This product complies with the RoHS Directive (EU 2002/95/EC). LNJ8L4C18RAA Surface Mounting Chip LED 3528 (PLCC4) Type Absolute Maximum Ratings Ta = 25°C Parameter Symbol Rating Unit Power dissipation PD 190 mW Forward current Lighting Color Red IF 70 mA Pulse forward current * IFP 100 mA Reverse voltage VR 5 V Junction temperature Tj 125 °C Thermal resistance Rth 130 °C/W Operating ambient temperature Topr –40 to +105 °C Storage temperature Tstg –40 to +125 °C Note) *: The condition of IFP is duty 10%, Pulse width 1 msec. Electro-Optical Characteristics Ta = 25°C±3°C Parameter Symbol Luminous intensity *1 Conditions Min Typ Max Unit 900 1 130 1 450 mcd IO IF = 50 mA Reverse current IR VR = 5 V 10 µA Forward voltage *2 VF IF = 50 mA 2.05 2.30 2.65 V Luminous flux *1 F IF = 50 mA (3.36) (4.20) (5.40) Peak emission wavelength λP IF = 50 mA Dominant emission wavelength *3 λd IF = 50 mA Spectral half band width Δλ IF = 50 mA lm 623 612 nm 617 624 nm 20 nm Note) *1: Measurement tolerance: ±11% *2: Measurement tolerance: ±0.15 V *3: Measurement tolerance: ±2 nm IO IF 102 10 1 10 103 Relative luminous intensity (%) 103 Relative luminous intensity Ta IF V F 102 Forward current IF (mA) Luminous intensity IO (mcd) 104 10 1 1.0 102 1.5 Forward current IF (mA) 2.0 2.5 3.0 10 −40 4.0 Forward voltage VF (V) −20 0 20 40 60 80 100 Ambient temperature Ta (°C) Relative luminous intensity λP IF Ta 80 100 Directive characteristics 80 30° 60 20° 10° 40° 0 60° 600 650 700 Peak emission wavelength λP (nm) Publication date: August 2011 90° 100 40° 50° 60° 40° 70° 20° 80° 550 30° 60° 70° 20 10° 20° 80° 50° 40 0° 80 60 40 20 0 Forward current IF (mA) Relative luminous intensity (%) 102 60 40 20 80° 20 40 60 Relative luminous intensity (%) Ver. AEK 80 90° 100 0 0 20 40 60 80 100 120 Ambient temperature Ta (°C) 1 This product complies with the RoHS Directive (EU 2002/95/EC). LNJ8L4C18RAA Package (Unit: mm) LLDFTR4JL400 Pin name 1: Cathode 2: Anode 3: N.C. 4: Anode 2 Ver. AEK Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. 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