TSOP62.., TSOP64.. Datasheet

TSOP62.., TSOP64..
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Vishay Semiconductors
IR Receiver Modules for Remote Control Systems
FEATURES
• Improved immunity against HF and RF noise
• Low supply current
• Photo detector and preamplifier in one package
• Internal filter for PCM frequency
1
2
3
• Supply voltage: 2.5 V to 5.5 V
4
• Improved immunity against optical noise
• Insensitive to supply voltage ripple and noise
16797
• Taping available for top view and side view
assembly
MECHANICAL DATA
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Pinning
1 = GND, 2 = N.C., 3 = VS, 4 = OUT
DESCRIPTION
ORDERING CODE
The TSOP6... series are miniaturized SMD IR receiver
modules for infrared remote control systems. A PIN diode
and a preamplifier are assembled on a leadframe, the epoxy
package contains an IR filter.
Taping:
TSOP6...TT - top view taped
TSOP6...TR - side view taped
The demodulated output signal can be directly connected to
a microprocessor for decoding.
The TSOP64.. series devices are optimized to suppress
almost all spurious pulses from Wi-Fi and CFL sources.
They may suppress some data signals if continuously
transmitted.
The TSOP62.. series devices are provided primarily for
compatibility with old AGC2 designs. New designs should
prefer the TSOP64.. series containing the newer AGC4.
These components have not been qualified according to
automotive specifications.
PARTS TABLE
LEGACY, FOR
LONG BURST REMOTE CONTROLS (AGC2)
RECOMMENDED FOR
LONG BURST CODES (AGC4)
30 kHz
TSOP6230
TSOP6430
33 kHz
TSOP6233
TSOP6433
36 kHz
TSOP6236
TSOP6436 (1)(2)(3)
38 kHz
TSOP6238
TSOP6438 (4)(5)
40 kHz
TSOP6240
TSOP6440
56 kHz
TSOP6256
TSOP6456 (6)(7)
AGC
Carrier
frequency
Package
Panhead
Pinning
1 = GND, 2 = N.C., 3 = VS, 4 = OUT
Dimensions (mm)
7.5 W x 5.3 H x 4.0 D
Mounting
SMD
Application
Best remote control code
Rev. 1.3, 10-Nov-15
Remote control
(1)
RC-5
(2)
RC-6
(3)
Panasonic
1
(4)
NEC
(5)
Sharp
(6)
r-step
(7)
Thomson RCA
Document Number: 82463
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BLOCK DIAGRAM
APPLICATION CIRCUIT
17170-10
3
33 kΩ
Transmitter
with
TSALxxxx
VS
Input
Demo dulator
Band
pass
AGC
VS
OUT
+ VS
C1
Circuit
4
R1
IR receiver
µC
OUT
VO
GND
GND
1
PIN
GND
Control circuit
The external components R1 and C1 are optional
to improve the robustness against electrical overstress
(typical values are R1 = 100 Ω, C1 = 0.1 µF).
16839-1
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
VALUE
Supply voltage
TEST CONDITION
VS
-0.3 to +6
V
Supply current
IS
5
mA
Output voltage
VO
-0.3 to (VS + 0.3)
V
Output current
IO
5
mA
Junction temperature
Tj
100
°C
Tstg
-25 to +85
°C
Tamb
-25 to +85
°C
Ptot
10
mW
Storage temperature range
Operating temperature range
Power consumption
Tamb ≤ 85 °C
UNIT
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
VS
2.5
-
5.5
V
VS = 5 V, Ev = 0
ISD
0.55
0.7
0.9
mA
Ev = 40 klx, sunlight
ISH
-
0.8
-
mA
Ev = 0,
IR diode TSAL6200,
IF = 250 mA,
test signal see fig. 1
d
-
40
-
m
Output voltage low
IOSL = 0.5 mA, Ee = 0.7 mW/m2,
test signal see fig. 1
VOSL
-
-
100
mV
Minimum irradiance
Pulse width tolerance:
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see fig. 1
Ee min.
-
0.2
0.4
mW/m2
Maximum irradiance
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see fig. 1
Ee max.
50
-
-
W/m2
Directivity
Angle of half transmission
distance
ϕ1/2
-
± 50
-
deg
Supply voltage
Supply current
Transmission distance
Rev. 1.3, 10-Nov-15
2
UNIT
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TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
ton, toff - Output Pulse Width (ms)
Optical Test Signal
Ee
(IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, t = 10 ms)
t
tpi *
T
10/f0 is recommended for optimal function
* tpi
Output Signal
VO
1)
VOH
2)
16110
7/f0 < td < 15/f0
tpi - 5/f0 < tpo < tpi + 6/f0
0.8
ton
0.7
0.6
0.5
toff
0.4
0.3
0.2
λ = 950 nm,
optical test signal, fig. 1
0.1
0
0.1
VOL
td 1)
tpo 2)
Fig. 1 - Output Active Low
Ee min./Ee - Relative Responsivity
tpo - Output Pulse Width (ms)
0.8
Input burst length
0.7
0.6
0.5
0.4
0.3
0.2
λ = 950 nm,
optical test signal, fig.1
0.1
10
102
103
104
10 000
1.0
0.8
0.6
0.4
f = f0 ± 5 %
Δf(3 dB) = f0/10
0.2
0.7
t
600 µs
t = 60 ms
94 8134
Output Signal, (see fig. 4)
VOH
VOL
t on
t off
1.1
1.3
Fig. 5 - Frequency Dependence of Responsivity
Ee min. - Threshold Irradiance (mW/m2)
600 µs
0.9
f/f0 - Relative Frequency
16925
Optical Test Signal
t
5.0
4.5
4.0
Correlation with ambient light sources:
10 W/m2 = 1.4 klx (std. illum. A, T = 2855 K)
10 W/m2 = 8.2 klx (daylight, T = 5900 K)
3.5
3.0
Wavelength of ambient
illumination: λ = 950 nm
2.5
2.0
1.5
1.0
0.5
0
0.01
0.1
1
10
100
Ee - Ambient DC Irradiance (W/m2)
Fig. 3 - Output Function
Rev. 1.3, 10-Nov-15
1000
0.0
1
Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
VO
100
1.2
Output pulse width
0.9
Ee - Irradiance (mW/m2)
Ee
10
Fig. 4 - Output Pulse Diagram
1.0
0
0.1
1
Ee - Irradiance (mW/m2)
t
Fig. 6 - Sensitivity in Bright Ambient
3
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1.0
S (λ) rel - Relative Spectral Sensitivity
Ee min. - Threshold Irradiance (mW/m2)
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f = f0
0.9
0.8
0.7
f = 30 kHz
0.6
0.5
f = 20 kHz
0.4
f = 10 kHz
0.3
0.2
0.1
f = 100 Hz
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
10
100
0
750
1000
ΔVsRMS - AC Voltage on DC Supply Voltage (mV)
800
850
950 1000 1050 1100 1150
λ- Wavelength (nm)
21425
Fig. 7 - Sensitivity vs. Supply Voltage Disturbances
900
Fig. 10 - Relative Spectral Sensitivity vs. Wavelength
0°
0.8
10°
20°
30°
Max. Envelope Duty Cycle
0.7
0.6
40°
0.5
1.0
TSOP62..
0.4
0.3
0.9
50°
0.8
60°
0.2
70°
TSOP64..
0.7
0.1
0
80°
f = 38 kHz, Ee = 2 mW/m²
0
20
40
60
80
100
120
0.6
Burst Length (Number of Cycles/Burst)
0.40
0.8
0.35
0.7
0.30
0.25
0.20
0.15
0.10
0.05
-10
10
30
50
70
0
0.2
0.6
0.4
0.6
0.5
0.4
0.3
0.2
0.1
0
1.5
90
Tamb - Ambient Temperature (°C)
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VS - Supply Voltage (V)
Fig. 9 - Sensitivity vs. Ambient Temperature
Rev. 1.3, 10-Nov-15
0.2
Fig. 11 - Horizontal Directivity
Ee min. - Sensitivity (mW/m2)
Ee min. - Sensitivity (mW/m2)
Fig. 8 - Max. Envelope Duty Cycle vs. Burst Length
0
-30
0.4
d rel - Relative Transmission Distance
16801
Fig. 12 - Sensitivity vs. Supply Voltage
4
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SUITABLE DATA FORMAT
IR Signal
This series is designed to suppress spurious output pulses
due to noise or disturbance signals. The devices can
distinguish data signals from noise due to differences in
frequency, burst length, and envelope duty cycle. The data
signal should be close to the device’s band-pass center
frequency (e.g. 38 kHz) and fulfill the conditions in the table
below.
When a data signal is applied to the product in the presence
of a disturbance, the sensitivity of the receiver is
automatically reduced by the AGC to insure that no spurious
pulses are present at the receiver’s output.
0
Some examples which are suppressed are:
5
• DC light (e.g. from tungsten bulbs sunlight)
10
15
20
Time (ms)
16920
Fig. 13 - IR Disturbance from Fluorescent Lamp
with Low Modulation
• Continuous signals at any frequency
• Strongly or weakly modulated noise from fluorescent
lamps with electronic ballasts (see fig. 13 or fig. 14)
IR Signal
• 2.4 GHz and 5 GHz Wi-Fi
0
16921
5
10
15
20
Time (ms)
Fig. 14 - IR Disturbance from Fluorescent Lamp
with High Modulation
TSOP62..
TSOP64..
Minimum burst length
10 cycles/burst
10 cycles/burst
After each burst of length
a minimum gap time is required of
10 to 70 cycles
≥ 12 cycles
10 to 35 cycles
≥ 12 cycles
For bursts greater than
a minimum gap time in the data stream is needed of
70 cycles
> 4 x burst length
35 cycles
> 10 x burst length
Maximum number of continuous short bursts/second
800
1300
NEC code
Yes
Preferred
RC5/RC6 code
Yes
Preferred
Thomson 56 kHz code
Yes
Preferred
Sharp code
Yes
Preferred
Mild disturbance patterns
are suppressed (example:
signal pattern of fig. 13)
Complex and critical disturbance patterns
are suppressed (example: signal pattern
of fig. 14 or highly dimmed LCDs)
Suppression of interference from fluorescent lamps
Note
• For data formats with short bursts please see the datasheet of TSOP61.., TSOP63.., TSOP65..
Rev. 1.3, 10-Nov-15
5
Document Number: 82463
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PACKAGE DIMENSIONS in millimeters
7.5
Pick and place area. TT taping
7.2
(1.5)
2.8
2.2
5.3
A
1
4
0.5 ± 0.15
0.1
(1.4)
0.3 4x
0.1
1.27
2.9
3 x 1.27 =
3.81
4
0.4 A
5.51
Not indicated tolerances ± 0.3
Pick and place area. TR taping
technical drawings
according to DIN
specifications
2.6
Footprint
2.35
3 x 1.27 = 3.81
0.9
2.2
1.27
R 1.7
Drawing-No.: 6.544-5341.01-4
Issue: 8; 02.09.09
16776
ASSEMBLY INSTRUCTIONS
Reflow Soldering
Manual Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handle products only after the temperature has cooled off
• Finish soldering within 3 s
• Handling after reflow should be done only after the work
surface has been cooled off
Rev. 1.3, 10-Nov-15
6
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VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
300
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
T (°C)
200
max. 20 s
150
max. 100 s
max. 120 s
100
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
50
0
0
19800
50
100
150
t (s)
200
250
300
max. 2 cycles allowed
TAPING VERSION TSOP..TT DIMENSIONS in millimeters
16584
Rev. 1.3, 10-Nov-15
7
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TAPING VERSION TSOP..TR DIMENSIONS in millimeters
16585
Rev. 1.3, 10-Nov-15
8
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REEL DIMENSIONS in millimeters
16734
LEADER AND TRAILER DIMENSIONS in millimeters
Trailer
no devices
Leader
devices
no devices
End
Start
min. 200
min. 400
96 11818
COVER TAPE PEEL STRENGTH
LABEL
According to DIN EN 60286-3
Standard bar code labels for finished goods
0.1 N to 1.3 N
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
300 mm/min. ± 10 mm/min.
165° to 180° peel angle
Rev. 1.3, 10-Nov-15
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VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING
ABBREVIATION
LENGTH
Item-description
-
18
Item-number
INO
8
Selection-code
SEL
3
LOT-/serial-number
BATCH
10
COD
3 (YWW)
Plant-code
PTC
2
Quantity
QTY
8
Accepted by
ACC
-
Packed by
PCK
-
Data-code
Mixed code indicator
Origin
LONG BAR CODE TOP
MIXED CODE
-
xxxxxxx+
Company logo
TYPE
LENGTH
Item-number
N
8
Plant-code
N
2
Sequence-number
X
3
Quantity
N
8
Total length
-
21
SHORT BAR CODE BOTTOM
TYPE
LENGTH
Selection-code
X
3
Data-code
N
3
Batch-number
X
10
Filter
-
1
Total length
-
17
DRY PACKING
After more than 72 h under these conditions moisture
content will be too high for reflow soldering.
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
Aluminum bag
Label
An EIA JEDEC® standard J-STD-020 level 4 label is included
on all dry bags.
Reel
LEVEL
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
15973
4
FINAL PACKING
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
RECOMMENDED METHOD OF STORAGE
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
Bag Seal Date:
(If blank, see barcode label)
Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020
22522
• Storage temperature 10 °C to 30 °C
EIA JEDEC standard J-STD-020 level 4 label is included
on all dry bags
• Storage humidity ≤ 60 % RH max.
Rev. 1.3, 10-Nov-15
10
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ESD PRECAUTION
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
22645
Rev. 1.3, 10-Nov-15
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Tape and Reel Standards for SMD IR Receiver Modules
Vishay Semiconductor SMD IR receivers are packaged
on tape and reel. The following specification is based on
IEC publication 286, which takes the industrial requirements
for automatic insertion into account.
NUMBER OF COMPONENTS
A. Panhead SMD: quantity per reel:
TT, SMD top view package, 1190 pcs
TR, SMD side view package, 1120 pcs
Absolute maximum ratings, mechanical dimensions, optical
and electrical characteristics for taped devices are identical
to the basic catalog types and can be found in the
specifications for untaped devices.
B. Heimdall: quantity per reel:
TT, Heimdall top view package, 2200 pcs
TR, Heimdall side view package, 2300 pcs
C. Heimdall without lens: quantity per reel:
PACKAGING
WTT, top view package, 2200 pcs
The tapes of components are available on reels. Each reel is
marked with labels which contain the following information:
WTR, side view package, 2300 pcs
D. Belobog: quantity per reel:
- Vishay
- Type
TT1, 1800 pcs
- Group
TT2, 7000 pcs
- Tape code, normally part of type name
TR, not available in side view
- Production code
E. Belobog with shield: quantity per reel:
- Quantity
TT1, 1500 pcs
TT2, 5000 pcs
MISSING COMPONENTS
Up to 3 consecutive components may be missing if the gap
is followed by at least 6 components. A maximum of 0.5 %
of the components per reel quantity may be missing. At least
5 empty positions are present at the start and the end of the
tape to enable tape insertion.
ORDER DESIGNATION
The type designation of the device is extended by
TT or TT1 for top view or TR for side view.
Example:
TSOP6238TR (reel packing)
Tensile strength of the tape: > 15 N
TSOP75238TR (reel packing)
TSOP75338WTT (reel packing)
TSOP57438TT1 (reel packing)
TSOP57238HTT1 (reel packing)
Rev. 2.1, 13-Oct-15
1
Document Number: 80125
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REEL DIMENSIONS FOR PANHEAD SMD AND HEIMDALL in millimeters
16734
Note
• The body structure of the reel can vary
Rev. 2.1, 13-Oct-15
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TAPING VERSION TSOP..TT (TOP VIEW) DIMENSIONS in millimeters
A. Panhead SMD (TSOP36...TT, TSSP....TT, TSOP6...TT)
16584
Rev. 2.1, 13-Oct-15
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TAPING VERSION TSOP..TT (TOP VIEW) DIMENSIONS in millimeters
3.65
0.3
B. Heimdall SMD (TSOP75...TT, TSOP77...TT, TSSP77...TT)
16
1.75
7.5
Ø 1.5
4
8
Direction of feed
2
Ø 1.5
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5338.01-4
Issue: 4; 12.06.13
Rev. 2.1, 13-Oct-15
4
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TAPING VERSION TSOP..TT (TOP VIEW) DIMENSIONS in millimeters
3
0.3
C. Heimdall SMD without lens (TSOP75...WTT, TSOP77...WTT, TSSP77...WTT)
16
1.75
7.5
Ø 1.5
4
Direction of feed
8
2
Ø 1.5 min.
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5341.01-4
Issue: 3; 06.10.15
Rev. 2.1, 13-Oct-15
5
Document Number: 80125
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SMD Tape and Reel
www.vishay.com
Vishay Semiconductors
TAPING VERSION TSOP..TT1, TSOP..TT2 (TOP VIEW) DIMENSIONS in millimeters
D. Belobog (TSOP37...TT1, TSOP37...TT2, TSOP57...TT1, TSOP57...TT2)
Tape and reel dimensions:
Unreel direction
TT1 Ø 180 ± 2 = 1800 pcs.
TT2 Ø 330 ± 2 = 7000 pcs.
Tape position
coming out from reel
2±
Ø 60 min.
Reel size "Y"
ØY
0.5
Ø 21 ± 0.8
Ø 13 ± 0.2
Label posted here
(12.4)
18.4 max.
Empty leader 400 mm min.
Parts mounted
100 mm min. with cover tape
Leader and trailer tape:
Empty trailer 200 mm min.
Direction of pulling out
Technical drawings
according to DIN
specifications
(Ø 1.5)
(2)
(5.5)
(0.3)
(4)
Drawing-No.: 9.700-5347.01-4
Issue: 1; 14.11.11
Rev. 2.1, 13-Oct-15
12 ± 0.3
(8)
(1.2)
(1.75)
X 2:1
Not indicated tolerances ± 0.1
6
Document Number: 80125
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SMD Tape and Reel
www.vishay.com
Vishay Semiconductors
TAPING VERSION TSOP..TT1, TSOP..TT2 (TOP VIEW) DIMENSIONS in millimeters
E. Belobog with shield (TSOP37...HTT1, TSOP37...HTT2, TSOP57...HTT1, TSOP57...HTT2)
Tape and Reel dimensions:
Reel size "Y"
X
Unreel direction
2±
Ø 60 min.
GS 08 Ø 180 ± 2 = 1500 pcs.
GS 18 Ø 330 ± 2 = 5000 pcs.
Tape position
coming out from reel
ØY
0.5
Not indicated tolerances ± 0.1
Ø 21 ± 0.8
Ø 13 ± 0.2
Label posted here
(12.4)
18.4 max.
Parts mounted
Empty leader 400 mm min.
100 mm min. with cover tape
Leader and trailer tape:
Empty trailer 200 mm min.
Direction of pulling out
Technical drawings
according to DIN
specifications
(Ø 1.5)
(2)
(5.5)
(0.3)
(4)
Drawing-No.: 9.700-5380.01-4
Issue: 1; 28.10.13
Reel dimensions and tape
Rev. 2.1, 13-Oct-15
(12)
(8)
(1.75)
X 2:1
7
Document Number: 80125
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SMD Tape and Reel
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Vishay Semiconductors
TAPING VERSION TSOP..TR (SIDE VIEW) DIMENSIONS in millimeters
A. Panhead SMD (TSOP36...TR, TSSP6...TR, TSOP6...TR)
16585
Rev. 2.1, 13-Oct-15
8
Document Number: 80125
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SMD Tape and Reel
www.vishay.com
Vishay Semiconductors
TAPING VERSION TSOP..TR (SIDE VIEW) DIMENSIONS in millimeters
0.3
3.6
B. Heimdall SMD (TSOP75..., TSOP77..., TSSP7....)
16
7.5
1.75
1.34 ref.
Ø 1.5
4
Direction of feed
8
2
Ø 1.5 min.
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5337.01-4
Issue: 2; 06.10.15
Rev. 2.1, 13-Oct-15
9
Document Number: 80125
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SMD Tape and Reel
www.vishay.com
Vishay Semiconductors
TAPING VERSION TSOP..TR (SIDE VIEW) DIMENSIONS in millimeters
3.6
0.3
C. Heimdall SMD without lens (TSOP75...WTR, TSOP77...WTR, TSSP...WTR)
16
1.75
7.5
Ø 1.5
4
Direction of feed
8
2
Ø 1.5
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5342.01-4
Issue: 2; 12.06.13
Rev. 2.1, 13-Oct-15
10
Document Number: 80125
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SMD Tape and Reel
www.vishay.com
Vishay Semiconductors
LEADER AND TRAILER DIMENSIONS in millimeters
Trailer
no devices
Leader
devices
no devices
End
Start
min. 200
min. 400
96 11818
COVER TAPE REEL STRENGTH
LABEL
According to DIN EN 60286-3
Standard bar code labels for finished goods
0.1 N to 1.3 N
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
300 mm/min. ± 10 mm/min.
165° to 180° peel angle
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING
ABBREVIATION
LENGTH
Item-description
-
18
INO
8
Item-number
Selection-code
SEL
3
BATCH
10
Data-code
COD
3 (YWW)
Plant-code
PTC
2
Quantity
QTY
8
Accepted by
ACC
-
Packed by
PCK
-
MIXED CODE
-
xxxxxxx+
Company logo
TYPE
LENGTH
LOT-/serial-number
Mixed code indicator
Origin
LONG BAR CODE TOP
Item-number
N
8
Plant-code
N
2
Sequence-number
X
3
Quantity
N
8
Total length
-
21
TYPE
LENGTH
Selection-code
X
3
Data-code
N
3
Batch-number
X
10
Filter
-
1
Total length
-
17
SHORT BAR CODE TOP
Rev. 2.1, 13-Oct-15
11
Document Number: 80125
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SMD Tape and Reel
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Vishay Semiconductors
DRY PACKAGING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
LEVEL
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
Aluminum bag
4
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
Label
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Reel
Bag Seal Date:
(If blank, see barcode label)
15973
Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020
22522
RECOMMENDED METHOD OF STORAGE
EIA JEDEC standard JSTD-020 level 4 label is included
on all dry bags
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
• Storage temperature 10 °C to 30 °C
• Storage humidity  60 % RH max.
After more than 72 h under these conditions moisture
content will be too high for reflow soldering.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers 
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC® standard JSTD-020 level 4 label is included
on all dry bags.
16962
OUTER PACKAGING
The sealed reel is packed into a pizza box.
CARTON BOX DIMENSIONS in millimeters
Length
Thickness
Width
22127
Pizza Box
(SMD and Heimdall)
(Taping in reels)
Rev. 2.1, 13-Oct-15
THICKNESS
WIDTH
LENGTH
50
340
340
12
Document Number: 80125
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000