CCD Area Image Sensor MN39116AT Diagonal 4.5 mm (type-1/4) 270k-pixel CCD Area Image Sensor ■ Overview ■ Pin Assignments The MN39116AT is a 4.5 mm (type-1/4) interline transfer CCD (IT-CCD) solid state image sensor device. This device uses photodiodes in the optoelectric conversion section and CCDs for signal readout. The electronic shutter function has made an exposure time of 1/10 000 seconds possible. Further, this device has the features of high sensitivity, low noise, broad dynamic range, and low smear. This device has a total of 267 206 pixels (542 horizontal × 493 vertical) and provides stable and clear images with a resolution of 360 horizontal TV-lines and 350 vertical TV-lines. Part Number Size MN39116AT 4.5 mm (type-1/4) VDD 1 14 PW φR 2 13 φV4 RD 3 12 φV3 VO 4 11 φV2 LG 5 10 φV1 φH2 6 9 PT φH1 7 8 Sub System Color or B/W EIA B/W (Top View) ■ Features • Effective pixel number 512 (horizontal) × 491 (vertical) • High sensitivity • Broad dynamic range • Low smear • Electronic shutter ■ Applications • Surveillance cameras • FA, OA cameras Publication date: May 2003 SMD00008CEC 1 MN39116AT ■ Block Diagram (2 columns OB + 512 columns valid area + 28 columns OB) LG VO VDD GND 14 5 4 1 3 Output section GND φV4 12 φ V3 11 φ 10 V2 φV1 Vertical shift register (Internal connection) 13 (2 dummies + OB1 + valid area 491 + OB1 + 1 dummy) Sub 14 Photo diode 8 9 Sub PT 7 φH1 6 φR φH2 2 Horizontal shift register (Top 6 dummies) ■ Pin Descriptions Pin No. Symbol 1 VDD 2 Description Pin No. Symbol Power supply 8 Sub Substrate φR Reset pulse (RG) 9 PT P-well for protection circuit 3 RD Reset drain 10 φV1 Vertical shift register clock pulse 1 4 VO Video output 11 φV2 Vertical shift register clock pulse 2 5 LG Output load transistor gate 12 φV3 Vertical shift register clock pulse 3 6 φH2 Horizontal register clock pulse 2 13 φV4 Vertical shift register clock pulse 4 7 φH1 Horizontal register clock pulse 1 14 PW P-well ■ Device Parameter (H × V) Parameter Value Unit * 512 × 491 pixel Image sensing block dimension 3.614 4 × 2.716 mm2 7.2 × 5.6 µm2 Pixel number Pixel dimension Note) *: OB columns are not included. 2 Description SMD00008CEC MN39116AT ■ Absolute Maximum Ratings and Operating Conditions Absolute maximum rating Parameter VDD VRD VPT *3, 4 GND VLG Upper limit Min Typ Max − 0.2 18.0 14.5 15.0 15.5 V − 0.2 18.0 14.5 15.0 15.5 V −10.0 0.2 −8.3 −8.0 −7.7 V 0 V (Referene voltage) VOG High-Low VφH2 VSub V (Supplied internally) V 3.0 3.3 5.3 (Supplied internally) V V High 8.0 3.0 3.3 5.3 V Low − 0.2 − 0.05 0 0.05 V High 8.0 3.0 3.3 5.3 V Low − 0.2 − 0.05 0 0.05 V *2 φVSub (Supplied internally) 8.0 Bias VφH1 Unit Lower limit *6 VφR Operating condition (Supplied internally) V − 0.2 45.0 22.5 23.0 23.5 V High 18.0 14.5 15.0 15.5 V Middle − 0.2 0 0.2 V Low −9.0 −8.3 −8.0 −7.7 V Middle 15.0 − 0.2 0 0.2 V Low −9.0 −8.3 −8.0 −7.7 V High 18.0 14.5 15.0 15.5 V Middle − 0.2 0 0.2 V Low −9.0 −8.3 −8.0 −7.7 V Middle 15.0 − 0.2 0 0.2 V Low −9.0 −8.3 −8.0 −7.7 V Operating temperature −10 60 25 °C Storage temperature −30 80 °C VφV1 *1 *3, 4, 5 VφV2 *3, 4, 5 VφV3 *3, 4, 5 VφV4 *3, 4, 5 Note) 1. Standard photo detecting condition Standard photo detecting condition stands for detecting image with a light source of color temperature of 2 856K, luminance of 1 050 cd/m2, and using a color temperature conversion filter LB-40 (HOYA), infrared cut filter CAW-500S with thickness 2.5 mm for a light path and with F8 lens aperture. The quantity of the incidental light to a photo-detecting surface under the above condition is defined as the standard quantity of light. 2. *1: VSub when using electronic shutter function φVSub H φVSub (V) φVSub L GND VSub (V) (Supplied internally) SMD00008CEC 3 MN39116AT ■ Absolute Maximum Ratings and Operating Conditions (continued) Note) 2. *2: VSub supplied internally is the voltage suppressing the blooming generation at ×1 000 light quantity relative to the standard light quantity. *3: Relation between VPT and VφVL Set VPT under the following condition against VL of a vertical transfer clock waveform. VPT ≤ VL (VφV1L to VφV4L) *4: Absolute maximum ratings − 0.2 < VSub − VPT < 55 (V) − 0.2 < VφV − VPT < 24.5 (V) *5: Ground LG pin with the capacitor of 0.047 µF or more. Ground φR pin with the capacitor of 1 MΩ. ■ Optical Characteristics Parameter S/N ratio (dark) Symbol S/Nd Conditions Min Typ Max Unit Dark condition 58 60 dB Sensitivity So J chart F8 480 650 mV Saturation output Sc Saturation maximum output 700 900 mV Vertical smear Sm 1/10 V chart, F2.8 0.01 % ■ Graph of Characteristics CCD spectral characteristics 1.2 1 Relative sensitivity 0.8 0.6 0.4 .02 0 400 500 600 Wavelength (nm) 4 SMD00008CEC 700 800 MN39116AT ■ Timing Diagram • High speed pulse timing φH2 50% 50% 50% 52 ns ± 3 ns CCD output φR 50% 50% −2 ns ∼ 10 ns Clamp pulse (DS1) 21 ns ± 3 ns 50% 50% 8 ns ± 5 ns Sampling pulse (DS2) 50% 8 ns ± 5 ns SMD00008CEC 26 ns ± 3 ns 50% 26 ns ± 3 ns 5 MN39116AT ■ Timing Diagram (continued) • Rise time and fall time of each pulse φV1 , φV3 0.9 0.9 0.1 0.1 0.9 0.9 0.1 0.1 ≤300 ns ≤300 ns φV2 , φV4 ≤300 ns 0.9 0.9 0.1 0.1 ≤300 ns φH1 , φH2 , φR 0.9 0.1 ≤10 ns 6 ≤300 ns DS1, DS2 0.9 0.1 ≤300 ns 0.9 0.9 0.1 0.1 ≤10 ns SMD00008CEC ≤10 ns ≤10 ns MN39116AT ■ Package Dimensions (unit: mm) • WDIP014-P-0400F Reference plane 0.3 M 7 (2.50) 1 0.30±0.05 3.40±0.15 (1.30) 1.27 (1.19) 1.30±0.10 3.50±0.20 (0.60) 10.16±0.25 0.25±0.05 7 (0.80) 1 10.00±0.08 Valid pixel center 0.015 8 5.00±0.08 9.00±0.10 10.00±0.08 9.00±0.10 5.00±0.08 14 2-R0.40 (Depth 0.30) 14 1. The center of the package is equal to the center of the effective pixel area. 2. The rotation angle of the effective pixel area: up to ±1.0 degree 3. The distance from the bottom face of the package to the surface of the effective pixel area: 1.69 mm ± 0.10 mm 4. The tilt of the effective pixel area for the bottom face of the package: up to 25 µm 5. Thickness of seal glass is 0.8 mm, and the refractive index is 1.50. 6. Package weight: 0.65 g (typ.) 8 SMD00008CEC 7 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2002 JUL