ECMF02-2AMX6 Common mode filter with ESD protection for USB 2.0 and MIPI D-PHY/MDDI interface Features ■ Very large differential bandwidth > 6 GHz ■ High common mode attenuation: – -34 dB at 900 MHz – -20 dB between 800 MHz and 2.2 GHz ■ Very low PCB space consumption ■ Thin package: 0.55 mm max ■ Lead-free package ■ High reduction of parasitic elements through integration µQFN-6L Complies with the following standards: ■ IEC 61000-4-2 level 4 input and output pins: – ±15 kV (air discharge) – ±8 kV (contact discharge) Figure 1. Applications ■ Mobile phones ■ Notebook, laptop ■ Portable devices ■ Pin configuration (top view) D+ D+ ESD ESD ESD ESD D- PND Description GND D- NC The ECMF02-2AMX6 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like MIPI D-PHY, MDDI or USB 2.0. The ECMF02-2AMX6 can protect and filter one differential lane. June 2011 Doc ID 17815 Rev 2 1/15 www.st.com 15 Characteristics ECMF02-2AMX6 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter VPP Peak pulse voltage(1) IDC Maximum DC current Top Operating temperature Tj Tstg Value Unit 8 20 kV 200 mA -40 to +85 °C 125 °C - 55 to +150 °C IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge Maximum junction temperature Storage temperature range 1. Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353. Figure 2. Electrical characteristics (definitions) Table 2. Electrical characteristics (values, Tamb = 25 °C) Symbol Test conditions VBR IR = 1 mA IRM VRM = 1.5 V per line RDC DC serial resistance Min. Typ. 6 1.8 Doc ID 17815 Rev 2 Unit V Compliant with USB 2.0 high speed sync field test (150 mV diff). 2/15 Max 100 nA 2.5 Ω ECMF02-2AMX6 Figure 3. Characteristics 0 SDD21 (dB) -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 -2.2 -2.4 -2.6 -2.8 -3 300k 1M 3M Figure 5. 0 Figure 4. SDD21 differential attenuation measurements (Z0 diff = 100 Ω) 0 SCC21 (dB) -2 -4 -6 -8 - 10 - 12 - 14 - 16 - 18 - 20 - 22 - 24 - 26 - 28 - 30 - 32 - 34 - 36 300k 1M 3M F(Hz) 10M 30M 100M 300M 1G 3G SDD11 / SDD22 differential return loss measurements (Z0 diff = 100 Ω) Figure 6. SDD11 / SDD22 (dB) SDD22 - 15 - 20 - 25 - 30 - 35 F(Hz) - 40 1M 30M 100M 300M 1G 3G SDD21 differential attenuation measurements (Z0 diff = 90 Ω) 0 SDD21 (dB) 0.2 0.4 0.6 0.8 -1 - 1.2 - 1.4 - 1.6 - 1.8 -2 - 2.2 - 2.4 - 2.6 - 2.8 -3 300k 1M 3M - 10 300k F(Hz) 10M - SDD11 - 5 SCC21 common mode attenuation measurements (Z0 com = 50 Ω) 3M 10M Figure 7. 30M 100M 300M 1G 3G F(Hz) 10M 30M 100M 300M 1G 3G SCC21 common mode attenuation measurements (Z0 com = 45 Ω) 0 -2 -4 -6 -8 - 10 - 12 - 14 - 16 - 18 - 20 - 22 - 24 - 26 - 28 - 30 - 32 - 34 - 36 SCC21 (dB) F(Hz) 300k 1M 3M 10M 30M 100M 300M Doc ID 17815 Rev 2 1G 3G 3/15 Characteristics Figure 8. 20 V/Div ECMF02-2AMX6 ESD response to IEC 61000-4-2 (+8 kV contact discharge) Figure 9. 20 ns/Div 82.3 V ESD response to IEC 61000-4-2 (-8 kV contact discharge) 20 V/Div PIN 6 20 ns/Div PIN 6 C2 C2 -71.1 V 112 V PIN 5 PIN 5 C3 C3 -115 V 50 V/Div 20 ns/Div 50 V/Div 20 ns/Div Figure 10. MIPI D-PHY low power mode test setup Generator Agilent 81110 Pattern mode, F=10MHz, modulation RZ, 50Ω output Oscilloscope Lecroy 7300A, 1MΩ input CMF Figure 11. Low power pulse response - see Figure 10 for test setup 500 mV/div Pulse: 50 ns, tr = tf = 5 ns 200 ns/div 500 mV/div 200 ns/div 4/15 Doc ID 17815 Rev 2 ECMF02-2AMX6 Characteristics Figure 12. USB 2.0 HSync measurement test setup Net PC Samsung NP-N510 Left USB output Oscilloscope Lecroy 7300A CMF USB key USB output Figure 13. USB 2.0 HSync measurement result 200 mV/Div 5 ns/Div 200 mV/Div 5 ns/Div Figure 14. USB 2.0 eye diagram, mask T1 0.2V/div 342.2ps/div Doc ID 17815 Rev 2 5/15 Application schematics 2 ECMF02-2AMX6 Application schematics Figure 15. MIPI D-PHY ECMF02-2AMX6 ECMF04-4AMX12 6/15 Doc ID 17815 Rev 2 ECMF02-2AMX6 Application schematics Figure 16. USB 2.0 USB Transceiver GND ESDALC6V1-1U2 ID D+ D+ ESD ESD ESD ESD D- D- GND NC D+ DV BUS Micro-USB LFTVS10-1F3 Doc ID 17815 Rev 2 7/15 Ordering information scheme 3 ECMF02-2AMX6 Ordering information scheme Figure 17. Ordering information scheme ECMF 02 Function ESD common mode filter Number of lines 02 = 2 lines Number of ESD protected lines 2 = 2 ESD protected lines Version Package MX6 = µQFN-6L 8/15 Doc ID 17815 Rev 2 – 2 A xxx ECMF02-2AMX6 4 Package information Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. µQFN-6L dimensions Dimensions D Ref. b L SIDE VIEW e Inches Min. Typ. Max. Typ. Max. A 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.02 0.05 b 0.18 0.25 0.30 0.007 0.010 0.012 D 1.65 1.70 1.75 0.065 0.067 0.069 E 1.45 1.50 1.55 0.057 0.059 0.061 e 0.45 0.50 0.55 0.018 0.020 0.022 L 0.30 0.40 0.50 0.012 0.016 0.020 E A A1 TOP VIEW Millimeters Min. 0.00 0.0008 0.0009 Figure 18. Footprint (dimensions in mm) Figure 19. Marking 1.9 0.7 0.6 0.25 KD 1.25 Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Doc ID 17815 Rev 2 9/15 Package information ECMF02-2AMX6 Figure 20. Tape and reel specifications Dot identifying Pin A1 location 2.0 Ø 1.55 4.0 8.0 3.5 1.85 1.75 0.22 KD KD KD 1.63 4.0 0.75 All dimensions are typical values in mm 10/15 User direction of unreeling Doc ID 17815 Rev 2 ECMF02-2AMX6 Recommendation on PCB assembly 5 Recommendation on PCB assembly 5.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 21. Stencil opening dimensions L T b) W General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect ratio = ----- ≥ 1.5 T L×W Aspect area = ---------------------------- ≥ 0.66 2T ( L + W ) 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 22. Recommended stencil window position 7 µm 600 µm 570 µm 15 µm 236 µm 250µm Stencil window Footprint Doc ID 17815 Rev 2 11/15 Recommendation on PCB assembly 5.2 5.3 5.4 12/15 ECMF02-2AMX6 Solder paste 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Doc ID 17815 Rev 2 ECMF02-2AMX6 5.5 Recommendation on PCB assembly Reflow profile Figure 23. ST ECOPACK® recommended soldering reflow profile for PCB mounting Temperature (°C) 260°C max 255°C 220°C 180°C 125 °C 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max 3°C/s max 3°C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec 6 7 Time (min) 90 sec max Note: Minimize air convection currents in the reflow oven to avoid component movement. 5.6 Layout recommendation Connection to PCB GND must be as short as possible to ensure ESD remaining voltage and SCC21 performance. Figure 24. Layout recommendation Zdiff according to the application Vias to GND plane Doc ID 17815 Rev 2 13/15 Ordering information 6 ECMF02-2AMX6 Ordering information Table 4. Ordering information Order code Marking Package Weight Base qty Delivery mode ECMF02-2AMX6 KD(1) µQFN-6L 3.55 mg 3000 Tape and reel 7” 1. The marking can be rotated by 90° to differentiate assembly location For the latest information on available order codes see the product pages on www.st.com. 7 Revision history Table 5. 14/15 Document revision history Date Revision Changes 10-Aug-2010 1 Initial release. 28-Jun-2011 2 Added Complies with the following standards:, and Air discharge parameter in Table 1. Removed Figure 6. Sdd41 / Sdd23 inter-lane differential cross-coupling measurements. Doc ID 17815 Rev 2 ECMF02-2AMX6 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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