C B P r o-D ON GLE UG C L O C KB U I L D E RP R O ™ F I E L D P R O G R A M M E R K I T 1. Introduction and Scope This document describes how to use the Si538x/4x ClockBuilder Field Programmer Kit (“CBPROG-DONGLE”) with ClockBuilder Pro (“CBPro”) to support four programming models. Refer to the text and table below for supported uses: 1. In-socket NVM Programming: NVM programming of “base” Si538x/4x devices (e.g., Si5341A-A-GM), or any other factory “pre-programmed” Si538x/4x device (e.g., Si5341A-A12345-GM) which has unused NVM banks. Silicon Labs provides 44-pin and 64-pin QFN socket adapter boards for this purpose. 2. In-system NVM Programming: NVM programming of Si538x/4x devices already mounted on a system PCB. Users are encouraged to include a standard 10-pin header on their PCB to allow the Si538x4x Field Programmer board and ribbon cable to easily connect to the USB to SPI/I2C adapter. 3. In-system Volatile Register Programming: of devices mounted on a PCB (e.g., use the Wizard and EVB GUIs to inspect status registers, make volatile configuration updates, debug system firmware, etc.). 4. In-socket Volatile Register Programming: of devices mounted in the socket (e.g., use the Wizard and EVB GUIs to inspect status registers, make volatile configuration updates, debug system firmware, etc.). Figure 1. Supported Programming Models 2. Kit Contents Shown below is a diagram of how the various components in the Field Programmer kit are connected to one of the QFN socket adapter boards, or to a PCB for in-system programming. Figure 2. Example Hardware Configuration (Using QFN Socket Board or Customer PCB) Rev. 1.0 4/15 Copyright © 2015 by Silicon Laboratories CBPro-DONGLE UG CBPr o-D O NG L E UG Figure 3 shows the kit contents for the CBPROG-DONGLE kit. Note that the 44-pin and 64-pin sockets are sold separately as part numbers “Si538X4X-44SKT” and “Si538X4X-64SKT”, respectively. The Clock Builder Pro Field Programmer resources including schematics, layout files, and BOM can be found at www.silabs.com/CBProgrammer. Note that the sockets are sold as separate kits. 10-Win &emale/&emale USB Programming Dongle Female/&emale Figure 3. CBPROG-DONGLE Kit Contents Figure 4. Si538x4x-44SKT-DK (l) and Si538x4x-64SKT-DK (r) Sockets Sold Separately 2 Rev. 1.0 C B P r o -D ON GL E U G 3. Software Download and Installation To install the CBPro software on any Windows 7 (or above) PC, go: http://www.silabs.com/CBPro and download the ZIP file to install the software on your host PC. 4. Hardware Configuration The Field Programmer Dongle acts as an interface between the CBPro GUI and the target device (any supported Si534x or Si538x IC). Connect the provided USB cable to your PC and the CBPROG-DONGLE. The CBPROGDONLGE is then connected to the target device using the provided cables or a programming socket, depending upon the four ways you may use the programmer as detailed in “5. Ways You can Use the Programmer”. 5. Ways You can Use the Programmer The following four sections describe four ways you can use the CBPROG-DONGLE. 5.1. In-Socket NVM Programming This workflow describes the process of programming or “burning” the non-volatile memory (NVM) of loose devices using the Si538X4X-44SKT or Si538X4X-64SKT boards that feature a programming socket. Once completed, this flow will “burn” a complete configuration from CBPro into one of the banks of NVM on the device. Devices shipped from Silicon Labs have two NVM banks available to program (“burn”). The steps needed to program a device’s NVM are as follows: 1. Assuming the CBPro software installs without error, connect the CBPROG-DONGLE adapter with the USB cable to the PC on which CBPro was installed. Use the USB extender cable (provided with the kit) if your host PC is located far from the CBPROG-DONGLE. Figure 5. PC to CBPROG-DONGLE Connection 2. Insert a base or previously pre-programmed (e.g. OPN) Si538x/4x device into the QFN socket. Socket and DUT Orientation: It is important to ensure the DUT is in the correct orientation before powering up the board. If not orientated correctly the software has a feature to auto-detect it is not able to read the part. Likely the reason is there is no part in the socket or it is oriented incorrectly. The part will not be damaged if oriented incorrectly. The DUT has two circles on the part. The smaller circle is the pin 1 indicator. Pin 1 on the socket is lined up with the U1 and dot symbol on the silk screen. Rev. 1.0 3 CBPr o-D O NG L E UG Figure 6. Correct Orientation of a DUT in the QFN Socket Note: Power is not applied to the socket’s VDD and VDDA pins unless explicit action by you within CBPro. It is safe to: 1. Insert or remove a DUT in the socket before or after the socket has been connected to the main board. 2. Insert or remove a DUT in the socket before or after power has been applied to the main board by connecting the USB cable to your PC. As will be discussed in the walk-through that follows, power is only applied to the DUT when you explicitly scan for a DUT or initiate a burn. Power is automatically off at all other times. 3. Connect the QFN Field Programmer Socket Board with the DUT into the CBPROG-DONGLE. Use the male-to-female ribbon cable if needed. Figure 7. System from PC to Programming CBPROG-DONGLE Board to QFN Field Programmer Socket Board 4 Rev. 1.0 C B P r o -D ON GL E U G 4. Start ClockBuilder Pro by locating the icon (see Figure 8) on your desktop or Windows Start Menu. Figure 8. ClockBuilder Pro Icon 5. The ClockBuilder Pro Wizard main menu should now appear as shown in Figure 9. Select the “NVM Burn Tool” as shown. Do not select EVB GUI. Figure 9. ClockBuilder Pro Wizard Rev. 1.0 5 CBPr o-D O NG L E UG 6. In the Burn NVM tool window: a. Step 1: Make sure “Kit Field Programmer Socket Board” is selected. b. Step 2: Select “Scan”. If the device is properly orientated in the socket, the middle section of the window will show information about the detected device, including how many NVM banks are available to burn. In socket mode, the CBPROG-DONGLE always communicates in 4-wire SPI host interface mode. c. Step 3: Click on “Select Project File”. Figure 10. Field Programmer Screen d. Step 4: Navigate to and select your CBPro project file in the Windows file browser: Figure 11. Navigating to CBPro Project File 6 Rev. 1.0 C B P r o -D ON GL E U G e. Step 5: After selecting the project file, select “Burn NVM” as shown in Figure 12. Figure 12. Click on Burn NVM Rev. 1.0 7 CBPr o-D O NG L E UG f. A series of status windows will appear as shown if the target DUT in the socket is successfully “burned”. Figure 13. Status Windows When you click OK, the DUT will be rescanned and you should see the number of banks available to burn decrease by 1. Note that you may remove the newly programmed DUT at any time: power to the DUT is turned off immediately after scan and burn operations complete. 8 Rev. 1.0 C B P r o -D ON GL E U G 5.2. In-System NVM Programming This workflow describes the process of programming or “burning” the non-volatile memory (NVMN) of a device mounted on a PCB, and your goal is to reprogram a device’s NVM with a different configuration from a CBPro project file. Once completed, this flow will “burn” a complete configuration from CBPro into one of the banks of NVM on the device, assuming an open NVM bank is available. Devices shipped from Silicon Labs always have to 2 NVM banks available to program (“burn”). If you don’t know how many banks are still open to burn on your target device, have no fear, as the kit’s software automatically detects and reports the number of remaining NVM banks. The steps needed to program an “in-system” device’s NVM are as follows: 1. Assuming the CBPro software installs without error (see "3. Software Download and Installation" on page 3), connect the adapter (CBPROG-DONGLE) board with the USB cable to the PC on which CBPro was installed. Use the USB extender cable (provided with the kit) if your host PC is located far from the CBPROG-DONGLE. Figure 14. PC to CBPROG-DONGLE Connection 2. Lookup and verify the host I/O mode (I2C or SPI), the I2C address, and the interface I/O voltage level compatibility of your host’s I/O voltage (for I2C or SPI) and the DUT’s. The value set at the DUT’s register address of 0x09043 determines how the I/O supply voltages must be configured to communicate reliably with the CBPROG-DONGLE. You can look up your DUT’s host I/O voltage using the “OPN Lookup” option in the NVM Burn tool as shown in Figure 15. Figure 15. OPN Lookup Option Rev. 1.0 9 CBPr o-D O NG L E UG If you have a custom OPN mounted on your board (a part number with a 5 digit code in the middle of the part number, such as Si5346B-A03260-GM), you should look up the host I/O setting (located at address of 0x09043) by selecting the OPN Lookup option. A browser will open and you will then enter in your custom OPN, as shown below. a. Select “Clock or Buffer”. b. Enter in your full ordering part number (OPN). E.g., Si5346B-A03260-GM. c. Click the blue arrow to lookup your OPN to verify the host I/O voltage setting of your DUT. Figure 16. OPN Lookup 10 Rev. 1.0 C B P r o -D ON GL E U G 3. When the utility displays the OPN’s files, click on Addendum to verify the I/O Power Supply setting of your DUT in the Data Sheet Addendum. “VDD Core” indicates the I/O supply for the I2C/SPI interface will operate from a 1.8 V supply. “VDDA 3.3 V” indicates the I/O supply for the I2C/SPI interface will operate from a 3.3 V supply. Figure 17. Finding the I/O Power Supply Type Figure 18 shows an example data sheet addendum showing VDDA (3.3 V). Figure 18. Finding VDDA Value 4. Connect/wire the pins of the CBPROG-DONGLE to your host system with the target Si538x4x device. Use the male-to-female ribbon cable to connect to your host board fitted with a standard 10-pin header. This assumes you included the 10-pin header on your PCB and followed the recommended pinout and connections to the target Si438x/4x on your PCB. Note the pinout diagram and descriptions in the table below. Rev. 1.0 11 CBPr o-D O NG L E UG Figure 19. Interface Pins on Header (Front View of CBPROG-DONGLE) Table 1. Interface Pin Connections from CBPROG-DONGLE Pin # Description Wire to Your PCB? 9 A0_CSB 3- or 4-Wire SPI 10 VDD Never Supplies the Core VDD voltage to the DUT when using a programming Field Programmer Socket Board. Do not use this pin for in-system programming. Supplies the Core VDD voltage to the DUT when using a programming Field Programmer Socket Board. Do not use this pin for in-system programming. 7 SDA_SDIO Always Serial data signal for I2C transactions. Serial data out to Bidirectional Serial DUT for 4-wire SPI data for 3-wire SPI transactions (MOSI). transactions (SDIO). 8 I2C_SEL1 Never Used to set I2C_SEL signal high to set the DUT for I2C communication. (Refer to specific part pinout and the programming Field Programmer Socket Board to determine whether to use I2C_SEL1 or I2C_SEL2) Used to put I2C_SEL signal low for SPI communication. (Refer to specific part pinout and the programming Field Programmer Socket Board to determine whether to use I2C_SEL1 or I2C_SEL2) 12 I2 C 4-wire SPI 3-wire SPI Can be used to set Drives the chip select Drives the chip select I2C address bit A0 signal during SPI signal during SPI high or low. Routed transactions transactions to A0 DUT pin on the programming Field Programmer Socket Boards. Rev. 1.0 Supplies the core VDD voltage to the DUT when using a programming Field Programmer Socket Board. Do not use this pin for in-system programming. Used to put I2C_SEL signal low for SPI communication. (Refer to specific part pinout and the programming Field Programmer Socket Board to determine whether to use I2C_SEL1 or I2C_SEL2) C B P r o -D ON GL E U G Table 1. Interface Pin Connections from CBPROG-DONGLE (Continued) Pin # Description Wire to Your PCB? 5 A1_SDO 4-Wire SPI Only 6 I2C_SEL2 Never 3 SCLK Always 4 VDDA_VDDS Never 1 GND Always 2 ID Never 4-wire SPI I2 C 3-wire SPI Can be used to set Serial data from DUT Not used I2C address bit A1 for 4-wire SPI transhigh or low. Routed actions (MISO). to A1 DUT pin on the programming Field Programmer Socket Boards. Used to set I2C_SEL signal high to set the DUT for I2C communication. (Refer to specific part pinout and the programming Field Programmer Socket Board to determine whether to use I2C_SEL1 or I2C_SEL2) Used to put I2C_SEL signal low for SPI communication. (Refer to specific part pinout and the programming Field Programmer Socket Board to determine whether to use I2C_SEL1 or I2C_SEL2) Used to put I2C_SEL signal low for SPI communication. (Refer to specific part pinout and the programming Field Programmer Socket Board to determine whether to use I2C_SEL1 or I2C_SEL2) Serial clock signal for Serial clock signal for Serial clock signal for I2C transactions. SPI transactions. SPI transactions. Supplies the VDDA and VDDS voltages to the DUT when using a programming Field Programmer Socket Board. Do not use this pin for in-system programming. Supplies the VDDA and VDDS voltages to the DUT when using a programming Field Programmer Socket Board. Do not use this pin for in-system programming. Supplies the VDDA and VDDS voltages to the DUT when using a programming Field Programmer Socket Board. Do not use this pin for in-system programming. GND GND GND The programming Field Programmer Socket Boards provide a voltage on this pin to identify the board. For in-system programming, this pin should be grounded or not connected to any signal. The programming Field Programmer Socket Boards provide a voltage on this pin to identify the board. For in-system programming, this pin should be grounded or not connected to any signal. The programming Field Programmer Socket Boards provide a voltage on this pin to identify the board. For in-system programming, this pin should be grounded or not connected to any signal. Rev. 1.0 13 CBPr o-D O NG L E UG 5.2.1. I2C Hardware Configuration For I2C Communication connecting to an external DUT board, the following pins should be used from the: CBPROG-DONGLE pins Pin 3: Serial Clock SCLK 7: Serial Data SDA Pin 1: Ground DUT pins Pin A0/CS: Drive this pin high or low to set the I2C Address. Drive this pin high or low to set the I2C Address. VDDA: The DUT should be externally powered. VDDA must be set to 3.3 V. VDD: The core voltage must be set to 1.8 V. A1/SDO: Figure 20. Example I2C Connection to External System Target Board Using Jumper Wires (Si5346-EVB) When using SPI Communication with long wires as shown above it is advisable to use 6 Mb/s bus speed or less. 14 Rev. 1.0 C B P r o -D ON GL E U G 5.2.2. SPI 3-Wire Hardware Configuration For 3-wire SPI communication, when connecting to an external DUT board, the following pins should be used from the MCU CBPROG-DONGLE. CBPROG-DONGLE pins Pin 3: Serial Clock SCLK 7: Serial Data SDIO for Data In and Out Pin 9: A0_CSB for Chip Select Pin 1: Ground DUT PINS Pin VDDA: The DUT should be externally powered. VDDA must be set to 3.3 V. VDD: The core voltage must be set to 1.8 V. 5.2.3. SPI 4-Wire Hardware Configuration For 4-wire SPI communication, when connecting to an external DUT board, the following pins should be used from the MCU CBPROG-DONGLE. CBPROG-DONGLE pins Pin 3: Serial Clock SCLK Pin 7: Serial Data SDIO for Data In to DUT (MOSI) Pin 5: A1_SDO for Data Out of DUT (MISO) Pin 9: A0_CSB for Chip Select Pin 1: Ground DUT PINS VDDA: The DUT should be externally powered. VDDA must be set to 3.3 V. VDD: The core voltage must be set to 1.8 V. 5. After verifying the CBPROG-DONGLE to DUT connections as noted above, execute the following steps in the “Burn NVM” menu. This example assumes a DUT is configured with the host I2C interface operating in 3.3 V I/O mode with an I2C address of 0x6F, and an I2C bus speed of 100 kHz. Figure 21. Selecting the I2C Configuration Options Note: 100 kHz I2C bus speed is recommended to avoid programming errors. The CBPro burn tool will always read back the programmed NVM to verify the DUT was programmed correctly. Rev. 1.0 15 CBPr o-D O NG L E UG 6. After entering in the fields noted above, select “Scan” to initiate detection of your target DUT. 7. Assuming your DUT was properly detected, the Burn NVM window will appear again, showing the presence of the DUT, its DESIGN_ID value, and the # of NVM banks available (in this case, there are no more NVM banks available to burn). Figure 22. Board Information and NVM Burn Banks Available 8. Navigate to and select your CBPro project file in the Windows file browser. Figure 23. Navigating to CBPro Project File 9. After selecting the project file, select “Burn NVM” as shown: 16 Rev. 1.0 C B P r o -D ON GL E U G Figure 24. Select Burn NVM if Fewer than 3 Banks Burned 5.3. In-System Volatile Register Programming and Register Debug This workflow allows users to use the full CBPro configuration Wizard and EVB GUI to make volatile changes to a device’s configuration and inspect the state of various status registers. There are two ways you can interact with your PCB-based DUT using the field programmer: Use CBPro Wizard to edit your device configuration, and write out changes directly to your DUT. the EVB GUI, to inspect registers All of the relevant CBPro features available when working with a Silicon Labs EVB will be available to you, with these exceptions: Launch There is no voltage regulator control or voltage/current readings of any kind You must configure the host interface settings so that CBPro can use the DUT correct communication scheme/wire out. If you write out your design/project file, all registers configured via the “Host Interface” section of the wizard are written to the DUT (these registers are skipped when writing a design to a Silicon Labs EVB). 5.3.1. Using the CBPro Wizard with Your PCB-Based DUT When you launch the CBPro wizard, instead of clicking the NVM Burn Tool, open your existing project file: Figure 25. Open Design Project File, and see Field Programmer Detected Rev. 1.0 17 CBPr o-D O NG L E UG In the design dashboard, you will see a pulldown to configure the host interface between the CBPROG-DONGLE and your PCB: Figure 26. Pull Down Menu for Communication Options Click the pulldown and configure the interface: Figure 27. Communication Configuration Window Once configured, you can write out your design to DUT using the button on the dashboard: Or on any configuration page in the wizard: 18 Rev. 1.0 C B P r o -D ON GL E U G 5.3.2. Using the EVB GUI with your PCB-Based DUT You launch the EVB GUI that same way you would when working with a Silicon Labs EVB: 1. From the CBPro wizard home page: 2. From the CBPro wizard design dashboard (you have opened a project file): 3. From the EVB GUI shortcut on the desktop or Windows Start Menu. Similar to the dashboard and burn tool, you must configure the host interface options. These are available in a panel in the upper right hand corner of the EVB GUI window. Figure 28. Socket or In-System Programming Options Rev. 1.0 19 CBPr o-D O NG L E UG First select either the Kit socket board if the socket is attached. Otherwise select “Wired to your own board”. Click the Config button to modify the host interface options. Once configured, you can then turn on the socket power to do the following: Write a project file to the device (File menu) DUT status registers Peek/poke arbitrary DUT registers Click the “Rescan” button to update the configuration options to the last command selected. Inspect 5.3.3. Socket Detection in EVB GUI Putting the device into the socket in the wrong orientation will not ruin the device, and the software does detect an orientation error. The first two images on the left show wrong orientation. The image on the right shows the proper orientation. The software automatically keeps the power off if it detects that the device is in an orientation that could damage the chip and won’t allow the socket power to be turned on. Figure 29. Socket Detection Results with Part in Different Orientations It is advised to review the socket orientation and chip to ensure everything is correct. Make sure that the smaller dot on the chip is lined up in the corner where the U1 is located on the socket as shown below. 20 Rev. 1.0 C B P r o -D ON GL E U G Figure 30. Correct Orientation of Device in Socket 5.4. In-Socket Volatile Register Programming and Register Debug This workflow allows users to use the full CBPro configuration Wizard and EVB GUI to make volatile changes to a device’s configuration and inspect the state of various status registers. There are two ways you can interact with your PCB-based DUT using the field programmer: Use CBPro Wizard to edit your device configuration, and write out changes directly to your DUT. Launch the EVB GUI, to inspect registers All of the relevant CBPro features available when working with a Silicon Labs EVB will be available to you, without any exceptions. The details of this workflow are the same as above. The IO voltage is set to 3.3 V within the hardware appropriately, and does not require any external configuration. Rev. 1.0 21 +V DD+ GND 1 2 3 4 BUSY_LED_B SF3 1 1 2 READY_LED_B PASS_LED_B C8 1uF 5V C9 10uF TP10 NI A0_CSB_SPI_PU_EN SDA_SDIO_SPI_PU_EN MCU_A1_SDO_SPI_PU_EN SCLK_SPI_PU_EN (SS) A0_CSB (MOSI) SDA_SDIO (MISO) MCU_A1_SDO (SCLK) SCLK LED Spacer Mounts 470 R64 D5 SP0503BAHT FB1 R63 470 22ohm @ 100MHz 2 2 2 2 2,3 2,3 2 2,3 SF4 LTL-14CHJ D15 Ready/Busy Red Green LTL-14CHJ D14 Red 2 JP1 GND BOOTLDR C2CK C2D C8051F380 U2 R3 100 P4.0 P4.1 P4.2 P4.3 P4.4 P4.5 P4.6 P4.7 P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 22 21 20 19 18 17 16 15 30 29 28 27 26 25 24 23 38 37 36 35 34 33 32 31 46 45 44 43 42 41 40 39 C3 1uF P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 5V MCU Programming RST/C2CK C2D D+ D- P0.7 P0.6 P0.5 P0.4 P0.3 P0.2 P0.1 P0.0 HEADER 4X1 13 14 8 9 47 48 1 2 3 4 5 6 C2 1uF VDD_MCU R67 10K R65 1K VDD_MCU VDD_MCU FAIL_LED_B PASS_LED_B BUSY_LED_B READY_LED_B R62 499 VDDA_VDDS This MCU pin is used to drive the VDDA_VDDS net and detect an incorrect catastraphic orientation of a 44-pin DUT. Two incorrect positions short VDDA_VDDS to gnd. 3 2,3 3 3 3 3 3 3 3 3 C4 0.1uF TP7 ID NI ENCLOSURE J3 Black plastic enclosure for the assembled circuit board. VDDA_VDDS_25VB A1_SDO VDD_SHDNB VDD_33VB VDD_25VB VDDIO_ENB VDDIO_33VB VDDIO_25VB VDDA_VDDS_SHDNB VDDA_VDDS_33VB 2 2 3 3 2 2 SPI_3W _EN MCU_A1_SDO_ENB I2C_LS_SHDNB I2C_XL_SHDNB I2C_SEL1 I2C_SEL2 2 2 ID 3 SDA SCL TP8 GND NI 1 R1 1K VDD_MCU 2 0 R68 V- 5 - + 4 3 VDD_MCU V+ C5 4.7uF AD8628 U4 NI Figure 31. CBPROG-DONGLE Schematic (1 of 3) 1K R12 C11 1uF R11 1K VDD_MCU TP9 NI VDD_MCU is supplied by the internal regulator of the MCU 10 VDD Green REGIN VBUS FAIL_LED_B J2 USB Type B SH SH Rev. 1.0 6 5 NI C7 0.1uF C6 0.1uF 1 2 C10 1uF NI GND I/O 5V U1 VDD VDD_pin 5 4 3 6 GND IN1 IN2 IN3 IN4 VDD C40 1uF NI NC NC ADG712 U3 4 12 VDDA_VDDS VDDA_VDDS_pin ADC Switching and Buffering 10.0K ±0.1% R9 5 1 16 9 8 13 NC3 NC2 NC1 NC0 R10 10.0K ±0.1% DS2431 Board Serial Number IC 3 11 12 GND 7 14 S1 2 D1 11 S2 D2 15 S3 D3 6 S4 D4 7 22 10 Pass/Fail CBPr o-D O NG L E UG 6. Schematics 6.1. CBPROG-DONGLE Schematic 1,2,3 1,2,3 A0_CSB SCLK SDA_SDIO Rev. 1.0 1 SCL 1 5 I2C_LS_SHDNB SDA 1 I2C signals from MCU SPI signals from MCU (SS) (SCLK) 1,2,3 (MOSI) MCU_A1_SDO 1 (MISO) C35 0.1uF B VDD_IO 6 R14 2.49K R15 2.49K NLSV1T244 U17 5 VDD_MCU 1 A R16 10K OEB VCCB GND VCCA 3 4 2 5 7 6 8 PCA9517D EN SCLB SDAB VCCB U6 C13 0.1uF GND SCLA SDAA VCCA 1 4 2 3 4 1 C14 0.1uF VDD_IO MCU_A1_SDO_ENB C38 0.1uF 1 3 5 2 R50 20K SPI_3W _EN ADG719 GND D VDD U16 0 NI R60 R51 20K IN S2 S1 1 6 4 1 I2C_XL_SHDNB 3 0 NI R61 R13 10K MCU_A1_SDO_SPI_PU_EN SDA_SDIO_SPI_PU_EN SCLK_SPI_PU_EN A0_CSB_SPI_PU_EN VDD_IO 1 1 1 1 2 3 1 C37 0.1uF GND EN VCC GND BUS2 BUS1 U5 GND IN1 IN2 IN3 IN4 VDD 3 R55 402 R56 402 NC NC 5 4 6 2 I2C bus accelerator for long bus lines and capacitance loading beyond 400pF. LTC4311 C12 0.1uF 5 1 16 9 8 13 Figure 32. CBPROG-DONGLE Schematic (2 of 3) I2C voltage level shifter VDD_MCU 10K R59 C36 0.1uF 5V Allows switching between 3-wire and 4-wire SPI. VDD_IO 14 S1 2 D1 11 S2 D2 15 S3 6 S4 D3 7 D4 10 SPI A1_SDO (MISO) voltage level shifter 5V R57 402 R58 402 Switchable Pull-ups for the SPI bus. 4 12 U8 ADG712 1 A0_CSB SCLK 1,2,3 1,2,3 1,3 1,2,3 SDA_SDIO A1_SDO SPI and I2C signals to DUT C B P r o -D ON GL E U G 23 Rev. 1.0 A B C 1 VDD_25VB VDDA_VDDS_33VB VDDA_VDDS_25VB 1 VDDA_VDDS_SHDNB VDD_33VB 1 VDD_SHDNB 1 1 1 VDDIO_25VB 1 VDDIO_ENB VDDIO_33VB 1 1 C26 1uF 5V 5V C31 1uF 10K R26 C32 1uF 10K R42 2 3 OUT 10K R43 4 5 6 8 2 1 C24 0.01uF FB OUT OUT 7 5 4 3 R33 4.42K R28 1.0 C25 4.7uF VDD_pin C27 0.01uF R34 9.53K 6 8 2 1 FB OUT OUT U14 GND NC EN IN IN TPS79501 7 5 4 3 1.0 R39 R47 8.06K C30 1uF R48 17.4K 1.0 R66 R45 17.4K R49 21.5K R41 10K VDD VDDA_VDDS VDDA_VDDS TP3 NI R46 21.5K R40 10K VDD TP1 NI SCLK 1,2 (SCLK) (MISO) A1_SDO 1,2 A0_CSB (MOSI) SDA_SDIO (SS) 1,2 1,2 D6 D7 D11 GL05T-E3-08 GL05T-E3-08 D10 R37 R35 R31 GL05T-E3-08 GL05T-E3-08 0 0 0 0 R29 33pF C39 9 7 5 3 1 SF1 Interface Connector 10 8 6 4 2 X1 SF2 2X5 Header 9 7 5 3 1 Figure 33. CBPROG-DONGLE Schematic (3 of 3) C29 0.01uF VDDA_VDDS_pin R44 8.06K C28 1uF R36 5.9K R27 10K VDDA_VDDS U13 GND NC EN IN IN TPS79501 VDD TPS76201 GND FB EN IN U12 3.3V 1 2.5V 5V 3.3V D VDD_IO 2.5V VDDIO 3.3V 24 2.5V VDD_IO TP2 NI 10 8 6 4 2 VDD R38 R32 R30 Bumpers that are placed on top of X1 as spacers between the conntector and the lid if the enclsoure. 0 0 0 VDDA_VDDS R24 2.49K VDD_IO GL05T-E3-08 D8 R25 2.49K D9 1 1 1 of GL05T-E3-08 D12 GL05T-E3-08 ID I2C_SEL2 I2C_SEL1 A B C D CBPr o-D O NG L E UG SF1 R3 20K NI R1 1K NI SF2 C7 10uF Rev. 1.0 SF3 5 4 3 6 NC3 NC2 NC1 NC0 SF4 U2 DS2431 I2C_SEL GND I/O 1 2 TP4 I2C_SEL NI 10 8 6 4 2 C8 10uF TP5 ID NI X1 10 8 6 4 2 9 7 5 3 1 TP6 GND 9 7 5 3 1 2X5 FEMALE NI C4 0.1uF VDDA_VDDS A0_CSB SDA_SDIO A1_SDO SCLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 VDD C1 0.1uF VDD C6 0.1uF C5 0.1uF 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 U1 64QFN-SKT, 9x9x0.5mm VDD Figure 34. 64-Pin Socket Board Schematic A0_CSB SDA_SDIO A1_SDO SCLK TP3 VDDA/VDDS NI 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 TP2 VDD 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 ePAD 65 VDDA_VDDS VDD NI I2C_SEL TP1 VDDS NI VDD C3 0.1uF 0 R2 0.1uF C2 VDDA_VDDS C B P r o -D ON GL E U G 25 R3 NI 182 1K R1 NI SF1 C6 10uF SF2 SF3 5 4 3 6 NC3 NC2 NC1 NC0 I2C_SEL1 I2C_SEL2 SF4 U2 DS2431 GND I/O TP4 I2C_SEL1 NI 1 2 TP5 I2C_SEL2 NI VDD NI 9 7 5 3 1 X2 TP7 GND 10 8 6 4 2 9 7 5 3 1 2X5 FEMALE NI TP6 ID 10 8 6 4 2 C7 10uF NI TP3 VDDA/VDDS A0_CSB A1_SDO SCLK SDA_SDIO C3 0.1uF VDDA_VDDS 1 2 3 4 5 6 7 8 9 10 11 VDD Figure 35. 44-Pin Socket Board Schematic A0_CSB SDA_SDIO A1_SDO SCLK 1 2 3 4 5 6 7 8 9 10 11 44 43 42 41 40 39 38 37 36 35 34 44 43 42 41 40 39 38 37 36 35 34 12 13 14 15 16 17 18 19 20 21 22 12 13 14 15 16 17 18 19 20 21 22 VDDA_VDDS C1 0.1uF NI TP2 VDD 33 32 31 30 29 28 27 26 25 24 23 C5 0.1uF 33 32 31 30 29 28 27 26 25 24 23 U1 VDD I2C_SEL1 44QFN-SKT, 7x7x0.5mm I2C_SEL2 ePAD 26 45 VDD 0.1uF C2 C4 0.1uF 0 R2 VDDS NI TP1 VDDA_VDDS CBPr o-D O NG L E UG Rev. 1.0 C B P r o -D ON GL E U G 7. Bill of Materials 7.1. CBPROG-DONGLE Bill of Materials NI Quantity Reference Value C2 C3 C8 C11 C26 9 C28 C30 C31 C32 1uF 3 1 9 2 1 2 1 7 1 1 C24 C27 C29 C39 C4 C6 C12 C13 C14 C35 C36 C37 C38 C5 C25 C9 D14 D15 D5 D6 D7 D8 D9 D10 D11 D12 FB1 J2 Voltage Tolerance Type PCB_Footprint ManufacturerPN Manufacturer 16V ±10% X7R C0603 C0603X7R160-105K Venkel 0.01uF 33pF 16V 25V ±20% ±10% X7R C0G C0603 C0402 C0603X7R160-103M C0402C0G250-330K Venkel Venkel 0.1uF 4.7uF 10uF LTL-14CHJ SP0503BAHT 10V 10V 10V ±10% ±20% ±20% X7R X7R X7R C0402|C0402L C1206 C1206 LED-T1-KK SOT143-AKKK|SOT143 C0402X7R100-104K C1206X7R100-475M C1206X7R100-106M LTL-14CHJ SP0503BAHTG Venkel Venkel Venkel SMT USB SOT23-123 L0805 CONN-USB-B GL05T-E3-08 BLM21PG220SN1 61729-0010BLF Vishay MuRata FCI GL05T-E3-08 22 Ohm USB Type B J3 ENCLOSURE 1 4 R1 R11 R12 R65 1K R13 R16 R26 R27 R40 R41 R42 R43 R59 R67 10 10K NI Rating 20mA 300mW 5A 6000mA 20V TVS 11V Dual Common Anode LITE-ON TECHNOLOGY CORP Littlefuse ±1% ThickFilm N/A R0402 Emulator7045 CR0402-16W-1001F Shanghai Zhongxingda Electronics 1/16W Venkel 1/16W ±1% ThickFilm R0402|R0402L CR0402-16W-1002F Venkel 4 R14 R15 R24 R25 2.49K R28 1.0 1 1/16W 1/16W ±1% ±1% ThickFilm ThickFilm R0402 R0402 CR0402-16W-2491F CR0402-16W-1R00F Venkel Venkel R29 R30 R31 R32 8 R35 R37 R38 R68 R3 1 R33 1 R34 1 R36 1 R39 R66 2 R44 R47 2 R45 R48 2 R46 R49 2 R50 R51 2 0 100 4.42K 9.53K 5.9K 1.0 8.06K 17.4K 21.5K 20K 1A 1/16W 1/16W 1/16W 1/16W 3/4W 1/16W 1/16W 1/16W 1/10W ±1% ±1% ±1% ±1% ±1% ±0.1% ±1% ±1% ±1% ThickFilm ThickFilm ThickFilm ThickFilm ThickFilm ThickFilm ±25PPM ThickFilm ThickFilm ThickFilm R0402|R0402L R0402 R0402 R0402 R0402 R1210 R0402 R0402 R0402 R0603 CR0402-16W-000 CR0402-16W-1000F CR0402-16W-4421F CR0402-16W-9531F CR0402-16W-5901F CRCW12101R00FKEAHP TFCR0402-16W-E-8061B CR0402-16W-1742F CR0402-16W-2152F CR0603-10W-2002F Venkel Venkel Venkel Venkel Venkel Vishay Dale Venkel Venkel Venkel Venkel 4 R55 R56 R57 R58 R62 1 R63 R64 2 R9 R10 2 SF1 SF2 2 402 499 470 10.0K BUMPER 1/16W 1/16W 1/16W 1/10W ±1% ±1% ±5% ±0.1% ThickFilm ThickFilm ThickFilm ±25PPM R0402 R0402|R0402L R0402 R0603 RUBBER_FOOT_0.250" CR0402-16W-4020F CR0402-16W-4990F CR0402-16W-471J ERA-3AEB103V SJ5382 Venkel Venkel Venkel Panasonic 3M Reference SF3 SF4 U1 U12 U13 U14 U16 U17 U2 U3 U8 U5 U6 X1 Value SPACER DS2431 TPS76201 TPS79501 ADG719 NLSV1T244 C8051F380 ADG712 LTC4311 PCA9517D 2X5 Header Rating Tolerance Type I2C Shrouded PCB_Footprint N/A SOJ6N4.45P1.27 SOT5N2.8P0.95 DFN8N3.0P0.65E2.4X1.65 SOT6N2.8P0.95 UDFN6N1P0.4 QFP48N9X9P0.5 TSSOP16N6.4P0.65 SC70-6N2.1P0.65 SO8N6.0P1.27 CONN2X5-RA-SBH11 ManufacturerPN 7363 DS2431P+ TPS76201DBV TPS79501DRBT ADG719BRTZ NLSV1T244MUTBG CF380P1104AGQ ADG712BRU LTC4311CSC6#TRMPBF PCA9517D SBH11-PBPC-D05-RA-BK Manufacturer Keystone Electronics Maxim TI TI Analog Devices On Semi SiLabs Analog Devices Linear Technology NXP Sullins Connector Solutions Reference C10 C40 C7 JP1 R60 R61 TP1 TP2 TP3 TP9 TP10 TP7 TP8 U4 Value 1uF 0.1uF HEADER 4X1 0 Rating Type X7R X7R Header ThickFilm PCB_Footprint C0603 C0402|C0402L CONN-1X4 R0603 ManufacturerPN C0603X7R160-105K C0402X7R100-104K TSW-104-07-T-S CR0603-16W-000 Manufacturer Venkel Venkel Samtec Venkel Loop Loop Loop OPAMP TESTPOINT TESTPOINT TESTPOINT SOT23-5N 151-207-RC 151-205-RC 151-203-RC AD8628AUJ-R2 Kobiconn Kobiconn Kobiconn Analog Devices Quantity 2 1 1 2 1 1 1 2 1 1 1 Not Installed Components Quantity NI NI NI NI NI 2 1 1 2 NI NI NI NI 5 1 1 1 RED BLUE BLACK AD8628 Voltage 100mA 500mA LDO LDO .9-4.5V Buffer MCU 5.5V Voltage 16V 10V Tolerance ±10% ±10% 1A 5V Rev. 1.0 27 CBPr o-D O NG L E UG 7.2. Si538x4x-64SKT-DK Socket Board BOM NI Reference Quantity Value Rating 6 C1 C2 C3 C4 C5 C6 0.1uF C7 C8 2 R2 1 SF1 SF2 SF3 SF4 4 U1 1 U2 1 X1 1 10uF 0 BUMPER 64QFN-SKT, 9x9x0.5mm DS2431 2X5 FEMALE Not Installed Components NI Quantity NI NI 1 1 Reference R1 R3 Value 1K 20K NI NI NI 3 2 1 TP1 TP2 TP3 TP4 TP5 TP6 RED BLUE BLACK Voltage Tolerance Type PCB_Footprint ManufacturerPN Manufacturer 10V ±10% X7R C0402|C0402L C0402X7R100-104K Venkel 10V ±20% X7R ThickFilm C1206 R0402|R0402L RUBBER_FOOT_SMALL 1A CONN C1206X7R100-106M CR0402-16W-000 SJ61A6 QFN64N9X9P0.5-SKT-WELLS-CTI 790-42064-101G SOJ6N4.45P1.27 DS2431P+ CONN2X5-FRA-SFH11 SFH11-PBPC-D05-RA-BK Sullins Connector Solutions Type ThickFilm ThickFilm PCB_Footprint R0402 R0402 ManufacturerPN CR0402-16W-1001F CR0402-16W-2002F Manufacturer Venkel Venkel Loop Loop Loop TESTPOINT TESTPOINT TESTPOINT 151-207-RC 151-205-RC 151-203-RC Kobiconn Kobiconn Kobiconn QFN Rating 1/16W 1/16W Voltage Tolerance ±1% ±1% Venkel Venkel 3M Sensata Maxim 7.3. Si538x4x-44SKT-DK Socket Board Bill of Materials NI Reference Quantity Value Rating 5 C1 C2 C3 C4 C5 0.1uF C6 C7 2 R2 1 4 SF1 SF2 SF3 SF4 U1 1 U2 1 X2 1 Not Installed Components NI Quantity NI NI NI NI NI 28 10uF 0 BUMPER 44QFN-SKT, 7x7x0.5mm DS2431 2X5 FEMALE 1 1 Reference R1 R3 Value 1K 182 3 3 1 TP1 TP2 TP3 TP4 TP5 TP6 TP7 RED BLUE BLACK Voltage Tolerance Type PCB_Footprint ManufacturerPN Manufacturer 10V ±10% X7R C0402|C0402L C0402X7R100-104K Venkel 10V ±20% X7R ThickFilm C1206 R0402|R0402L RUBBER_FOOT_SMALL 1A CONN C1206X7R100-106M CR0402-16W-000 SJ61A6 QFN44N7X7P0.5-SKT-WELLS-CTI 790-41044-101G SOJ6N4.45P1.27 DS2431P+ CONN2X5-FRA-SFH11 SFH11-PBPC-D05-RA-BK Sullins Connector Solutions Type ThickFilm ThickFilm PCB_Footprint R0402 R0402 ManufacturerPN CR0402-16W-1001F CR0402-16W-1820F Manufacturer Venkel Venkel Loop Loop Loop TESTPOINT TESTPOINT TESTPOINT 151-207-RC 151-205-RC 151-203-RC Kobiconn Kobiconn Kobiconn QFN Rating 1/16W 1/16W Voltage Tolerance ±1% ±1% Rev. 1.0 Venkel Venkel 3M Sensata Maxim C B P r o -D ON GL E U G CONTACT INFORMATION Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 Tel: 1+(512) 416-8500 Fax: 1+(512) 416-9669 Toll Free: 1+(877) 444-3032 Please visit the Silicon Labs Technical Support web page: https://www.siliconlabs.com/support/pages/contacttechnicalsupport.aspx and register to submit a technical support request. Patent Notice Silicon Labs invests in research and development to help our customers differentiate in the market with innovative low-power, small size, analogintensive mixed-signal solutions. Silicon Labs' extensive patent portfolio is a testament to our unique approach and world-class engineering team. The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or parameters. Silicon Laboratories reserves the right to make changes without further notice. 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Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders. Rev. 1.0 29