ECMF02-3F3 Common mode filter with ESD protection Datasheet production data Figure 1. Pin configuration (bump side) 1 2 A B C Flip Chip 6 bumps Figure 2. Schematic (bump side) Features Very large differential bandwidth A1 DP_int Very low PCB space consumption High ESD robustness: IEC 61000-4-2 level 4 ESD 2kV A2 DP_ext ESD 15kV Withstand 1000 ESD strikes Lead-free Flip-Chip package B1 DM_int Small footprint ESD 2kV Very low profile Complies with the following standard: C1 GND IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) B2 DM_ext ESD 15kV C2 ID ESD 15kV Description Applications Where transient overvoltage protection in ESD sensitive equipment is required such as: Mobile phones The ECMF02-3F3 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses. Computers Portable navigation devices Digital still cameras Portable multimedia players TM: IPAD is a trademark of STMicroelectronics. December 2013 This is information on a product in full production. DocID023283 Rev 3 1/12 www.st.com 12 Characteristics 1 ECMF02-3F3 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit 15 8 kV IEC 61000-4-2 (C = 150 pF, R = 330 External pins (A2, B2 and C2): level 4 Air discharge Contact discharge Internal pins (A1, B1): level 1 Air discharge Contact discharge VPP 2 2 Pd Line resistance power dissipation at 85 °C (top max) Tj Tstg 60 mW Operating temperature range - 30 to + 85 °C Storage temperature range - 55 to 150 °C Figure 3. Electrical characteristics (definitions) I IF Symbol Parameter V BR I RM R DC Breakdown voltage = = = Leakage current @VBM Serial resistance VCL VBR VRM IRM IPP Table 2. Electrical characteristics (values, Tamb = 25 °C) Symbol 2/12 Test conditions VBR IR = 1 mA IRM VRM = 3 V per line RDC DC serial resistance Min. Typ. Max. 6 V 3.4 DocID023283 Rev 3 Unit 100 nA 4.5 ECMF02-3F3 Characteristics Figure 4. SDD21 differential attenuation versus frequency SDD21 (dB) 0.00 -1.00 -2.00 -3.00 F(Hz) -4.00 100.0k 1.0M 10.0M 100.0M 1.0G Figure 5. SCC21 common mode attenuation versus frequency (ID pin floating) SCC21 (dB) 0.00 -5.00 -10.00 -15.00 -20.00 -25.00 -30.00 -35.00 F(Hz) -40.00 100.0k 1.0M 10.0M DocID023283 Rev 3 100.0M 1.0G 3/12 Characteristics ECMF02-3F3 Figure 6. SDD11 / SDD22 differential return loss versus frequency (ID pin floating) SDD11 / SDD22 (dB) 0.00 -5.00 -10.00 -15.00 SDD22 -20.00 -25.00 SDD11 -30.00 -35.00 F(Hz) -40.00 100.0k 1.0M 10.0M 100.0M 1.0G Figure 7. Eye diagram (according to USB 2.0 high speed specification mask1) Through ISS (Impedance Standard Substrate) Board only 4/12 ID open With ECMF02-3F3 With ECMF02ID pin floating 3F3, Id pin open 200 mV/c 200 mV/c 347.2 ps/c 347.2 ps/c DocID023283 Rev 3 ECMF02-3F3 Characteristics Figure 8. TDR: Z0 DIFF = 100 tR = 400 ps (10% - 90%), 12.5 Ω / div 100 Ω Figure 9. ESD response to IEC 61000-4-2 (+8 kV contact discharge) DocID023283 Rev 3 5/12 Characteristics ECMF02-3F3 Figure 10. ESD response to IEC 61000-4-2 (- 8 kV contact discharge) 6/12 DocID023283 Rev 3 ECMF02-3F3 2 USB 2.0 application schematic USB 2.0 application schematic Figure 11. Application schematic V BUS D+ ESD 15kV D- ESD 2kV B1 DM_int B2 DM_ext ESD 15kV ID D- ESD 2kV C2 ID ESD 15kV D+ A1 DP_int A2 DP_ext C1 GND ECMF02-3F3 GND USB CONTROLLER USB CONNECTOR DocID023283 Rev 3 7/12 Ordering information scheme 3 ECMF02-3F3 Ordering information scheme Figure 12. Ordering information scheme ECMF Function ESD common mode filter Number of lines 02 = 2 lines Number of ESD protected lines 3 = 3 ESD protected lines Package F3 = Flip Chip, 0.4 mm pitch 8/12 DocID023283 Rev 3 02 - 3 F3 ECMF02-3F3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 13. Package dimensions 400 µm ± 40 500 µm ± 50 400 µm ± 40 1330 µm ± 40 µm 255 µm ± 40 215 µm 830 µm ± 30 µm 265 µm 4 Package information Figure 14. Marking DocID023283 Rev 3 x x z y ww Dot ECOPACK grade xx = marking z = manufacturing location yww = date code (y = year ww = week) 9/12 Package information ECMF02-3F3 Figure 15. Footprint recommendations Copper pad Diameter: 220 µm recommended 260 µm maximum Solder mask opening: 300 µm minimum Solder stencil opening: 220 µm recommended Dot identifying Pin A1 location Ø 1.50 ± 0.1 4.0 ± 0.1 2.0 ± 0.05 3.5 ± 0.05 1.43 ± 0.05 xxz yww ST xxz yww 0.93 ± 0.05 ST xxz yww ST 8.0 + 0.3 / - 0.1 0.20 ± 0.02 1.75 ± 0.1 Figure 16. Flip Chip tape and reel specification 4.0 ± 0.1 0.59 ± 0.05 All dimensions are in mm Note: User direction of unreeling More information is available in the application notes: AN2348, “IPAD™ 400 µm Flip Chip: package description and recommendations for use” AN1751, “EMI filters: recommendations and measurements” 10/12 DocID023283 Rev 3 ECMF02-3F3 5 Ordering information Ordering information Table 3. Ordering information 6 Order code Marking Package Weight Base qty Delivery mode ECMF02-3F3 KH Flip Chip 1.2 mg 5000 Tape and reel 7” Revision history Table 4. Document revision history Date Revision Changes 19-Nov-2012 1 Initial release. 22-May-2013 2 Moved dot position in Figure 13. Moved arrow in Figure 16 to point to pin A1 location. 19-Dec-2013 3 Corrected typographical error in Figure 13. DocID023283 Rev 3 11/12 ECMF02-3F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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