Single N-channel MOSFET ELM32414LA-S ■General description ■Features ELM32414LA-S uses advanced trench technology to provide excellent Rds(on), low gate charge and low gate resistance. • • • • Vds=25V Id=35A Rds(on) < 20mΩ (Vgs=10V) Rds(on) < 31mΩ (Vgs=4.5V) ■Maximum absolute ratings Parameter Ta=25°C. Unless otherwise noted. Limit Unit Note Symbol Gate-source voltage Vgs Continuous drain current Ta=25°C Ta=100°C Repetitive avalanche energy V Idm 120 A Iar 15 A Eas Ear 15.0 5.6 mJ mJ Id Pulsed drain current Avalanche current Avalanche energy ±20 35 25 L=0.133mH L=0.05mH Tc=25°C Tc=100°C Junction and storage temperature range Power dissipation Pd Tj, Tstg A 50 35 -55 to 150 3 4 W °C ■Thermal characteristics Parameter Maximum junction-to-case Maximum junction-to-ambient Maximum case-to-heatsink Steady-state Steady-state Symbol Rθjc Rθja Rθcs ■Pin configuration Typ. Max. 2.5 Unit °C/W 75.0 °C/W °C/W 0.7 Note ■Circuit D TO-252-3(TOP VIEW) TAB 2 1 Pin No. Pin name 1 2 GATE DRAIN 3 SOURCE 3 4- 1 G S Single N-channel MOSFET ELM32414LA-S ■Electrical characteristics Parameter STATIC PARAMETERS Drain-source breakdown voltage Symbol Condition BVdss Id=250μA, Vgs=0V Zero gate voltage drain current Idss Gate-body leakage current Igss Vds=20V, Vgs=0V, Ta=125°C 250 Vds=0V, Vgs=±20V ±250 nA 2.5 V A Static drain-source on-resistance Rds(on) Pulsed body-diode current DYNAMIC PARAMETERS Input capacitance Output capacitance Reverse transfer capacitance SWITCHING PARAMETERS Total gate charge V 25 Vgs(th) Vds=Vgs, Id=250μA Id(on) Vgs=10V, Vds=10V Max. body-diode continuous current 25 Vds=20V, Vgs=0V Gate threshold voltage On state drain current Forward transconductance Diode forward voltage Ta=25°C. Unless otherwise noted. Min. Typ. Max. Unit Note 1.0 35 1.5 μA 1 Vgs=10V, Id=15A 15.5 20.0 mΩ Vgs=4.5V, Id=15A 23.0 31.0 mΩ 1.4 S V Is 35 A Ism 120 A 530 700 pF 200 60 275 90 pF pF 8.4 2.5 11.0 3.1 nC nC 2 2 6.4 6.2 9.6 9.3 nC ns 2 2 11.0 17.0 ns 2 23.0 34.0 ns 2 2 Gfs Vsd Vds=15V, Id=30A If=Is, Vgs=0V Ciss Coss Crss Gate-source charge Qg Qgs Gate-drain charge Turn-on delay time Qgd td(on) Turn-on rise time Turn-off delay time tr Vgs=0V, Vds=25V, f=1MHz Vgs=10V, Vds=12.5V Id=15A Vgs=10V, Vds=15V, Id=15A td(off) Rgen=12.7Ω 14 28 1.1 Turn-off fall time Body diode reverse recovery time tf trr 18.0 15 27.0 18 ns ns Body diode reverse recovery charge Qrr 2 3 nC NOTE : 1. Pulse test : Pulsed width ≤ 300μsec and Duty cycle ≤ 2%. 2. Independent of operating temperature. 3. Pulsed width limited by maximum junction temperature. 4. Duty cycle ≤ 1%. 4- 2 1 1 1 3 P2003BDG Single N-channel N-Channel Logic LevelMOSFET Enhancement ModeELM32414LA-S Field Effect Transistor NIKO-SEM TO-252 (DPAK) Lead-Free ■Typical electrical and thermal characteristics 10.0V 50 7.0V 45 3.0 5.0V 6.0V R DS(ON) ,NORMALIZED 55 4.5V 40 35 30 25 4.0V 20 15 DRAIN - SOURCE ON - RESISTANCE ID ,DRAIN - SOURCE CURRENT( A ) ON- RESISTANCE VARIATION WITH DRAIN CURRENT AND GATE VOLTAGE ON-REGION CHARACTERISTIC 60 3.5V 10 VGS =3.0V 5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 VDS,DRAIN- SOURCE VOLTAGE ( V ) 4.5 0.8 25 50 75 100 125 0 Tj ,JUNCTION TEMPERATURE( °C ) 50 150 0 10 20 30 40 I D ,DRAIN CURRENT( A ) 50 60 0.05 0.04 0.03 TA = 125°C 0.02 TA = -55°C 25°C 125°C 20 10 3 4 2 VGS,GATE TO SOURCE VOLTAGE TA = 25°C 2 60 30 1 10V 0.5 0.01 175 40 0 1.0 TRANSFER CHARACTERISTICS VDS =10V I D,DRAIN CURRENT( A ) R DS(ON) ,ON-RESISTANCE(OHM) 1.0 I S,REVERSE DRAIN CURRENT( A ) DS(ON) R ,NORMALIZED DRAIN - SOURCE ON - RESISTANCE 1.2 60 6.0V 7.0V ID = 15A 1.4 -25 5.0V ON-RESISTANCE VARIATION WITH GATE-TO-SOURCE VOLTAGE I D = 15A 0.6 -50 4.5V 1.5 0.06 VGS= 10V 1.6 2.0 0 5.0 ON- RESISTANCE VARIATION WITH TEMPERATURE 1.8 VGS = 4.0V 2.5 BODY DIODE FORWARD VOLTAGE VARIATION WITH SOURCE CURRENT AND TEMPERATURE 10 TA = 125°C 1 25°C 0.1 -55°C 0.01 0.001 3 4- 3 10 VGS= 0V 0.0001 5 6 8 4 VGS,GATE TO SOURCE VOLTAGE 0 0.8 1.0 1.2 0.2 0.4 0.6 VSD ,BODY DIODE FORWARD VOLTAGE( V ) 1.4 DEC-28-2004 Single N-channel MOSFET NIKO-SEM GATE CHARGE CHARACTERISTICS 10 I D = 15A V GS ,GATE - SOURCE VOLTAGE ( V ) P2003BDG N-Channel Logic Level Enhancement ELM32414LA-S Mode Field Effect Transistor TO-252 (DPAK) Lead-Free CAPACITANCE CHARACTERISTICS 10000 15V CAPACITANCE( pF ) 8 VDS = 5V 10V 6 4 1000 Ciss Coss 100 Crss 2 0 0 4 10 16 8 12 Qg ,GATE CHARGE ( nC ) 10 15 25 20 30 VDS ,DRAIN TO SOURCE VOLTAGE ( V ) SINGLEPULSE MAXIMUMPOWERDISSIPATION 2400 f = 1MHZ VGS= 0V 1 5 MAXIMUM SAFE OPERATING AREA 3 10 SINGLE PULSE R� = 2 .5°C/W TC = 25°C JC I D,DRAIN CURRENT( A ) POWER( W ) 2000 1600 1200 800 10 VGS= 10V SINGLE PULSE R� JC= 2.5 °C/W Tc = 25 °C 10 -1 10 1000 10m s 0 1 10 10 VDS,DRAIN - SOURCE VOLTAGE 2 10 D=0.5 0 -1 0.20 0.10 0.05 -2 0.02 0.01 P(pk) TRANSIENT THERMAL RESISTANCE r ( t ) ,NORMALIZED EFFECTIVE 10 DC 1 10 TRANSIENT THERMAL RESPONSE CURVE 1 10 10 100 10 0µ S 1m s 0 10 0.1 1 SINGLE PULSE TIME( SEC) imit )L n R ds(o 400 0 0.01 35.0µS 2 10 10 t1 -3 t2 1.R� JC (t)=r(t)*R 2.R � JC = 2.5° C/W 3.T j + TC = P * R � JC (t) t1 4.Duty Cycle,D = t2 Single pulse 10 -4 10 -7 10 -6 10 -5 -4 10 10 t1 , TIME( ms ) -3 10 -2 10 4 4- 4 -1 10 0 DEC-28-2004