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STPS5045S
Power Schottky rectifier
Datasheet − production data
Features
A
■
Low forward voltage drop
■
Very small conduction losses
■
Negligible switching losses
■
Extremely fast switching
■
Low thermal resistance
■
200 °C maximum junction temperature
■
K
A
K
A
A
Avalanche rated
D2PAK
STPS5045SG-TR
Description
This device is a dual center tap Schottky rectifier
suited for switch mode power supply and high
frequency DC to DC converters.
j
Table 1.
Packaged in D2PAK, this device is especially
intended for use in low voltage, high frequency
inverters, freewheeling and polarity protection
applications. Also ideal for PV cell-bypass diode
for junction and smart junction boxes.
June 2012
This is information on a product in full production.
Doc ID022861 Rev 1
Device summary
Symbol
Value
IF(AV)
50 A
VRRM
45 V
Tj (max)
200 °C
VF(max)
0.48 V
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7
Characteristics
1
STPS5045S
Characteristics
Table 2.
Absolute ratings (limiting values at 25 °C unless otherwise specified)
Symbol
Value
Unit
VRRM
Repetitive peak reverse voltage
45
V
IF(RMS)
Forward rms current
90
A
50
A
IF(AV)
Average forward current δ = 0.5
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
600
A
PARM
Repetitive peak avalanche power
tp = 10 µs Tj = 125 °C
1200
W
-65 to +175
°C
+200
°C
+175
°C
Value
Unit
1.0
°C/W
Tstg
Tj(1)
1.
Parameter
Tc = 135 °C
Storage temperature range
Maximum operating junction temperature in DC forward
mode(2)
Maximum operating junction temperature
1
dPtot <
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j-a)
dTj
2. Maximum operating junction temperature only in DC forward mode
Table 3.
Thermal resistance
Symbol
Rth(j-c)
Table 4.
Symbol
IR
(1)
Parameter
Junction to case
Static electrical characteristics
Parameter
Test conditions
Reverse leakage current
Forward voltage drop
Max.
VR = VRRM
0.090
0.36
Tj = 75 °C
VR = 20 V
0.7
1.9
Tj = 125 °C
VR = VRRM
65
185
0.55
0.61
0.48
0.56
Tj = 125 °C
Tj = 200 °C
IF = 50 A
Unit
mA
V
IF = 10 A
0.22
IF =20 A
0.28
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.38 x IF(AV) + 0.0036 IF2(RMS)
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Typ.
Tj = 25 °C
Tj = 25 °C
VF(2)
Min.
Doc ID022861 Rev 1
STPS5045S
Figure 1.
Characteristics
Average forward power dissipation Figure 2.
versus average forward current
PF(AV)(W)
45
60
δ = 0.1 δ = 0.2
Average forward current versus
ambient temperature
(δ = 0.5)
IF(AV)(A)
δ = 0.5
40
Rth(j -a)=Rth(j-c)
50
δ = 0.05
35
40
δ=1
30
25
30
20
15
20
T
T
10
10
5
IF(AV)(A)
0
0
10
Figure 3.
1
20
30
40
δ=tp/T
50
δ=tp/T
tp
Tamb(°C)
tp
0
60
70
Normalized avalanche power
derating versus pulse duration
0
25
Figure 4.
PARM(tp)
PARM(10µs)
1.0
50
75
100
125
150
175
Relative variation of thermal
impedance junction to case versus
pulse duration
Zth(j-c)/Rth(j-c)
0.9
0.8
0.7
0.1
0.6
0.5
0.4
0.3
0.01
0.2
0.1
tp(µs)
0.001
1
10
Single pulse
0.0
1.E-05
100
tp(s)
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1000
Doc ID022861 Rev 1
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Characteristics
Figure 5.
STPS5045S
Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 6.
C(pF)
IR(mA)
1.E+03
Junction capacitance versus
reverse voltage applied
(typical values)
10000
F=1MHz
Vosc =30mVRMS
Tj =25°C
Tj =150°C
1.E+02
Tj =125°C
1.E+01
Tj =100°C
Tj =75°C
1.E+00
1000
Tj =50°C
1.E-01
Tj =25°C
1.E-02
VR(V)
1.E-03
0
5
Figure 7.
1000.0
10
15
20
25
30
35
40
VR(V)
100
45
Forward voltage drop versus
forward current
1
Figure 8.
IFM(A)
100
Thermal resistance junction to
ambient versus copper surface
under tab
Rth(j-a)(°C/W)
80
Tj =125°C
(Maximum values)
100.0
10
epoxy printed circuit board FR4, copper thickness = 35 µm, D2PAK
70
Tj =125°C
(Typical values)
60
Tj =200°C
(Typical values)
50
Tj =25°C
(Maximum values)
10.0
40
30
20
1.0
10
VFM(V)
0.0
4/7
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
S(Cu)(cm²)
0
0.1
1.0
0
Doc ID022861 Rev 1
5
10
15
20
25
30
35
40
STPS5045S
2
Package information
Package information
●
Epoxy meets UL94, V0
●
Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5.
D2PAK dimensions
Dimensions
Ref
A
E
C2
L2
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
R
V2
Figure 9.
0.40 typ.
0°
8°
0.016 typ.
0°
8°
Footprint (dimensions in millimeters)
16.90
10.30
5.08
1.30
8.90
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Ordering information
3
Ordering information
Table 6.
4
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
STPS5045SG-TR
STPS5045SG
D2PAK
1.48 g
1000
Tape and reel
Revision history
Table 7.
6/7
STPS5045S
Revision history
Date
Revision
28-June-2012
1
Changes
First issue.
Doc ID022861 Rev 1
STPS5045S
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