TSFM www.vishay.com Vishay Electro-Films Thin Film Top-Contact Resistor for High Temperature Applications FEATURES • Qualified to operate at elevated temperatures up to 250 °C • DC power rating up to 250 mW • Small Size: 0.02" square • Self passivating tantalum nitride film • Oxidized silicon substrate • Wide value range: 100 to 100 k Product may not be to scale The TSFM series of single-value resistors chips offer a small size, wide ohmic value range and excellent power capacity, maintaining these qualities to temperatures up to 250 °C. The TSFM Tantalum Nitride resistor material offers excellent resistance to high moisture environments. The TSFMs are manufactured using Vishay Electro-Films (EFI) sophisticated thin-film equipment and manufacturing technology. The TSFMs are 100 % electrically tested and visually inspected to MIL-STD-883, method 2032 class H or K. APPLICATIONS Vishay EFI TSFM top-contact 0.02" square resistor chips are designed to operate at elevated temperatures and power loads in many types of hybrid (chip and wire) assemblies. They are ideally suited for extreme environment applications such as “down hole” drilling. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES PARAMETER VALUE Resistance Range Tolerances TCR Tightest Standard Tolerance Available UNIT 100 to 100K ± 0.1 % ± 25; ± 50; ± 100; ± 250 ppm/°C Load Life Stability, 1000 h, +125 °C, 175 mW ± 0.1 % ± 25 ppm/°C ±1% ± 50 ppm/°C ±2% ±2% ± 100 ppm/°C ± 250 ppm/°C 100 Ω 100 kΩ 100 Ω 1 kΩ 10 kΩ 100 kΩ STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 Moisture Resistance, MIL-STD-202, Method 106 - Hermetic Applications VALUE UNIT -35 dB ± 0.5 max. R/R % Stability, 1000 h, +125 °C, 175 mW Down to ± 1 % Operating Temperature Range -55 to +250 °C ± 0.25 max. R/R % Down to ± 1 % Thermal Shock, MIL-STD-202, Method 107, Test Condition F High Temperature Exposure, +250 °C, 1000 h Dielectric Voltage Breakdown Operating Voltage DC Power Rating at +125 °C (Derated to Zero at +250 °C) 5 x Rated Power Short-Time Overload, +25 °C, 5 s Revision: 11-Sep-13 200 V 100 max. V 250 at 70 °C mW ± 0.25 max. R/R % Document Number: 61094 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSFM www.vishay.com Vishay Electro-Films CONFIGURATIONS in inches 0.020 0.020 0.016 0.020 0.006 0.004 0.004 0.004 TYPICAL RANGE 820 Ω to 1 MΩ TYPICAL RANGE 100 Ω to 819 Ω SCHEMATIC MECHANICAL SPECIFICATIONS in inches (millimeters) PARAMETER Chip Size 0.020 x 0.020 ± 0.003 (0.5 x 0.5 ± 0.076) Chip Thickness 0.010 ± 0.002 (0.254 ± 0.05) Chip Substrate Material Oxidized silicon, 10 kÅ minimum SiO2 Film Material Tantalum nitride, self-passivating Passivation None Bonding Pad Size 0.004 x 0.004 (0.10 x 0.10) Number of Pads 2 Pad Material 100 μ" Au Backing None, lapped silicon (Au optional) GLOBAL PART NUMBER INFORMATION Global Part Number: TSFM50000FKGNHWS Global Part Number Description: TSFM 5K 1 % 100 ppm/°C Au None H WS T S F MODEL RESISTANCE TSFM First 4 digits are significant figures of resistance 20 x 20 size Ta2N on silicon Revision: 11-Sep-13 M 5 0 0 RESISTANCE MULTILPLIER CODE TOL. CODE (%) C = 0.001 B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 B = 0.1 C = 0.25 D = 0.5 F = 1.0 G = 2.0 H = 2.5 J = 5.0 K = 10.0 0 0 TCR (ppm/°C) E = ± 25 C = ± 50 K = ± 100 M = ± 250 F K TERMINATION G = Au G N H W S BACK METAL VISUAL CLASS PACKAGING CODE G = Au N = None H= Class H K= Class K WS = Waffle pack 100 min., 1 mult Document Number: 61094 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000