### STMICROELECTRONICS STPS3150-Y

```STPS3150-Y
Automotive power Schottky rectifier
Features
■
AEC-Q101 qualified
■
Negligible switching losses
■
Low forward voltage drop for higher efficiency
and extented battery life
■
Low thermal resistance
■
ECOPACK®2 compliant component
A
Description
K
SMB
STPS3150UY
Table 1.
Packaged in SMB, this device is intended for use
in automotive applications where low drop forward
voltage is required to reduce power dissipation.
November 2011
Doc ID 018926 Rev 1
Device summary
Symbol
Value
IF(AV)
3A
VRRM
150 V
Tj (max)
175 °C
VF (max)
0.67 V
1/7
www.st.com
7
Characteristics
STPS3150-Y
1
Characteristics
Table 2.
Absolute ratings (limiting values)
Symbol
Parameter
Unit
150
V
VRRM
Repetitive peak reverse voltage
IF(AV)
Average forward current
TL = 130 °C δ = 0.5
3
A
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
80
A
Tstg
Storage temperature range
-65 to +175
°C
-40 to +175
°C
Operating junction temperature range
Tj
dPtot
--------------dTj
1.
Value
<
1
-------------------------Rth ( j – a )
Table 3.
condition to avoid thermal runaway for a diode on its own heatsink
Thermal resistance
Symbol
Rth(j-l)
Parameter
Table 4.
Parameter
Tests conditions
Tj = 25 °C
Reverse leakage current
Tj = 125 °C
Tj = 25 °C
VF (2)
Value
Unit
20
°C/W
Static electrical characteristics
Symbol
IR (1)
(1)
Tj = 125 °C
Forward voltage drop
Tj = 25 °C
Tj = 125 °C
Min.
VR = VRRM
IF = 3 A
Typ
Max.
Unit
0.4
2.0
µA
0.6
2.0
mA
0.78
0.82
0.63
0.67
0.85
0.89
0.70
0.75
V
IF = 6 A
1. tp = 5 ms, δ < 2%
2. tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.59 x IF(AV) + 0.023 IF2(RMS)
Figure 1.
Average forward power
dissipation versus average
forward current
Figure 2.
IF(AV)(A)
PF(AV)(W)
2.4
δ = 0.2
δ = 0.1
2.2
3.5
δ = 0.5
Rth(j-a)=Rth(j-I)
3.0
δ = 0.05
2.0
Average forward current versus
ambient temperature (δ = 0.5)
1.8
2.5
δ=1
1.6
1.4
2.0
1.2
1.5
1.0
Rth(j-a)=75°C/W
0.8
1.0
0.6
T
T
0.4
0.5
IF(AV)(A)
0.2
δ=tp/T
0.0
0.0
2/7
0.5
1.0
1.5
2.0
2.5
3.0
δ=tp/T
tp
0.0
3.5
0
Doc ID 018926 Rev 1
25
Tamb(°C)
tp
50
75
100
125
150
175
STPS3150-Y
Figure 3.
Characteristics
Non repetitive surge peak forward
(maximum values)
Figure 4.
IM(A)
PARM(tp)
PARM(1 µs)
12
11
Normalized avalanche power
derating versus pulse duration
SMB
1
10
9
8
0.1
Ta=25°C
7
6
Ta=75°C
5
4
0.01
Ta=125°C
3
IM
2
t
1
t(s)
δ=0.5
tp(µs)
0.001
0
1.E-03
1.E-02
Figure 5.
1.E-01
0.01
1.E+00
Normalized avalanche power
derating versus junction
temperature
Figure 6.
0.1
1
10
100
1000
Relative variation of thermal
impedance junction to ambient
versus pulse duration
Zth(j-a)/Rth(j-a)
PARM(Tj)
PARM(25 °C)
1.0
SMB
0.9
1.2
0.8
1
0.7
0.8
0.6
0.5
0.6
0.4
0.4
0.3
T
0.2
0.2
Tj(°C)
0.1
0
25
50
75
Single pulse
100
125
150
1.E-02
Figure 7.
Reverse leakage current versus
reverse voltage applied (typical
values)
δ=tp/T
tp(s)
tp
0.0
Figure 8.
IR(µA)
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
1.E+04
1000
F=1MHz
VOSC=30mVRMS
Tj=25°C
Tj=150°C
1.E+03
Tj=125°C
1.E+02
Tj=100°C
1.E+01
100
Tj=75°C
Tj=50°C
1.E+00
Tj=25°C
1.E-01
VR(V)
VR(V)
10
1.E-02
0
25
50
75
100
125
150
1
Doc ID 018926 Rev 1
10
100
1000
3/7
Characteristics
Figure 9.
STPS3150-Y
Forward voltage drop versus
forward current
Figure 10. Forward voltage drop versus
forward current
IFM(A)
IFM(A)
100
100
Tj=125°C
(maximum values)
Tj=125°C
(maximum values)
Tj=125°C
(typical values)
Tj=125°C
(typical values)
Tj=25°C
(maximum values)
Tj=25°C
(maximum values)
10
10
VFM(V)
VFM(V)
1
1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Figure 11. Thermal resistance junction to ambient versus copper surface under each lead
Rth(j-a)(°C/W)
110
100
Epoxy printed circuit board
FR4, copper thickness = 35 µm
90
80
70
60
50
40
30
20
10
SCu(cm²)
0
0.0
4/7
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Doc ID 018926 Rev 1
4.0
4.5
5.0
1.8
STPS3150-Y
2
Package information
Package information
●
Epoxy meets UL94, V0
●
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
Table 5.
SMB dimensions
Dimensions
Ref.
Millimeters
Inches
E1
D
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
D
3.30
3.95
0.130
0.156
L
0.75
1.50
0.030
0.059
E
A1
A2
C
L
b
Figure 12. SMB footprint (dimensions in mm)
1.62
2.60
1.62
2.18
5.84
Doc ID 018926 Rev 1
5/7
Ordering information
3
Ordering information
Table 6.
4
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
STPS3150UY
G315Y
SMB
0.107 g
2500
Tape and reel
Revision history
Table 7.
6/7
STPS3150-Y
Document revision history
Date
Revision
03-Nov-2011
1
Description of Changes
Initial release.
Doc ID 018926 Rev 1
STPS3150-Y
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