Reliability Data Report Product Family R007 LT1001 / 1002 / 1007 / 1037 OP05 / 07 / 27 / 37 LT227 / 237 RH07 RH27 / RH37 Reliability Data Report Report Number: R007 Report generated on: Wed Sep 19 09:47:30 PDT 2012 OPERATING LIFE TEST PACKAGE TYPE HERMETIC CERDIP PLASTIC DIP SOIC/SOT/MSOP FLATPACK Totals SAMPLE SIZE 3591 2123 4834 2772 623 13,943 OLDEST DATE NEWEST DATE CODE CODE 8301 8301 8301 8501 9506 - 0942 0002 9811 9823 0942 - K DEVICE No. of FAILURES HRS (125°C) 1 12719 5541 21301 10553 647 50,761 2,3 6 1 2 0 0 9 HIGHLY ACCELERATED STRESS TEST AT +131 DEG C / 85% RH PACKAGE TYPE PLASTIC DIP SOIC/SOT/MSOP Totals SAMPLE SIZE 1260 4287 5,547 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES 4 CODE CODE HOURS (+85°C) 9015 8951 - 9930 1116 - 1750 5638 7,388 0 0 0 No. of FAILURES PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C PACKAGE TYPE SAMPLE SIZE PLASTIC DIP SOIC/SOT/MSOP Totals 13196 7006 20,202 OLDEST DATE NEWEST DATE K DEVICE CODE CODE HOURS 9501 9501 - 0337 0951 - 334 2258 2,592 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 8310 8324 8600 8508 9318 - 0834 0833 1103 0951 0417 - 251 371 1480 1256 17 3,375 0 0 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 8310 8324 8624 8401 9632 - 0215 0146 9908 0951 9632 - 80 139 1443 1173 0 2,835 TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE HERMETIC CERDIP PLASTIC DIP SOIC/SOT/MSOP FLATPACK Totals 1355 1724 3436 3378 176 10,069 THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE HERMETIC CERDIP PLASTIC DIP SOIC/SOT/MSOP FLATPACK Totals 446 813 2506 2192 17 5,974 (1) Assumes Activation Energy = 1.0 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =0.41 FITS (3) Mean Time Between Failure in Years = 278247.47 (4) Assumes 20X Acceleration from 85 °C to +131 °C Note: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL Preconditioning 0 0 0 0 0 0