MDS

Full Material Declaration for attached parts list
Full Material Declaration for attached parts list
Report generated: 21 June 2016, 16:42 GMT
Diotec Semiconductor AG
DUNS number: 330866844
-, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany
Declarations authorised by:
Udo Steinebrunner, Product Manager, -
Declaration effective from: 1 January 2007 [Approved on 21 June 2016, 16:39 GMT]
Materials and substances
Use/Location
Chip (die)
Die attach
Encapsulation
Material
group
Other inorganic
materials
Lead and Lead
alloys
EP (Epoxy resin)
% w/w of
material
in the
part
0.30000%
0.20000%
29.90000%
Substances in the
material
CAS Number
% w/w of
substance
in the
material
Nickel
8049-31-8
1.00000%
Gold
7440-57-5
11.50000%
Polydimethylsiloxane
rubber
63394-02-5
25.00000%
Silicon
7440-21-3
62.50000%
Silver
7440-22-4
2.50000%
Tin
7440-31-5
5.00000%
Lead
7439-92-1
92.50000%
Carbon black
1333-86-4
0.30000%
ANTIMONY TRIOXIDE
1309-64-4
0.80000%
Tetrabromobisphenol A
(TBBPA)
79-94-7
0.99000%
Epoxy resin 89
26335-32-0
27.61000%
Quartz sand
60676-86-0
70.30000%
109-16-0
100.00000%
7440-31-5
100.00000%
7440-50-8
100.00000%
Housing
UP (Unsaturated
polyester)
24.50000%
2- Propenoic acid, 2methyl- , 1,2ethanediylbis(oxy- 2,1ethanediyl) ester
Leadfinish
Tin plating
0.10000%
Tin
Leadframe
Copper (e.g.
copper amounts
in cable
harnesses)
45.00000% Copper
Page 1
Report generated: 21 June 2016, 16:42 GMT
Full Material Declaration for attached parts list
Attached parts list
Part number
Part name
Part Mass
Part Mass UoM
BxxxR
Bridge Rectifier round
1.2
g
Page 2
Report generated: 21 June 2016, 16:42 GMT