221A-09

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AH
DATE 28 AUG 2014
−T−
B
SEATING
PLANE
C
F
T
SCALE 1:1
S
4
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
A
Q
1 2 3
U
H
K
Z
L
R
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
J
G
D
INCHES
MIN
MAX
0.570
0.620
0.380
0.415
0.160
0.190
0.025
0.038
0.142
0.161
0.095
0.105
0.110
0.161
0.014
0.024
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
0.045
----0.080
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.53
4.07
4.83
0.64
0.96
3.61
4.09
2.42
2.66
2.80
4.10
0.36
0.61
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
1.15
1.39
5.97
6.47
0.00
1.27
1.15
----2.04
N
STYLE 1:
PIN 1.
2.
3.
4.
BASE
COLLECTOR
EMITTER
COLLECTOR
STYLE 2:
PIN 1.
2.
3.
4.
BASE
EMITTER
COLLECTOR
EMITTER
STYLE 3:
PIN 1.
2.
3.
4.
CATHODE
ANODE
GATE
ANODE
STYLE 4:
PIN 1.
2.
3.
4.
MAIN TERMINAL 1
MAIN TERMINAL 2
GATE
MAIN TERMINAL 2
STYLE 5:
PIN 1.
2.
3.
4.
GATE
DRAIN
SOURCE
DRAIN
STYLE 6:
PIN 1.
2.
3.
4.
ANODE
CATHODE
ANODE
CATHODE
STYLE 7:
PIN 1.
2.
3.
4.
CATHODE
ANODE
CATHODE
ANODE
STYLE 8:
PIN 1.
2.
3.
4.
CATHODE
ANODE
EXTERNAL TRIP/DELAY
ANODE
STYLE 9:
PIN 1.
2.
3.
4.
GATE
COLLECTOR
EMITTER
COLLECTOR
STYLE 10:
PIN 1.
2.
3.
4.
GATE
SOURCE
DRAIN
SOURCE
STYLE 11:
PIN 1.
2.
3.
4.
DRAIN
SOURCE
GATE
SOURCE
STYLE 12:
PIN 1.
2.
3.
4.
MAIN TERMINAL 1
MAIN TERMINAL 2
GATE
NOT CONNECTED
DOCUMENT NUMBER:
STATUS:
98ASB42148B
ON SEMICONDUCTOR STANDARD
1
© Semiconductor Components Industries, LLC, 2000
February, 2000 − Rev. 09AA
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
TO−220
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled exceptCase
when
stamped
Outline
Number:
221A−09
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98ASB42148B
PAGE 2 OF 2
ISSUE
REVISION
DATE
AB
CHANGED MINIMUM DIMENSION FOR S FROM 0.045 (1.15) TO 0.020 (0.508).
REQ. BY W. LOW.
04 MAY 2006
AC
INTERNAL REVISION IN DDCM
30 MAY 2006
AD
REVERSED CHANGES FROM REVISION AB. RETURNED DIMENSION S TO DUAL GAUGE VALUES. REQ. BY M. SCHAGER.
17 JUL 2006
AE
CHANGED MAXIMUM DIMENSION F FROM 0.147 INCH (3.73MM) TO 0.16 1INCH
(4.09MM) AND MINIMUM DIMENSION FOR J FROM 0.018 INCH (0.46MM) TO
0.014 INCH (0.36MM). REQ. BY M. SCHAGER.
13 APR 2007
AF
ADDED STYLE 12. REQ. BY A. ANGUS.
26 NOV 2007
AG
CHANGED DIMENSIONS D AND H MAX LIMITS TO 0.036 (0.91) AND 0.161 (4.10)
RESPECTIVELY. REQ. BY J. RAMIREZ.
16 SEP 2011
AH
MODIFIED MAXIMUM VALUES OF DIMENSIONS B TO 0.415 (10.53), C TO 0.190
(4.83), D TO 0.038 (0.96), & J TO 0.024 (0.61) TO MATCH SUB−CONTRACTORS
SPECS. REQ. BY J. MORRIS.
28 AUG 2014
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. AH
Case Outline Number:
221A−09