Datasheet Capacitive Controller ICs Capacitive Switch Controller IC BU21077MUV General Description Key Specifications BU21077MUV is a capacitive switch controller for switch operation. BU21077MUV has programmable MPU and it control the sensing sequence and how to use value of sensor. It is possible to reduce operational current with devising a sensing sequence. ■ ■ Input Voltage Range Operating Temperature Range 2.7 to 5.5V -20 to +85°C Package VQFN020V4040 4.00 ㎜×4.00 ㎜×1.00 ㎜ Features ■ ■ ■ ■ ■ Programmable MPU 8 Capacitive Sensor Ports 2-Wire Serial Bus Interface Single Power Supply Built-in Power-On-Reset and Oscillator Applications ■ ■ ■ ■ ■ Portable Device such as Smart Phone, PDA. Electronic Device with Multi Switches Information Appliance such as Projector AV Appliance such as Digital TV, HDD Recorder PC / PC Peripheral Equipment such as Laptop PC Typical Application Circuit Figure 1. Typical Application Circuit 〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays www.rohm.co.jp TSZ02201-0Y2Y0FZ00130-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 1/12 TSZ22111・14・001 29.Aug.2013 Rev.001 Datasheet BU21077MUV NC SIN4 SIN3 NC 15 SIN2 Pin Configurations 11 16 10 SIN1 SIN5 SIN0 SIN6 BU21077MUV TOP VIEW AVDD SIN7 DVDD TEST RSTB INT SCL SDA NC VSS 6 1 VDD 20 5 Figure 2. Pin Configurations Pin Descriptions Pin No. Pin Name 1 VDD Power Power - - I/O Equivalent Circuit - 2 VSS Ground Ground - - - I/O Functions Note Power Initial Condition 3 NC - - - - - 4 SCL In Host-I/F SCL pin VDD Hi-Z b 5 SDA InOut Host-I/F SDA pin VDD Hi-Z b 6 INT Out Interrupt output VDD Hi-Z b 7 TEST In Test input VDD Hi-Z c 8 SIN7 InOut Sensor 7 AVDD Hi-Z a 9 SIN6 InOut Sensor 6 AVDD Hi-Z a 10 SIN5 InOut Sensor 5 AVDD Hi-Z a 11 NC - - - - 12 SIN4 InOut Sensor 4 AVDD Hi-Z a 13 SIN3 InOut Sensor 3 AVDD Hi-Z a 14 SIN2 InOut Sensor 2 AVDD Hi-Z a 15 NC - 16 SIN1 InOut Fix ‘L’ at the normal operation - - - - Sensor 1 - AVDD Hi-Z a AVDD Hi-Z a - - - 17 SIN0 InOut Sensor 0 18 AVDD Power LDO output for analog blocks 19 DVDD Power LDO output for digital blocks 20 RSTB In Reset bar input Active ‘L’ - - - VDD Hi-Z c I/O Equivalent Circuits Figure 3. I/O Equivalent Circuit (a) www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 4. I/O Equivalent Circuit (b) 2/12 Figure 5. I/O Equivalent Circuit (c) TSZ02201-0Y2Y0FZ00130-1-2 29.Aug.2013 Rev.001 Datasheet BU21077MUV Block Diagram Figure 6. Block Diagram Description of Blocks ●Sensor AFE, C/V Converter Convert from capacitance to voltage for each sensor. ●A/D Converter Convert from analog value to digital value. ●LDO25 2.5V output LDO for Sensor AFE, C/V Converter, and A/D converter. ●LDO15 1.5V output LDO for OSC and Logic blocks. ●OSC Oscillator. ●POR Power-On-Reset for system reset. ●MPU Control sensor and sequence by program. ●PRAM 8kbyte Program RAM of MPU. It needs to download program from host. ●WRAM Working RAM for MPU. ●HOST I/F 2-wire serial bus interface compatible with I2C protocol. ●AFE Control Control sequencer for Sensor AFE, C/V Converter, and A/D Converter. ●WDTR Watchdog timer reset. It issues a reset when the MUP is hang-upped. www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/12 TSZ02201-0Y2Y0FZ00130-1-2 29.Aug.2013 Rev.001 Datasheet BU21077MUV Absolute Maximum Ratings (Ta = 25°C) Parameter Power Supply Voltage Symbol Rating Unit VDD -0.5 to +7.0 V Input Voltage VIN -0.5 to VDD + 0.3 V Operating Temperature Range Topr -20 to +85 °C Storage Temperature Range Tstg -55 to +125 °C Power Dissipation Pd 0.55 Maximum Junction Temperature T jmax (Note 1) W 125 °C (Note 1) Derate by 5.5mW/°C when operating above Ta=25°C (mounted in 1-layer 74.2×74.2×1.6mm board with 10.22mm2 surface capper area) Pd of IC is 0.27W and derate by 2.7mW/°C when operating above Ta=25°C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Condition (Ta = -20 to +85°C) Parameter Power Supply Voltage Symbol Rating Unit VDD 2.7 to 5.5 V Electrical Characteristics (Ta = 25°C, VDD = 3.3V, VSS = 0V) Symbol Min Typ Max Input High Voltage VIH Input Low Voltage VIL VDD x 0.7 - VDD + 0.3 V VSS - 0.3 - VDD x 0.3 V Output High Voltage Output Low Voltage VOH VDD - 0.5 - VDD V IOH = -4mA VOL VSS - VSS + 0.5 V IOL = +4mA OSC Frequency 1 fOSC1 45 50 55 MHz OSC Frequency 2 fOSC2 51.2 64 76.8 kHz DVDD Voltage VDVDD 1.35 1.50 1.65 V AVDD Voltage VAVDD 2.40 2.50 2.60 V Parameter www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/12 Unit Conditions TSZ02201-0Y2Y0FZ00130-1-2 29.Aug.2013 Rev.001 Datasheet BU21077MUV Host Interface BU21077MUV has 2-wire serial bus interface. It is compatible with I2C protocol and BU21077MUV is a slave device. Slave address of BU21077MUV is 5Ch (Shown 7-bit). And it supports Standard-mode (100 KHz) and Fast-mode (400 kHz). It has sequential read for reduce access time. SDA SCL SDA SCL 1-7 8 9 1-7 8 9 8 1-7 9 S P R/W START Address Address R/W ACK START ACK Data Data ACK ACK Data Data ACK NACK / ACK STOP STOP Figure 7. 2-wire Serial Bus Interface Data Format Figure 8. 2-wire Serial Bus Interface Timing Chart Parameter Symbol SCL Clock Frequency Standard-mode Min Max Fast-mode Min Max Unit fSCL 0 100 0 400 kHz tHD;STA 4.0 - 0.6 - μs Low Period of SCL tLOW 4.7 - 1.3 - μs High Period of SCL tHIGH 4.0 - 0.6 - μs Data Hold Time tHD;DAT 0.1 3.45 0.1 0.9 μs Data Setup Time tSU;DAT 0.25 - 0.1 - μs Setup Time for Repeated Start Condition tSU;STA 4.7 - 0.6 - μs Setup Time for STOP Condition tSU;STO 4.0 - 0.6 - μs tBUF 4.7 - 1.3 - μs Hold Time for ( Repeated ) START Condition Bus Free Time Between STOP and START Condition www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/12 TSZ02201-0Y2Y0FZ00130-1-2 29.Aug.2013 Rev.001 Datasheet BU21077MUV ●Byte Write S T A R T Slave Address =0x5C WA R C I K T E S S S S S S S A A A A A A A 6 5 4 3 2 1 0 Register Address (n) R R R R R R R R A A A A A A A A 7 6 5 4 3 2 1 0 A Write Data C to Register K (Register Address =n) A S C T K O P SA : Slave Address RA : Register Address RD : Read Data WD : Write Data W W W W W W W W D D D D D D D D 7 6 5 4 3 2 1 0 ●Random Read S T A R T Slave Address =0x5C WA R C I K T E S S S S S S S A A A A A A A 6 5 4 3 2 1 0 A S Slave Address C T =0x5C K A R T R R R R R R R R S S S S S S S A A A A A A A A A A A A A A A 7 6 5 4 3 2 1 0 6 5 4 3 2 1 0 R A Read Data E C from Register A K (Register Address D =n) A S Slave Address C T =0x5C K A R T R R R R R R R R S S S S S S S A A A A A A A A A A A A A A A 7 6 5 4 3 2 1 0 6 5 4 3 2 1 0 R A Read Data E C from Register A K (Register Address D =n) Register Address (n) N A C K S T O P R R R R R R R R D D D D D D D D 7 6 5 4 3 2 1 0 ●Sequential Read S T A R T Slave Address =0x5C S S S S S S S A A A A A A A 6 5 4 3 2 1 0 WA R C I K T E Register Address (n) R R R R R R R R D D D D D D D D 7 6 5 4 3 2 1 0 A C K A C K R D 7 R D 0 Read Data from Register (Register Address =n+x) N A C K S T O P R R R R R R R R D D D D D D D D 7 6 5 4 3 2 1 0 Figure 9. 2-wire Serial Bus Protocol www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/12 TSZ02201-0Y2Y0FZ00130-1-2 29.Aug.2013 Rev.001 Datasheet BU21077MUV Power on Sequence The power supply pin is only VDD. AVDD and DVDD are generated by built-in LDO, these are not necessary to supply from external. When the voltage level of RSTB change form low to High after VDD supplying, LDO is wakeup and DVDD voltage is raised. And built-in power on reset (POR) circuit release the system reset and host interface is enable After DVDD voltage reach the normal voltage range. RSTB pin can not need to be controlled by host and connects to the VDD, because the BU21077MUV has POR circuit. If the RSTB pin is connected to the VDD, the system reset is release automatically after VDD supplying. VDD Recommended Value of External Capacitors C1 0.1uF Decoupling capacitor for VDD C2 1.0uF Decoupling capacitor for DVDD C3 2.2uF Decoupling capacitor for AVDD VDD AVDD DVDD C1 C3 BU21077MUV C2 VSS GND Figure 10. Arrangement of External Capacitors Figure 11. Power on Sequence (Controlled RSTB） www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 12. Power on Sequence (VDD Shorted RSTB） 7/12 TSZ02201-0Y2Y0FZ00130-1-2 29.Aug.2013 Rev.001 Datasheet BU21077MUV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when 2 the IC is mounted on a 74.2mm x 74.2mm x 1.6mm glass epoxy board with 10.22mm copper areas. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/12 TSZ02201-0Y2Y0FZ00130-1-2 29.Aug.2013 Rev.001 Datasheet BU21077MUV Operational Notes – continued 11. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input terminals have voltages within the values specified in the electrical characteristics of this IC. 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/12 TSZ02201-0Y2Y0FZ00130-1-2 29.Aug.2013 Rev.001 Datasheet BU21077MUV Ordering Information B U 2 1 0 7 7 M U V - Package MUV: VQFN020V4040 Part Number E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram VQFN020V4040 (TOP VIEW) Part Number Marking BU LOT Number 2 1 0 7 7 1PIN MARK www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/12 TSZ02201-0Y2Y0FZ00130-1-2 29.Aug.2013 Rev.001 Datasheet BU21077MUV Physical Dimension, Tape and Reel Information Package Name VQFN020V4040 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 11/12 TSZ02201-0Y2Y0FZ00130-1-2 29.Aug.2013 Rev.001 Datasheet BU21077MUV Revision History Date Revision 29.Aug.2013 001 Changes New Release www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/12 TSZ02201-0Y2Y0FZ00130-1-2 29.Aug.2013 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. 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The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. 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ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001