Datasheet CMOS LDO Regulators for Portable Equipments 1ch 300mA CMOS LDO Regulators BHxxMA3 series ●General Description BHxxMA3 series are high-performance CMOS LDO regulators with output current ability of up to 300mA. These devices have excellent noise characteristics despite of their low circuit current consumption of 65µA. They are most appropriate for various applications such as power supplies for logic IC, RF, and camera modules. ●Key Specifications Input Power Supply Voltage Range: Output Current Range: Operating Temperature Range: Output Voltage Lineup: Output Voltage Accuracy: Circuit Current: Standby Current: ●Package HVSOF6 ●Features High Output Voltage Accuracy: ±1 % (±25mV on VOUT<2.5V products) Dropout voltage: 60mV (IOUT=100mA) Compatible with small ceramic capacitor Output Voltage ON/OFF Control Built-in Over Current Protection Circuit (OCP) Built-in Thermal Shutdown Circuit (TSD) Ultra-small power package:HVSOF6 2.5V to 5.5V 0 to 300mA -40 to 85℃ 1.5V to 3.3V ±1% 65μA (Typ.) 0μA (Typ.) W(Typ.) x D(Typ.) x H(Max.) 1.60mm x 3.00mm x 0.75mm ●Applications Battery-driven portable devices Other electronic devices using microcontrollers or logic circuits ●Typical Application Circuit Vin VIN Vout VOUT Cout Cin VOUT BHxxMA3 On Off NOISE STBY GND Cn Figure 1. Typical Application Circuit ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/10 TSZ02201-0RBR0A300170-1-2 25.Sep.2013 Rev.001 Datasheet BHxxMA3 series ●Pin Configuration STBY GND VIN NOISE VOUT VOUT ●Pin Description Pin No. Symbol Function 1 VIN 2 VOUT OUTPUT Pin 3 VOUT OUTPUT Pin 4 NOISE NOISE reducing capacitor ground terminal 5 GND GROUND Pin 6 STBY OUTPUT CONTROL Pin (High:ON,Low:OFF) reverse FIN INPUT Pin OPEN ●Block Diagram VIN 1 VOLTAGE REFERENCE + GND 5 THERMAL PROTECTION VOUT 2 3 VOUT OVER CURRENT PROTECTION STBY 6 CONTROL BLOCK NOISE 4 Figure 2. Block diagram www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/10 TSZ02201-0RBR0A300170-1-2 25.Sep.2013 Rev.001 Datasheet BHxxMA3 series ●Absolute Maximum Ratings Parameter Symbol Ratings Unit VMAX -0.3 to +6.5 V Pd 680(*1) mW Tjmax +125 ℃ Operating Temperature Range Topr -40 to +85 ℃ Storage Temperature Range Tstg -55 to +125 ℃ Maximum Power Supply Voltage Range Power Dissipation Maximum Junction Temperature (*1) Derate by 6.8mW/℃ when operating above Ta=25℃. (When mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer.) ●Recommended Operating Ratings Parameter Symbol Input Power Supply Voltage Range Maximum Output Current Range Limit Unit VIN 2.5 to 5.5 V IMAX 0 to 300 mA ●Recommended Operating Conditions (*2) Parameter Symbol Input Capacitor Ratings Unit Conditions － µF A ceramic capacitor is recommended. － － µF A ceramic capacitor is recommended. 0.01 0.22 µF A ceramic capacitor is recommended. Min. Typ. Max. Cin 1.0(*2) － Output Capacitor Cout 1.0(*2) Noise Decrease Capacitor Cn － Set the value of the capacitor so that it does not fall below the minimum value. Take into considerations the temperature characteristics, DC device characteristics, and degradation with time. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/10 TSZ02201-0RBR0A300170-1-2 25.Sep.2013 Rev.001 Datasheet BHxxMA3 series ●Electrical characteristics (*3) (Unless otherwise noted, Ta=25℃,VIN=VOUT+1.0V ,STBY=1.5V, Cin=1μF, Co=1μF, Cn=0.01μF.) Limit PARAMETER Symbol UNIT Conditions MIN. TYP. MAX. 【REG】 VOUT VOUT IOUT=1mA, VOUT≧2.5V VOUT ×1.01 ×0.99 V Output Voltage VOUT VOUT VOUT IOUT=1mA, VOUT＜2.5V VOUT +25mV -25mV Circuit Current IGND 65 95 μA IOUT=1mA Circuit Current (STBY) ISTBY 1.0 μA STBY=0V Ripple Rejection Ratio R.R. 60 dB VRR=-20dBv,fRR=1kHz,IOUT=10mA VIN=0.98×VOUT,IOUT=100mA Dropout Voltage VSAT1 60 90 mV VOUT≧2.5V IOUT=1mA Line Regulation VDL1 2 20 mV VIN=VOUT+0.5V to 5.5V(*4) Load Regulation 1 VDLO1 6 30 mV IOUT=1mA to 100mA Load Regulation 2 VDLO2 18 90 mV IOUT=1mA to 300mA Output Voltage ⊿VOUT/⊿Ta ±100 ppm/℃ IOUT=1mA,Ta=-40 to +85℃ Temperature 【OCP】 Limit Current Short Current ILMAX ISHORT 310 - 600 100 1300 - mA mA 【STBY】 STBY Pull-down Resistor ON STBY Control OFF Voltage RSTB VSTBH VSTBL 550 1.5 -0.3 1100 - 2200 VCC 0.3 kΩ V V Vo=VOUT×0.85 Vo=0V (*3) VIN=3.5V for VOUT＜2.5V. (*4) VIN=3.0V to 5.5V for VOUT＜2.5V. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/10 TSZ02201-0RBR0A300170-1-2 25.Sep.2013 Rev.001 Datasheet BHxxMA3 series ●Reference data BH30MA3WHFV (Unless otherwise specified, Ta=25℃.) Figure 3. Output Voltage vs. Input Voltage Figure 4. GND Current vs. Input Voltage Figure 5. Output Voltage vs. Output Current (OCP Threshold) Figure 6. Dropout Voltage vs. Output Current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/10 TSZ02201-0RBR0A300170-1-2 25.Sep.2013 Rev.001 Datasheet BHxxMA3 series ●Reference data BH30MA3WHFV (Ta=25℃, unless otherwise specified.) Figure 7. Output Voltage vs. Temperature Figure 8. Ripple Rejection vs. Frequency Figure 9. Load response www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 10. Startup time 6/10 TSZ02201-0RBR0A300170-1-2 25.Sep.2013 Rev.001 Datasheet BHxxMA3 series ●About input/output capacitor Capacity value of ceramic capacitor - DC bias characteristics (Example) 10-V withstand voltage B1characteristics GRM188B11A105KA61D 10 0 -10 Capacitance Change [%] It is recommended that an input capacitor is placed near pins between the VCC pin and GND as well as an output capacitor between the output pin and GND. The input is valid when the power supply impedance is high or when the PCB trace has significant length. For the output capacitor, the greater the capacitance, the more stable the output will be depending on the load and line voltage variations. However, please check the actual functionality of this capacitor by mounting it on a board for the actual application. Ceramic capacitors usually have different, thermal and equivalent series resistance characteristics, and may degrade gradually over continued use. For additional details, please check with the manufacturer, and select the best ceramic capacitor for your application 10-V withstand voltage B characteristics -20 6.3-V withstand voltage B characteristics -30 10-V withstand voltage F characteristics -40 -50 -60 4-V withstand voltage X6S characteristics 10-V withstand voltage F characteristics -70 -80 -90 -100 0 0.5 1 1.5 2 2.5 3 3.5 4 DC Bias Voltage [V] Figure 11. Capacity-bias characteristics Cout=1.0μF,Cin=1.0μF,Temp=+25℃ ●Equivalent Series Resistance (ESR) of a Ceramic Capacitor 100 10 ESR [Ω] Capacitors generally have ESR (equivalent series resistance) and it operates stably in the ESR-IOUT area shown on the right. Since ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different ESR, please check the ESR of the capacitor to be used and use it within the stability area range shown in the right graph for evaluation of the actual application. 1 Stable region 0.1 0.01 0 50 100 150 200 250 300 Output Current IOUT [mA] Figure 12. Stable region (example) ●Power Dissipation (Pd) As for power dissipation, an estimate of heat reduction characteristics and internal power consumption of IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as causing the operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare sufficient margin within power dissipation for usage. Calculation of the maximum internal power consumption of IC (PMAX) Where : VIN=Input voltage VOUT= Output voltage IOMAX: Maximum output current PMAX=(VIN-VOUT)×IOMAX 0.8 0.68W 0.7 Pd (W) 0.6 Standard ROHM board 0.5 * Please design the margin so that PMAX becomes is than Pd (PMAX<Pd) within the usage temperature range 0.4 0.3 0.2 0.1 0 0 25 75 85 50 100 125 Ta (℃) Figure 13.HVSOF6 Power dissipation heat reduction characteristics (Reference) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/10 TSZ02201-0RBR0A300170-1-2 25.Sep.2013 Rev.001 Datasheet BHxxMA3 series ●Operational Notes 1) Absolute maximum ratings This product is produced with strict quality control, however it may be destroyed if operated beyond its absolute maximum ratings. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. T h e r e f o r e , i t i s i m p o r t a n t t o c o n s i d e r c i r c u i t p r o t e c t i o n m e a s u r e s , l i k e a d d i n g a fuse, in case the IC is operated in a special mode exceeding the absolute maximum ratings. 2) GND Potential GND potential must be the lowest potential of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 3) Setting of Heat Carry out the heat design that have adequate margin considering Pd of actual working states. 4) Pin Short and Mistake Fitting When mounting the IC on the PCB, pay attention to the orientation of the IC. If there is mistake in the placement, the IC may be burned up. 5) Actions in Strong Magnetic Field Using the IC within a strong magnetic field may cause the IC to malfunction. 6) Mutual impedance Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as possible. Use a capacitor to keep ripple to a minimum. 7) STBY Pin Voltage For standby mode, set STBY voltage below 0.3V. For normal operation, set the pin voltage beyond 1.5V. It is not recommended to set STBY voltage between 0.3V and 1.5V, as it may cause malfunctions. 8) Over Current Protection Circuit Over current and short circuit protection is built-in at the output, and IC destruction is prevented at the time of load short circuit. These protection circuits are effective in the destructive prevention by the sudden accident. Please avoid applications where the over current protection circuit operates continuously. 9) Thermal shutdown This IC also features a thermal shutdown circuit that is designed to turn off the output when the junction temperature of the IC exceeds about 170℃. This feature is intended to protect the IC only in the event of thermal overload and is not designed to guarantee operation or act as an active security device for applications. Therefore, it is not recommended that you design application where TSD will work in normal condition. TSD ON TEMPURATURE(℃) (typ.) HYSTERESIS TEMPURATURE(℃) (typ.） 170 15 BHxxMA3 series 10) Noise Pin NOISE pin can drive small current, since it is directly connected to reference voltage circuit. The output voltage may drop when the load of NOISE pin is more than 100nA. If the pin is connected to a capacitor, please use ceramic capacitor for small leak current. Please take note that the output noise is smaller as NOISE pin capacitor is larger, but startup time is longer. 11)Output capacitor To prevent oscillation at output, it is recommended that the IC be operated at the stable region shown in Figure 12. It operates at the capacitance value of more than 1.0μF. As capacitance is larger, stability becomes more stable and characteristic of output load fluctuation is also improved. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/10 TSZ02201-0RBR0A300170-1-2 25.Sep.2013 Rev.001 Datasheet BHxxMA3 series ●Ordering Information B H ROHM Part No. x x M A 3 W Series name MA3:300mA Output voltage xx=15:1.5V xx=18:1.8V xx=25:2.5V xx=28:2.8V xx=29:2.9V xx=30:3.0V xx=31:3.1V xx=33:3.3V H F V - Package HFV:HVSOF6 Shutdown switch W:With switch T R Packaging and forming specifications TR:Embossed tape and reel ●Physical Dimension Tape and Reel Information HVSOF6 <Tape and Reel information> (1.5) (0.45) (1.4) Embossed carrier tape Quantity 3000pcs Direction of feed (1.2) 1 2 3 Tape TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand (0.15) 2.6±0.1 (MAX 2.8 include BURR) 6 5 4 ) 1pin 0.145±0.05 0.75Max. 3.0±0.1 1.6±0.1 (MAX 1.8 include BURR) S 0.1 S 0.22±0.05 Direction of feed 0.5 (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagram(s) xx 15 18 25 28 29 30 31 33 Output Voltage 1.5V typ. 1.8V typ. 2.5V typ. 2.8V typ. 2.9V typ. 3.0V typ. 3.1V typ. 3.3V typ. Marking CB CC CD CE CF CG CH CJ HVSOF6(TOP VIEW) Part Number Marking LOT Number 1PIN MARK www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/10 TSZ02201-0RBR0A300170-1-2 25.Sep.2013 Rev.001 Datasheet BHxxMA3 series ●Revision History Date Revision 25.Sep.2013 001 Changes New Release www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/10 TSZ02201-0RBR0A300170-1-2 25.Sep.2013 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. 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The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. 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