ECMF04-4AMX12 Common mode filter with ESD protection for MIPI D-PHY and MDDI interface Datasheet - production data Features • Very large differential bandwidth > 6 GHz • High common mode attenuation: – -34 dB at 900 MHz – -20 dB between 800 MHz and 2.2 GHz • Very low PCB space consumption • Thin package: 0.6 mm max • Lead-free package • High reduction of parasitic elements through integration µQFN-12L Complies with the following standards: Figure 1. Pin configuration (top view) D1+ • IEC 61000-4-2 level 4 input and output pins: – ±15 kV (air discharge) – ±8 kV (contact discharge) D1+ ESD ESD ESD ESD D1- Applications D1- • Mobile phones • Notebook, laptop NC GND1 NC GND0 D0+ D0+ • Portable devices • PND Description ESD ESD ESD ESD D0- D0- The ECMF04-4AMX12 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like MIPI D-PHY or MDDI. The ECMF04-4AMX12 can protect and filter 2 lanes. March 2014 This is information on a product in full production. DocID17793 Rev 3 1/13 www.st.com Characteristics 1 ECMF04-4AMX12 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Peak pulse voltage(1) IDC Maximum DC current Top Operating temperature Tstg Unit 8 20 kV 200 mA -40 to +85 °C 125 °C - 55 to +150 °C IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge VPP Tj Value Maximum junction temperature Storage temperature range 1. Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353. Figure 2. Electrical characteristics (definitions) Table 2. Electrical characteristics (values, Tamb = 25 °C) Symbol 2/13 Test conditions VBR IR = 1 mA IRM VRM = 1.5 V per line RDC DC serial resistance Min. Typ. Max. 6 V 1.8 DocID17793 Rev 3 Unit 100 nA 2.5 Ω ECMF04-4AMX12 Characteristics Figure 3. Sdd21 differential attenuation measurements (Z0 diff = 100 Ω) 0 dB - 0.2 - 0.4 - 0.6 - 0.8 -1 - 1.2 - 1.4 - 1.6 - 1.8 -2 - 2.2 - 2.4 - 2.6 - 2.8 -3 300k Figure 4. Scc21 common mode attenuation measurements (Z0 com = 50 Ω) 0 -2 -4 -6 -8 - 10 - 12 - 14 - 16 - 18 - 20 - 22 - 24 - 26 - 28 - 30 - 32 - 34 - 36 F(Hz) 1M 3M 10M 30M 100M 300M 1G dB F(Hz) 300k 3G Figure 5. Sdd11, Sdd22 differential return loss measurements (Z0 diff = 100 Ω) 1M 3M 10M 30M 100M 300M 1G 3G Figure 6. Sdd41 / Sdd23 inter-lane differential cross-coupling measurements (Z0 diff = 100 Ω) 0 dB Sdd11 -5 Sdd22 0 dB - 10 - 20 - 10 - 30 - 40 - 15 - 50 - 20 - 60 - 25 - 70 - 80 - 30 - 90 - 35 - 100 F(Hz) - 40 300k 1M 3M 10M 30M 100M 300M 1G - 110 300k 3G F(Hz) 1M 3M 10M 30M 100M 300M 1G 3G Figure 7. Scc41 / Scc23 inter-lane common-mode cross-coupling measurements (Z0 com = 50 Ω) 0 dB - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 90 F(Hz) - 100 300k 1M 3M 10M 30M 100M 300M DocID17793 Rev 3 1G 3G 3/13 13 Characteristics ECMF04-4AMX12 Figure 8. ESD response to IEC 61000-4-2 (+8kV contact discharge) Figure 9. ESD response to IEC 61000-4-2 (-8kV contact discharge) 20 ns/Div 20 V/Div Vpeak = 82 V 20 ns/Div 20 V/Div PIN 12 PIN 12 C2 C2 Vpeak = -70 V PIN 11 Vpeak = 110 V PIN 11 C3 C3 Vpeak = -115 V 50 V/Div 50 V/Div 20 ns/Div 20 ns/Div Figure 10. MIPI D-PHY low power mode test setup Generator Agilent 81110 Pattern mode, F=10MHz, modulation RZ, 50Ω output Oscilloscope Lecroy 7300A, 1MΩ input CMF Figure 11. Low power pulse response - see Figure 10 for test setup 500 mV/div Pulse: 50 ns, tr = tf = 5 ns 200 ns/div 500 mV/div 200 ns/div 4/13 DocID17793 Rev 3 ECMF04-4AMX12 2 Application information Application information Figure 12. Application information Camera Application Baseband ECMF02-2AMX6 CSI Receiver CSI Transmitter Data N+ D+ D+ Data N+ Data N - D- D- Data N - GND NC GND GND Data 1+ Data 1GND D1+ D1+ D1- D1- GND1 NC Data 1+ Data 1GND NC GND0 Clock + D0+ D0+ Clock + Clock - D0- D0- Clock GND GND ECMF04-4AMX12 CCI Slave CCI Master SCL IN 1 GND 2 SDA IN 3 4 OUT SCL 5 GND 6 OUT SDA EMIF02-1003M6 DocID17793 Rev 3 5/13 13 Ordering information scheme 3 ECMF04-4AMX12 Ordering information scheme Figure 13. Ordering information scheme ECMF yy Function Common mode filter with ESD protection Number of filtered lines yy = Number of filtered lines Number of ESD protected lines 4 = 4 lines with ESD protection Version A = Version Package MX12 = µQFN-12L, pitch 500 µm, 12 = 12 pads 6/13 DocID17793 Rev 3 - x A MX12 ECMF04-4AMX12 4 Package information Package information • Epoxy meets UL94, V0 • Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. µQFN-12L dimensions Dimensions D Ref. Millimeters Inches Typ. Max. A 0.51 0.55 0.6 A1 0 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.3 D 3.25 3.3 3.35 0.128 0.130 0.132 E 1.45 1.5 1.55 0.057 0.059 0.061 e 0.45 0.5 0.55 0.018 0.020 0.022 L 0.3 0.4 0.5 E Min. Min. Typ. Max. 0.020 0.022 0.024 A TOP VIEW 0.007 0.010 0.012 b L e A1 SIDE VIEW 0.012 0.016 0.020 Figure 14. Footprint (dimensions in mm) Figure 15. Marking KC Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. DocID17793 Rev 3 7/13 13 Package information ECMF04-4AMX12 Figure 16. µQFN-12L tape and reel specification Ø 1.55 2.0 4.0 0.80 All dimensionare typical values in mm 8/13 3.70 12.00 5.5 1.75 Dot identifying Pin A1 location KC KC 1.70 KC 4.0 User direction of unreeling DocID17793 Rev 3 ECMF04-4AMX12 Recommendation on PCB assembly 5 Recommendation on PCB assembly 5.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 17. Stencil opening dimensions L T b) W General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect ratio = ----- ≥ 1.5 T L×W Aspect area = ---------------------------- ≥ 0.66 2T ( L + W ) Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 18. Recommended stencil window position 7 µm 600 µm 15 µm 570 µm 2. 236 µm 250µm Stencil window Footprint DocID17793 Rev 3 9/13 13 Recommendation on PCB assembly 5.2 5.3 5.4 10/13 ECMF04-4AMX12 Solder paste 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. DocID17793 Rev 3 ECMF04-4AMX12 5.5 Recommendation on PCB assembly Reflow profile Figure 19. ST ECOPACK® recommended soldering reflow profile for PCB mounting Temperature (°C) 260°C max 255°C 220°C 180°C 125 °C 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max 3°C/s max 3°C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec 6 7 Time (min) 90 sec max Note: Minimize air convection currents in the reflow oven to avoid component movement. 5.6 Layout recommendation Connection to PCB GND must be as short as possible to ensure ESD remaining voltage and SCC21 performance. Figure 20. Layout recommendation Zdiff according to the application Vias to GND plane DocID17793 Rev 3 11/13 13 Ordering information 6 ECMF04-4AMX12 Ordering information Table 4. Ordering information Order code Marking Package Weight Base qty Delivery mode ECMF04-4AMX12 KC(1) µQFN-12L 7.25 mg 3000 Tape and reel 7” 1. The marking can be rotated by 90° to differentiate assembly location For the latest information on available order codes see the product pages on www.st.com. 7 Revision history Table 5. Document revision history 12/13 Date Revision Changes 10-Aug-2010 1 Initial release. 28-Jun-2011 2 Added Complies with the following standards: and Air discharge parameter in Table 1. 14-Mar-2014 3 Corrected typographical error in Description. DocID17793 Rev 3 ECMF04-4AMX12 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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