must be set to 100 µs or longer. EN terminal Output setting voltage Figure 45. Timing Chart with Enable Control 3) Protective Functions The protective circuits are intended for prevention of damage caused by unexpected accidents. Do not use them for continuous protective operation. 3-1) Short Circuit Protection (SCP) The short circuit protection block compares the FB terminal voltage with the internal reference voltage VREF. When the FB terminal voltage has fallen below 0.56 V (typ.) and remained there for 0.9 msec (typ.), SCP stops the operation for 14.4 msec (typ.) and subsequently initiates a restart. Table 1. Short circuit protection function EN pin 2.0 V or higher FB pin < 0.56 V (typ.) > 0.56 V (typ.) 0.8 V or lower - Short circuit protection Enabled Disabled Short circuit protection operation ON OFF OFF Soft start 2.5msec (typ.) VOUT SCP detection time 0.9msec (typ.) SCP detection time 0.9msec (typ.) 0.8V FB terminal SCP threshold voltage： 0.56Ｖ(typ.) SCP detection released Upper MOSFET gate LOW Lower MOSFET gate LOW OCP Threshold Coil current IC internal SCP signal 14.4msec (typ.) SCP reset Figure 46. Short circuit protection function (SCP) timing chart www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 18/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ 3-2) Under Voltage Lockout Protection (UVLO) The under voltage lockout protection circuit monitors the VIN terminal voltage. The operation enters standby when the VIN terminal voltage is 6.4 V (typ.) or lower. The operation starts when the VIN terminal voltage is 6.6 V (typ.) or higher. VIN UVLO OFF UVLO ON 0V hys VOUT Soft start FB terminal High-side MOSFET gate Low-side MOSFET gate Normal operation UVLO Normal operation Figure 47. UVLO Timing Chart 3-3) Thermal Shutdown Function (TSD) When the chip temperature exceeds Tj = 175C, the DC/DC converter output is stopped. The thermal shutdown circuit is intended for shutting down the IC from thermal runaway in an abnormal state with the temperature exceeding Tjmax = 150C. It is not meant to protect or guarantee the soundness of the application. Do not use the function of this circuit for application protection design. 3-4) Over Current Protection Function (OCP) The overcurrent protection function is realized by using the current mode control to limit the current that flows through the high-side MOSFET at each cycle of the switching frequency. 3-5) Over Voltage Protection Function (OVP) Over voltage protection function (OVP) compares FB terminal voltage with internal standard voltage VREF and when FB terminal voltage exceeds1.04V (typ) it turns MOSFET of output part MOSFET OFF. After output voltage drop it returns with hysteresis. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 19/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ Application Example Figure 48. Application Circuit Table 2. Recommendation Circuit constants VIN VOUT CIN CBOOT L R1 R2 R3 C1 C2 COUT 12V 10μF 0.1μF 6.8μH 430kΩ 82kΩ 91kΩ 680pF 5V 10μF 0.1μF 6.8μH 430kΩ 82kΩ 82kΩ 13pF 360pF Ceramic 22μF×3 Ceramic 10μF×3 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 10μF 0.1μF 6.8μH 430kΩ 82kΩ 51kΩ 10pF 100pF Ceramic 10μF and Aluminum 100μF 20/29 10μF 0.1μF 6.8μH 470kΩ 150kΩ 68kΩ 1200pF Ceramic 22μF×3 3.3V 10μF 0.1μF 6.8μH 470kΩ 150kΩ 56kΩ 13pF 470pF Ceramic 10μF×3 10μF 0.1μF 6.8μH 470kΩ 150kΩ 43kΩ 10pF 160pF Ceramic 10μF and Aluminum 100μF TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ Selection of Components Externally Connected 1) Output LC Filter The DC/DC converter requires an LC filter for smoothing the output voltage in order to supply a continuous current to the load. BD9E102FJ is returned to the IC and IL ripple current flowing through the inductor for SLLMTM control. This feedback current, Inductance value is the behavior of the best when the 6.8µH. Therefore, the inductor to use is recommended 6.8µH. VIN IL Inductor saturation current > IOUTMAX +⊿IL /2 L VOUT Driver IOUTMAX ⊿IL COUT Average inductor current Figure 49. Waveform of current through inductor Figure 50. Output LC filter circuit Computation with VIN = 12V, VOUT = 5V, L=6.8µH, switching frequency FOSC= 570kHz, the method is as below. Inductor ripple current ⊿IL = VOUT (VIN - VOUT) 1 VIN FOSC L = 752 mA Also for saturation current of inductor, select the one with larger current than maximum output current added by 1/2 of inductor ripple current ∆IL. Output capacitor COUT affects output ripple voltage characteristics. Select output capacitor COUT so that necessary ripple voltage characteristics are satisfied. Output ripple voltage can be expressed in the following method. 1 ∆VRPL = ⊿IL ( RESR + )V 8 COUT FOSC RESR is the serial equivalent series resistance here. With COUT = 66µF, RESR = 10mΩ the output ripple voltage is calculated as ∆VRPL = 0.75 (10m + 1 / (8 66µ 570k)) = 10mV *Be careful of total capacitance value, when additional capacitor CLOAD is connected in addition to output capacitor COUT. Use maximum additional capacitor CLOAD(max.) condition which satisfies the following method. Maximum starting inductor ripple current ILSTART < Over Current limit 1.9A (min.) Maximum starting inductor ripple current ILSTART can be expressed in the following method. ILSTART = Maximum starting output current (IOMAX) + Charge current to output capacitor(ICAP) + ⊿IL 2 Charge current to output capacitor ICAP can be expressed in the following method. ICAP = ( COUT + CLOAD ) VOUT TSS A Computation with VIN = 12V, VOUT = 5V, L = 6.8µH, IOMAX = 1A (max.), switching frequency FOSC= 484kHz (min.), Output capacitor COUT = 66µF, Soft Start time TSS = 1.2ms (min.), the method is as below. ( 1.9 – IOMAX – ⊿IL / 2 ) × TSS CLOAD (max.) < – COUT = 43.6µF VOUT www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 21/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ 2) Output Voltage Set Point The output voltage value can be set by the feedback resistance ratio. VOUT VOUT = R1 FB R2 － R1 + R2 R2 0.8 V ERR ＋ ※ 0.8V Figure 51. Feedback resister circuit Minimum pulse range that output can output stably through all the load area is 250nsec for BD9E102FJ. Use input/output condition which satisfies the following method. VOUT 250 nsec ≤ 1.75 µsec VIN 3) Phase Compensation A current mode control buck DC/DC converter is a two-pole, one-zero system: two poles formed by an error amplifier and load and one zero point added by phase compensation. The phase compensation resistor RCMP determines the crossover frequency FCRS where the total loop gain of the DC/DC converter is 0 dB. Specifying a high value for this crossover frequency FCRS provides a good load transient response characteristic but inferior stability. Conversely, specifying a low value for the crossover frequency FCRS greatly stabilizes the characteristics but the load transient response characteristic is impaired. 3-1) Selection of Phase Compensation Resistor RCMP The phase compensation resistance RCMP can be determined by using the following equation. 2 x VOUT x FCRS x COUT RCMP = VFB x GMP x GMA VOUT: output voltage FCRS: crossover frequency COUT: output capacitanceor VFB: feedback reference voltage (0.8 V (typ.)) GMP: current sense gain (7 A/V (typ.)) GMA: error amplifier transconductance (82 µA/V (typ.)) 3-2) Selection of phase compensation capacitance CCMP For stable operation of the DC/DC converter, inserting a zero point at 1/6 of the zero crossover frequency that cancels the phase delay due to the pole formed by the load often provides favorable characteristics. The phase compensation capacitance CCMP can be determined by using the following equation. 1 2 x RCMP X FZ CCMP= F Fz: Zero point inserted 3-3) Loop stability To ensure the stability of the DC/DC converter, use the actual device to make sure that a sufficient phase margin is provided. Ensuring a phase margin of at least 45 degrees in the worst conditions is recommended. The feed forward capacitor CRUP is used for the purpose of forming a zero point together with the resistor RUP to increase the phase margin within the limited frequency range. Using a CRUP is effective when the RUP resistance is larger than the combined parallel resistance of RUP and RDW. VOUT A (a) Gain [dB] RUP CRUP FB GBW(b) 0 COMP Phase[deg] RDW 0.8V CCMP －90 RCMP －180 f FCR S 0 －90° PHASE MARGIN －180° f Figure 52. Phase compensation circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 Figure 53. Bode plot 22/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ PCB Layout Design In the buck DC/DC converter, a large pulsed current flows in two loops. The first loop is the one into which the current flows when the High Side FET is turned on. The flow starts from the input capacitor CIN, runs through the FET, inductor L and output capacitor COUT and back to ground of CIN via ground of COUT. The second loop is the one into which the current flows when the Low Side FET is turned on. The flow starts from the Low Side FET, runs through the inductor L and output capacitor COUT and back to ground of the Low Side FET via ground of COUT. Tracing these two loops as thick and short as possible allows noise to be reduced for improved efficiency. It is recommended to connect the input and output capacitors, in particular, to the ground plane. The PCB layout has a great influence on the DC/DC converter in terms of all of the heat generation, noise and efficiency characteristics. Figure 54. Current loop of buck converter Accordingly, design the PCB layout with particular attention paid to the following points. Provide the input capacitor as close to the IC VIN terminal as possible on the same plane as the IC. If there is any unused area on the PCB, provide a copper foil plane for the ground node to assist heat dissipation from the IC and the surrounding components. Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Trace to the coil as thick and as short as possible. Provide lines connected to FB and COMP as far away from the SW node. Provide the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input. COUT VOUT GND L CIN CBOOT SW R1 C2 VIN R2 R3 EN Top Layer Bottom Layer Figure 55. Example of sample board layout pattern www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 23/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ Power Dissipation When designing the PCB layout and peripheral circuitry, sufficient consideration must be given to ensure that the power dissipation is within the allowable dissipation curve. 0.8 Power dissipation: Pd [W] 0.675W 0.6 θj-a=185.2℃/W 1 layer board （back side copper foil area:70mm×70mm） 0.4 0.2 0 0 25 50 75 85 100 125 150 Temperature:Ta [℃] Figure 56. Power dissipation (SOP-J8) I/O Equivalence Circuit 1. BOOT 8. SW 3. EN BOOTREG BOOT VIN SW REG PGND 5. FB 6. COMP FB AGND Figure 57. I/O equivalence circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 24/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ Operational Notes 1) Absolute Maximum Ratings While abundant attention is paid to quality management of this IC, use of the IC in excess of absolute maximum ratings such as the applied voltage and operating temperature range may result in deterioration or damage. For design, ensure that it is always used within the guaranteed range. Use of the IC in excess of absolute maximum ratings such as the applied voltage and operating temperature range may result in damage. The state of the IC (short mode, open mode, etc.) cannot be identified if such damage occurs. Physical safety measures such as provision of a fuse should be taken when a special mode in which the absolute maximum ratings may be exceeded is anticipated. 2) GND Potential Ensure the minimum GND pin potential in all operating conditions. 3) Thermal Design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin Short and Faulty Mounting Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Avoid short-circuiting between VIN and VOUT/SW. Short-circuiting between these may result in damage to the IC and smoke generation. In a case that has been applied VIN = 20V or more, when there is a possibility the BOOT terminal and SW terminal is short-circuited, please insert a resistance of about 10 ohms between the bootstrap capacitor 0.1µF and BOOT terminal. Short-circuiting between these without inserting this resistance may result in damage to the IC and smoke generation. 5) Actions is Strong Magnetic Field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. 6) Testing on Application Boards When testing the IC on an application board, connecting a capacitor to a pin with a low impedance may subject the IC to stress. Always discharge capacitors after each process. Always turn the power supply off before connecting it to or removing it from a jig or fixture during the inspection process. As an antistatic measure, ground the IC during assembly steps and use similar caution when transporting or storage the IC. 7) PCB Layout Be sure to connect VIN to the power supply on the board. Be sure to connect PGND and AGND to the GND on the board. Ensure that the VIN wiring is thick and short for a sufficiently low impedance. Ensure that the PGND and AGND wiring is thick and short for a sufficiently low impedance. Take the output voltage of the DC/DC converter from the two ends of the output capacitor. The PCB layout and peripheral components may influence the performance of the DC/DC converter. Give sufficient consideration to the design of the peripheral circuitry. 8) IC Pin Input This IC is a monolithic IC and, between each element, it has P+ isolation for element separation and P substrate. With this P layer and the N layer of the respective elements, P-N junctions are formed to constitute a variety of parasitic elements. For example, when a resistor and transistor are connected to terminals as shown in the figure below, reversal of the terminal voltage and GND voltage activates the parasitic diode and transistor. Parasitic elements are inevitably generated by the potential relationship due to the IC structure. Activation of a parasitic element may cause interference in circuit operation, possibly leading to damage. Accordingly, use abundance of caution to avoid use that causes the parasitic elements to operate such as applying a voltage that is lower than the GND (P substrate) to an I/O terminal. Resistor Transistor (NPN) B ～ ～ E B ～ ～ C (Pin B) (Pin B) ～ ～ (Pin A) GND P+ P+ N N P N N N GND Parasitic elements P+ N (Pin A) P substrate Parasitic elements GND P Parasitic elements E ～ ～ N P P+ C Parasitic elements GND GND Figure 58. Example of simplified structure of monolithic IC www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 25/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ 9) Overcurrent protection Circuit The DC/DC converter output terminal integrates an overcurrent protection function, which is effective in protecting the IC from damage caused by unexpected GND short circuit. Avoid use on the premise of continuous operation of the protection circuit. 10) Thermal Shutdown Circuit If the chip temperature reaches Tj = 175°C (typ.), the thermal shutdown function is activated and the DC/DC converter stops switching. The thermal shutdown circuit is intended for shutting down the IC from thermal runaway and is not meant to protect or guarantee the soundness of the application. Accordingly, avoid use on the premise of continuous use or operation after the activation of this circuit. 11) Enable Function If the rate of fall of the EN terminal signal is too low, chattering may occur. Chattering with the output voltage remaining may generate a reverse current that boosts the voltage from the output to the input, possibly leading to damage. For on/off control with the EN signal, ensure that the signal falls within 100 µsec. 12) Load at Startup Ensure that the respective output has light load at startup of this IC. Restrain the power supply line noise at startup and voltage drop generated by operating current within the hysteresis width of UVLO. Input of any noise exceeding the hysteresis noise width may cause malfunction. 13) External Elements Use a ceramic capacitor with a low ESR for the bypass capacitor between VIN and PGND and provide it as close to the IC as possible. For external components such as inductors and capacitors, use theose recommended in this specification and provide as close to the IC as possible. For those through which large current flows, in particular, ensure that the wiring is thick and short. 14) IC Applications This IC is not developed for in-vehicle or military applications or equipment/devices that may affect human lives. Do not use the IC for such applications. If this IC is used by customers in any of such applications as described above, ROHM shall not be held responsible for failure to satisfy the requirements concerned. 15) Use Environment The operating temperature range is intended to guarantee functional operation and does not guarantee the life of the IC within this range. The life of the IC may be subject to derating depending on use environment such as the voltage applied, ambient temperature and humidity. Design equipment and devices in view of derating. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 26/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ Ordering Information B D 9 E 1 Part Number 0 2 F J Package FJ: SOP-J8 - E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram SOP-J8(TOP VIEW) Part Number Marking 9 E 1 0 2 LOT Number 1PIN MARK www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 27/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ ●Physical Dimension, Tape and Reel Information – continued Package Name SOP-J8 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 28/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet BD9E102FJ ●Revision History Date Revision 1. May. ’13 001 Description Created www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111•15•001 29/29 TSZ02201-0J3J0AJ00500-1-2 1.MAY.2013 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001