EClamp2374K ESD/EMI Protection for Color LCD Interfaces PRELIMINARY PROTECTION PRODUCTS - EMIClampTM Description Features The EClampTM2374K is a low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics. They have been optimized for protection of color LCD panels in cellular phones and other portable electronics. Bidirectional EMI/RFI filter with integrated TVS for ESD protection ESD protection to IEC 61000-4-2 (ESD) Level 4, ±15kV (air), ±8kV (contact) Filter performance: 30dB minimum attenuation The device consists of four identical circuits comprised of TVS diodes for ESD protection, and a resistor capacitor network for EMI/RFI filtering. A series resistor value of 100Ω and a capacitance value of 10pF are used to achieve 30dB minimum attenuation from 1.8GHz to 2.5GHz. The TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 610004-2, level 4. 1.8GHz to 2.5GHz TVS working voltage: 5V Resistor: 100Ω +/− 15% Typical Capacitance: 20pF (VR = 0V) Protection and filtering for four lines Solid-state technology Mechanical Characteristics The EClamp2374K is in a 8-pin, RoHS/WEEE compliant, SLP1713P8 package. It measures 1.7 x 1.3 x 0.50mm. The leads are spaced at a pitch of 0.4mm and are finished with lead-free NiPdAu. The small package makes it ideal for use in portable electronics such as cell phones, digital still cameras, and PDAs. SLP1713P8 8-pin package RoHS/WEEE Compliant Nominal Dimensions: 1.7 x 1.3 x 0.50 mm Lead Pitch: 0.4mm Lead finish: NiPdAu Marking : Marking Code Packaging : Tape and Reel Applications Color LCD Protection Cell Phone CCD Camera Lines Clamshell Cell Phones Package Configuration Circuit Diagram (Each Line) 1.70 1 2 100 Ω IN OUT 10pF 1.30 10pF 0.40 BSC GND 0.50 8 Pin SLP package (Bottom Side View) Nominal Dimensions in mm Device Schematic (4X) Revision 1/30/2008 1 www.semtech.com EClamp2374K PRELIMINARY PROTECTION PRODUCTS Maximum Ratings R ating Symbol Value Units VESD +/- 17 +/- 12 kV Junction Temp erature TJ 125 o Op erating Temp erature Top -40 to +85 o Storage Temp erature TSTG -55 to +150 o ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) C C C Electrical Characteristics (T = 25oC) P a r a met er Symb ol C on d i t i on s Mi n i mu m Ty p i c a l M a xi m u m Un i ts 5 V 10 V 0.5 μA T VS Reverse Stand-Of f Voltage VRWM T VS Reverse Breakdown Voltage VBR It = 1mA T VS Reverse Leakage Current IR VRWM = 3.0V Total Series Resistance R Each Line 85 100 115 Ohms Total Capacitance C in Input to Gnd, Each Line VR = 0V, f = 1MHz 16 20 24 pF Total Capacitance C in Input to Gnd, Each Line VR = 2.5V, f = 1MHz 9 11 13 pF © 2008 Semtech Corp. 2 6 8 www.semtech.com EClamp2374K PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 (Each Line) CH1 S21 LOG Analog Crosstalk (Each Line) 6 dB / REF 0 dB CH1 S21 LOG 20 dB /REF 0 dB 1: -9.1473 dB 297.671 MHz 2: -19.559 dB 900 MHz 0 dB 3: -30.645 dB 1.8 GHz -6 dB 1 -12 dB 4: -34.705 dB 2.5 GHz -18 dB 2 -24 dB -30 dB 3 4 -36 dB -42 dB -48 dB 1 MHz 100 MHz 10 MHz 1 3 GHz GHz START. 030 MHz STOP 3000. 000000 MHz STOP 3000. 000000 MHz START. 030 MHz ESD Clamping (+8kV Contact) ESD Clamping (-8kV Contact) Capacitance vs. Reverse Voltage (Normalized to 0 volts) 1.1 1 0.9 CJ(VR) / CJ(VR=0) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 f = 1 MHz 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Reverse Voltage - VR (V) © 2008 Semtech Corp. 3 www.semtech.com EClamp2374K PRELIMINARY PROTECTION PRODUCTS Device Connection Figure 1 - Pin Identification and Configuration (Top Side View) The EClamp2374K is comprised of four identical circuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. The device is in a 8-pin SLP package. Electrical connection is made to the 8 pins located at the bottom of the device. A center tab serves as the ground connection. The device has a flow through design for easy layout. Pin connections are noted in Figure 1. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. Recommendations for the ground connection are given below. In 1 1 In 2 In 3 In 4 Ground Connection Recommendation Parasitic inductance present in the board layout will affect the filtering performance of the device. As frequency increases, the effect of the inductance becomes more dominant. This effect is given by Equation 1. 8 Gnd 4 5 Out 1 Out 2 Out 3 Out 4 Pin Identification 1-4 Inp ut Lines 5-8 Outp ut Lines Center Tab Ground Equation 1: The Impedance of an Inductor at Frequency XLF Figure 2 - Inductance of Rectangular Wire Loops XLF(L, f ) = 2 * π * f * L Ground Via 1 Where: L= Inductance (H) f = Frequency (Hz) d Signal Layer x Via connections to the ground plane form rectangular wire loops or ground loop inductance as shown in Figure 2. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Bringing the ground plane closer to the signal layer (preferably the next layer) also reduces ground loop inductance. Multiple vias in the device ground pad will result in a lower inductive ground loop over two exterior vias. Vias with a diameter d are separated by a distance y run between layers separated by a distance x. The inductance of the loop path is given by Equation 2. Thus, decreasing distance x and y will reduce the loop inductance and result in better high frequency filter characteristics. © 2008 Semtech Corp. Ground Via 2 Ground Layer Layer y Equation 2: Inductance of Rectangular Wire Loop [ LRECT(d, x , y) = 10.16 *10 −9 * x * ln [ ] + y * ln[ ]] 2*y d 2*x d Where: d = Diameter of the wire (in) x = Length of wire loop (in) y = Breath of wire loop (in) 4 www.semtech.com EClamp2374K PRELIMINARY PROTECTION PRODUCTS Applications Information Figure 3 shows the recommended device layout. The ground pad vias have a diameter of 0.008 inches (0.20 mm) while the two external vias have a diameter of 0.010 inches (0.250mm). The internal vias are spaced approximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance (i.e. the log function in Equation 2 in highly insensitive to parameter d) . Figure 4 shows a typical insertion loss (S21) plot for the device using Semtech’s filter evaluation board with 50 Ohm traces and the recommended via configuration. Figure 5 shows a typical insertion loss (S21) plot using a similar board without the internal ground pad vias. The result is a more inductive ground loop. Note the “hump” at a frequency of 2.5GHz. This is the resonant frequency of the higher ground loop inductance. Figure 4 - Filter Characteristics Using Recommended Layout with Internal Vias Figure 3 - Recommended Layout Using Ground Vias Figure 5 - Filter Characteristics Using Layout without Internal Ground Vias CH1 S21 LOG 6 dB / REF 0 dB 1: -9.1473 dB 297.671 MHz 2: -19.559 dB 900 MHz 0 dB 3: -30.645 dB 1.8 GHz -6 dB 1 -12 dB 4: -34.705 dB 2.5 GHz -18 dB 2 -24 dB -30 dB 3 4 -36 dB -42 dB -48 dB 1 MHz 10 MHz 100 MHz STOP 3000. 000000 MHz START . 030 MHz CH1 S21 LOG 3 1 GHz GHz 6 dB / REF 0 dB 1: -8.9400 dB 288.002 MHz 2: -20.032 dB 900 MHz 3: -23.761 dB 1.8 GHz 0 dB 4: -16.085 dB 2.5 GHz -6 dB 1 -12 dB 4 -18 dB 2 -24 dB 3 -30 dB -36 dB 1 MHz START . 030 MHz © 2008 Semtech Corp. 5 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz www.semtech.com EClamp2374K PRELIMINARY PROTECTION PRODUCTS Applications Information - Spice Model Line In 0.5nH 0.5nH Line Out EClamp2374K Spice Model EClamp2374K Spice Parameters © 2008 Semtech Corp. Parameter Unit D1 (T VS) D2 (T VS) IS Amp 2E-15 2E-15 BV Volt 7.42 7.42 VJ Volt 0.775 0.775 RS Ohm 1.00 1.00 IB V Amp 1E-3 1E-3 CJO Farad 9.8E-12 9.8E-12 TT sec 2.541E-9 2.541E-9 M -- 0.246 0.246 N -- 1.1 1.1 EG eV 1.11 1.11 6 www.semtech.com EClamp2374K PRELIMINARY PROTECTION PRODUCTS Outline Drawing - SLP1713P8 A D B DIM PIN 1 INDICATOR (LASER MARK) E A SEATING PLANE aaa C A2 C A1 A A1 A2 b D D1 E E1 e L N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .018 .020 .022 .000 .001 .002 (.005) .006 .008 .010 .065 .067 .070 .047 .051 .055 .049 .051 .054 .008 .012 .016 .016 BSC .008 .010 .012 8 .003 .004 0.45 0.50 0.55 0.00 0.02 0.05 (0.13) 0.15 0.20 0.25 1.65 1.70 1.775 1.20 1.30 1.40 1.25 1.30 1.375 0.20 0.30 0.40 0.40 BSC 0.20 0.25 0.30 8 0.08 0.10 D1 1 2 LxN E/2 E1 N bxN e/2 bbb C A B e D/2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP1713P8 P X Z G DIM C G H K P X Y Z H (C) Y DIMENSIONS INCHES MILLIMETERS (.050) (1.27) .027 0.69 0.30 .012 .055 1.40 .016 0.40 .008 0.20 .023 0.58 .073 1.85 K NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET © 2008 Semtech Corp. 7 www.semtech.com EClamp2374K PRELIMINARY PROTECTION PRODUCTS Marking Ordering Information 2374K PIN 1 INDICATOR YYWW Part Number Qty per Reel R eel Size EClamp 2374K.TCT 3000 7 Inch EMIClamp and EClamp are marks of Semtech Corporation Note: YYWW = Date Code Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 1.51 +/-0.10 mm B0 K0 1.91 +/-0.10 mm 0.66 +/-0.10 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.8 mm ±0.05 (.031) E 1.750±.10 mm (.069±.004) F K (MAX) P P0 P2 T(MAX) W 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 4.0±0.1 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05mm (.079±.002) 0.4 mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2008 Semtech Corp. 8 www.semtech.com