MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS I2PAK (TO-262) CASE 418D-01 ISSUE D DATE 16 OCT 2007 C E V -B- SCALE 1:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4 A W 1 2 DIM A B C D E F G H J K S V W 3 F -TSEATING PLANE K S MILLIMETERS MIN MAX 8.51 9.65 9.65 10.31 4.06 4.70 0.66 0.89 1.14 1.40 3.10 REF 2.54 BSC 2.39 2.79 0.33 0.64 12.70 14.27 9.90 REF 1.14 1.78 13.25 14.00 J G D 3 PL 0.13 (0.005) M T B STYLE 1: PIN 1. 2. 3. 4. DOCUMENT NUMBER: INCHES MIN MAX 0.335 0.380 0.380 0.406 0.160 0.185 0.026 0.035 0.045 0.055 0.122 REF 0.100 BSC 0.094 0.110 0.013 0.025 0.500 0.562 0.390 REF 0.045 0.070 0.522 0.551 BASE COLLECTOR EMITTER COLLECTOR 98ASB16716C H M STYLE 2: PIN 1. 2. 3. 4. GATE DRAIN SOURCE DRAIN STYLE 3: PIN 1. 2. 3. 4. ANODE CATHODE ANODE CATHODE STYLE 4: PIN 1. 2. 3. 4. GATE COLLECTOR EMITTER COLLECTOR Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com October, DESCRIPTION: 2002 - Rev. 0 PAGE 1 OFXXX 2 I2PAK (TO-262) 1 DOCUMENT NUMBER: 98ASB16716C PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY E. POPE. 05 MAY 1997 A REVISION TO CHANGE LEGAL OWNERSHIP OF DOCUMENT FROM MOTOROLA TO ON SEMICONDUCTOR. REQ. BY C. PAYNE. 02 JAN 2000 B CHANGED DIMENSIONS A, B, D, J AND V. REQ. BY M. SCHAGER. 08 NOV 2005 C CORRECTED DIMENSION D MAX FROM 0.88 TO 0.89. (0.035 INCH = 0.89 MM) REQ. BY M. SCHAGER. 19 MAR 2007 D CORRECTED LEAD LENGTH OF SIDE VIEW. REQ. BY M. SCHAGER. 16 OCT 2007 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2007 October, 2007 - Rev. 01D Case Outline Number: 418D