PCF8576C
Universal LCD driver for low multiplex rates
Rev. 13 — 16 December 2013
Product data sheet
1. General description
The PCF8576C is a peripheral device which interfaces to almost any Liquid Crystal
Display (LCD)1 with low multiplex rates. It generates the drive signals for any static or
multiplexed LCD containing up to four backplanes and up to 40 segments and can easily
be cascaded for larger LCD applications. The PCF8576C is compatible with most
microcontrollers and communicates via the two-line bidirectional I2C-bus. Communication
overheads are minimized by a display RAM with auto-incremented addressing and by
hardware subaddressing.
For a selection of NXP LCD segment drivers, see Table 24 on page 52.
2. Features and benefits
Single-chip LCD controller and driver
40 segment drives:
Up to twenty 7-segment alphanumeric characters
Up to ten 14-segment alphanumeric characters
Any graphics of up to 160 elements
Versatile blinking modes
No external components required (even in multiple device applications)
Selectable backplane drive configuration: static, 2, 3, or 4 backplane multiplexing
Selectable display bias configuration: static, 1⁄2, or 1⁄3
Internal LCD bias generation with voltage-follower buffers
40 4-bit RAM for display data storage
Auto-incremented display data loading across device subaddress boundaries
Display memory bank switching in static and duplex drive modes
Wide logic LCD supply range:
From 2 V for low-threshold LCDs
Up to 6 V for high-threshold twisted nematic LCDs
Low power consumption
May be cascaded for large LCD applications (up to 2560 elements possible)
No external components required
Separate or combined LCD and logic supplies
Optimized pinning for plane wiring in both single and multiple PCF8576C applications
Power-saving mode for extremely low power consumption in battery-operated and
telephone applications
1.
The definition of the abbreviations and acronyms used in this data sheet can be found in Section 20.
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
3. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
PCF8576CHL/1
LQFP64
plastic low profile quad flat package;
64 leads; body 10 10 1.4 mm
SOT314-2
PCF8576CT/1
VSO56
plastic very small outline package, 56 leads
SOT190-1
PCF8576CU/2/F2
bare die
bare die; 56 bumps; 3.2 2.92 0.40 mm
PCF8576CU/2
PCF8576CU/F1
bare die
wire bond die; 56 bonding pads; 3.2 2.92 0.38 mm
PCF8576CU
3.1 Ordering options
Table 2.
Ordering options
Product type number
Sales item (12NC)
Orderable part
number
IC
Delivery form
revision
PCF8576CHL/1
935290305118
PCF8576CHL/1,118
1
tape and reel, 13 inch
935290305157
PCF8576CHL/1,157
1
tray pack
PCF8576CT/1
935278818518
PCF8576CT/1,518
1
tape and reel, 13 inch, dry pack
PCF8576CU/2/F2
935261851026
PCF8576CU/2/F2,026 1
chips in tray
PCF8576CU/F1
935208600026
PCF8576CU/F1,026
chips in tray
1
4. Marking
Table 3.
PCF8576C
Product data sheet
Marking codes
Product type number
Marking code
PCF8576CHL/1
PCF8576CHL
PCF8576CT/1
PCF8576CT
PCF8576CU/2/F2
PC8576C-2
PCF8576CU/F1
PC8576C-1
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Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
2 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
5. Block diagram
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Block diagram of PCF8576C
PCF8576C
Product data sheet
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Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
3 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
6. Pinning information
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6.1 Pinning
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Top view. For mechanical details, see Figure 33.
Fig 2.
PCF8576C
Product data sheet
Pin configuration for LQFP64 (PCF8576CHL/1)
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Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
4 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
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Top view. For mechanical details, see Figure 34.
Fig 3.
PCF8576C
Product data sheet
Pin configuration for VSO56 (PCF8576CT/1)
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Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
5 of 62
PCF8576C
NXP Semiconductors
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Universal LCD driver for low multiplex rates
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Viewed from pin side. For mechanical details, see Figure 36 and Figure 35.
Fig 4.
PCF8576C
Product data sheet
Pin locations of PCF8576CU/F1 and PCF8576CU/2/F2
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© NXP B.V. 2013. All rights reserved.
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PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
6.2 Pin description
Table 4.
Pin description
Input or input/output pins must always be at a defined level (VSS or VDD) unless otherwise specified.
Symbol
Pin
Description
LQFP64
(PCF8576CHL)
VSO56
(PCF8576CT)
PCF8576CU
Type
SDA
10
1
1
input/output
I2C-bus serial data input and output
SCL
11
2
2
input
I2C-bus serial clock input
SYNC
12
3
3
input/output
cascade synchronization input and
output
CLK
13
4
4
input/output
external clock input/output
5
5[1]
supply
supply voltage
14
VDD
OSC
15
6
6
input
internal oscillator enable input
A0 to A2
16 to 18
7 to 9
7 to 9
input
subaddress inputs
SA0
19
10
10
input
I2C-bus address input; bit 0
VSS
20
11
11
supply
ground supply voltage
VLCD
21
12
12
supply
LCD supply voltage
BP0, BP2,
BP1, BP3
25 to 28
13 to 16
13 to 16
output
LCD backplane outputs
S0 to S39
2 to 7, 29 to 32,
34 to 47, 49 to 64
17 to 56
17 to 56
output
LCD segment outputs
n.c.
1, 8, 9, 22 to 24,
33, 48
-
-
-
not connected; do not connect and
do not use as feed through
[1]
The substrate (rear side of the die) is connected to VDD and should be electrically isolated.
PCF8576C
Product data sheet
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Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
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PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
7. Functional description
The PCF8576C is a versatile peripheral device designed to interface between any
microcontroller to a wide variety of LCD segment or dot matrix displays (see Figure 5). It
can directly drive any static or multiplexed LCD containing up to four backplanes and up to
40 segments.
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Fig 5.
Example of displays suitable for PCF8576C
The possible display configurations of the PCF8576C depend on the number of active
backplane outputs required. A selection of display configurations is shown in Table 5. All
of these configurations can be implemented in the typical system shown in Figure 6.
Table 5.
Selection of possible display configurations
Number of
Backplanes
PCF8576C
Product data sheet
Icons
Digits/Characters
7-segment
14-segment
Dot matrix/
Elements
4
160
20
10
160 dots (4 40)
3
120
15
7
120 dots (3 40)
2
80
10
5
80 dots (2 40)
1
40
5
2
40 dots (1 40)
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8 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
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Fig 6.
Typical system configuration
The host microprocessor or microcontroller maintains the 2-line I2C-bus communication
channel with the PCF8576C.
Biasing voltages for the multiplexed LCD waveforms are generated internally, removing
the need for an external bias generator. The internal oscillator is selected by connecting
pin OSC to VSS. The only other connections required to complete the system are the
power supplies (pins VDD, VSS, and VLCD) and the LCD panel selected for the application.
7.1 Power-On-Reset (POR)
At power-on the PCF8576C resets to the following starting conditions:
•
•
•
•
•
•
All backplane and segment outputs are set to VDD
The selected drive mode is 1:4 multiplex with 1⁄3 bias
Blinking is switched off
Input and output bank selectors are reset
The I2C-bus interface is initialized
The data pointer and the subaddress counter are cleared
Remark: Do not transfer data on the I2C-bus for at least 1 ms after a power-on to allow
the reset action to complete.
7.2 LCD bias generator
The full-scale LCD voltage (Voper) is obtained from VDD VLCD. The LCD voltage may be
temperature compensated externally through the VLCD supply to pin VLCD.
Fractional LCD biasing voltages are obtained from an internal voltage divider comprising
three series resistors connected between VDD and VLCD. The center resistor can be
switched out of the circuit to provide a 1⁄2 bias voltage level for the 1:2 multiplex
configuration.
PCF8576C
Product data sheet
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Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
9 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
7.3 LCD voltage selector
The LCD voltage selector coordinates the multiplexing of the LCD in accordance with the
selected LCD drive configuration. The operation of the voltage selector is controlled by the
mode-set command from the command decoder. The biasing configurations that apply to
the preferred modes of operation, together with the biasing characteristics as functions of
VLCD and the resulting discrimination ratios (D) are given in Table 6.
Discrimination is a term which is defined as the ratio of the on and off RMS voltage across
a segment. It can be thought of as a measurement of contrast.
Table 6.
Biasing characteristics
LCD drive
mode
Number of:
LCD bias
Backplanes Levels configuration
V off RMS
------------------------V LCD
V on RMS
-----------------------V LCD
V on RMS
D = -----------------------V off RMS
static
1
2
static
0
1
3
1⁄
2
0.354
0.791
2.236
1:2 multiplex 2
4
1⁄
3
0.333
0.745
2.236
1:3 multiplex 3
4
1⁄
3
0.333
0.638
1.915
1:4 multiplex 4
4
1⁄
3
0.333
0.577
1.732
1:2 multiplex 2
A practical value for VLCD is determined by equating Voff(RMS) with a defined LCD
threshold voltage (Vth), typically when the LCD exhibits approximately 10 % contrast. In
the static drive mode, a suitable choice is VLCD > 3Vth.
Multiplex drive modes of 1:3 and 1:4 with 1⁄2 bias are possible but the discrimination and
hence the contrast ratios are smaller.
1
Bias is calculated by ------------- , where the values for a are
1+a
a = 1 for 1⁄2 bias
a = 2 for 1⁄3 bias
The RMS on-state voltage (Von(RMS)) for the LCD is calculated with Equation 1:
V on RMS =
V LCD
a 2 + 2a + n
-----------------------------2
n 1 + a
(1)
where the values for n are
n = 1 for static drive mode
n = 2 for 1:2 multiplex drive mode
n = 3 for 1:3 multiplex drive mode
n = 4 for 1:4 multiplex drive mode
The RMS off-state voltage (Voff(RMS)) for the LCD is calculated with Equation 2:
V off RMS =
V LCD
a 2 – 2a + n
-----------------------------2
n 1 + a
(2)
Discrimination is the ratio of Von(RMS) to Voff(RMS) and is determined from Equation 3:
PCF8576C
Product data sheet
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Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
10 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
V on RMS
D = ----------------------- =
V off RMS
2
a + 1 + n – 1
-------------------------------------------2
a – 1 + n – 1
(3)
Using Equation 3, the discrimination for an LCD drive mode of 1:3 multiplex with
1⁄
2
bias is
1⁄
2
21
bias is ---------- = 1.528 .
3
3 = 1.732 and the discrimination for an LCD drive mode of 1:4 multiplex with
The advantage of these LCD drive modes is a reduction of the LCD full scale voltage VLCD
as follows:
• 1:3 multiplex (1⁄2 bias): V LCD =
6 V off RMS = 2.449V off RMS
4 3
- = 2.309V off RMS
• 1:4 multiplex (1⁄2 bias): V LCD = --------------------3
These compare with V LCD = 3V off RMS when 1⁄3 bias is used.
VLCD is sometimes referred as the LCD operating voltage.
7.3.1 Electro-optical performance
Suitable values for Von(RMS) and Voff(RMS) are dependent on the LCD liquid used. The
RMS voltage, at which a pixel will be switched on or off, determine the transmissibility of
the pixel.
For any given liquid, there are two threshold values defined. One point is at 10 % relative
transmission (at Vth(off)) and the other at 90 % relative transmission (at Vth(on)), see
Figure 7. For a good contrast performance, the following rules should be followed:
V on RMS V th on
(4)
V off RMS V th off
(5)
Von(RMS) and Voff(RMS) are properties of the display driver and are affected by the selection
of a (see Equation 1), n (see Equation 3), and the VLCD voltage.
Vth(off) and Vth(on) are properties of the LCD liquid and can be provided by the module
manufacturer. Vth(off) is sometimes named Vth. Vth(on) is sometimes named saturation
voltage Vsat.
It is important to match the module properties to those of the driver in order to achieve
optimum performance.
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
11 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
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PCF8576C
Product data sheet
Electro-optical characteristic: relative transmission curve of the liquid
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PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
7.4 LCD drive mode waveforms
7.4.1 Static drive mode
The static LCD drive mode is used when a single backplane is provided in the LCD.
Backplane and segment drive waveforms for this mode are shown in Figure 8.
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Vstate1(t) = VSn(t) VBP0(t).
Von(RMS) = VLCD.
Vstate2(t) = VSn+1(t) VBP0(t).
Voff(RMS) = 0 V.
Fig 8.
PCF8576C
Product data sheet
Static drive mode waveforms
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13 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
7.4.2 1:2 Multiplex drive mode
When two backplanes are provided in the LCD, the 1:2 multiplex mode applies. The
PCF8576C allows the use of 1⁄2 bias or 1⁄3 bias (see Figure 9 and Figure 10).
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Vstate1(t) = VSn(t) VBP0(t).
Von(RMS) = 0.791VLCD.
Vstate2(t) = VSn(t) VBP1(t).
Voff(RMS) = 0.354VLCD
Fig 9.
PCF8576C
Product data sheet
Waveforms for the 1:2 multiplex drive mode with 1⁄2 bias
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Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
14 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
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Vstate1(t) = VSn(t) VBP0(t).
Von(RMS) = 0.745VLCD
Vstate2(t) = VSn(t) VBP1(t)
Voff(RMS) = 0.333VLCD.
Fig 10. Waveforms for the 1:2 multiplex drive mode with 1⁄3 bias
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
15 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
7.4.3 1:3 Multiplex drive mode
When three backplanes are provided in the LCD, the 1:3 multiplex drive mode applies as
shown in Figure 11.
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Vstate1(t) = VSn(t) VBP0(t).
Von(RMS) = 0.638VLCD.
Vstate2(t) = VSn(t) VBP1(t).
Voff(RMS) = 0.333VLCD.
Fig 11. Waveforms for the 1:3 multiplex drive mode with 1⁄3 bias
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
16 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
7.4.4 1:4 multiplex drive mode
When four backplanes are provided in the LCD, the 1:4 multiplex drive mode applies, as
shown in Figure 12.
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Vstate1(t) = VSn(t) VBP0(t).
Von(RMS) = 0.577VLCD.
Vstate2(t) = VSn(t) VBP1(t).
Voff(RMS) = 0.333VLCD.
Fig 12. Waveforms for the 1:4 multiplex mode with 1⁄3 bias
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
17 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
7.5 Oscillator
The internal logic and the LCD drive signals of the PCF8576C are timed by the frequency
fclk, which equals either the built-in oscillator frequency fosc or the external clock frequency
fclk(ext).
The clock frequency (fclk) determines the LCD frame frequency (ffr) and the maximum rate
for data reception from the I2C-bus. To allow I2C-bus transmissions at their maximum data
rate of 100 kHz, fclk should be chosen to be above 125 kHz.
7.5.1 Internal clock
The internal oscillator is enabled by connecting pin OSC to pin VSS. In this case, the
output from pin CLK is the clock signal for any cascaded PCF8576C in the system.
7.5.2 External clock
Connecting pin OSC to VDD enables an external clock source. Pin CLK then becomes the
external clock input.
Remark: A clock signal must always be supplied to the device. Removing the clock,
freezes the LCD in a DC state, which is not suitable for the liquid crystal.
7.6 Timing
The timing of the PCF8576C sequences the internal data flow of the device. This includes
the transfer of display data from the display RAM to the display segment outputs. In
cascaded applications, the synchronization signal (SYNC) maintains the correct timing
relationship between the PCF8576Cs in the system. The timing also generates the LCD
frame frequency which is derived as an integer division of the clock frequency (see
Table 7). The frame frequency is set by the mode-set command (see Table 10) when an
internal clock is used or by the frequency applied to the pin CLK when an external clock is
used.
Table 7.
LCD frame frequencies [1]
Power mode
Frame frequency
Nominal frame frequency (Hz)
Normal-power mode
f clk
f fr = ------------2880
69 [2]
Power-saving mode
f clk
f fr = ---------480
65 [3]
[1]
The possible values for fclk see Table 17.
[2]
For fclk = 200 kHz.
[3]
For fclk = 31 kHz.
The ratio between the clock frequency and the LCD frame frequency depends on the
power mode in which the device is operating. In the power-saving mode, the reduction
ratio is six times smaller; this allows the clock frequency to be reduced by a factor of six.
The reduced clock frequency results in a significant reduction in power consumption.
PCF8576C
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PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
The lower clock frequency has the disadvantage of increasing the response time when
large amounts of display data are transmitted on the I2C-bus. When a device is unable to
process a display data byte before the next one arrives, it holds the SCL line LOW until
the first display data byte is stored. This slows down the transmission rate of the I2C-bus
but no data loss occurs.
7.7 Display register
The display register holds the display data while the corresponding multiplex signals are
generated.
7.8 Shift register
The shift register transfers display information from the display RAM to the display register
while previous data is displayed.
7.9 Segment outputs
The LCD drive section includes 40 segment outputs, S0 to S39, which must be connected
directly to the LCD. The segment output signals are generated based on the multiplexed
backplane signals and with data residing in the display register. When less than
40 segment outputs are required, the unused segment outputs should be left open-circuit.
7.10 Backplane outputs
The LCD drive section includes four backplane outputs: BP0 to BP3. The backplane
output signals are generated based on the selected LCD drive mode.
• In 1:4 multiplex drive mode: BP0 to BP3 must be connected directly to the LCD.
If less than four backplane outputs are required, the unused outputs can be left as an
open-circuit.
• In 1:3 multiplex drive mode: BP3 carries the same signal as BP1, therefore these two
adjacent outputs can be tied together to give enhanced drive capabilities.
• In 1:2 multiplex drive mode: BP0 and BP2, BP1 and BP3 respectively carry the same
signals and can also be paired to increase the drive capabilities.
• In static drive mode: the same signal is carried by all four backplane outputs and they
can be connected in parallel for very high drive requirements.
7.11 Display RAM
The display RAM is a static 40 4-bit RAM which stores LCD data.
There is a one-to-one correspondence between
• the bits in the RAM bitmap and the LCD elements
• the RAM columns and the segment outputs
• the RAM rows and the backplane outputs.
A logic 1 in the RAM bitmap indicates the on-state of the corresponding LCD element;
similarly, a logic 0 indicates the off-state.
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PCF8576C
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Universal LCD driver for low multiplex rates
The display RAM bit map Figure 13 shows the rows 0 to 3 which correspond with the
backplane outputs BP0 to BP3, and the columns 0 to 39 which correspond with the
segment outputs S0 to S39. In multiplexed LCD applications the segment data of the first,
second, third and fourth row of the display RAM are time-multiplexed with BP0, BP1, BP2,
and BP3 respectively.
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The display RAM bitmap shows the direct relationship between the display RAM column and the
segment outputs; and between the bits in a RAM row and the backplane outputs.
Fig 13. Display RAM bit map
When display data is transmitted to the PCF8576C, the display bytes received are stored
in the display RAM in accordance with the selected LCD drive mode. The data is stored as
it arrives and does not wait for an acknowledge cycle as with the commands. Depending
on the current multiplex drive mode, data is stored singularly, in pairs, triples or
quadruples. To illustrate the filling order, an example of a 7-segment numeric display
showing all drive modes is given in Figure 14; the RAM filling organization depicted
applies equally to other LCD types.
PCF8576C
Product data sheet
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Fig 14. Relationship between LCD layout, drive mode, display RAM filling order, and display data transmitted over the I2C-bus
PCF8576C
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Universal LCD driver for low multiplex rates
Rev. 13 — 16 December 2013
All information provided in this document is subject to legal disclaimers.
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NXP Semiconductors
PCF8576C
Product data sheet
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PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
The following applies to Figure 14:
• In the static drive mode, the eight transmitted data bits are placed in row 0 of eight
successive 4-bit RAM words.
• In the 1:2 multiplex mode, the eight transmitted data bits are placed in pairs into
row 0 and 1 of four successive 4-bit RAM words.
• In the 1:3 multiplex mode, the eight bits are placed in triples into row 0, 1, and 2 to
three successive 3-bit RAM words, with bit 3 of the third address left unchanged. It is
not recommended to use this bit in a display because of the difficult addressing. This
last bit may, if necessary, be controlled by an additional transfer to this address but
care should be taken to avoid overwriting adjacent data because always full bytes are
transmitted.
• In the 1:4 multiplex mode, the eight transmitted data bits are placed in quadruples into
row 0, 1, 2, and 3 of two successive 4-bit RAM words.
7.12 Data pointer
The addressing mechanism for the display RAM is realized using the data pointer. This
allows the loading of an individual display data byte or a series of display data bytes, into
any location of the display RAM. The sequence commences with the initialization of the
data pointer by the load-data-pointer command (see Table 11). After this, the data byte is
stored starting at the display RAM address indicated by the data pointer (see Figure 14).
Once each byte is stored, the data pointer is automatically incremented based on the
selected LCD configuration.
The contents of the data pointer are incremented as follows:
•
•
•
•
In static drive mode by eight.
In 1:2 multiplex drive mode by four.
In 1:3 multiplex drive mode by three.
In 1:4 multiplex drive mode by two.
If an I2C-bus data access terminates early, the state of the data pointer is unknown.
Consequently, the data pointer must be rewritten prior to further RAM accesses.
7.13 Sub-address counter
The storage of display data is conditioned by the contents of the subaddress counter.
Storage is allowed to take place only when the contents of the subaddress counter match
with the hardware subaddress applied to A0, A1, and A2. The subaddress counter value
is defined by the device-select command (see Table 12). If the contents of the subaddress
counter and the hardware subaddress do not match, then data storage is blocked but the
data pointer will be incremented as if data storage had taken place. The subaddress
counter is also incremented when the data pointer overflows.
The storage arrangements described lead to extremely efficient data loading in cascaded
applications. When a series of display bytes are sent to the display RAM, automatic
wrap-over to the next PCF8576C occurs when the last RAM address is exceeded.
Subaddressing across device boundaries is successful even if the change to the next
device in the cascade occurs within a transmitted character.
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PCF8576C
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Universal LCD driver for low multiplex rates
7.14 Bank selector
7.14.1 Output bank selector
The output bank selector (see Table 13), selects one of the four rows per display RAM
address for transfer to the display register. The actual row selected depends on the LCD
drive mode in operation and on the instant in the multiplex sequence.
• In 1:4 multiplex mode: all RAM addresses of row 0 are selected, followed sequentially
by the contents of row 1, row 2, and then row 3.
• In 1:3 multiplex mode: rows 0, 1, and 2 are selected sequentially.
• In 1:2 multiplex mode: rows 0 and 1 are selected.
• In the static mode: row 0 is selected.
The PCF8576C includes a RAM bank switching feature in the static and 1:2 multiplex
drive modes. In the static drive mode, the bank-select command may request the contents
of row 2 to be selected for display instead of the contents of row 0. In 1:2 multiplex drive
mode, the contents of rows 2 and 3 may be selected instead of rows 0 and 1. This
enables preparation of display information in an alternative bank and the ability to switch
to it once it has been assembled.
7.14.2 Input bank selector
The input bank selector (see Table 13) loads display data into the display RAM based on
the selected LCD drive configuration. Using the bank-select command, display data can
be loaded in row 2 into static drive mode or in rows 2 and 3 into 1:2 multiplex drive mode.
The input bank selector functions independently of the output bank selector.
7.15 Blinking
The display blinking capabilities of the PCF8576C are very versatile. The whole display
can be blinked at frequencies selected by the blink-select command. The blinking
frequencies are integer fractions of the clock frequency; the ratios between the clock and
blinking frequencies depend on the mode in which the device is operating (see Table 8).
Table 8.
Blink frequencies
Blinking mode
Normal-power mode
ratio
Power-saving mode
ratio
Blink frequency
off
-
-
blinking off
1
f clk
f blink = ---------------92160
f clk
f blink = ---------------15360
2 Hz
2
f clk
f blink = -------------------184320
f clk
f blink = ---------------30720
1 Hz
3
f clk
f blink = -------------------368640
f clk
f blink = ---------------61440
0.5 Hz
An additional feature is for an arbitrary selection of LCD segments to be blinked. This
applies to the static and 1:2 multiplex drive modes and can be implemented without any
communication overheads. Using the output bank selector, the displayed RAM banks are
exchanged with alternate RAM banks at the blinking frequency. This mode can also be
specified by the blink-select command (see Table 14).
PCF8576C
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PCF8576C
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Universal LCD driver for low multiplex rates
In the 1:3 and 1:4 multiplex modes, where no alternate RAM bank is available, groups of
LCD segments can be blinked by selectively changing the display RAM data at fixed time
intervals.
If the entire display must be blinked at a frequency other than the nominal blink frequency,
this can be done using the mode-set command to set and reset the display enable bit E at
the required rate (see Table 10).
7.16 Characteristics of the I2C-bus
The I2C-bus is for bidirectional, two-line communication between different ICs or modules.
The two lines are a Serial DAta line (SDA) and a Serial CLock line (SCL). Both lines must
be connected to a positive supply via a pull-up resistor when connected to the output
stages of a device. Data transfer may be initiated only when the bus is not busy.
7.16.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse. Changes in the data line at this time will
be interpreted as a control signal. Bit transfer is illustrated in Figure 15.
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Fig 15. Bit transfer
7.16.2 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW change
of the data line, while the clock is HIGH, is defined as the START condition (S).
A LOW-to-HIGH change of the data line, while the clock is HIGH, is defined as the STOP
condition (P). The START and STOP conditions are illustrated in Figure 16.
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Fig 16. Definition of START and STOP conditions
PCF8576C
Product data sheet
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PCF8576C
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Universal LCD driver for low multiplex rates
7.16.3 System configuration
A device generating a message is a transmitter and a device receiving a message is the
receiver. The device that controls the message is the master and the devices which are
controlled by the master are the slaves. The system configuration is illustrated in
Figure 17.
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Fig 17. System configuration
7.16.4 Acknowledge
The number of data bytes transferred between the START and STOP conditions from
transmitter to receiver is unlimited. Each byte of eight bits is followed by an acknowledge
cycle.
• A slave receiver, which is addressed, must generate an acknowledge after the
reception of each byte.
• A master receiver must generate an acknowledge after the reception of each byte that
has been clocked out of the slave transmitter.
• The device that acknowledges must pull-down the SDA line during the acknowledge
clock pulse, so that the SDA line is stable LOW during the HIGH period of the
acknowledge related clock pulse (set-up and hold times must be considered).
• A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
Acknowledgement on the I2C-bus is illustrated in Figure 18.
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Fig 18. Acknowledgement of the I2C-bus
PCF8576C
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PCF8576C
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Universal LCD driver for low multiplex rates
7.16.5 PCF8576C I2C-bus controller
The PCF8576C acts as an I2C-bus slave receiver. It does not initiate I2C-bus transfers or
transmit data to an I2C-bus master receiver. The only data output from the PCF8576C are
the acknowledge signals of the selected devices. Device selection depends on the
I2C-bus slave address, the transferred command data and the hardware subaddress.
In single device application, the hardware subaddress inputs A0, A1, and A2 are normally
tied to VSS which defines the hardware subaddress 0. In multiple device applications
A0, A1, and A2 are tied to VSS or VDD using a binary coding scheme so that no two
devices with a common I2C-bus slave address have the same hardware subaddress.
In the power-saving mode, it is possible that the PCF8576C is not able to keep up with the
highest transmission rates when large amounts of display data are transmitted. If this
situation occurs, the PCF8576C forces the SCL line LOW until its internal operations are
completed. This is known as the clock synchronization feature of the I2C-bus and serves
to slow down fast transmitters. Data loss does not occur.
7.16.6 Input filter
To enhance noise immunity in electrically adverse environments, RC low-pass filters are
provided on the SDA and SCL lines.
7.17 I2C-bus protocol
Two I2C-bus slave addresses (0111000 and 0111001) are reserved for the PCF8576C.
The least significant bit of the slave address that a PCF8576C responds to is defined by
the level tied at its input SA0. Therefore, two types of PCF8576C can be distinguished on
the same I2C-bus which allows:
• Up to 16 PCF8576Cs on the same I2C-bus for very large LCD applications.
• The use of two types of LCD multiplexes on the same I2C-bus.
The I2C-bus protocol is shown in Figure 19. The sequence is initiated with a START
condition (S) from the I2C-bus master which is followed by one of the two PCF8576C
slave addresses available. All PCF8576Cs with the corresponding SA0 level acknowledge
in parallel with the slave address but all PCF8576Cs with the alternative SA0 level ignore
the whole I2C-bus transfer.
After acknowledgement, one or more command bytes follow which define the status of the
addressed PCF8576Cs.
The last command byte is tagged with a cleared most significant bit, the continuation bit C.
The command bytes are also acknowledged by all addressed PCF8576Cs on the bus.
After the last command byte, a series of display data bytes may follow. These display
bytes are stored in the display RAM at the address specified by the data pointer and the
subaddress counter. Both data pointer and subaddress counter are automatically updated
and the data is directed to the intended PCF8576C device. The acknowledgement after
each byte is made only by the (A0, A1, and A2) addressed PCF8576C. After the last
display byte, the I2C-bus master issues a STOP condition (P).
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PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
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Fig 19. I2C-bus protocol
7.18 Command decoder
The command decoder identifies command bytes that arrive on the I2C-bus. All available
commands carry a continuation bit C in the most significant bit position as shown in
Figure 20. When this bit is set logic 1, it indicates that the next byte of the transfer to arrive
will also represent a command. If this bit is set logic 0, it indicates that the command byte
is the last in the transfer. Further bytes will be regarded as display data.
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(1) C = 0; last command.
(2) C = 1; commands continue.
Fig 20. General format of the command byte
The five commands available to the PCF8576C are defined in Table 9.
Table 9.
PCF8576C
Product data sheet
Definition of PCF8576C commands
Command
Operation Code
Reference
Bit
7
6
5
4
3
2
1
LP
E
B
M[1:0]
0
mode-set
C
1
0
load-data-pointer
C
0
P[5:0]
Section 7.18.1
device-select
C
1
1
0
0
A[2:0]
bank-select
C
1
1
1
1
0
I
blink-select
C
1
1
1
0
AB
BF[1:0]
Section 7.18.2
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Rev. 13 — 16 December 2013
Section 7.18.3
O
Section 7.18.4
Section 7.18.5
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PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
7.18.1 Mode-set command
Table 10.
Mode-set command bit description
Bit
Symbol
Value
Description
7
C
0, 1
see Figure 20
6 to 5
-
10
fixed value
4
LP
3
power dissipation (see Table 7)
0
normal-power mode
1
power-saving mode
E
2
display status
0
disabled[1]
1
enabled
LCD bias configuration[2]
B
1 to 0
0
1⁄
3
bias
1
1⁄
2
bias
M[1:0]
LCD drive mode selection
01
static; BP0
10
1:2 multiplex; BP0, BP1
11
1:3 multiplex; BP0, BP1, BP2
00
1:4 multiplex; BP0, BP1, BP2, BP3
[1]
The possibility to disable the display allows implementation of blinking under external control.
[2]
Bit B is not applicable for the static LCD drive mode.
7.18.2 Load-data-pointer command
Table 11.
Load-data-pointer command bit description
Bit
Symbol
Value
Description
7
C
0, 1
see Figure 20
6
-
0
fixed value
5 to 0
P[5:0]
000000 to
100111
6-bit binary value, 0 to 39; transferred to the data pointer to
define one of forty display RAM addresses
7.18.3 Device-select command
PCF8576C
Product data sheet
Table 12.
Device-select command bit description
Bit
Symbol
Value
Description
7
C
0, 1
see Figure 20
6 to 4
-
1100
fixed value
3 to 0
A[2:0]
000 to 111
3-bit binary value, 0 to 7; transferred to the subaddress
counter to define one of eight hardware subaddresses
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PCF8576C
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Universal LCD driver for low multiplex rates
7.18.4 Bank-select command
Table 13.
Bank-select command bit description
Bit
Symbol
Value
Description
Static
7
C
0, 1
see Figure 20
6 to 2
-
11110
fixed value
1
I
input bank selection; storage of arriving display data
0
1
0
[1]
1:2 multiplex[1]
O
RAM bit 0
RAM bits 0 and 1
RAM bit 2
RAM bits 2 and 3
output bank selection; retrieval of LCD display data
0
RAM bit 0
RAM bits 0 and 1
1
RAM bit 2
RAM bits 2 and 3
The bank-select command has no effect in 1:3 and 1:4 multiplex drive modes.
7.18.5 Blink-select command
Table 14.
Blink-select command bit description
Bit
Symbol
Value
Description
7
C
0, 1
see Figure 20
6 to 3
-
1110
2
AB
1 to 0
fixed value
blink mode selection
0
normal blinking[1]
1
alternate RAM bank blinking[2]
BF[1:0]
blink frequency selection
00
off
01
1
10
2
11
3
[1]
Normal blinking is assumed when the LCD multiplex drive modes 1:3 or 1:4 are selected.
[2]
Alternate RAM bank blinking does not apply in 1:3 and 1:4 multiplex drive modes.
7.19 Display controller
The display controller executes the commands identified by the command decoder. It
contains the status registers of the PCF8576C and coordinates their effects. The
controller is also responsible for loading display data into the display RAM as required by
the filling order.
PCF8576C
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PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
8. Internal circuitry
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DDD
Fig 21. Device protection diagram
9. Safety notes
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
CAUTION
Static voltages across the liquid crystal display can build up when the LCD supply voltage
(VLCD) is on while the IC supply voltage (VDD) is off, or vice versa. This may cause unwanted
display artifacts. To avoid such artifacts, VLCD and VDD must be applied or removed together.
CAUTION
Semiconductors are light sensitive. Exposure to light sources can cause the IC to
malfunction. The IC must be protected against light. The protection must be applied to all
sides of the IC.
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
30 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
10. Limiting values
Table 15. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
supply voltage
VDD
[1]
Min
Max
Unit
0.5
+8.0
V
VDD 8.0 VDD
V
0.5
+8.0
V
0.5
+8.0
V
VLCD
LCD supply voltage
VI
input voltage
on each of the pins SCL, SDA,
CLK, SYNC, SA0, OSC and
A0 to A2
VO
output voltage
on each of the pins
S0 to S39 and BP0 to BP3
II
input current
20
+20
mA
IO
output current
25
+25
mA
IDD
supply current
50
+50
mA
ISS
ground supply current
50
+50
mA
IDD(LCD)
LCD supply current
50
+50
mA
Ptot
total power dissipation
-
400
mW
Po
output power
-
100
mW
VESD
electrostatic discharge
voltage
-
4000
V
all pins
-
500
V
corner pins
-
1000
V
-
500
V
[1]
HBM
[2]
CDM
[4]
PCF8576CHL
PCF8576CT
all pins
corner pins
PCF8576C
Product data sheet
-
750
V
Ilu
latch-up current
[5]
-
150
mA
Tstg
storage temperature
[6]
65
+150
C
Tamb
ambient temperature
40
+85
C
operating device
[1]
Values with respect to VDD.
[2]
Pass level; Human Body Model (HBM), according to Ref. 8 “JESD22-A114”.
[3]
Pass level; Machine Model (MM), according to Ref. 9 “JESD22-A115”.
[4]
Pass level; Charged-Device Model (CDM), according to Ref. 10 “JESD22-C101”.
[5]
Pass level; latch-up testing according to Ref. 11 “JESD78” at maximum ambient temperature (Tamb(max)).
[6]
According to the store and transport requirements (see Ref. 13 “UM10569”) the devices have to be stored
at a temperature of +8 C to +45 C and a humidity of 25 % to 75 %.
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
31 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
11. Static characteristics
Table 16. Static characteristics
VDD = 2.0 V to 6.0 V; VSS = 0 V; VLCD = VDD 2.0 V to VDD 6.0 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
Supplies
VDD
supply voltage
VLCD
LCD supply voltage
2.0
-
6.0
[1]
VDD 6.0
-
VDD 2.0 V
IDD
supply current:
fclk = 200 kHz
[2]
-
-
120
A
IDD(lp)
low-power mode supply
current
VDD = 3.5 V; VLCD = 0 V; fclk = 35 kHz;
A0, A1 and A2 connected to VSS
-
-
60
A
VIL
LOW-level input voltage
on pins CLK, SYNC, OSC,
A0 to A2 and SA0
VSS
-
0.3VDD
V
VIH
HIGH-level input voltage
on pins CLK, SYNC, OSC,
A0 to A2 and SA0
0.7VDD
-
VDD
V
VOL
LOW-level output voltage
IOL = 0 mA
-
-
0.05
V
VOH
HIGH-level output voltage
IOH = 0 mA
VDD 0.05 -
-
V
IOL
LOW-level output current
output sink current;
VOL = 1.0 V; VDD = 5.0 V;
on pins CLK and SYNC
1
-
-
mA
IL
leakage current
VI = VDD or VSS; on pins
CLK, SCL, SDA, A0 to A2 and SA0
1
-
+1
A
IL(OSC)
leakage current on pin OSC
VI = VDD
1
-
+1
A
Ipd
pull-down current
VI = 1.0 V; VDD = 5.0 V;
on pins A0 to A2 and OSC
15
50
150
A
RSYNC_N
SYNC resistance
20
50
150
k
VPOR
power-on reset voltage
[3]
-
1.0
1.6
V
CI
input capacitance
[4]
-
-
7
pF
Logic
I2C-bus;
pins SDA and SCL
VIL
LOW-level input voltage
VSS
-
0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
6.0
V
IOH(CLK)
HIGH-level output current on
pin CLK
output source current;
VOH = 4.0 V; VDD = 5.0 V
1
-
-
mA
IOL(SDA)
LOW-level output current on
pin SDA
output sink current;
VOL = 0.4 V; VDD = 5.0 V
3
-
-
mA
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
32 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
Table 16. Static characteristics …continued
VDD = 2.0 V to 6.0 V; VSS = 0 V; VLCD = VDD 2.0 V to VDD 6.0 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
20
-
+20
mV
LCD outputs
VBP
voltage on pin BP
Cbpl = 35 nF; on pins BP0 to BP3
VS
voltage on pin S
Csgm = 5 nF; on pins S0 to S39
20
-
+20
mV
RBP
resistance on pin BP
VLCD = VDD 5 V; on pins BP0 to BP3
[5]
-
-
5
k
resistance on pin S
VLCD = VDD 5 V; on pins S0 to S39
[5]
-
-
7.5
k
RS
[1]
VLCD VDD 3 V for 1⁄3 bias.
[2]
LCD outputs are open-circuit; inputs at VSS or VDD; external clock with 50 % duty factor; I2C-bus inactive.
[3]
Resets all logic when VDD < VPOR.
[4]
Periodically sampled, not 100 % tested.
[5]
Outputs measured one at a time.
11.1 Typical supply current characteristics
PEH
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VDD = 5 V; VLCD = 0 V; Tamb = 25 C
Fig 22. ISS as a function of ffr
PCF8576C
Product data sheet
IIU+]
IIU+]
VDD = 5 V; VLCD = 0 V; Tamb = 25 C
Fig 23. IDD(LCD) as a function of ffr
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
33 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
PEH
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9''9
&
VLCD = 0 V; external clock; Tamb = 25 C
9''9
VLCD = 0 V; external clock; Tamb = 25 C
Fig 24. ISS as a function of VDD
Fig 25. IDD(LCD) as a function of VDD
11.2 Typical LCD output characteristics
PEH
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56
56
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9''9
VLCD = 0 V; Tamb = 25 C
Fig 26. RO(max) as a function of VDD
PCF8576C
Product data sheet
7DPE&
VDD = 5 V; VLCD = 0 V
Fig 27. RO(max) as a function of Tamb
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
34 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
12. Dynamic characteristics
Table 17. Dynamic characteristics
VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = VDD 2.0 V to VDD 6.0 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
125
200
315
kHz
21
31
48
kHz
Timing characteristics: driver timing waveforms (see Figure 28)
clock frequency
fclk
normal-power mode;
VDD = 5 V
[1]
power-saving mode;
VDD = 3 V
tclk(H)
clock HIGH time
1
-
-
s
tclk(L)
clock LOW time
1
-
-
s
-
-
400
ns
1
-
-
s
-
-
30
s
4.7
-
-
s
tPD(SYNC_N) SYNC propagation delay
tSYNC_NL
SYNC LOW time
tPD(drv)
driver propagation delay
VLCD = 5 V
Timing characteristics: I2C-bus (see Figure 29)
tBUF
bus free time between a STOP and START
condition
[2]
tHD;STA
hold time (repeated) START condition
4.0
-
-
s
tSU;STA
set-up time for a repeated START condition
4.7
-
-
s
tLOW
LOW period of the SCL clock
4.7
-
-
s
tHIGH
HIGH period of the SCL clock
4.0
-
-
s
tr
rise time of both SDA and SCL signals
-
-
1
s
tf
fall time of both SDA and SCL signals
-
-
0.3
s
Cb
capacitive load for each bus line
-
-
400
pF
tSU;DAT
data set-up time
250
-
-
ns
tHD;DAT
data hold time
0
-
-
ns
tSU;STO
set-up time for STOP condition
4.0
-
-
s
[1]
fclk < 125 kHz, I2C-bus maximum transmission speed is derated.
[2]
All timing values are valid within the operating supply voltage and ambient temperature range and are referenced to VIL and VIH with an
input voltage swing of VSS to VDD.
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
35 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
I&/.
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Fig 29. I2C-bus timing waveforms
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
36 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
13. Application information
13.1 Cascaded operation
In large display configurations, up to 16 PCF8576Cs can be recognized on the same
I2C-bus by using the 3-bit hardware subaddress (A0, A1, and A2) and the programmable
I2C-bus slave address (SA0).
Table 18.
Addressing cascaded PCF8576C
Cluster
Bit SA0
Pin A2
Pin A1
Pin A0
Device
1
0
0
0
0
0
0
0
1
1
0
1
0
2
0
1
1
3
1
0
0
4
1
0
1
5
1
1
0
6
2
1
1
1
1
7
0
0
0
8
0
0
1
9
0
1
0
10
0
1
1
11
1
0
0
12
1
0
1
13
1
1
0
14
1
1
1
15
Cascaded PCF8576Cs are synchronized. They can share the backplane signals from one
of the devices in the cascade. Such an arrangement is cost-effective in large LCD
applications since the backplane outputs of only one device must be through-plated to the
backplane electrodes of the display. The other PCF8576C of the cascade contribute
additional segment outputs. The backplanes can either be connected together to enhance
the drive capability, some can be left open-circuit (as shown in Figure 30) or just some of
one and some of the other device can be taken to facilitate the layout of the display.
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
37 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
9''
9/&'
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Fig 30. Cascaded PCF8576C configuration
The SYNC line is provided to maintain the correct synchronization between all cascaded
PCF8576Cs. This synchronization is guaranteed after the power-on reset. The only time
that SYNC is likely to be needed is if synchronization is accidentally lost (e.g. by noise in
adverse electrical environments; or by the defining a multiplex mode when PCF8576Cs
with differing SA0 levels are cascaded).
SYNC is organized as an input/output pin; the output selection being realized as an
open-drain driver with an internal pull-up resistor. A PCF8576C asserts the SYNC line and
monitors the SYNC line at all other times. If synchronization in the cascade is lost, it is
restored by the first PCF8576C to assert SYNC. The timing relationship between the
backplane waveforms and the SYNC signal for the various drive modes of the PCF8576C
are shown in Figure 31.
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
38 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
7IU
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Excessive capacitive coupling between SCL or CLK and SYNC causes erroneous synchronization.
If this is a problem, you can increase the capacitance of the SYNC line (e.g. by an external
capacitor between SYNC and VDD.) Degradation of the positive edge of the SYNC pulse can be
countered by an external pull-up resistor.
Fig 31. Synchronization of the cascade for the various PCF8576C drive modes
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
39 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
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Fig 32. Single plane wiring of packaged PCF8576CT
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
40 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
14. Package outline
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PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
41 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
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PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
42 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
15. Bare die outline
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PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
43 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
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PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
44 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
Table 19. Pad and bump description for PCF8576CU
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip.
PCF8576C
Product data sheet
Symbol
Pad
X (m)
Y (m)
Description
SDA
1
74
1380
I2C-bus serial data input/output
SCL
2
148
1380
I2C-bus serial clock input
SYNC
3
355
1380
cascade synchronization input/output
CLK
4
534
1380
external clock input/output
VDD
5
742
1380
supply voltage
OSC
6
913
1380
internal oscillator enable input
A0
7
1087
1380
subaddress input
A1
8
1290
1284
subaddress input
A2
9
1290
1116
subaddress input
SA0
10
1290
945
subaddress input
VSS
11
1290
751
logic ground
VLCD
12
1290
485
LCD supply voltage
BP0
13
1290
125
LCD backplane output
BP2
14
1290
285
LCD backplane output
BP1
15
1290
458
LCD backplane output
BP3
16
1290
618
LCD backplane output
S0
17
1290
791
LCD segment output
S1
18
1290
951
LCD segment output
S2
19
1290
1124
LCD segment output
S3
20
1290
1284
LCD segment output
S4
21
1074
1380
LCD segment output
S5
22
914
1380
LCD segment output
S6
23
741
1380
LCD segment output
S7
24
581
1380
LCD segment output
S8
25
408
1380
LCD segment output
S9
26
248
1380
LCD segment output
S10
27
75
1380
LCD segment output
S11
28
85
1380
LCD segment output
S12
29
258
1380
LCD segment output
S13
30
418
1380
LCD segment output
S14
31
591
1380
LCD segment output
S15
32
751
1380
LCD segment output
S16
33
924
1380
LCD segment output
S17
34
1084
1380
LCD segment output
S18
35
1290
1243
LCD segment output
S19
36
1290
1083
LCD segment output
S20
37
1290
910
LCD segment output
S21
38
1290
750
LCD segment output
S22
39
1290
577
LCD segment output
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
45 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
Table 19. Pad and bump description for PCF8576CU
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip.
Symbol
Pad
X (m)
Y (m)
Description
S23
40
1290
417
LCD segment output
S24
41
1290
244
LCD segment output
S25
42
1290
84
LCD segment output
S26
43
1290
89
LCD segment output
S27
44
1290
249
LCD segment output
S28
45
1290
422
LCD segment output
S29
46
1290
582
LCD segment output
S30
47
1290
755
LCD segment output
S31
48
1290
915
LCD segment output
S32
49
1290
1088
LCD segment output
S33
50
1290
1248
LCD segment output
S34
51
1083
1380
LCD segment output
S35
52
923
1380
LCD segment output
S36
53
750
1380
LCD segment output
S37
54
590
1380
LCD segment output
S38
55
417
1380
LCD segment output
S39
56
257
1380
LCD segment output
Table 20.
PCF8576C
Product data sheet
Alignment marks
Symbol
X (m)
Y (m)
C1
1290
1385
C2
1295
1385
F
1305
1405
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46 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
16. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
17. Packing information
17.1 Tray information
Tray information for the PCF8576CU/F1 and PCF8576CU/2/F2 is shown in Figure 37,
Figure 38 and Table 21.
&
-
$
+
[
%
$
$
.
)
(
'
\
\
[
*
)
(
&
2
1
/
0
6(&7,21$$
;
'LPHQVLRQVLQPP
GHWDLO;
DDD
Fig 37. Tray details
PCF8576C
Product data sheet
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Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
47 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
Table 21. Description of tray details
Tray details are shown in Figure 37.
Tray details
Dimensions
A
B
C
D
E
F
G
H
J
K
L
M
N
O
Unit
4.4
4.4
3.02
3.3
50.8
45.72
39.6
5.6
5.6
39.6
3.96
2.18
2.49
0.5
mm
Number of pockets
x direction
y direction
10
10
PDUNLQJFRGH
DDD
Fig 38. Tray alignment
PCF8576C
Product data sheet
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Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
48 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
18. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
18.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
18.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
18.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
PCF8576C
Product data sheet
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Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
49 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
18.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 39) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 22 and 23
Table 22.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
220
Table 23.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 39.
PCF8576C
Product data sheet
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Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
50 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 39. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
51 of 62
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
NXP Semiconductors
PCF8576C
Product data sheet
19. Appendix
19.1 LCD segment driver selection
Table 24.
Selection of LCD segment drivers
Type name
Number of elements at MUX
VDD (V)
VLCD (V)
ffr (Hz)
1:1 1:2 1:3 1:4 1:6 1:8 1:9
VLCD (V) VLCD (V)
Tamb (C)
charge temperature
pump
compensat.
Interface
Package
AECQ100
PCA8561AHN[5]
18
36
54
72
-
-
-
1.8 to 5.5 1.8 to 5.5 32 to 256[1]
N
N
40 to 105 I2C
HVQFN32 Y
PCA8561BHN[5]
18
36
54
72
-
-
-
1.8 to 5.5 1.8 to 5.5 32 to 256[1]
N
N
40 to 105 SPI
HVQFN32 Y
PCF8566TS
24
48
72
96
-
-
-
2.5 to 6
N
N
40 to 85
I2C
VSO40
N
40 to 85
I2C
TSSOP48 N
I2C
TSSOP48 Y
PCF85162T
32
64
96
128 -
-
-
2.5 to 6
69
1.8 to 5.5 2.5 to 6.5 82
N
N
32
64
96
128 -
-
-
1.8 to 5.5 2.5 to 8
110
N
N
40 to 95
PCA85262ATT
32
64
96
128 -
-
-
1.8 to 5.5 2.5 to 8
200
N
N
40 to 105 I2C
TSSOP48 Y
TSSOP48 N
TSSOP48 N
PCF8551ATT[5]
PCF8551BTT[5]
36
36
72
72
108 144 108 144 -
-
-
1.8 to 5.5 1.8 to 5.5 32 to
128[1]
N
N
40 to 85
I2C
1.8 to 5.5 1.8 to 5.5 32 to
128[1]
N
N
40 to 85
SPI
256[1]
I2C
TSSOP48 Y
PCA8551ATT[5]
36
72
108 144 -
-
-
1.8 to 5.5 1.8 to 5.5 32 to
N
N
40 to 105
PCA8551BTT[5]
36
72
108 144 -
-
-
1.8 to 5.5 1.8 to 5.5 32 to 256[1]
N
N
40 to 105 SPI
TSSOP48 Y
PCF85176T
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 6.5 82
N
N
40 to 85
I2C
TSSOP56 N
N
40 to 95
I2C
TSSOP56 Y
N
N
40 to 105
I2C
TSSOP56 Y
N
N
40 to 85
I2C
TQFP64
N
N
40 to 95
I2C
TQFP64
Y
TSSOP56 N
PCA85176T
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 8
110
PCA85276ATT
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 8
PCF85176H
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 6.5 82
PCA85176H
PCF8553ATT[5]
40
40
80
80
120 160 120 160 -
-
-
1.8 to 5.5 2.5 to 8
N
200
82
N
1.8 to 5.5 1.8 to 5.5 32 to
128[1]
N
N
40 to 85
I2C
128[1]
40
80
120 160 -
-
-
1.8 to 5.5 1.8 to 5.5 32 to
N
N
40 to 85
SPI
TSSOP56 N
PCA8553ATT[5]
40
80
120 160 -
-
-
1.8 to 5.5 1.8 to 5.5 32 to 256[1]
N
N
40 to 105 I2C
TSSOP56 Y
-
1.8 to 5.5 1.8 to 5.5 32 to
256[1]
N
N
40 to 105 SPI
TSSOP56 Y
1.8 to 5.5 2.5 to 9
60 to
300[1]
N
N
40 to 95
I2C
TSSOP56 Y
300[1]
N
N
40 to 95
SPI
TSSOP56 Y
Y
Y[3]
40 to 95
I2C
TQFP64
Y
Y
Y[3]
40 to 95
SPI
TQFP64
Y
N
40 to 85
I2C
LQFP80
N
N
40 to 95
I2C
LQFP80
Y
PCA8553BTT[5]
PCA8546ATT
40
-
80
-
120 160 -
176 -
-
-
52 of 62
© NXP B.V. 2013. All rights reserved.
PCA8546BTT
-
-
-
176 -
-
-
1.8 to 5.5 2.5 to 9
60 to
PCA8547AHT[5]
44
88
-
176 -
-
-
1.8 to 5.5 2.5 to 9
60 to 300[1]
1.8 to 5.5 2.5 to 9
300[1]
PCA8547BHT[5]
PCF85134HL
PCA85134H
44
60
60
88
-
176 -
120 180 240 120 180 240 -
-
-
60 to
1.8 to 5.5 2.5 to 6.5 82
1.8 to 5.5 2.5 to 8
82
N
N
PCF8576C
PCF8553BTT[5]
Universal LCD driver for low multiplex rates
Rev. 13 — 16 December 2013
All information provided in this document is subject to legal disclaimers.
PCA85162T
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Selection of LCD segment drivers …continued
Type name
Number of elements at MUX
VDD (V)
VLCD (V)
ffr (Hz)
VLCD (V) VLCD (V)
Tamb (C)
charge temperature
pump
compensat.
60 to 300[1]
Y
Y
1:1 1:2 1:3 1:4 1:6 1:8 1:9
40 to 105 I2C
LQFP80
Y
120 -
240 -
PCF8545ATT
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 5.5 60 to 300[1]
N
N
40 to 85
I2C
TSSOP56 N
PCF8545BTT
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 5.5 60 to 300[1]
N
N
40 to 85
SPI
TSSOP56 N
176 252 320 -
60 to
300[1]
N
N
40 to 85
I2C
TSSOP56 N
300[1]
-
-
2.5 to 5.5 2.5 to 9
AECQ100
60
-
-
Package
PCA8543AHL
PCF8536AT[4]
-
Interface
1.8 to 5.5 2.5 to 9
PCF8536BT[4]
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 9
60 to
N
N
40 to 85
SPI
TSSOP56 N
PCA8536AT[4]
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 9
60 to 300[1]
N
N
40 to 95
I2C
TSSOP56 Y
1.8 to 5.5 2.5 to 9
60 to
300[1]
N
N
40 to 95
SPI
TSSOP56 Y
60 to
300[1]
Y
Y[3]
40 to 85
I2C
TQFP64
300[1]
PCA8536BT[4]
PCF8537AH
44
88
-
176 252 320 176 276 352 -
1.8 to 5.5 2.5 to 9
N
44
88
-
176 276 352 -
1.8 to 5.5 2.5 to 9
60 to
Y
40 to 85
SPI
TQFP64
N
PCA8537AH
44
88
-
176 276 352 -
1.8 to 5.5 2.5 to 9
60 to 300[1]
Y
Y[3]
40 to 95
I2C
TQFP64
Y
PCA8537BH
44
88
-
176 276 352 -
1.8 to 5.5 2.5 to 9
60 to 300[1]
Y
Y[3]
40 to 95
SPI
TQFP64
Y
2.5 to 5.5 2.5 to 9
60 to
300[1]
Y
Y[3]
40 to 105
I2C
LQFP80
Y
60 to
300[1]
Y
Y[3]
40 to 105
I2C
bare die
Y
-
1.8 to 5.5 1.8 to 5.5 32 to 128[1]
N
N
40 to 85
I2C, SPI
bare die
N
-
256[1]
N
40 to 105
I2C,
bare die
Y
N
40 to 85
I2C
bare die
N
I2C
60
120 -
PCA9620U
60
120 -
PCF8552DUG[5]
36
72
PCA8552DUG[5]
PCF8576DU
36
40
72
80
240 320 480 240 320 480 -
108 144 108 144 120 160 -
-
-
2.5 to 5.5 2.5 to 9
1.8 to 5.5 1.8 to 5.5 32 to
1.8 to 5.5 2.5 to 6.5 77
N
N
SPI
PCF8576EUG
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 6.5 77
N
N
40 to 85
bare die
N
PCA8576FUG
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 8
N
N
40 to 105 I2C
bare die
Y
N
40 to 85
I2C
bare die
N
N
40 to 95
I2C
bare die
Y
I2C
PCF85133U
PCA85133U
80
80
160 240 320 160 240 320 -
PCA85233U
80
PCA8530DUG[5]
102 204 -
PCF85132U
408 -
160 320 480 640 160 320 480 640 -
53 of 62
© NXP B.V. 2013. All rights reserved.
PCA85232U
160 320 480 640 -
PCF8538UG
102 204 -
PCA8538UG
102 204 -
-
-
1.8 to 5.5 2.5 to 6.5 82,
110[2]
1.8 to 5.5 2.5 to 8
110[2]
82,
N
N
40 to 105
bare die
Y
Y
Y[3]
40 to 105 I2C, SPI
bare die
Y
N
40 to 85
I2C
bare die
N
N
40 to 95
I2C
bare die
Y
N
N
40 to 95
I2C
bare die
Y
Y
Y[3]
40 to 85
I2C, SPI[2] bare die
N
Y
Y[3]
40 to 105
I2C,
Y
-
1.8 to 5.5 2.5 to 8
150,
-
-
2.5 to 5.5 4 to 12
45 to 300[1]
-
-
1.8 to 5.5 1.8 to 8
1.8 to 5.5 1.8 to 8
1.8 to 5.5 1.8 to 8
60 to
90[1]
60 to
90[1]
117 to
176[1]
408 612 816 918 2.5 to 5.5 4 to 12
45 to 300[1]
408 612 816 918 2.5 to 5.5 4 to 12
300[1]
[1]
Can be selected by command.
[2]
Can be selected by pin configuration.
45 to
N
220[2]
-
N
N
N
SPI[2]
bare die
PCF8576C
PCA85132U
160 240 320 -
-
200
Universal LCD driver for low multiplex rates
Rev. 13 — 16 December 2013
All information provided in this document is subject to legal disclaimers.
PCF8537BH
Y[3]
PCA9620H
NXP Semiconductors
PCF8576C
Product data sheet
Table 24.
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Extra feature: Temperature sensor.
[4]
Extra feature: 6 PWM channels.
[5]
In development.
NXP Semiconductors
PCF8576C
Product data sheet
[3]
PCF8576C
54 of 62
© NXP B.V. 2013. All rights reserved.
Universal LCD driver for low multiplex rates
Rev. 13 — 16 December 2013
All information provided in this document is subject to legal disclaimers.
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
20. Abbreviations
Table 25.
PCF8576C
Product data sheet
Abbreviations
Acronym
Description
CDM
Charged-Device Model
DC
Direct Current
HBM
Human Body Model
I2C
Inter-Integrated Circuit
IC
Integrated Circuit
LCD
Liquid Crystal Display
LSB
Least Significant Bit
MM
Machine Model
MOS
Metal-Oxide Semiconductor
MSB
Most Significant Bit
MSL
Moisture Sensitivity Level
PCB
Printed-Circuit Board
POR
Power-On Reset
RC
Resistance-Capacitance
RAM
Random Access Memory
RMS
Root Mean Square
SCL
Serial CLock line
SDA
Serial DAta line
SMD
Surface-Mount Device
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
55 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
21. References
[1]
AN10170 — Design guidelines for COG modules with NXP monochrome LCD
drivers
[2]
AN10365 — Surface mount reflow soldering description
[3]
AN10706 — Handling bare die
[4]
AN11267 — EMC and system level ESD design guidelines for LCD drivers
[5]
IEC 60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[6]
IEC 61340-5 — Protection of electronic devices from electrostatic phenomena
[7]
IPC/JEDEC J-STD-020D — Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices
[8]
JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM)
[9]
JESD22-A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model
(MM)
[10] JESD22-C101 — Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components
[11] JESD78 — IC Latch-Up Test
[12] UM10204 — I2C-bus specification and user manual
[13] UM10569 — Store and transport requirements
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
56 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
22. Revision history
Table 26.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCF8576C v.13
20131216
Product data sheet
-
PCF8576C v.12
Modifications:
•
•
Changed product ordering information
Enhanced the description of connecting segment and backplane outputs in a cascade
(Section 13)
PCF8576C v.12
20130716
Product data sheet
-
PCF8576C v.11
PCF8576C v.11
20120330
Product data sheet
-
PCF8576C v.10
PCF8576C v.10
20100722
Product data sheet
-
PCF8576C v.9
PCF8576C v.9
20090709
Product data sheet
-
PCF8576C v.8
PCF8576C v.8
20041122
Product specification
-
PCF8576C v.7
PCF8576C v.7
20011002
Product specification
-
PCF8576C v.6
PCF8576C v.6
19980730
Product specification
-
PCF8576C v.5
PCF8576C v.5
19971114
Product specification
-
PCF8576C v.4
PCF8576C v.4
19970402
Product specification
-
PCF8576C v.3
PCF8576C v.3
19970203
Product specification
-
PCF8576C v.2
PCF8576C v.2
19961209
Product specification
-
PCF8576C v.1
PCF8576C v.1
19950630
Product specification
-
-
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
57 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
23. Legal information
23.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
23.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
23.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PCF8576C
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
58 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Bare die — All die are tested on compliance with their related technical
specifications as stated in this data sheet up to the point of wafer sawing and
are handled in accordance with the NXP Semiconductors storage and
transportation conditions. If there are data sheet limits not guaranteed, these
will be separately indicated in the data sheet. There are no post-packing tests
performed on individual die or wafers.
NXP Semiconductors has no control of third party procedures in the sawing,
handling, packing or assembly of the die. Accordingly, NXP Semiconductors
assumes no liability for device functionality or performance of the die or
systems after third party sawing, handling, packing or assembly of the die. It
is the responsibility of the customer to test and qualify their application in
which the die is used.
All die sales are conditioned upon and subject to the customer entering into a
written die sale agreement with NXP Semiconductors through its legal
department.
23.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
24. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
59 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
25. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Ordering information . . . . . . . . . . . . . . . . . . . . .2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . .2
Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .7
Selection of possible display configurations . . . .8
Biasing characteristics . . . . . . . . . . . . . . . . . . .10
LCD frame frequencies [1] . . . . . . . . . . . . . . . .18
Blink frequencies . . . . . . . . . . . . . . . . . . . . . . .23
Definition of PCF8576C commands . . . . . . . . .27
Mode-set command bit description . . . . . . . . .28
Load-data-pointer command bit description . . .28
Device-select command bit description . . . . . .28
Bank-select command bit description . . . . . . .29
Blink-select command bit description . . . . . . . .29
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .31
Static characteristics . . . . . . . . . . . . . . . . . . . .32
Dynamic characteristics . . . . . . . . . . . . . . . . . .35
Addressing cascaded PCF8576C . . . . . . . . . .37
Pad and bump description for PCF8576CU . . .45
Alignment marks . . . . . . . . . . . . . . . . . . . . . . . .46
Description of tray details . . . . . . . . . . . . . . . . .48
SnPb eutectic process (from J-STD-020D) . . .50
Lead-free process (from J-STD-020D) . . . . . .50
Selection of LCD segment drivers . . . . . . . . . .52
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .55
Revision history . . . . . . . . . . . . . . . . . . . . . . . .57
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
60 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
26. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 10.
Fig 11.
Fig 12.
Fig 13.
Fig 14.
Fig 15.
Fig 16.
Fig 17.
Fig 18.
Fig 19.
Fig 20.
Fig 21.
Fig 22.
Fig 23.
Fig 24.
Fig 25.
Fig 26.
Fig 27.
Fig 28.
Fig 29.
Fig 30.
Fig 31.
Fig 32.
Fig 33.
Fig 34.
Fig 35.
Fig 36.
Fig 37.
Fig 38.
Fig 39.
Block diagram of PCF8576C . . . . . . . . . . . . . . . . .3
Pin configuration for LQFP64 (PCF8576CHL/1) . .4
Pin configuration for VSO56 (PCF8576CT/1) . . . .5
Pin locations of PCF8576CU/F1 and
PCF8576CU/2/F2 . . . . . . . . . . . . . . . . . . . . . . . . .6
Example of displays suitable for PCF8576C . . . . .8
Typical system configuration . . . . . . . . . . . . . . . . .9
Electro-optical characteristic: relative
transmission curve of the liquid . . . . . . . . . . . . . .12
Static drive mode waveforms . . . . . . . . . . . . . . . .13
Waveforms for the 1:2 multiplex drive mode
with 1⁄2 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Waveforms for the 1:2 multiplex drive mode
with 1⁄3 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Waveforms for the 1:3 multiplex drive mode
with 1⁄3 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Waveforms for the 1:4 multiplex mode
with 1⁄3 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Display RAM bit map . . . . . . . . . . . . . . . . . . . . . .20
Relationship between LCD layout, drive mode,
display RAM filling order, and display data
transmitted over the I2C-bus . . . . . . . . . . . . . . . .21
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Definition of START and STOP conditions. . . . . .24
System configuration . . . . . . . . . . . . . . . . . . . . . .25
Acknowledgement of the I2C-bus . . . . . . . . . . . .25
I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . .27
General format of the command byte . . . . . . . . .27
Device protection diagram . . . . . . . . . . . . . . . . . .30
ISS as a function of ffr . . . . . . . . . . . . . . . . . . . . . .33
IDD(LCD) as a function of ffr . . . . . . . . . . . . . . . . . .33
ISS as a function of VDD . . . . . . . . . . . . . . . . . . . .34
IDD(LCD) as a function of VDD . . . . . . . . . . . . . . . .34
RO(max) as a function of VDD . . . . . . . . . . . . . . . . .34
RO(max) as a function of Tamb . . . . . . . . . . . . . . . .34
Driver timing waveforms . . . . . . . . . . . . . . . . . . .36
I2C-bus timing waveforms . . . . . . . . . . . . . . . . . .36
Cascaded PCF8576C configuration . . . . . . . . . .38
Synchronization of the cascade for the various
PCF8576C drive modes . . . . . . . . . . . . . . . . . . .39
Single plane wiring of packaged PCF8576CT . . .40
Package outline SOT314-2 (LQFP64) of
PCF8576CHL/1 . . . . . . . . . . . . . . . . . . . . . . . . . .41
Package outline SOT190-1 (VSO56) of
PCF8576CT/1 . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Bare die outline of PCF8576CU/2/F2 . . . . . . . . .43
Bare die outline of PCF8576CU/F1 . . . . . . . . . . .44
Tray details . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
Tray alignment . . . . . . . . . . . . . . . . . . . . . . . . . . .48
Temperature profiles for large and small
components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 13 — 16 December 2013
© NXP B.V. 2013. All rights reserved.
61 of 62
PCF8576C
NXP Semiconductors
Universal LCD driver for low multiplex rates
27. Contents
1
2
3
3.1
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.3.1
7.4
7.4.1
7.4.2
7.4.3
7.4.4
7.5
7.5.1
7.5.2
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
7.14.1
7.14.2
7.15
7.16
7.16.1
7.16.2
7.16.3
7.16.4
7.16.5
7.16.6
7.17
7.18
7.18.1
7.18.2
7.18.3
7.18.4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
Functional description . . . . . . . . . . . . . . . . . . . 8
Power-On-Reset (POR) . . . . . . . . . . . . . . . . . . 9
LCD bias generator . . . . . . . . . . . . . . . . . . . . . 9
LCD voltage selector . . . . . . . . . . . . . . . . . . . . 9
Electro-optical performance . . . . . . . . . . . . . . 11
LCD drive mode waveforms . . . . . . . . . . . . . . 13
Static drive mode . . . . . . . . . . . . . . . . . . . . . . 13
1:2 Multiplex drive mode. . . . . . . . . . . . . . . . . 14
1:3 Multiplex drive mode. . . . . . . . . . . . . . . . . 16
1:4 multiplex drive mode. . . . . . . . . . . . . . . . . 17
Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Internal clock . . . . . . . . . . . . . . . . . . . . . . . . . 18
External clock . . . . . . . . . . . . . . . . . . . . . . . . . 18
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Display register . . . . . . . . . . . . . . . . . . . . . . . . 19
Shift register . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Segment outputs. . . . . . . . . . . . . . . . . . . . . . . 19
Backplane outputs . . . . . . . . . . . . . . . . . . . . . 19
Display RAM . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Data pointer . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Sub-address counter . . . . . . . . . . . . . . . . . . . 22
Bank selector . . . . . . . . . . . . . . . . . . . . . . . . . 23
Output bank selector . . . . . . . . . . . . . . . . . . . 23
Input bank selector . . . . . . . . . . . . . . . . . . . . . 23
Blinking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Characteristics of the I2C-bus. . . . . . . . . . . . . 24
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
START and STOP conditions . . . . . . . . . . . . . 24
System configuration . . . . . . . . . . . . . . . . . . . 24
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 25
PCF8576C I2C-bus controller . . . . . . . . . . . . . 26
Input filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 26
Command decoder . . . . . . . . . . . . . . . . . . . . . 27
Mode-set command . . . . . . . . . . . . . . . . . . . . 28
Load-data-pointer command. . . . . . . . . . . . . . 28
Device-select command . . . . . . . . . . . . . . . . . 28
Bank-select command . . . . . . . . . . . . . . . . . . 29
7.18.5
Blink-select command . . . . . . . . . . . . . . . . . . 29
7.19
Display controller . . . . . . . . . . . . . . . . . . . . . . 29
8
Internal circuitry . . . . . . . . . . . . . . . . . . . . . . . 30
9
Safety notes. . . . . . . . . . . . . . . . . . . . . . . . . . . 30
10
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 31
11
Static characteristics . . . . . . . . . . . . . . . . . . . 32
11.1
Typical supply current characteristics . . . . . . 33
11.2
Typical LCD output characteristics. . . . . . . . . 34
12
Dynamic characteristics. . . . . . . . . . . . . . . . . 35
13
Application information . . . . . . . . . . . . . . . . . 37
13.1
Cascaded operation. . . . . . . . . . . . . . . . . . . . 37
14
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 41
15
Bare die outline . . . . . . . . . . . . . . . . . . . . . . . . 43
16
Handling information . . . . . . . . . . . . . . . . . . . 47
17
Packing information . . . . . . . . . . . . . . . . . . . . 47
17.1
Tray information . . . . . . . . . . . . . . . . . . . . . . . 47
18
Soldering of SMD packages . . . . . . . . . . . . . . 49
18.1
Introduction to soldering. . . . . . . . . . . . . . . . . 49
18.2
Wave and reflow soldering. . . . . . . . . . . . . . . 49
18.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 49
18.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 50
19
Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
19.1
LCD segment driver selection . . . . . . . . . . . . 52
20
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 55
21
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
22
Revision history . . . . . . . . . . . . . . . . . . . . . . . 57
23
Legal information . . . . . . . . . . . . . . . . . . . . . . 58
23.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 58
23.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
23.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 58
23.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 59
24
Contact information . . . . . . . . . . . . . . . . . . . . 59
25
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
26
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
27
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 16 December 2013
Document identifier: PCF8576C