ROHM BU6653NUX

CMOS LDO Regulator Series for Portable Equipments
High-speed Load Response
Full CMOS LDP Regulators
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
No.09020EBT06
●Description
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX are high-performance 3ch FULL CMOS regulator with 200-mA
outputs, which is mounted on small package VSON008X2030(2.0 mm  3.0 mm  0.6 mm). It has excellent noise
characteristics and load responsiveness characteristics despite its low circuit current consumption of 120 A. It is most
appropriate for various applications such as power supplies for logic IC, RF, and camera modules.
●Features
1) High-accuracy output voltage of 1% (25 mV on 1.5-V & 1.8-V products)
2) High ripple rejection: 70 dB (Typ., 1 kHz, VOUT≦1.8 V))
3) Compatible with small ceramic capacitor (CIN=2.2F ,Co=1.0 F)
4) Low current consumption: 120 A
5) ON/OFF control pin(STBY) of output voltage
6) With built-in overcurrent protection circuit and thermal shutdown circuit
7) With built-in output discharge circuit
8) Adopting small package VSON008X2030
●Applications
Battery-powered portable equipment, etc.
●Line up matrix
■ 200 mA
BU665□NUX series
Product Name
VOUT1
VOUT2
VOUT3
BU6650NUX
2.8V
2.8V
1.8V
BU6651NUX
2.8V
1.8V
1.5V
BU6652NUX
2.8V
2.8V
1.5V
BU6653NUX
2.8V
1.8V
1.8V
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© 2009 ROHM Co., Ltd. All rights reserved.
Package
VSON008X2030
1/17
2009.09 - Rev.B
Technical Note
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
 Absolute maximum rating
Parameter
Symbol
Maximum applied power voltage
Limits
VMAX
Power dissipation
-0.3 ~
Unit
+6.0
V
1
Pd
660*
mW
Maximum junction temperature
TjMAX
+125
°C
Operational temperature range
Topr
-40 ~
+85
°C
Storage temperature range
Tstg
-55 ~
+125
°C
* When 1 PCB (70 mm  70 mm, thickness 1.6-mm glass epoxy) a standard ROHM board is implemented.
Reduced to 6.6 mW/C when used at Ta=25C or higher.
 Recommended operating range (Do not exceed Pd.)
Parameter
Symbol
Input power supply voltage
VIN
Maximum output current
Limits
2.5 ~
IMAX
Unit
5.5
V
200
mA
 Recommended operating conditions
Parameter
Input capacitor
Output capacitor
Symbol
CIN
CO
Min.
Typ.
Max.
Unit
Conditions
2
2.2
－
µF
A ceramic capacitor is recommended.
2
1.0
－
µF
A ceramic capacitor is recommended.
1.0*
0.5*
*2 Set the capacity value of the capacitor so that it does not fall below the minimum value, taking temperature characteristics, DC device characteristics, and
change with time into consideration.
2009. Jun.
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© 2009 ROHM Co., Ltd. All rights reserved.
2/17
2009.09 - Rev.B
Technical Note
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Electrical characteristics
(Ta=25C, VIN=VOUT+1.0 V (VIN=3.5V on VOUT=1.8V and1.5V products),
STBY=1.5V,CIN=2.2F, CO=1.0F,unless otherwise specified)
Parameter
Symbol
VOUT
Output voltage
Operating current
Circuit current (at STBY)
Min.
VOUT×0.99
VOUT-25 mV
Typ.
VOUT
Max.
Unit
VOUT×1.01
V
IOUT=10 μA，VOUT≥2.5 V
VOUT+25 mV
V
IOUT=10 μA，VOUT<2.5 V
IIN1
-
40
95
µA
IOUT=0mA
STBY×1=1.5V, STBY×2=0V
IIN2
-
80
190
µA
IOUT=0mA
STBY×2=1.5V, STBY×1=0V
IIN3
-
120
285
µA
IOUT=0mA
STBY×3=1.5V
ISTBY
-
-
1
μA
STBY=0 V
70
RR
Ripple rejection
Conditions
55
-
dB
65
VRR=-20dBv, fRR=1kHz,
IOUT=10 mA,1.5V≦VOUT≦1.8V
VRR=-20dBv, fRR=1 kHz,
IOUT=10 mA,2.5 V≦VOUT
VSAT
-
360
720
mV
VOUT=2.8 V
(VIN=0.98*VOUT, IOUT=200 mA)
Line regulation
VDL
-
2
20
mV
VIN=VOUT+1.0 V to 5.5 V,
IOUT=10 μA
Load regulation
VDLO
-
10
80
mV IOUT=0.01 mA to 100 mA
Overcurrent protection detection
current
ILMAX
220
350
700
mA Vo=VOUT*0.8
Output short-circuit current
ISHORT
20
70
150
mA Vo=0 V
Output discharge resistance
RDSC
20
50
80
Ω
Standby pull-down resistance
RSTB
500
1000
2000
kΩ
ON
VSTBH
1.5
-
5.5
V
Output Voltage ON
OFF
VSTBL
-0.3
-
0.3
V
Output Voltage OFF
Input/Output voltage difference
VIN=4.0 V, STBY=0 V
Control Voltage
* This product does not have radiation-proof design.
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© 2009 ROHM Co., Ltd. All rights reserved.
3/17
2009.09 - Rev.B
Technical Note
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
 Block diagram, recommended circuit diagram, and PACKAGE DIMENSIONS (VSON008X2030)
Device Mark a
VIN
CIN
VREF
STBY1
VOUT1
STBY
COUT
OCP
VREF
STBY2
VOUT2
STBY
COUT
OCP
VREF
STBY3
VOUT3
STBY
COUT
OCP
Fig.1 Block diagram
Fig.2 PACKAGE DIMENSIONS
 Pin configuration diagram
PIN No.
PIN NAME
1
VIN
2
STBY1
3
STBY2
4
STBY3
5
6
7
8
GND
VOUT3
VOUT2
VOUT1
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© 2009 ROHM Co., Ltd. All rights reserved.
DESCRIPTION
INPUT Pin
OUTPUT1 CONTROL Pin
( High : ON, Low : OFF )
OUTPUT2 CONTROL Pin
( High : ON, Low : OFF )
OUTPUT3 CONTROL Pin
( High : ON, Low : OFF )
GROUND Pin
OUTPUT3 Pin
OUTPUT2 Pin
OUTPUT1 Pin
4/17
Device Mark
Series Name
Device Mark a
BU6650NUX
U6650
BU6651NUX
U6651
BU6652NUX
U6652
BU6653NUX
U6653
2009.09 - Rev.B
Technical Note
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
 Input/Output terminal equivalent circuit schematic
6,7,8pin (VOUT)
5pin (GND)
2,3,4pin (STBY)
VIN
1pin (VIN)
VIN
VOUT
STBY
Fig.3
Input/Output equivalent circuit
About input/output capacitor
Capacity value of ceramic capacitor - DC bias characteristics
(Example)
10-V withstand voltage
B1characteristics
GRM188B11A105KA61D
10
0
-10
Capacitance Change [%]
It is recommended to place a capacitor as close as possible to the pins
between the input terminal and GND or between the output terminal and
GND.
The capacitor between the input terminal and GND becomes valid when
source impedance increases or when wiring is long. The larger the
capacity of the output capacitor between the output terminal and GND is,
the better the stability and characteristics in output load fluctuation
become. However, please check the status of actual implementation.
Ceramic capacitors generally have variation, temperature characteristics,
and direct current bias characteristics and the capacity value also
decreases with time depending on the usage conditions. It is
recommended to select a ceramic capacitor upon inquiring about
detailed data of the related manufacturer.
10-V withstand voltage
B characteristics
-20
6.3-V withstand voltage
B characteristics
-30
10-V withstand voltage
F characteristics
-40
-50
-60
4-V withstand voltage
X6S characteristics
10-V withstand voltage
F characteristics
-70
-80
-90
-100
0
0.5
1
1.5
2
2.5
3
3.5
DC Bias Voltage [V]
Fig.4 Capacity – bias characteristics
100
ESR [Ω]
 About the equivalent series resistance (ESR) of a ceramic capacitor
Capacitors generally have ESR (equivalent series resistance) and it
operates stably in the ESR-IOUT area shown on the right. Since
ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc.
generally have different ESR, please check the ESR of the capacitor
to be used and use it within the stability area range shown in the
right graph for evaluation of the actual application.
Unstable area
10
Stability area
1
0.1
0.01
0
50
100
150
200
IOUT [mA]
Fig.5 Stability area characteristics (Example)
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© 2009 ROHM Co., Ltd. All rights reserved.
5/17
2009.09 - Rev.B
4
Technical Note
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
(Ta=25ºC unless otherwise specified.)
40.00
Input Current (uA)
Input Current (uA)
50.00
30.00
20.00
10.00
0.00
-40
-15
10
35
60
100.00
150.00
80.00
120.00
Input Current (uA)
●Reference data total device
60.00
40.00
20.00
0.00
-40
85
90.00
60.00
30.00
0.00
-15
10
35
60
85
-40
-15
10
Fig. 7. Iin2 vs. Temp
Fig. 6. Iin1 vs. Temp
35
60
85
Temp (°C)
Temp (°C)
Temp (°C)
Fig. 8. Iin3 vs. Temp
3.50
1.000
VIN=3.8V
0.900
3.00
Output Voltage (V)
Gnd Current (uA)
0.800
0.700
0.600
0.500
0.400
0.300
VIN=3.8V
STBY=0V
0.200
0.100
0.000
2.50
2.00
1.50
Temp.=85°C
Temp.=25°C
Temp.=-40°C
1.00
0.50
-0.100
-40
-15
10
35
60
85
0.00
0
Temp. (°C)
0.5
1
1.5
STBY Voltage (V)
Fig. 9. IIstby vs Temp (STBY)
Fig. 10. STBY Threshold
●Reference data Vo=2.8V (Ta=25ºC unless otherwise specified.)
3.5
IO=0uA
2.84
2.5
2.0
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.5
1.0
Temp.=25°C
VIN = STBY
0.5
0.0
IO=0uA
IO=100uA
IO=50mA
IO=200mA
2.83
2.82
2.81
80
Gnd Current (uA)
Output Voltage (V)
Output Voltage (V)
100
2.85
3.0
2.80
2.79
2.78
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Temp.=25°C
2.76
VIN = STBY
5.5
40
Temp.=-40°C
Temp.=25°C
Temp.=85°C
0
2.7
2.8
2.9
Vin Voltage (V)
3
3.1
3.2
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vin Voltage (V)
Fig. 11. Output Voltage
0.40
Vin Voltage (V)
Fig. 12. Line Regulation
Fig. 13. Circuit Current IGND
10
120
0.35
110
Temp.=85°C
0.25
Temp.=25°C
0.20
Temp.=-40°C
0.15
0.10
8
Temp.=85°C
Temp.=25°C
6
Temp.=-40°C
4
2
VIN=0.98 x VOUT
0.05
Gnd Current (uA)
0.30
STBY Current (uA)
Dropout Voltage (V)
60
20
2.77
2.75
0
VIN = STBY
0
0.05
0.1
0.15
0.2
Output Current (A)
Fig. 14. Dropout Voltage
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© 2009 ROHM Co., Ltd. All rights reserved.
Temp.=25°C
80
70
Temp.=-40°C
60
VIN = 3.8V
STBY = 1.5V
40
0
0.00
90
50
VIN = STBY
STBY = 1.5V
Temp.=85°C
100
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
STBY Voltage (V)
Fig. 15. STBY Input Current
6/17
5
5.5
0
0.05
0.1
0.15
0.2
Output Currnt (A)
Fig. 16. IOUT - IGND
2009.09 - Rev.B
Technical Note
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
● Reference data Vo=2.8V
(Ta=25ºC unless otherwise specified.)
2.85
Output Voltage (V)
Output Voltage (V)
2.84
2.83
2.82
2.81
2.80
2.79
2.78
VIN=3.8V
STBY=1.5V
Io=0.1mA
2.77
2.76
2.75
-40
-15
10
35
60
85
Temp. (°C)
Fig. 18. OCP Threshold
80
80
1.6
f= 0 .1 kHz
70
60
Ripple Rejection [dB]
Ripple Rejection (dB )
70
Fig. 19. VOUT vs. Temp
50
40
30
20
Vin= 3.8V
Io=10mA
Ta = 25℃
10
1
10
f= 1 kH z
50
f= 1 0 kH z
40
f= 1 0 0 kH z
30
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
20
10
0
0
0.1
60
100
1000
Frequency (kHz)
Fig. 20. Ripple Rejection VS Freq.
Fig. 23. Load Response
2.8
3.8
4.8
Input Voltage VIN[V]
Fig. 21. Ripple Rejection VS VIN
Fig. 24. Load Response
⇔
Fig. 26. Load Response
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© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 27. Load Response
Current Pulse=10kHz
7/17
O utput N oise D ensity [μ V /√ H z]
Fig. 17. Load Regulation
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0.1
1
10
Frequency f [kHz]
100
Fig. 22. Output Noise Spectral
Density VS. Freq.
Fig. 25. Load Response
⇔
Fig. 28. Load Response
Current Pulse=10kHz
2009.09 - Rev.B
Technical Note
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
● Reference data Vo=2.8V
(Ta=25ºC unless otherwise specified.)
⇔
⇔
Fig. 29. Load Response
Current Pulse=100kHz
Fig. 31. Start Up Time
Iout = 0mA
Fig. 34. Start Up Time(STBY=VIN)
Iout = 200mA
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© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 30. Load Response
Current Pulse=100kHz
Fig. 32. Start Up Time
Iout = 200mA
Fig. 35. Discharge Time
Iout = 0mA
8/17
Fig. 33. Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 36. VIN Response
Iout = 10mA
2009.09 - Rev.B
Technical Note
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
●Reference data Vo=1.8V
(Ta=25ºC unless otherwise specified.)
3.5
1.84
2.5
2.0
1.5
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.0
0.5
Temp=25°C
VIN = STBY
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.83
1.82
1.81
1.80
1.79
1.78
1.77
Temp=25°C
VIN = STBY
1.76
0.0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
80
60
40
Temp=-40°C
Temp=25°C
Temp=85°C
20
1.75
1.85
1.95
Vin Voltage (V)
2.05
2.15
2.25
0
2.35
0.5
1
1.5
2
3
110
80
60
Temp=-40°C
Temp=25°C
Temp=85°C
40
IO=200mA
VIN = STBY
20
Temp=85°C
8
Gnd Current (uA)
STBY Current (uA)
100
Temp=25°C
6
Temp=-40°C
4
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Temp=85°C
90
80
70
Temp=-40°C
60
VIN = 3.5V
STBY = 1.5V
50
40
0
5.5
5
Temp=25°C
2
0
0.5
4.5
100
VIN = STBY
0
0
4
120
10
120
3.5
Fig. 39. Circuit Current IGND
Fig. 38. Line Regulation
140
2.5
Vin Voltage (V)
Vin Voltage (V)
Fig. 37. Output Voltage
IO=0uA
VIN = STBY
0
1.75
0
Gnd Current (uA)
Gnd Current (uA)
Output Voltage (V)
Output Voltage (V)
100
1.85
3.0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
5.5
Fig. 40. Circuit Current IGND
0.05
0.1
0.15
0.2
Output Current (A)
STBY Voltage (V)
Vin Voltage (V)
Fig. 41. STBY Input Current
Fig. 42. IOUT - IGND
3.50
Output Voltage (V)
Output Voltage (V)
Output Voltage (V)
3.00
2.50
2.00
1.50
Temp=85°C
Temp=25°C
Temp=-40°C
1.00
0.50
0.00
0
0.5
1
1.5
STBY Voltage (V)
Fig. 43. Load Regulation
Fig. 44. OCP Threshold
Fig. 45. STBY Threshold
50.00
1.85
1.82
1.81
1.80
1.79
1.78
VIN=3.5V
STBY=1.5V
Io=0.1mA
1.77
1.76
G nd Current (uA)
1.83
Input Current (uA)
Output Voltage (V)
1.84
40.00
30.00
20.00
VIN=3.5V
STBY=1.5V
Io=0mA
10.00
0.00
1.75
-40
-15
10
35
60
85
Temp (°C)
Fig. 46. VOUT vs. Temp
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© 2009 ROHM Co., Ltd. All rights reserved.
-40
-15
10
35
60
Temp (°C)
Fig. 47. IGND vs. Temp
9/17
85
1.000
0.900
0.800
0.700
0.600
0.500
0.400
0.300
0.200
0.100
0.000
-0.100
-40
VIN=3.5V
STBY=0V
-15
10
35
60
85
Temp (°C)
Fig. 48. IGND vs. Temp (STBY)
2009.09 - Rev.B
Technical Note
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
80
70
70
60
50
40
30
Vin= 3.5V
Io=10mA
Ta = 25℃
20
10
0.7
f= 0 .1 kHz
O u tpu t N oise D e n sity [μ V / √ H z]
80
Ripple Rejection [dB]
R ipple R ejection (dB)
●Reference data Vo=1.8V (Ta=25ºC unless otherwise specified.)
f= 1 kHz
60
f= 1 0 kHz
50
40
f= 1 0 0 kHz
30
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
20
10
0
0
0.1
1
10
100
2.5
1000
4.5
5.5
0.5
0.4
0.3
0.2
0.1
0
0.1
1
Input Voltage VIN[V]
Frequency (kHz)
Fig. 49. Ripple Rejection VS Freq.
3.5
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
0.6
Fig. 50. Ripple Rejection VS VIN
10
Frequency f [kHz]
100
Fig. 51. Output Noise Spectral
Density VS Freq.
Fig. 53. Load Response
Fig. 52. Load Response
Fig. 54. Load Response
Fig. 55. Load Response
⇔
Fig. 56. Load Response
Current Pulse=10kHz
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© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 57. Load Response
Current Pulse=10kHz
10/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
● Reference data Vo=1.8V
Technical Note
(Ta=25ºC unless otherwise specified.)
⇔
Fig. 58. Load Response
Current Pulse=100kHz
Fig. 60. Start Up Time
Iout = 0mA
Fig. 63. Start Up Time(STBY=VIN)
Iout = 200mA
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Fig. 59. Load Response
Current Pulse=100kHz
Fig. 61. Start Up Time
Iout = 200mA
Fig. 64. Discharge Time
Iout = 0mA
11/17
Fig. 62. Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 65. VIN Response
Iout = 10mA
2009.09 - Rev.B
Technical Note
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
● Reference data Vo=1.5V
(Ta=25ºC unless otherwise specified.)
100
1.55
1.54
1.5
1.2
IO=0uA
IO=100uA
IO=50mA
IO=200mA
0.9
0.6
Temp=25°C
VIN = STBY
0.3
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.53
1.52
1.51
1.50
1.49
1.48
1.47
Temp=25°C
VIN = STBY
1.46
0.0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
80
60
40
Temp=-40°C
Temp=25°C
Temp=85°C
20
1.25 1.35 1.45
1.55 1.65 1.75 1.85 1.95
Vin Voltage (V)
0
2.05 2.15 2.25
0.5
1
1.5
Fig. 66. Output Voltage
2
2.5
3
Fig. 67. Line Regulation
Temp=-40°C
Temp=25°C
Temp=85°C
40
20
IO=200mA
VIN = STBY
Gnd Current (uA)
60
Temp=85°C
8
STBY Current (uA)
80
Temp=25°C
6
Temp=-40°C
4
2
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
0.5
1
1.5
Vin Voltage (V)
Temp=85°C
Temp=25°C
90
80
70
Temp=-40°C
60
VIN = 3.5V
STBY = 1.5V
2
2.5
3
3.5
4
4.5
5
0
5.5
0.05
0.1
0.15
0.2
Output Current (A)
STBY Voltage (V)
Fig. 69. Circuit Current IGND
5.5
40
0
0
5
100
50
VIN = STBY
0
4.5
120
110
100
4
Fig. 68. Circuit Current IGND
10
120
3.5
Vin Voltage (V)
Vin Voltage (V)
140
IO=0uA
VIN = STBY
0
1.45
0
Gnd Current (uA)
Gnd Current (uA)
Output Voltage (V)
Output Voltage (V)
1.8
Fig. 70. STBY Input Current
Fig. 71. IOUT - IGND
2.00
3.50
Temp=25℃
1.75
Output Voltage (V)
Output Voltage (V)
3.00
2.50
VIN=5.5V
2.00
VIN=3.5V
1.50
1.00
VIN=2.0V
0.50
1.50
1.25
1.00
0.75
Temp=85°C
Temp=25°C
Temp=-40°C
0.50
0.25
STBY=1.5V
0.00
0.00
0
0.1
0.2
0.3
0.4
0.5
0.6
0
0.5
Output Current (A)
Fig. 72. Load Regulation
Fig. 73. OCP Threshold
1.55
50.00
1.51
1.50
1.49
1.48
VIN=3.5V
STBY=1.5V
Io=0.1mA
1.47
1.46
1.45
Gnd Current (uA)
Input Current (uA)
Output Voltage (V)
1.52
40.00
30.00
20.00
VIN=3.5V
STBY=1.5V
Io=0mA
10.00
0.00
-40
-15
10
35
60
85
Temp (°C)
Fig. 75. VOUT vs. Temp
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© 2009 ROHM Co., Ltd. All rights reserved.
-40
-15
10
35
60
Temp (°C)
Fig. 76. IGND vs. Temp
12/17
1.5
Fig. 74. STBY Threshold
1.54
1.53
1
STBY Voltage (V)
85
1.000
0.900
0.800
0.700
0.600
0.500
0.400
0.300
0.200
0.100
0.000
-0.100
-40
VIN=3.5V
STBY=0V
-15
10
35
60
85
Temp (°C)
Fig. 77. IGND vs. Temp (STBY)
2009.09 - Rev.B
Technical Note
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
(Ta=25ºC unless otherwise specified.)
80
80
0.7
f= 0 .1 kHz
70
Ripple Rejection [dB]
Ripple Re je c tion (dB )
70
O u tpu t N o is e D e n s ity [μ V / √ H z ]
● Reference data Vo=1.5V
60
50
40
30
Vin= 3.5V
Io=10mA
Ta = 25℃
20
10
f= 1 kHz
60
f= 1 0 kHz
50
40
30
f= 1 0 0 kHz
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
20
10
0
0
2.5
0.1
1
10
100
1000
Frequency (kHz)
Fig. 78. Ripple Rejection vs. Freq.
3.5
4.5
Input Voltage VIN[V]
Fig. 79. Ripple Rejection vs. VIN
(Iout=10 mA)
5.5
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
0.6
0.5
0.4
0.3
0.2
0.1
0
0.1
1
10
Frequency f [kHz]
Fig. 80. Output Noise Spectral
Density vs. Freq.
Fig. 81. Load Response
Fig. 82. Load Response
Fig. 83. Load Response
Fig. 84. Load Response
Fig. 85. Load Response
Current Pulse=10 kHz
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© 2009 ROHM Co., Ltd. All rights reserved.
100
Fig. 86. Load Response
Current Pulse=10 kHz
13/17
2009.09 - Rev.B
Technical Note
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
● Reference data Vo=1.5V
(Ta=25ºC unless otherwise specified.)
Fig. 87. Load Response
Current Pulse=100 kHz
Fig. 89. Startup Time
Iout = 0 mA
Fig. 92. Startup Time (STBY=VIN)
Iout = 200mA
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© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 88. Load Response
Current Pulse=100 kHz
Fig. 90. Startup Time
Iout = 200 mA
Fig. 93. Discharge Time
Iout = 0 mA
14/17
Fig. 91. Startup Time (STBY=VIN)
Iout = 0 mA
Fig. 94. VIN Response
Iout = 10 mA
2009.09 - Rev.B
Technical Note
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
●About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be
sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT1)×IOUT1(MAX.)＋(VIN-VOUT2)×IOUT2(MAX.)＋(VIN-VOUT3)×IOUT3(MAX.)
(VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
0.7
0.6
0.66W
* Please design the margin so that PMAX
becomes is than Pd (PMAXPd) within
the usage temperature range.
Pd [W]
0.5
0.4
0.3
0.2
- Standard ROHM board Size: 70 mm  70 mm  1.6 mm
Material: Glass epoxy board
0.1
0
0
25
50
75
85
100
125
Ta [℃]
Fig.95 VSON008X2030
Power dissipation heat reduction characteristics (Reference)
●Notes for use
・About absolute maximum rating
Breakage may occur when absolute maximum ratings such as applied voltage and operating temperature range are
exceeded. Short mode or open mode cannot be specified at occurrence of a break, so please prepare physical safety
measures (e.g., fuse) if such special mode in which the absolute maximum rating is exceeded can be assumed.
・About GND potential
Please be sure that the potential of the GND terminal is the lowest in any operating condition.
・About thermal design
Please provide thermal design with sufficient margin, taking power dissipation (Pd) in actual usage conditions into
consideration.
・About short between pins and misattachment
Please be careful regarding the IC direction and misalignment at attachment onto a printed circuit board. Misattachment
may cause a break of IC. Short caused by foreign matter between outputs, output and power supply, or GNDs may also
lead to a break.
・About operation in a strong electromagnetic field
Please note that usage in a strong electromagnetic field may cause malfunction.
・About common impedance
Please give due consideration to wiring of the power source and GND by reducing common-mode ripple or making ripple
as small as possible (e.g., making the wiring as thick and short as possible, or reducing ripple by LC), etc.
・About STBY terminal voltage
Set STBY terminal voltage to 0.3 V or less to put each channel into a standby state and to 1.5 V or more to put each
channel into an operating state. Do not fix STBY terminal voltage to 0.3 V or more and 1.5 V or less or do not lengthen
the transition time. This may cause malfunction or failure.
When shorting the VIN terminal and STBY terminal for usage, the status will be “STBY=VIN＝LOW” at turning the power
OFF, and discharge of the VOUT terminal cannot operate, which means voltage may remain for a certain time in the
VOUT terminal. Since turning the power ON again in this state may cause overshoot, turn the power ON for use after the
VOUT terminal is completely discharged.
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© 2009 ROHM Co., Ltd. All rights reserved.
15/17
2009.09 - Rev.B
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
Technical Note
・About overcurrent protection circuit
Output has a built-in overcurrent protection circuit, which prevents IC break at load short. Note that this protection circuit
is effective for prevention of breaks due to unexpected accidents. Please avoid usage by which the protection circuit
operates continuously.
・About thermal shutdown
Output is OFF when the thermal circuit operates since a temperature protection circuit is built in to prevent thermal
breakdown. However, it recovers when the temperature returns to a certain temperature. The thermal circuit operates at
emergency such as overheating of IC. Since it is prepared to prevent IC breakdown, please do not use it in a state in
which protection works.
●About reverse current
For applications on which reverse current is assumed to flow into IC, it is recommended to prepare a path to let the current
out by putting a bypass diode between the VIN-VOUT terminals.
Reverse current
VIN
STBY
OUT
GND
Fig.96 Example of bypass diode connection
●About testing on a set board
When connecting a capacitor to a terminal with low impedance for testing on a set board, please be sure to discharge for
each process since IC may be stressed. As a countermeasure against static electricity, prepare grounding in the assembly
process and take sufficient care in transportation and storage. In addition, when connecting a capacitor to a jig in a testing
process, please do so after turning the power OFF and remove it after turning the power OFF.
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© 2009 ROHM Co., Ltd. All rights reserved.
16/17
2009.09 - Rev.B
Technical Note
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX
●Ordering part number
B
U
6
Part No.
6
5
0
N
Part No.
6650
6651
6652
6653
U
X
-
Package
NUX: VSON008X2030
T
R
Packaging and forming specification
TR: Embossed tape and reel
VSON008X2030
<Tape and Reel information>
3.0±0.1
2.0±0.1
0.6MAX
1PIN MARK
0.25
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
(0.12)
+0.03
0.02 –0.02
1.5±0.1
4000pcs
0.5
1
4
8
5
1.4±0.1
0.3±0.1
C0.25
Embossed carrier tape
Quantity
Direction
of feed
S
0.08 S
Tape
+0.05
0.25 –0.04
1pin
(Unit : mm)
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© 2009 ROHM Co., Ltd. All rights reserved.
Reel
17/17
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.09 - Rev.B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2009 ROHM Co., Ltd. All rights reserved.
R0039A