New CEM-3 Epoxy resin copper-clad laminate using glass fabric and nonwoven glass fabric as base materials ■Features ●Excellent tracking resistance (CTI value for CEM-3 materials:600) can realize integration with power supply circuits. ●Excellent in thickness accuracy. Variations in board thickness are ±0.05 mm. This thickness accuracy is approx. 3 times higher compared with the existing composite copper-clad laminate. ●Excellent in high frequency characteristics. Small dissipation factor and thickness variations can realize designed performance. （Double-sided copper-clad） R-1786 （Single-sided copper-clad） R-1781 ●Provides dimensional stability equivalent to that of glass epoxy (FR-4). ●Reduces CO2 emission amount in our manufacturing process to one-quarter by means of our unique manufacturing process. (Compared with our conventional FR-4) ■Applications ●Liquid crystal television, PDP, PC peripheral equipment, air conditioner, plumbing equipment, power supply board, tuner, amusement machine, etc. ■Specifications（Assured values） Standard size (Warp × Fill) Thickness tolerance R-1786 Nominal thickness Warpage, Twist R-1781 Copper foil 0.018mm Copper foil 0.035mm Copper foil 0.018mm Copper foil 0.035mm 0.8mm 0.81±0.05mm 0.85±0.05mm 0.80±0.05mm Including ＋5 ＋3 1.0mm 1.00±0.05mm 1.04±0.05mm 0.99±0.05mm 1,020 ×1,025 mm −0 −0 copper foil ＋5 ＋3 1.2mm thickness. 1.15±0.05mm 1.19±0.05mm 1.14±0.05mm 1,220 ×1,025 mm −0 −0 1.6mm 1.52±0.05mm 1.56±0.05mm 1.51±0.05mm 0.82±0.05mm 1.01±0.05mm 1.16±0.05mm 1.53±0.05mm Single-sided Double-sided ≦10.0％ ≦9.0％ ≦7.0％ ≦6.0％ ≦2.5％ ≦2.5％ ≦2.5％ ≦2.0％ Note：When thickness is measured at 10 positions according to Section 5.3.3 in JIS C6481, thicknesses of at least 9 positions are within the tolerance range specified above. Thickness out of the tolerance range is within 125% of the above tolerance. Note：For detail dimensions, please confer with us separately. ■General Properties Test item Volume resistivity R-1786 Unit MΩ・m Surface resistance MΩ Insulation resistance MΩ − Dissipation factor（1MHz） − Solder heat resistance（260℃） second Peel strength Dielectric constant（1MHz） N/mm Copper foil：0.018mm（18μm） Copper foil：0.035mm（35μm） Heat resistance Flexural strength (crosswise direction) Water absorption Flammability (UL method) Alkali resistance Punching workability − N/mm2 ％ − − − Treatment conditions Actual value C-96/20/65 C-96/20/65+C-96/40/90 C-96/20/65 C-96/20/65+C-96/40/90 C-96/20/65 C-96/20/65+D-2/100 C-96/20/65 C-96/20/65+D-24/23 C-96/20/65 C-96/20/65+D-24/23 A A S4 A S4 A A E-24/50+D-24/23 A and E-168/70 Immersion （3 minutes） A 1×10 7 5×10 8 Guaranteed value 6 ≧1×10 ≧1×10 5 8 ≧1×10 6 8 ≧1×10 5 8 ≧1×10 6 7 ≧1×10 4 3×10 1×10 5×10 1×10 ≦5.5 4.5 ≦5.8 4.5 ≦0.030 0.015 ≦0.035 0.015 ≧120 ≧60 1.47 ≧1.08 1.47 ≧1.08 1.82 ≧1.40 1.82 ≧1.40 240℃60minutes No blister 200℃60minutes No blister 280 ≧225 0.08 ≦0.25 94V-0 94V-0 no abnormality no abnormality Suitable temperature:25℃ − Note：Test piece thickness is 1.6 mm. Note：The above tests are in accordance with JIS C6481. However, flame resistance is tested in accordance with UL94, and punching workability is in accordance with our company’s testing method. R-1786 ■Characteristic graph (reference value) ■Time-dependent change of surface resistance（40℃、90％RH processing） 〈Comb pattern circuit width：0.64mm、Circuit interval：1.3mm〉 ■Peel strength of copper foil 9 10 2.0 10 Bonding strength（N/mm） Surface resistivity (MΩ) 8 7 10 6 10 5 10 4 10 copper foil thickness 0.018mm ＋ plating thickness 0.030mm 1.5 copper foil thickness 0.018mm 1.0 0.5 3 10 0 5 10 15 0 20 50 100 150 200 250 Temperature（℃） Number of days for processing ■Temperature characteristic of surface resistance 〈Comb pattern circuit width：0.64mm、Circuit interval：1.3mm〉 ■Through hole reliability ●Test condition Create test pieces by applying copper through hole processing on test patterns, give the following thermal shocks, and measure the number of cycles until disconnection occurs. 9 10 Surface resistivity（MΩ） 8 10 ●Example 7 10 Number of cycles to break 6 10 5 Ｘ1 Ｘ2 Ｘ3 Ｘ 60 69 66 65 10 260℃ oil 10 seconds immersion 4 10 3 20℃ water 10 seconds immersion air blow 10 20 40 60 80 100 １cycle 120 Temperature（℃） ■Frequency characteristic of dielectric constant（IPC TM-650 2.5.5.9） ■Thermal expansion and contraction rates（Dilatometer method） 〈150℃ scale〉 0.4 5.0 Dimensional variation ratio（%） Dielectric constant 4.5 4.0 50 100 200 500 1,000 Y-axis X-axis 0.3 0.2 0.1 0 X-axis Y-axis Expansion rate（％） 0.252 0.295 Contraction rate（％） 0.020 0.030 -0.1 -0.2 30 50 70 Frequency （MHz） 90 110 130 150 Temperature(℃) ■Frequency characteristic of dissipation factor （IPC TM-650 2.5.5.9） ■Thermal expansion and contraction rates（TMA method） 〈150℃ scale〉 1.5 Dissipation factor Dimensional variation ratio（%） 0.02 0.01 50 100 200 Frequency （MHz） 500 1,000 1.0 0.5 0 Z-axis -0.5 30 50 70 90 Expansion rate（％） 1.00 Contraction rate（％） 0.45 110 Temperature(℃) 130 150 R-1786 ■Tracking resistance (IEC method)(0.1％ NH4Cl) ■Inner wall roughness〈60,000rpm 0.05mm/rev 3 ply〉 〈Electrode (platinum) interval〉 140 0.04 Number of dripping Inner wall roughness（mm） 120 100 80 60 40 20 0 100 200 300 400 500 0.03 0.02 0.01 0 600 1,000 3,000 5,000 Applied voltage(Ｖ) 10,000 hit ■Dimensional variation ratio（plate thickness 1.6mm copper foil thickness 0.018mm） Size：305mm(X-axis)×280mm(Y-axis)/Span：270mm(X-axis), 260mm(Y-axis) ■Punching characteristic（Punching temperature25℃） Dimensional variation ratio（％） 0.02 ●X-axis Maximum dynamic shearing stress Ｎ／mm2 Maximum dynamic pull-out stress Ｎ／mm2 0.01 ○Y-axis 161.7 46.1 ※Punching temperature is equal to the board's surface temperature. 0 -0.01 ● ○ ● -0.02 ○ -0.03 -0.04 After etching (E-0.5/80) After heating (E-0.5/170) ■Dimensional variation ratio（Processing steps plate thickness 1.6mm copper foil thickness 0.018mm) Size：305mm(X-axis)×280mm(Y-axis)/Span：270mm(X-axis), 260mm(Y-axis) ●X-axis 0.01 ○Y-axis 0 Accuracy level Dimensional variation ratio（％） 0.02 ■thickness accuracy board thickness 1.6mm copper foil thickness 0.018mm 〈x＝1.52mm Ｒ＝0.053mm ｖ＝0.014mm〉 -0.01 -0.02 -0.03 150 100 50 -0.04 After plating After etching After SR printing 0 130℃ 15minutes 3times ■Drill wear resistance Drill φ0.6mm ＵＣ35 Number of rotations 60,000rpm Feed rate 0.035mm/rev Entry boards：Aluminum(0.15mm) Backup board：Bakelite plate thickness：1.6mm Copper foil 0.018mm 3 ply 1.45 1.50 1.55 plate thickness （mm） ■Hole diameter contraction after punching（Punching temperature：25℃ Ｒ-1581） 0.17 60 Contraction amount（mm） Drill edge wear rate (area ratio)(%) 70 50 40 30 20 10 0.16 0.15 0.14 0.13 0.12 0.11 0.10 0.09 2,000 4,000 6,000 hit 8,000 10,000 0.8 0.9 1.0 1.1 1.2 1.3 1.4 Nominal pin diameter(mm) 1.5