Caution about mounting and soldering . 1.1.2 Parts layout on Printed wiring board Film chip capacitors, unlike the leaded type film Although there are specific restrictive conditions for the chip type film capacitor, please check and consider capacitors do not have coating. the following items in order to guarantee soldering Retaliated heat from a near by heated components quality. Please consult us when using part adhesive may cause the temperature to exceed the usable for mounting because there is a possibility that type of temperature range. adhesive affects the characteristic and the reliability of Without coating, if there is an exposed live part in capacitor. the vicinity, a short circuit may be formed through the capacitor. Consider the arrangement. 1.1 Printed wiring board 1.1.1 Selection of printed wiring board 1.1.3 Land dimension design The chip parts are directly mounted on the printed If the land area is wide, tombstone phenomenon wiring board without using lead wires, and therefore (chip rising) is likely to occur in relation to the solder thermal expansion of the printed wiring board may amount. affect the characteristic of the film chip capacitor, It is disadvantageous for keeping the mount and hence the following cautions should be clearance of the mounting machine, but it is observed. advised to design in the recommended land dimension shown each specifications. 1. Soldering of chip type <Remarks for selecting the printed wiring board> Item Point of notice If there is a large difference in coefficient of thermal expansion between the capacitor and Printed wiring board, a mechanical stress is applied due to temperature changes after mounting, and the element main body may be changed, the soldered area may be cracked, and the performance may be lowered. Check sufficiently beforehand. * In particular, consult us if you are using ceramic Printed wiring boards. Coefficient of thermal expansion of printed wiring board Type of Printed Chip film capacitor wiring board Item Coefficient of thermal expansion( *10 –6 /°C) ECHU ECWU ECPU Paper Paper Glass (PPS film) (PEN film) (Plastic film) phenol epoxy epoxy 1~30 1~15 22 10 70 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Ceramic Printed wiring board Resin Printed wiring board Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. Alumina 1~25 7~8 Caution about mounting and soldering 1.3.1 Reflow soldering conditions Perform reflow soldering within the following temperature profile. 1.2 Flow soldering In flow soldering, the chip capacitor is soaked in molten solder. Film capacitor has lower heat resisting temperature than other capacitors, therefore cannot be used in flow soldering. 1.3 Reflow soldering Reflow soldering is a method of soldering by printing a proper amount of cream solder on the mounting land of the surface mount Printed Wiring Board, putting a film chip capacitor thereon, heating, and fusing the cream solder to fix. 1.3.2 Cautions for reflow soldering The film chip capacitor has no coating on the capacitor element, and the internal evaporated electrode may be deteriorated due to activating agent (halogen, etc.) in the cream solder, and the capacitance value may be decrease, dissipation factor may increase, or the characteristic may be deteriorated. Use cream solder with halogen content of 0.1wt.% or less. (Soldering is within twice, the second dip should be carried after the capacitor itself has returned to normal temperature.) Reflow soldering Recommendable condition Temp. on element surface(℃) Method 300 Soldering 235℃,MAX.5s 250 200 150 100 ≧220℃,MAX.30s Pre-heating 150℃～180℃ 60～120s Note External temperature of P. W. Board will be different according to P. W. Board materials and soldering method. For temperature measuring we recommend glass epoxy P. W. Board (115 mm × 50 mm, 0.8 t) as standard. 50 0 Time (s) When performing reflow soldering, an appropriate coating thickness of cream solder is 0.10 to 0.15 mm. Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. Caution about mounting and soldering The maximum temperature reached on the element surface in reflow is as follows. If a higher temperature is applied, abnormality may occur on the appearance or electrical characteristics. When washing right after soldering, make sure the capacitor surface temperature is lower than 60°C. Type Max. temperature on element surface ECHU ECWU ECPU 260°C 250°C 240°C If exceeding the specified temperature, it must be noted that the reliability of the part cannot be guaranteed. The moisture-proof packaging is made ECWU and ECPU. When that’s opened, a capacitor absorbs moisture, and soldering heat-resistance falls to a low level. Please confirm the notice after opening. The notice in detail has decided on Approval Specification. 1.4 When using soldering iron With a soldering iron, high temperature is directly to the film chip 2.4applied When using soldering ironcapacitor. Abide by the following soldering conditions, and strictly control With a soldering iron, highiron temperature is directly the iron tipfilm temperature. applied to the chip capacitor. Abide by the 1.4.1 Soldering conditions when using soldering iron Observe the following cautions, and use within the soldering conditions below. ECHU 270°Cmax.–4s max. ECWU 260°Cmax.–4s max. ECPU 280°Cmax.–4s max. Conditions for use of soldering iron 270 260 250 240 0 1 2 3 4 5 280 -----Soldering time(sec)----- 260 250 240 0 1 2 3 4 5 270 260 250 3 4 5 240 0 1 -----Soldering time(sec)----- 2 -----Soldering time(sec)---- :Applicable range Soldering iron capacity : 30W 280 :Applicable range 270 -----Iron tip temperature(DegreeC)----- 280 -----Iron tip temperature(DegreeC)----- -----Iron tip temperature(DegreeC)----- Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. :Applicable range Caution about mounting and soldering 1.4.2 Cautions for use of soldering iron Be careful that the soldering iron not directly touch the main body of the chip film capacitor. In particular, don’t touch the side (cut section). If touched by the heated soldering iron, lowering of insulation resistance, short circuit or other characteristic deterioration may occur. 2. Washing Since the chip type capacitor does not have a coating, components of flux or detergent left over on the element at the time of washing may be activated and invade into the inside of the capacitor, and adverse effects may be caused. Observe the following cautions. Preheat the printed wiring board land sufficiently with the soldering iron, and then solder. Solder without directly touching the iron tip to the electrode of the capacitor. In the case of washing, use flux and cream solder with halogen content of 0.1wt.% or less when mounting. In the case of ultrasonic washing, note that peeling of protective film, electrode separation due to resonance, or characteristic deterioration may occur depending on the detergent used or ultrasonic output. Check carefully beforehand. Don’t reuse the product (part) once removed by the soldering iron. Avoid mass mounting of chip film capacitors by soldering iron. (Temperature control is difficult, and the characteristics may be deteriorated.) Please do not re-solder with heat directly from bottom side of P. W. B. because capacitor will likely be damaged. When using a CFC substitute detergent, with the washing method of spraying detergent (rinsing water) to the substrate at high pressure, the protective film on the element surface may be peeled off due to the water pressure. Check carefully beforehand. <Usable detergent and washing method> (Usable detergent) Classification Detergent name Maker Alcohol derivative IPA (isopropyl alcohol) (Reagent for general industrial use) Halogenated hydrocarbon AK-225AES Asahi Glass Co. (Washing method) Condition Temperature Time Immersion washing Steam washing 50°C 50°C Within 5 minutes Within 5 minutes Ultrasonic washing 50°C Within 5 minutes Item Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. Caution about mounting and soldering <CFC substitute detergent> As a result of regulation of CFC and chlorine derivative detergents, many substitute detergents come to be used, but the performance of the chip type capacitor may be reduced depending on the type of detergent or washing condition. Check sufficiently beforehand. Consult us in advance if planning to use CFC Substitute detergent. <Drying after washing> Dry after washing so that the detergent is not left over. If drying is insufficient, the detergent is left over on the element surface, and the insulation resistance is measured to be lowered. Dry enough so as not to leave detergent. Applicability of detergents in film chip capacitors is listed for reference. <List of applicability of detergents> Applicability Washing condition Alcohol Solvent Isopropyl alcohol (IPA) Washing enabled Ultrasonic washing or immersion washing for 5 min Washing enabled FRW-100 : Steam drying for 1 min, 100°C Asahi Clean AK-225AES Halogen HCFC141b-MS Washing enabled Ultrasonic washing or immersion washing for 5 min Washing enabled Ultrasonic washing or immersion washing for 5 min P3 Cold Cleaner 225S Ultrasonic washing for 5 min, 60°C IPA ultrasonic rinsing for 5 Washing enabled min at ordinary temperature hot air drying for 5 min, 40°C hydrocarbon Toluene Washing disabled Ultrasonic washing or immersion washing for 5 min Terpene Cleaner EC-7 Spray washing for 5 min at ordinary temperature purified water Washing disabled spraying for 5 min, 50°C hot air drying for 5 min, 80°C Terpene Washing enabled FRW-17 : Ultrasonic washing for 5 min, 60°C. FRW-1N : Ultrasonic washing for 5 min, 60°C Silicon Petroleum Ethanol Ultrasonic washing or immersion washing for 5 min Purified water 1.Ultrasonicwashing for 5 min 60°C 2.Wind-free drying for 5 min, 85°C Washing disabled Washing disabled Clean Through 750L Washing disabled Clean Through 710M Washing disabled Clean Through LC-841 Washing disabled Pine-Alfa ST-100s Washing disabled Aqua-Cleaner 210SET Washing disabled Low residue flux ULF-500VS Washing enabled Inactivated flux AM-173 Washing enabled Water Clean Through 750H Surface active agent <Wash-free flux> Washing disabled detergent should be avoided because the appearance may be impaired, the characteristic may be deteriorated, and the reliability cannot be guaranteed. Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. Caution about mounting and soldering 3. Temperature measuring in soldering of film Capacitor When using film capacitor of low heat resisting temperature in mounting or chip type, measure the element temperature profile in mounting in the following manner, and make sure the soldering is done below the heat resisting temperature. <Preparation of measuring sample> Fix thermocouple (ø0.1T wire) to the top of the capacitor with adhesive. <Measurement of temperature profile> As shown below, connect a thermocouple (3 to 4m) of same type as the thermocouple to the capacitor, to the thermocouple of the capacitor as shown below. Mount the sample on the mounting printer wiring board, and pass into the soldering and mounting process, and measure the temperature profile. 4. Additional Points Product specifications, materials and other points mentioned in the catalog may be changed without notification. Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.