KW01 Development Hardware Reference Manual

KW01 Development Hardware
Reference Manual
Document Number: KW01DHRM
Rev. 1
1/2014
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© 2013 Freescale Semiconductor, Inc.
Document Number: KW01DHRM
Rev. 1
1/2014
Contents
About This Book
Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v
Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v
Chapter 1
Safety Information
1.1
1.1.1
1.2
1.3
Regulatory Approval For Canada (IC RSS 210) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
26 PART 5 – Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrostatic Discharge Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1
1-1
1-1
1-1
Chapter 2
KW01 Development Platform Overview and Description
2.1
2.2
2.2.1
2.3
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TWR-RF Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Driver Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1
2-2
2-3
2-4
Chapter 3
KW01-MRB
3.1
3.1.1
3.1.2
3.1.3
3.2
3.2.1
3.2.2
3.3
3.3.1
3.3.2
3.4
3.4.1
KW01-MRB Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Board Level Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
RF Performance and Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
Reset and JTAG Debug Port. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
IO Connectors J14 and J15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13
Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
Chapter 4
PCB Manufacturing Specifications
4.1
4.2
4.3
4.4
4.5
Single PCB Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Panelization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4-1
4-2
4-2
4-3
4-3
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iii
4.6
4.7
4.8
4.9
Electrical PCB Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Hole Specification/Tool Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
File Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4-3
4-3
4-3
4-4
KW01 Development Hardware Reference Manual, Rev. 1
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Freescale Semiconductor
About This Book
This manual describes Freescale’s KW01-MRB development platform hardware. The MKW01Z128CHN
development platform is a highly-integrated, cost-effective, system-in-package (SIP), sub-1GHz wireless
node solution with an FSK, GFSK, MSK, or OOK modulation-capable transceiver and low-power ARM
Cortex M0+CPU microcontroller. The highly integrated RF transceiver operates over a wide frequency
range including 315 MHz, 433 MHz, 470 MHz, 868 MHz, 915 MHz, 928 MHz, and 955 MHz in the
license-free Industrial, Scientific and Medical (ISM) frequency bands.
Audience
This manual is intended for system designers.
Organization
This document is organized into the following chapters.
Chapter 1
Safety Information — Highlights some of the FCC requirements.
Chapter 2
MKW01 Development Platform Overview and Description — Provides an
overview of the two boards that comprise the MKW01 development platform.
Chapter 3
Modular Reference Board — This chapter details the KW01-MRB evaluation
board based on the Freescale MKW01Z128CHN device.
Chapter 4
PCB Manufacturing Specifications — This chapter provides the specifications
used to manufacture the various KW01-MRB printed circuit boards (PCBs).
Revision History
The following table summarizes revisions to this document since the previous release (Rev 0.0).
Revision History
Location
Entire document
Revision
First public release
KW01 Development Hardware Reference Manual, Rev. 1
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v
Definitions, Acronyms, and Abbreviations
The following list defines the acronyms and abbreviations used in this document.
ADC
Analog to Digital Converter
AES
Advanced Encryption Standard
CTS
Clear to Send
DAC
Digital to Analog Converter
I2C
Inter-Integrated Circuit is a multi-master serial computer bus
ISM
Industrial Scientific Medical 2.4 GHz radio frequency band
JTAG
Joint Test Action Group
LGA
Land Grid Array
MAC
Media Access Controller
MCU
Microcontroller Unit
PCB
Printed circuit board
PiP
Platform in Package
PWM
Pulse-width modulation
RCM
Remote Control Module
REM
Remote Extender Board
RTS
Request to Send
SMA Connector
SubMiniature version “A” connector
SPI
Serial Peripheral Interface
SSI
Synchronous Serial Interface
TACT Switch
A switch that provides a slight “snap” or “click” to the user to indicate function.
TELCO
Telephone Company
USB
Universal Serial Bus
VCP
Virtual Com Port
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Freescale Semiconductor
Chapter 1
Safety InformationRev. 1
1.1
Regulatory Approval For Canada (IC RSS 210)
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the
following two conditions:
1. This device may not cause interference, and
2. This device must accept any interference, including interference that may cause undesired
operation of the device.
1.1.1
26 PART 5 – Appendix
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
1.2
Electrostatic Discharge Considerations
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the human body
model (HBM), the machine model (MM) and the charge device model (CDM).
All latch-up test testing is in conformity with the JESD78 IC Latch-Up Test.
When operating or handling the development boards or components, Freescale strongly recommends
using at least the grounding wrist straps plus any or all of the following ESD dissipation methods:
• Flexible fabric, solid fixed size, or disposable ESD wrist straps
• Static control workstations, static control monitors and table or floor static control systems
• Static control packaging and transportation materials and environmental systems
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1-1
Safety InformationRev. 1
1.3
Disposal Instructions
This product may be subject to special disposal requirements. For product disposal instructions, refer to
www.freescale.com/productdisposal.
KW01 Development Hardware Reference Manual, Rev. 1
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Freescale Semiconductor
Chapter 2
MKW01 Development Platform Overview and Description
2.1
Introduction
The MKW01development platform is an evaluation environment based on the Freescale
MKW01Z128CHN device. The MKW01Z128CHN is a highly-integrated, cost-effective,
system-in-package (SIP), sub-1GHz wireless node solution with an FSK, GFSK, MSK, or OOK
modulation-capable transceiver and low-power ARM Cortex M0+CPU microcontroller. The highly
integrated RF transceiver operates over a wide frequency range including 315 MHz, 433 MHz, 470 MHz,
868 MHz, 915 MHz, 928 MHz, and 955 MHz in the license-free Industrial, Scientific and Medical (ISM)
frequency bands. This configuration allows users to minimize the use of external components.
The MKW01Z128CHN is targeted for the following low-power wireless applications:
• Automated Meter Reading
• Wireless Sensor Networks
• Home and Building Automation
• Wireless Alarm and Security Systems
• Industrial Monitoring and Control
• Wireless MBUS Standard (EN13757-4:2005)
Freescale supplements the MKW01Z128CHN with tools and software that include hardware evaluation
and development boards, software development IDE and applications, drivers, custom PHY usable with
Freescale’s IEEE 802.15.4 compatible MAC, and an available wireless MBUS solution.
Features are listed in Section 2.2, “Features”.
2.2
Features
The MKW01 development platform is built around the concept of having a single daughter card
(KW01-MRB) that contains the MKW01Z128CHN IC and all necessary I/O connections for use as a
self-contained module or for connection to an application motherboard like the TWR-RF board.
Figure 2-1 shows a photo of the KW01-MRB.
KW01 Development Hardware Reference Manual, Rev. 1
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2-1
MKW01 Development Platform Overview and Description
Figure 2-1. KW01-MRB
Features of the MKW01Z128CHN development platform include:
• Based on Freescale’s low-cost MKW01Z128CHN sub-1GHz wireless node solution with an FSK,
GFSK, MSK, or OOK modulation-capable transceiver and low-power ARM Cortex M0+CPU
microcontroller, and a functional set of MCU peripherals into a 60-pin LGA package
• Reference design area with small footprint, low cost RF node
— Power Amplifier Output
— Unbalanced input/output port
— Flexible RF-Front End for different bands operation
— Programmable output power from -18 dBm to +17 dBm in 1dB steps
— High Sensitivity: down to -120dBm at 1.2kbps
• 30 or 32 MHz reference oscillator depending on regional configuration
• SWD MCU debug port
KW01 Development Hardware Reference Manual, Rev. 1
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Freescale Semiconductor
MKW01 Development Platform Overview and Description
•
•
•
•
2.2.1
Optional secondary 32.768 kHz crystal for accurate low power RTC timing
Master reset switch
Full power regulation and management
KW01-MRB board provides
— Required circuitry for MKW01Z128CHN - crystals and RF circuitry including SMA
connectors for Power Amplifier Output and Input/Output RF port
— Local power supply regulation
— Access to all GPIO
— Standalone or daughter card use modes
— SWD connector
— Onboard UART communication via mini-USB connector.
— Two boards allow board-to-board packet communications.
TWR-RF Module
The KW01-MRB can run in the Freescale Tower System using the RF-Tower module (TWR-RF). Features
of the TWR-RF module include:
• Standard sockets 100 mils J5 and J4 (2 x 9 and 2 x 10) to connect either a 1323x Modular Reference
Board (1323x-MRB), a 12311 Modular Reference Board (12311-MRB) or a KW01 Modular
Reference Board (KW01-MRB)
• Standard header 100 mils J1 (2 x 20) to enable signalling path to TWR primary and secondary
connectors.
• Standard header 100 mils J6 (3 x 12) to enable signalling to on board HW and USB interface or to
TWR system Hardware
• On-board regulator to provide external supply
• Four (4) user-controllable LEDs
• Four (4) user push-button switches
• Mini-USB Type mini-B connector
Figure 2-2 shows a simplified block diagram of the Freescale Tower RF system.
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2-3
MKW01 Development Platform Overview and Description
Figure 2-2. Simplified TWR-RF Block Diagram
See the TWR-RF Reference Manual for more information about the RF-Tower module.
2.3
Driver Considerations
When users first connect a KW01-MRB to a PC, they may be prompted to install drivers. If the drivers do
not automatically load, they can be found here if they have been previously installed:
C:\Program Files\Freescale\Drivers
If they haven’t been downloaded previously, download the appropriate drivers and follow the instructions
to complete driver installation from:
www.freescale.com
Follow the instructions as they appear on the screen to complete driver installation.
Be aware of the following:
• The boards use the FSL USB2SER USB to UART bridge converter.
• Download the appropriate driver and follow the instructions to complete driver installation from
www.freescale.com
KW01 Development Hardware Reference Manual, Rev. 1
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Freescale Semiconductor
Chapter 3
KW01-MRB
3.1
KW01-MRB Overview
The KW01-MRB is an evaluation board based on the Freescale MKW01Z128CHN device. The
KW01-MRB provides a platform to evaluate the MKW01Z128CHN device, develop software and
applications. The core device is accompanied by the 32 MHz reference oscillator crystal, RF circuitry
including SMA for antenna connection and/or instrumentation, and supporting circuitry.
This basic board is intended as the core module for MKW01Z128CHN evaluation and application
development and can be used in the following modes:
• Simple standalone evaluation platform
• Daughtercard to other Development Platform boards (TWR-RF, 1323x-RCM or 1323x-REM)
• Daughtercard to an application specific motherboard.
3.1.1
Features
The KW01-MRB provides the following features:
• Small form factor (2.6 x 2 inches)
• 4-Layer, 0.034 inch thick FR4 board
• MKW01Z128CHN reference design area
— LGA footprint and power supply bypass
— 30 or 32 MHz reference oscillator crystal depending on regional configuration
— RF components and layout
• Low cost RF node
— Dual Output RF Path. Transmit/Receive (RFIO) and single Power Amplifier Transmitter (PA
Boost) Output
— Differential input/output port (typically used with a balun)
— Programmable output power from -18 dBm to +17 dBm typical
— High sensitivity of -120 dBm at 1.2 KBPS
— SMA output connector for Transmit/Receive Output
— SMA output connector for Power Amplifier
• Two connectors provided daughter card mounting
— 20-Pin primary connector
— 18-Pin secondary connector
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3-1
KW01-MRB
•
•
•
3.1.2
— Provide main supply voltage to board
— Provide access to all MKW01Z128CHN GPIO pins
Flexible board power supply
— Onboard 3.3 V LDO series regulator
— Regulator bypass jumper option
— Separate external voltage source option
— Power-on green LED
— Jumpers allow various block current measurements
10-Pin SWD MCU debug port
MKW01Z128CHN reset switch
Form Factor
Figure 3-1 shows the KW01-MRB connector and header locations.
Figure 3-1. KW01-MRB
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Freescale Semiconductor
KW01-MRB
Figure 3-2 shows a footprint of the KW01-MRB with the location of the IO Headers J2 and J3. Users can
create a motherboard to mount the KW01-MRB and headers J2 and J3 are used for that connection.
• Both headers have standard 0.10in / 2.54 mm pin spacing
• J2 is 20-pin and J3 is 18-pin
• Both are pin headers mounted on the bottom side of the KW01-MRB and are intended to plug into
matching receptacles on the motherboard.
Figure 3-2. KW01-MRB Top Side (Component Side) Footprint
3.1.3
Board Level Specifications
Table 3-1. KW01-MRB Specifications
Parameter
Min
Typ
Max
Units
66 x 51
2.60 x 2.01
mm
inches
Notes/Conditions
General
Size (PCB: X, Y)
Layer build (PCB)
0.8
0.031
mm 4-Layer
inches
Dielectric material (PCB)
FR4
Power
Voltage supply (DC)
3.5
5
16
V
Full module, into 3.3 V regulator, U2. Take
care to not exceed power dissipation of U2.
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3-3
KW01-MRB
Table 3-1. KW01-MRB Specifications (continued)
Parameter
Min
Current consumption
(All numbers typical)
Typ
Max
Units
Notes/Conditions
31
mA
XCVR Standby (MCU running)
45
mA
Receive
80
mA
TX, +13 dBm via RFIO
110
mA
TX, +17 dBm via PA_Boost
• Operating temperature is limited to +70°C
due to switches. Basic circuit is good for a
maximum temperature of +85°C.
Temperature
Operating temperature (see note)
-40
+25
+70
°C
Storage temperature
-30
+25
+70
°C
RF Receiver
FSK Sensitivity
-105
to
-120
dBm
OOK Sensitivity
-112
dBm
Adjacent channel Rejection (Offset =
+/- 25 kHz or 50 kHz)
-42
dB
2nd order Intercept point
+75
dBm
3rd order Intercept point
+20
dBm
RSSI dynamic range
-115
0
-18
+13
RF Transmitter
RF Power Output (RFIO pin)
RF Power Output (PA_Boost pin)
+17
Adjacent channel Power (25KHz
offset)
dBm
Programmable in 1dB steps
dBm
-37
dBm
Safety
UL
MRB is approved accordingly to the IEC
60950-1 and EN 60950-1, First Edition
standards
Environment
RoHS
MRB complies with the EU Directive
2002/95/EC of 27 January 2003
WEEE
MRB complies with the EU Directive
2002/95/EC of 27 January 2003
3.2
Functional Description
The KW01-MRB is built around Freescale’s MKW01Z128CHN 56-pin LGA platform. Figure 3-2 shows
a simple block diagram. This board is intended as a simple evaluation platform and as a building block for
KW01 Development Hardware Reference Manual, Rev. 1
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Freescale Semiconductor
KW01-MRB
application development. The 4-layer board provides the MKW01Z128CHN with its required RF
circuitry, 32 MHz reference oscillator crystal, and power supply bypassing. The layout for this base level
functionality can be used as a reference layout by the user target board.
In additional to the base MKW01Z128CHN functionality, the KW01-MRB provides features to assist in
debug, reset button, simple power manager, and expansion connectors for the GPIO. In the following
sections, refer to:
• Figure 3-1 for location of connectors and features
• Figure 3-3 for the functional blocks
• Figure 3-9 for the board schematic
Figure 3-3. KW01-MRB Block Diagram
3.2.1
RF Performance and Considerations
The MKW01Z128CHN transceiver is a single-chip integrated circuit ideally suited for today's high
performance ISM band RF applications. It is intended for use as a high-performance, low-cost FSK and
OOK RF transceiver for robust, frequency agile, half-duplex bi-directional RF links. The
MKW01Z128CHN is intended for applications over a wide frequency range, including the 433 MHz and
868 MHz European and the 902–928 MHz North American ISM bands.
• Output power –18 to +17 dBm, depending on output and setting
The KW01-MRB uses a flexible RF path topology that make it suitable for working in different frequency
bands by replacing a minimum number of components while providing good RF performance. The tables
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3-5
KW01-MRB
in Section 3.4.1, “Bill of Materials” show the different BOM according to different frequency bands of
operation.
NOTE
See the MKW01Z128CHN Data Sheet and Reference Manual for more RF
design information.
Figure 3-4. KW01-MRB RF Circuitry
3.2.2
Clocks
The MKW01Z128CHN provides for two clocks:
• 32 MHz Reference Oscillator — Figure 3-5 shows the external 32 MHz external crystal Y1. This
mounted crystal must meet the MKW01Z128CHN specifications. (30 MHz in some board
configurations)
— Capacitors C22 and C25 provide the bulk of the crystal load capacitance.
— Signal DIO5/CLKOUT can be used to supply an external clock to MCU die and to measure a
the 32MHz oscillator frequency.
— The KW01-MRB has provision for injecting an external 32 MHz clock source as an alternative
to use of the onboard crystal:
– The 0 Ohm jumper R5 should be removed to disconnect Y1.
– C23 must be mounted
– The external 32 MHz source is connected to 2-pin header J4.
• Optional 32.768 kHz Crystal Oscillator - Provision is also made for a secondary 32.768 kHz crystal
Y2 (see Figure 3-6). This oscillator can be used for a low power accurate time base.
KW01 Development Hardware Reference Manual, Rev. 1
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Freescale Semiconductor
KW01-MRB
— The module comes provided with this Y2 crystal and its load capacitors C34 and C35.
— Load capacitors C34 and C35 provide the entire crystal load capacitance
— The 32 kHz oscillator components are supplied, but un-enabled. Zero-ohm resistors R10 and
R11 enable use of IO signals PTA18 and PTA17 via the IO connector
— Use J8 to enable crystal signaling to MCU die from the DIO5 or from the 32kHz crystal.
Figure 3-5. KW01-MRB 32 MHz Reference Oscillator Circuit
Figure 3-6. KW01-MRB 32.768 kHz Optional Oscillator Circuit
KW01 Development Hardware Reference Manual, Rev. 1
Freescale Semiconductor
3-7
KW01-MRB
3.3
Reset and SWD Debug Port
The reset circuit and SWD port connector are shown in Figure 3-7. See Figure 3-1 for switch and header
locations.
• Reset switch SW1 is active low and provides a hardware reset to the MKW01Z128CHN MCU die,
which in turn, through a GPIO, can provide a RESET to the radio die by adding a jumper to J7. The
Reset circuit also includes an LED for monitoring purposes.
• The 10-pin SWD 2x3 header J5 is provided to connect the MKW01 serial debug port to a standard
Kinetis Series debug module.
Figure 3-7. KW01-MRB Reset Switch and SWD Port
KW01 Development Hardware Reference Manual, Rev. 1
3-8
Freescale Semiconductor
KW01-MRB
3.3.1
Power Management
The KW01-MRB power management circuit is shown in Figure 3-8.
Figure 3-8. KW01-MRB Power Management Circuit
Power to the KW01-MRB can be configured in several ways and the circuit has the following features:
• Board can be supplied through the IO headers (V_BRD)
• Board can be supplied through the mini-USB connector (J16)
• Board can be supplied from an external DC supply (J6).
— The external supply can be unregulated voltage and make use of the onboard 3.3 V LDO
regulator.
• Board can be supplied from an external DC supply (J9).
— The external supply voltage can be used directly without use of the LDO if its above 3.3Volts.
• 8-Pin 2x4 header J13 provides means to supply current to various board components and also
measure current if desired
• Green LED D1 is available as a power indicator.
Table 3-2 shows the header configuration information for the various power supply modes.
•
•
•
•
NOTE
The Freescale TWR-RF development boards can generate system
powerand supply the voltage to the KW01-MRB through pin V_BRD
on both J14 or J15.
If an external supply is used via KW01-MRB header J5, current can
flow to the TWR_RF.
Only one supply at a time should be connected to the platform.
In all modes, the IO voltage supply to peripherals on any board on the
TWR platform must be the same voltage (V_BRD) as all other boards
on the platform.
KW01 Development Hardware Reference Manual, Rev. 1
Freescale Semiconductor
3-9
KW01-MRB
Table 3-2. KW01-MRB Power Configurations
Mode
Voltage
Range
External
Source
J6
Ext Mode
Source
J9
Source V_BRD
2.7 - 3.6 V1
Not used
Not used
Mini USB
-Using LDO
5V
Mini-USB
Not used
Short pins for all
desired supplies
External voltage w/regulation • Input range is set by the LDO
regulator.
• 3.3 V is supplied to KW01-MRB;
do not use motherboard supply
• J14 and J15 Headers supply
voltage to V_BRD pins when J13,
Pins 3-4 are shorted
Not used
Short pins for all
desired supplies
External voltage w/regulation • Input range is set by the LDO
regulator.
• 3.3 V is supplied to KW01-MRB;
do not use motherboard supply
• J14 and J15 Headers supply
voltage to V_BRD pins when J13,
Pins 3-4 are shorted
Connected supplies
DC Voltage
Short pins for all
desired supplies
External voltage w/o regulation • Input range is set by the onboard
circuitry
• 2.7 - 3.3 V is supplied to
KW01-MRB
• J14 and J15 Headers supply
voltage to V_BRD pins
Current Enable
J13
Short Pins 3-4 - Normal Operation short other desired The KW01-MRB main supply is
supplies
supplied by an external board
through the J15 and J14 Headers
J17 Short
Pins 2-3
External Source
- Using LDO
3.5 - 16 V2
Connected supplies
DC Voltage
J17 Short
Pins 1-2
External Source
- Not Using LDO
1
2
2.7 - 3.6 V
Not used
Description
The MKW01Z128CHN can run as low as 1.8 V
Take care to not exceed power dissipation of U2. Typically, at room temperature, this voltage should not exceed 7.5 V. At max
temperature (70C), it should not exceed 5.5 V during full power: +17 dBm, transmit, 8 V and 12 V, respectively, at +13 dBm,
transmit.
Header J13 provides means to disable different sub-circuits or measure current and connections are
described in Table 3-3. Current measurements can be made by inserting a current meter in place of a
designated jumper.
KW01 Development Hardware Reference Manual, Rev. 1
3-10
Freescale Semiconductor
KW01-MRB
Table 3-3. Power Distribution Header J13
3.3.2
Supply
Designation
Header
Pins
V_RF
1-2
Supply voltage to MKW01Z128CHN -Radio die
• Normally jumpered
• Supplies only the MKW01Z128CHN Radio die
Normally always same voltage as V_BRD
V_BRD
3-4
Supply voltage connected to IO Connectors J2 and J3 • This supplies J2 and J3 if an external MRB supply is used
• This voltage supplies the MRB if the motherboard is the main power
• This connection is normally always jumpered
V_IC
5-6
Supply voltage to MKW01Z128CHN -MCU die
• Normally jumpered
• Supplies only the MKW01Z128CHN MCU die
• Normally always same voltage as V_BRD
V_LED
7-8
Supply voltage to power indicator LED
• Jumper to use indicator or IR blaster
• Leave open for lowest power
Description
IO Connectors J14 and J15
The two IO connectors J14 and J15 are standard 100 mil pin headers mounted on the back (non-component
side) of the KW01-MRB.The primary header J15 is 20-pin and the secondary header J14 is 18-pin, and
they are mounted physically in such a manner as to prevent reverse insertion of the KW01-MRB into a
motherboard receptacle (see Figure 3-2). When the TWR-RF, 1323x-RCM or 1323x-REM or custom
motherboard is plugged into these connectors, most GPIOs on the MKW01Z128CHN MCU can be
accessed via the IO connectors.
• V_BRD is the connector supply voltage.
— Depending on power supply configuration, this voltage may supply the KW01-MRB from the
motherboard or the KW01-MRB may supply this voltage to the motherboard. See
Section 3.3.1, “Power Management”.
— Peripherals connecting to the MKW01Z128CHN IO and the MKW01Z128CHN supply should
all use this same voltage.
NOTE
The TWR-RF, 1323x-RCM and 1323x-REM and KW01-MRB are supplied
configured for the motherboard to supply main power.
•
•
Some of the GPIO are shared with onboard devices. Check for the KW01-MRB schematic and
Table 3-4 and Table 3-5 for any conflict.
SWD port signals PTA3 and PTA4 are NOT connected to the IO headers to prevent possible
interference with the debug port.
KW01 Development Hardware Reference Manual, Rev. 1
Freescale Semiconductor
3-11
KW01-MRB
Table 3-4. 20 Pin Connector
Header Pin
Number
MKW01Z128CHN Pin
Name
1
V_BRD
2
NC
3
GND
4
NC
5
PTA1/RXD
6
NC
7
PTA2/TXD
8
NC
9
PTB0
10
PTA20/Reset
11
PTC2/SDA
12
PTB2
13
PTC1/SCL
14
PTB17
15
GND
16
DIO5/CLKOUT
17
PTA4
Port A Bit 4
18
PTD5
Port D Bit 5
19
PTD6
Port D Bit 6
20
PTD7
Port D Bit 7
Description
VDD supply to module
Module ground
UART RXD input to MCU
UART TXD Output from MCU
GPIO / Timer IO
MCU Reset_out_b
I2C Bus data signal (SDA)
UART flow control RTS input into MCU (implemented in Freescale software)
I2C Bus clock signal (SCL)
UART flow control CTS output from MCU (implemented in Freescale software)
Module ground
Reference Crystal Oscillator
Table 3-5. 18 Pin Connector
Header Pin
Number
MKW01Z128CHN Pin Name
1
V_BRD
2
PTA18/EXTAL_32K
Port A Bit 18- signal shared with 32.768 kHz oscillator
3
PTA19/XTAL_32K
Port A Bit 19- signal shared with 32.768 kHz oscillator
4
GND
Module Ground
5
DIO0
Transceiver GPIO Bit 0
6
DIO3
Transceiver GPIO Bit 3
7
PTE16
Port E Bit 16
8
PTB1
Port B Bit 1
9
PTC3
Port C Bit 3
Description
VDD supply to module
KW01 Development Hardware Reference Manual, Rev. 1
3-12
Freescale Semiconductor
KW01-MRB
Table 3-5. 18 Pin Connector
Header Pin
Number
MKW01Z128CHN Pin Name
10
PTE18
Port E Bit 18
11
PTE19
Port E Bit 19
12
PTE0
Port E Bit 0
13
PTC4
Port C Bit 4
14
PTE1
Port E Bit 1
15
PTE17
Port E Bit 17
16
PTD4
Port D Bit 4
17
DIO2
Transceiver GPIO Bit 2
18
GND
Module ground
Description
KW01 Development Hardware Reference Manual, Rev. 1
Freescale Semiconductor
3-13
Schematic, Board Layout, and Bill of Material
5
4
3
2
KW01-MRB
3-14
3.4
1
TP3
V_IC
V_RF
V_RF
TP1
TP2
D
D
VR_ANA
VR_DIG
V_IC
TP18
C33
C24
C26
C27
C30
C19
C20
C21
0.1UF
10UF
0.01UF
0.1UF
0.1UF
0.1UF
0.1UF
TP19
PTD4
PTE1
PTC1/SCL
32
31
5
6
7
8
9
19
55
VDDA
SCK/PTC5
PA_BOOST
XTA
XTB
PTD4
PTE1
RXTX
PTE0/DISABLED
PTD7
PTE16/ADC0DP1/ADC0_SE1
PTE17/ADC0_DM1/ADC0_SE5a
PTE18/ADC0_DP2/ADC0_SE2
PTE19/ADC0_DM2/ADC0_SE6a
PTE30/DAC_OUT/ADC0_SE23/CMP0_IN4
RFIO
RESET
VR_PA
TP13
J3
DIO1
3
HDR 1X2
DIO2
DIO3
MRB-SPI_MISO
59
MRB-SPI_CLK
C17
220PF
0.01UF
TP7
TP11
L9
1
2
3
4
20
1
47PF
C12
6.8PF
DNP
10PF
2
L1
1
TP6
C5
100PF
PA_BOOST_EXT
2
5.6NH
C45
10PF
DNP
C3
C2
6.8PF
3.3pf
39
J2
5
2
48
RESET_B_XCVR
30
C14
220PF
L6
33nH
0.1UF
L7
MKW01Z128
RFIO
DNP
C11
10PF
C13 6.8PF
1
2
1
L4
C7
2
CON_1_SMA
DNP
10PF
C6
100PF
L2
1
0.0068UH
C15
2.0PF
B
C1
L3
C10
0.002uH
0.0047UH
R8
DNP
10PF
5.6NH
EXTAL_32M
XTAL_32M
CON_1_SMA
C
C8
C16
NC_30
L5
33nH
TP10
PA_BOOST
41
C18
1
57
TP8
1
60
58
37
J1
5
2
PTD4
DIO5/CLKOUT
MRB-SPI_MOSI
MRB-SPI_SS_B
46
47
4
TP16
2
1
35
56
VDD
VDD
MISO/PTC7
VSS1
VSS1
PTE0
PTD7
PTE16
PTE17
PTE18
PTE19
PTE30
27
34
MOSI/PTC6
NSS/PTD0
PTC4/DISABLED
PTC1/ADC0_SE15
PTC2/ADC0_SE11
PTC3
PTD5
PTD6
TP14
DIO0
4
PTC3
PTD5
PTD6
PTC2/SDA
23
24
25
26
28
29
TP4
VR_PA
DIO0
DIO1
DIO2
DIO3
DIO4
3
PTC1/SCL
PTC2/SDA
VR_DIG
49
50
51
52
53
54
1
PTC4
PTB0
PTB1
PTB2
PTB17
VR_ANA
45
2
SCL
SDA
VR_PA
DIO0/PTE2
DIO1/PTE3
DIO2
DIO3
DIO4
DIO5/CLKOUT
44
42
1
4.7K
VR_DIG
2
R4
4.7K
VR_ANA
PTA0/SWD_CLK
PTA1/DISABLED
PTA2/DISABLED
PTA3/SWD_DIO
PTA4/NMI_b
PTA18/EXTAL0
PTA19/XTAL0
PTA20/RESET_b
FLAG1
FLAG2
R2
C
17
18
21
22
VREFH
VREFL
GND_PA1
GND_PA2
PTB0
PTB1
PTB2/UART0_RTS
PTB17/UART0_CTS
U1
61
62
EXTAL_32K
XTAL_32K
PTA20
10
14
13
11
12
15
16
33
VSSA
40
38
V_IC
SWD_CLK
RXD1
TXD1
SWD_DIO
GND/SCAN
VREF_L
1
2
36
VREF_H
PTA0
PTA1/UART0_RXD
PTA2/UART0_TXD
PTA3
PTA4
PTA18
PTA19
V_IC RESET_OUT_B
VBAT1
HDR 1X2
VSSA
2
1
HDR 1X2
VBAT2
J11
V_IC
2
1
KW01 Development Hardware Reference Manual, Rev. 1
J10
43
0.1UF
RFIO_EXT
2
0.0068UH
C46
10PF
DNP
C4
C9
7.5pF
5.6PF
0
B
VSSA
DIO0
DIO1
R21
0
R22
0
PTC3
TL1
TL2
TP25
BH2
BH1
BH3
BH4
PTC4
125
125
125
125
DIO SIGNALS
Freescale Semiconductor
A
A
ICAP Classification:
Drawing Title:
X
FCP:
FIUO: ___
PUBI: ___
MRB-KW019032
Page Title:
MKW01Z128CHN
5
4
3
Figure 3-9. KW01-MRB Schematic
2
Size
C
Document Number
Date:
Friday, October 25, 2013
Rev
D
SCH-27792 PDF: SPF-27792
Sheet
1
4
of
5
Freescale Semiconductor
5
4
3
2
1
J7
RADIO RESET
V_IC
2
1
HDR 1X2
R19
100
R6
RESET_B_XCVR
PTE30
4.7K
DNP
V_IC
V_BRD
J15
D
1
3
5
7
9
11
13
15
17
19
RXD0
TXD0
UART_RXD0
UART_TXD0
PTB0
PTC2/SDA
PTC1/SCL
SDA
SCL
NMI_b
PTA4
PTD6
V_BRD
2
4
6
8
10
12
14
16
18
20
RESET_B_XCVR
V_BRD
V_BRD
J14
C38
PTA20
RTS
CTS
0
DIO0
PTE16
PTC3
PTE19
PTC4
PTE17
DIO2
0.1UF
RESET_OUT_B
PTB2
PTB17
DIO5/CLKOUT
PTD5
PTD7
R10
XTAL_32K
PTA19
HDR_10X2
1
3
5
7
9
11
13
15
17
2
4
6
8
10
12
14
16
18
R11
EXTAL_32K
0
PTA18
D
C37
DIO3
PTB1
PTE18
PTE0
PTE1
PTD4
0.1UF
R12
RESET
15K
SW1
HDR 2X9
20-PIN GPIO
STANDARD HEADER
J12
GPIO
1
RESET_SW
2
SKQYAFE010
GPIO MAPPING
1
3
C36
2
4
PTA20
RESET_OUT_B
961204-6404-AR
1000pF
D4
422.0 RST_IND_R
R13
3.3V
C RST_IND
A
RED
J9
1
2
P3V3
HDR 1X2
J6: EXTERNAL SUPPLY > 3.3V
XTAL_32K
J6
V_EXT_IN
1
2
C
D3
A
HDR TH 1X3
0
EXTAL_32K_EXT
EXTAL_32K
V_LED
TP15
C
R5
XTAL_32M
EXTAL_32M
POWER ON
P3V3
PTA18
DIO5/CLKOUT
HDR 1X2
A
MBR0520LT1G
VDD
TP20
V_LDO
V_RF
U2
1UF
1
0
4
BYP
3
EN
2
C28
VIN
D2
VOUT
J13
C V_LDO_R
A
5
1
3
5
7
0
MBR0520LT1G
C29
BYP
R9
2
4
6
8
C22
11pF
1
2
3
XTAL_32K
C34
12PF
C25
11pF
HDR 1X2
330
32MHz XTAL
V_IC
32kHz XTAL
TP22
0.01UF
PTA19
2
32.768KHZ
12PF
GND
LP2985AIM5-3.3
C35
XTB
32MHZ
V_BRD
TP21
4
2
Y2
J4
R3
HDR_2X4
1
1
C23
DNP
10PF
TP17
2.2UF
ON/OFF
TP9
C
R7
C
J8
Y1
TP12
C32
3
2
1
XTAL_32M
D1
GREEN
V_UNREG
3.3V LDO REGULATOR
V_LED
TP5
POWER MANAGEMENT
BER TEST CONNECTOR
B
B
J17
UART_TXD_Onboard
UART_RXD0
UART_RXD_Onboard
UART_TXD0
V_BUS
V_EXT_IN
UART_CTS_Onboard
PTB17
V_IC
UART_RTS_Onboard
PTB2
RXD0
TXD0
1
3
4
6
7
9
10
12
13
15
2
RX
5
TX
8
J18
PTA1/UART0_RXD
PTA2/UART0_TXD
DIO1
DIO2
PTE17
V_UNREG
11
1
2
3
4
DCLK
DATA
PTB17/UART0_CTS
14
HDR_1X4
PTB2/UART0_RTS
HDR 3X5
S1
R16
4M_XTAL
EXTAL
USBD_N
USBD_P
33
R14
21
22
C42
ID
G
9.0PF
1
CONN USB MINI-B 1x5
5
7
8
9
10
17
19
20
TP23
Y3
1
2
V_IC
4MHz
C41
9.0PF
TP24
UART_RTS_Onboard
UART_CTS_Onboard
UART_RXD_Onboard
UART_TXD_Onboard
USB_LED
UART_LED
RS485_TXEN
RTS
CTS
VUSB33_MON
RXD
TXD
L8
330 OHM
A
11
XTAL
EXTAL
24
18
12
6
C39
0.1UF
V_IC
J17-> 1-2-3 RX Selector:
»SHUNT 2->3 UART RX THOUGH 20-pin CONNECTOR
»SHUNT 1->2 ON-BOARD RX (USB2SER TX CROSS WITH RX)
J17-> 4-5-6 TX Selector:
»SHUNT 5->6 UART TX THOUGH 20-pin CONNECTOR
»SHUNT 4->5 ON-BOARD TX (USB2SER RX CROSS WITH TX)
C44
10uF
V_IC
V_IC
DNP
16
15
14
USBD_P
USBD_N
C40
0.47UF
C43
4.7UF
J17: POWER SELECTOR
»SHUNT 8->9 UNREGULATED EXTERNAL SUPPLY V_EXT > 3.3V
»SHUNT 7->8 USB SUPPLY VOLTAGE 5V
»NO-SHUNT WHEN V_BRD USED AS SUPPLY THROUGH J13, PINS 3 & 4 SHUNTED
2
4
6
8
10
SWD_DIO
SWD_CLK
PTA20
PTA3
PTA0
RESET_OUT_B
HDR 2X5
GND
J17-> 10-11-12 CTS Selector:
»SHUNT 11->12 UART CTS THOUGH 20-pin CONNECTOR
»SHUNT 10->11 ON-BOARD CTS
J17->13-14-15 RTS Selector:
»SHUNT 14->15 UART RTS THOUGH 20-pin CONNECTOR
»SHUNT 13->14 ON-BOARD RTS
2
USB2SERA10CFK
VUSB33
USBDP
USBDN
R20
10K
J5
1
3
5
7
9
1M
4
5
SWD CONNECTOR
NC24
NC18
NC12
NC6
EP
33
S2
S4
R17
3
RESUME
RESET
SUSPEND
NC4
VSS
VSSOSC
2
10K
25
D- VBUS
1
1
2
3
4
R15
13
23
S3
U3
V_IC
V_BUS
V_BUS
VDD
J16
D+
KW01 Development Hardware Reference Manual, Rev. 1
V_IC
J9: EXTERNAL SUPPLY <
USB TO UART
UART0 / POWER SELECTOR
A
ICAP Classification:
Drawing Title:
FCP:
FIUO: ___
X
PUBI: ___
MRB-KW019032
Page Title:
POWER SUPPLY / GPIOs / XTAL / RESET
5
4
3
2
Size
C
Document Number
Date:
Friday, October 25, 2013
Rev
D
SCH-27792 PDF: SPF-27792
Sheet
5
of
5
1
KW01-MRB
3-15
KW01-MRB
Figure 3-10. Modular Reference Board PCB Component Location (Top View)
Figure 3-11. Modular Reference Board PCB Test Points
KW01 Development Hardware Reference Manual, Rev. 1
3-16
Freescale Semiconductor
KW01-MRB
Figure 3-12. Modular Reference Board PCB Layout (Top View)
Figure 3-13. Modular Reference Board PCB Layout (Bottom View)
KW01 Development Hardware Reference Manual, Rev. 1
Freescale Semiconductor
3-17
KW01-MRB
3.4.1
Bill of Materials
The following three tables detail the bill of materials. Table 3-6 details the common parts for all frequency
bands, Table 3-7 details the parts for the 915 and 868 MHz frequency bands, Table 3-8 details the parts for
the 433 MHz frequency band and Table 3-9 details the parts for the 315 MHz frequency band.
Table 3-6. Bill of Materials (Common parts for all MRB-KW01xxyyZZ bands.)
Item Qty
Referenc
e
Value
Description
Mfg. Name
Mfg. Part Number
1
4
BH1,BH2, 125
BH3,BH4
NON-PLATED MOUNTING HOLE
125 DRILL / 160 KEEPOUT NO
PART TO ORDER
2
3
C1,C7,C2 10PF
3 (DNP)
CAP CER 10PF 50V 5% C0G 0402 Avx
04025A100JAT2A
3
2
C5,C6
100PF
CAP CER 100PF 50V 5% C0G
0402
Kemet
C0402C101J5GAC
4
10
C14,C19, 0.1UF
C20,C21,
C24,C30,
C31,C33,
C37,C38
CAP CER 0.1UF 16V 10% X7R
0402
Kemet
C0402C104K4RAC
5
2
C16,C18
CAP CER 220PF 50V 5% C0G
0402
Kemet
C0402C221J5GAC
6
3
C17,C27, 0.01UF
C28
CAP CER 0.01UF 50V 10% X7R
0402
Murata
GCM155R71H103KA55D
7
2
C22,C25
11PF
CAP CER 11PF 50V 1% C0G 0402 Avx
0425U110FAT2A
8
2
C34,C35
12PF
CAP CER 12PF 50V 5% C0G 0402 Murata
GRM1555C1H120JZ01D
9
1
C26
10UF
CAP CER 10UF 10V 10% X5R
0805
Murata
GRM21BR61A106KE19_
10
1
C29
2.2UF
CAP CER 2.2UF 10V 10% X7R
0603
Taiyo Yuden
LMK107B7225KA-T
11
1
C32
1UF
CAP CER 1.0UF 10V 10% X7R
0603
Murata
GRM188R71A105KA61D
12
1
C36
1000pF
CAP CER 1000PF 50V 5% C0G
0402
Murata
GRM1555C1H102JA01D
13
1
D1
GREEN
LED GRN SGL 30MA SMT 0805
Lite On
LTST-C171KGKT
14
2
D2,D3
MBR0520LT DIODE SCH 0.5A 20V SOD-123
1G
On Semiconductor
MBR0520LT1G
15
1
D4
RED
16
2
J1,J2
CON_1_SM CON 1 COAX SMA SKT TH -A
376H AU
17
7
J3,J4,J6,J HDR 1X2
7,J9,J10,
J11
220PF
LED RED CLEAR SGL 30MA SMT Lite On
0805
Samtec
HDR 1X2 TH 100MIL SP 330H SN Samtec
115L
LTST-C171KRKT
SMA-J-P-H-ST-TH1
TSW-102-07-T-S
KW01 Development Hardware Reference Manual, Rev. 1
3-18
Freescale Semiconductor
KW01-MRB
Table 3-6. Bill of Materials (Common parts for all MRB-KW01xxyyZZ bands.)
Item Qty
Referenc
e
Value
Description
Mfg. Name
Mfg. Part Number
18
1
J5
HDR 2X3
HDR 2X3 TH 100MIL CTR 335H
AU 95L
Samtec
TSW-103-07-S-D
19
1
J8
HDR TH
1X3
HDR 1X3 TH 100MIL SP 339H AU Samtec
100L
TSW-103-07-G-S
20
1
J12
961204-640 HDR 2X2 TH 100MIL CTR 323H
4-AR
AU 130L
3m
961204-6404-AR
21
1
J13
HDR_2X4
HDR 2X4 TH 100MIL CTR 330H
AU 100L
Samtec
TSW-104-07-S-D
22
1
J14
HDR 2X9
HDR 2X9 TH 100MIL CTR 330H
AU
Samtec
TSW-109-07-S-D
23
1
J15
HDR_10X2
HDR 2X10 TH 100MIL CTR 330H
AU 100L
Samtec
TSW-110-07-S-D
24
1
L6
33nH
IND -- 0.033UH@100MHZ 200MA Murata
5% 0402
25
2
R2,R4
4.7K
RES MF 4.7K 1/10W 5% 0603
26
1
R3
330
RES MF 330 OHM 1/16W 5% 0402 Vishay Intertechnology CRCW0402330RJNED
27
8
R5,R7,R8 0
,R9,R10,
R11,R21,
R22
RES MF ZERO OHM 1/10W -0603
Vishay Intertechnology CRCW06030000Z0EA
28
1
R6 DNP
4.7K
RES MF 4.7K 1/16W 1% 0402
Koa Speer
29
1
R12
15K
RES MF 15K 1/16W 5% 0402
Vishay Intertechnology CRCW040215K0JNED
30
1
R13
422
RES MF 422 OHM 1/10W 1%
0603
Yageo America
31
1
SW1
SW_MOM
SW SPST MOM PB 50MA 12V
SMT
Alps Electric (Usa) Inc. SKQYAFE010
32
2
TL1,TL2,
TESTLOOP TEST POINT PAD SIZE 3.4MM X
1.8MM SMT
33
24
TP1,TP2, TPAD_040
TP3,TP4,
TP5,TP6,
TP7,TP8,
TP9,TP10
,TP11,TP
12,TP13,
TP14,TP1
5,TP16,T
P17,TP18
,TP19,TP
20,TP21,
TP22,TP2
3,TP24
LQG15H33NJ02D
Vishay Intertechnology CRCW06034K70JNEA
Keystone Electronics
TEST POINT PAD 40MIL DIA SMT, Notacomponent
NO PART TO ORDER
RK73H1ETTP4701F
RC0603FR-07422RL
5015
NOTACOMPONENT
KW01 Development Hardware Reference Manual, Rev. 1
Freescale Semiconductor
3-19
KW01-MRB
Table 3-6. Bill of Materials (Common parts for all MRB-KW01xxyyZZ bands.)
Item Qty
Referenc
e
Value
Description
Mfg. Name
Mfg. Part Number
34
1
U1
MKW01Z12 IC MCU ARM 48MHZ 128KB
8
FLASH 16KB RAM 1.8-3.6V
LGA60
Freescale
Semiconductor
MKW01Z128CHN
35
1
U2
LP2985AIM
5-3.3
IC VREG LDO 3.3V 150MA
3.8-16V SOT-23-5
National
Semiconductor
LP2985AIM5-3.3/NOPB
36
1
Y1
32MHZ
XTAL 32MHZ 9PF -- SMT
3.2X2.5MM
Ndk
EXS00A-CS02368
36
1
Y1
(Optional
for JA
variant)
30MHZ
XTAL 30MHZ 8PF -- SMT
3.2X2.5MM
Ndk
NX3225SA-30MHZ-STD-C
SR-3
37
1
Y2
32.768KHZ
XTAL 32.768KHZ SMT ROHS
COMPLIANT
Epson Electronics
FC-135 32.7680KA-A3
38
1
Y3
4MHz
XTAL 4MHZ -- -- AUTO SMT
NDK
NX8045GE-4.000M-STD-C
JL-6
39
1
U3
USB2SERA IC XCVR USB TO UART CONV
10CFK
12MBPS 3-5V QFN24
FREESCALE
SEMICONDUCTOR
USB2SERA10CFK
40
1
TP25
TESTLOOP TEST POINT PC MULTI
_BLACK
PURPOSE BLK TH
KEYSTONE
ELECTRONICS
5011
41
1
R14
1M
RES MF 1.0M 1/16W 1%
AEC-Q200 0402
VISHAY
CRCW04021M00FKED
INTERTECHNOLOGY
42
1
R15
10K
RES MF 10K 1/16W 5% 0402
VISHAY
CRCW040210K0JNED
INTERTECHNOLOGY
43
2
R16, R17 33
RES MF 33.0 OHM 1/16W 1%
0402
THYE MING TECH CO CR-02FL6---33R
LTD
44
1
R19
RES MF 100 OHM 1/16W 1% 0402 THYE MING TECH CO CR-02FL6--100R
LTD
45
1
R20 DNP 10K
RES MF 10K 1/16W 5% 0402
VISHAY
CRCW040210K0JNED
INTERTECHNOLOGY
46
1
C40
0.47UF
CAP CER 0.47UF 16V 10% X7R
0603
KEMET
C0603C474K4RAC
47
2
C41,C42
9.0PF
CAP CER 9.0PF 50V +/- 0.5PF
C0G 0402
MURATA
GRM1555C1H9R0DZ01D
48
1
C43
4.7UF
CAP CER 4.7UF 25V 10% X5R
0805
VENKEL COMPANY
C0805X5R250-475KNP
49
1
C44
10uF
CAP CER 10UF 10V 20% X5R
0603
TAIYO YUDEN
LMK107BJ106MALTD
50
1
J16
CONN USB CON 1X5 USB MINI-B RA SHLD
MINI-B 1x5 SKT SMT 0.8MM SP 159H AU
Molex
67503-1020
51
1
J17
HDR 3X5
SAMTEC
TSW-105-07-T-T
100
HDR 3X5 TH 100MIL CTR 338H
SN 100L
KW01 Development Hardware Reference Manual, Rev. 1
3-20
Freescale Semiconductor
KW01-MRB
Table 3-6. Bill of Materials (Common parts for all MRB-KW01xxyyZZ bands.)
Item Qty
Referenc
e
Value
Description
Mfg. Name
Mfg. Part Number
52
1
J18
HDR_1X4
HDR 1X4 TH 100MIL SP 205H AU SAMTEC
130L
TSW-104-05-G-S
53
1
L8
330 OHM
IND FER BEAD
330OHM@100MHZ 2.5A -- SMT
MPZ2012S331A
TDK
Table 3-7. Bill of Materials (MRB-KW0190yyZZ frequency bands)
Item Qty Reference
Value
Description
Mfg. Name
Mfg. Part Number
1
1
C2
3.3pf
CAP CER 3.3PF 25V 0.1PF -0402
AVX
04023J3R3BBSTR
2
1
C4
5.6PF
CAP CER 5.6PF 50V +/-0.25PF
C0G CC0402
MURATA
GJM1555C1H5R6CB0
1D
3
3
C3,C12,C1 6.8PF
3
CAP CER 6.8PF 50V 0.5PF C0G
0402
MURATA
GRM1555C1H6R8DZ
01J
4
1
C10
47PF
CAP CER 47PF 50V 5% C0G 0402 CAL-CHIP
GMC04CG470J50NTLF
5
1
C15
2.0PF
CAP CER 2.0PF 50V 0.25PF C0G MURATA
0402
GRM1555C1H2R0CA
01B
6
2
C8,C11,
DNP
10PF
CAP CER 10PF 50V 5% C0G 0402 AVX
04025A100JAT2A
7
2
L1,L3
5.6NH
IND AIR 5.6NH@100MHZ 300MA muRata
0.3NH 0402
LQG15HN5N6S02D
8
2
L2,L4
0.0068UH
IND -- 0.0068UH@100MHZ
300MA 5% 0402
MURATA
LQG15HS6N8J02D
9
1
L7
0.0047UH
IND -- 0.0047UH@100MHZ
300MA +/-0.3NF 0402
MURATA
LQG15HS4N7S02D
10
1
L5
33nH
IND -- 0.033UH@100MHZ 200MA TOKO INC.
5% 0402
LL1005-FHL33NJ
11
1
L9
2.0nH
IND -- 0.002UH@100MHZ 300MA MURATA
0.0003UH 0402
LQG15HS2N0S02
12
1
C9
7.5 PF
CAP CER 7.5PF 50V +/-0.5pF
C0G 0402
GRM1555C1H7R5DA
01D
13
2
C45,C46
(DNP)
10PF
CAP CER 10PF 50V 5% C0G 0402 AVX
MURATA
04025A100JAT2A
KW01 Development Hardware Reference Manual, Rev. 1
Freescale Semiconductor
3-21
KW01-MRB
Table 3-8. Bill of Materials (MRB-KW014532CN)
Item Qty Reference
Value
8.2PF
Description
CAP CER 8.2PF 50V 0.5PF C0G
0402
Mfg. Name
AVX
Mfg. Part Number
1
2
C2,C4
04025A8R2CAT2A
2
4
C3,C9,C12 15PF
,C15
CAP CER 15PF 50V 1% C0G 0402 VENKEL COMPANY C0402C0G500-150FNE
3
2
C8,C11
2.4PF
CAP TF 2.4PF 50V 0.25PF -- 0402 MURATA
GJM1555C1H2R4BB01
4
2
C10,C13
10PF
CAP CER 10PF 50V 5% C0G 0402 AVX
04025A100JAT2A
5
3
L1,L3, L4
12 NH
IND -- 0.012UH@100MHZ 300MA MURATA
5% 0402
LQW15AN12NJ00D
6
1
L5
22NH
IND -- 22NH@100MHZ 310MA 5% MURATA
0402
LQW15AN22NG00D
7
1
L2
10 NH
IND -- 0.010UH@100MHZ 300MA MURATA
5% 0402
LQW15AN10NJ00D
8
2
L7,L9
0 ohms
RES MF ZERO OHM 1/10W 0402 PANASONIC
ERJ-2GE0R00X
9
2
C45, C46
(DNP)
10PF
CAP CER 10PF 50V 5% C0G 0402 AVX
04025A100JAT2A
.
KW01 Development Hardware Reference Manual, Rev. 1
3-22
Freescale Semiconductor
KW01-MRB
Table 3-9. Bill of Materials (MRB-KW013032CN)
Item Qty Reference
Value
Description
Mfg. Name
Mfg. Part Number
1
2
C2,C4
12PF
CAP CER 12PF 50V 5% C0G 0402 MURATA
2
1
C9
15PF
CAP CER 15PF 50V 5% C0G 0402 VENKEL COMPANY C0402C0G250-150JNP
3
4
C8,C11,
C45,C46
DNP
10PF
CAP CER 10PF 50V 5% C0G 0402 AVX
04025A100JAT2A
4
4
C15, C10,
C3,C12
22pF
CAP CER 22pF 50V 5% C0G
AEC-Q200 0402
GCM1555C1H220JA16
5
1
C13
10PF
CAP CER 10PF 50V 5% C0G 0402 AVX
04025A100JAT2A
6
2
L1,L5
33NH
IND -- 0.033UH@100MHZ 200MA MURATA
5% 0402
LQG15HS33NJ02D
7
2
L3, L4
22 NH
IND -- 22NH@100MHZ 310MA 2% MURATA
0402
LQW15AN22NG00D
8
1
L2
18 NH
IND AIR 18NH@100MHZ 370MA
3% 0402
MURATA
LQW15AN18NH00D
9
1
L9
1.5NH
IND -- 1.5NH@500MHZ 280MA
7% 0402
MURATA
LQP15MN1N5B02D
10
1
L7
4.7NH
IND -- 4.7NH@100MHZ 300MA
+/-0.3nH 0402
MURATA
LQG15HN4N7S02D
MURATA
GRM1555C1H120JZ01D
KW01 Development Hardware Reference Manual, Rev. 1
Freescale Semiconductor
3-23
KW01-MRB
KW01 Development Hardware Reference Manual, Rev. 1
3-24
Freescale Semiconductor
Chapter 4
PCB Manufacturing Specifications
This chapter provides the specifications used to manufacture the MKW01 Development hardware printed
circuit board (PCB) described in this manual. This information is provided as an example or starting point.
The MKW01 Development hardware PCBs must comply with the following:
• The PCB must comply with Perfag10/3C (http://www.perfag.dk/Uk/ukindex.htm)
• The PCB manufacturer’s logo is required
• The PCB production week and year code is required
— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder
mask
— The PCB manufacturer can not insert text on the PCB either in copper or in silkscreen without
written permission from Freescale Semiconductor, Inc.
• The required Underwriter’s Laboratory (UL) Flammability Rating
— The level is 94V-0 (http://www.ul.com/plastics/flame.html)
— The UL information must be stamped on the back of the PCB solder mask
•
•
4.1
NOTE
A complete set of design files is available for the KW01 Development
hardware at the Freescale web site (http:www.freescale.com/802154)
under reference designs. It is recommended that this design or one of a
number of other reference designs be used as a starting point for a
custom application.
The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout
Considerations Reference Manual, (ZHDCRM) is also available at the
same web site to provide additional design guidance.
Single PCB Construction
This section describes individual PCB construction details.
• The MKW01 PCB is a four-layer, multi layer designs
• The PCBs contains no blind, buried, or micro vias
• PCB data:
— MKW01 Size: Approximately 66 x 51mm (2.60 x 2.01 inches)
— MKW01 Final thickness (Cu/Cu): 0.34 mm (0.8 inches) +/- 10% (excluding solder mask)
The following table defines some of the layers of the completed PCB. The artwork identification refers to
the name of the layer in commonly used terms.
KW01 Development Hardware Reference Manual, Rev. 1
Freescale Semiconductor
4-1
PCB Manufacturing Specifications
Table 4-1. MKW01 Layer by Layer Overview
Layer
Artwork Identification
File Name
1
Silkscreen Top
SILK_TOP.art
2
Top Layer Metal
TOP.art
3
Ground Layer
GND.art
4
Power Layer
PWR.art
5
Bottom Layer Metal
BOTTOM.art
6
Silkscreen Bottom
SILK_BOTTOM.art
NOTE
The MKW01 contains sub 1 GHz RF circuitry. As a result, RF component
placement, line geometries and layout, and spacing to the ground plane are
critical parameters. As a result, BOARD STACKUP GEOMETRY IS
CRITICAL. Dielectric and copper thicknesses and spacing must not be
changed; follow the stackup (see Figure 4-1) information is provided with
the reference design.
Figure 4-1. MKW01 PCB Stackup Cross-Section (Four Layer)
•
•
4.2
Solder mask is required
Silk screen is required
Panelization
The panel size can be negotiated depending on production volume.
4.3
Materials
The PCB composite materials must meet the following requirements:
• Laminate - The base laminate material (laminate) must be FR4. If the laminate material were
changed the RF electrical characteristics may change and degrade RF performance.
KW01 Development Hardware Reference Manual, Rev. 1
4-2
Freescale Semiconductor
PCB Manufacturing Specifications
•
•
4.4
Copper Foil — Top and Bottom copper layers must be 1 oz. copper
— Interior layers must be 1/2 oz. copper
Plating - All pad plating must be Hot Air Levelling (HAL)
Solder Mask
The solder mask must meet the following requirements:
• Solder mask type: Liquid Film Electra EMP110 or equivalent
• Solder mask thickness: 10 – 30 µm
4.5
Silk Screen
The silk screen must meet the following requirements:
• Silkscreen color: White
• Silkscreen must be applied after application of solder mask if solder mask is required
• The silkscreen ink must not extend into any plated-thru-holes
• The silk screen must be clipped back to the line of resistance
4.6
•
•
4.7
Electrical PCB Testing
All PCBs must be 100 percent tested for opens and shorts
Impedance Measurement - An impedance measurement report is not mandatory
Packaging
Packaging for the PCBs must be the following requirements:
• Finished PCBs must remain in panel
• Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials.
These materials can degrade solderability.
4.8
Hole Specification/Tool Table
See the ncdrill-1-4.tap file included with the Gerber files and the FAB-27792.pdf file.
KW01 Development Hardware Reference Manual, Rev. 1
Freescale Semiconductor
4-3
PCB Manufacturing Specifications
4.9
File Description
Files included with the download include Design, Gerber and PDF files.
Gerber files are RS-374x format. Not all files included with the Gerber files are for PCB manufacturing.
PDF files included are:
• FAB-27792.pdf — Board fabrication drawing
• GRB-27792.zip — Metal layers, solder mask, solder paste and silk screen
• SPF-27792.pdf — Schematic
Design files are in Allegro format with OrCAD schematic capture.
KW01 Development Hardware Reference Manual, Rev. 1
4-4
Freescale Semiconductor