MN102H81G Type MN102H81G ROM (×× 8-bit) 128 K RAM (×× 8-bit) 4K Package QFP084-P-1818E *Lead-free Minimum Instruction Execution Time 83 ns (at 3.135 V to 3.465 V, 12 MHz) Interrupts External (5 lines) Internal (28 lines) : Timer × 11, A/D × 1, Undefined command × 1, RESET × 1, OSD × 2, Serial × 1, I2C × 1, Caption × 2, Remote control × 1, Address coincidence × 4, HSYNC× 1, VSYNC× 1 Timer Counter 8-bit timer × 10 Watchdog timer: 17-bit × 1 Serial Interface I2C × 1: for multimaster mode, bus line (output) has 2 systems Sync serial / UART × 1 • Built-in sync separator × 1 Caption I/O Pins I/O 30 • Common use A/D Inputs PWM 10-bit × 8-ch. (with S/H) Special Ports Remote control reception CRTC 3-layer display (graphics, characters, splits) Notes Remote control input discriminant circuit built-in, build-in NTSC video signal processing circuit, built-in 3-line comb filter 8-bit × 6-ch. MAE00017CEM MN102H81G DVDD P07, ADIN7, VDAF P06, ADIN8, HDAF P05, ADIN5 DVDD DVSS P04, ADIN4 P03, ADIN3 P02, ADIN2 P01, ADIN1 P00, ADIN0 /TESTMD OSC2 OSC1 PDO VCOI AVDD AVSS BOUT SIREF SCOMP 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 Pin Assignment P15, RMIN, /IRQ7 64 42 GOUT *P16, SDA0 65 41 ROUT *P17, SCL0 66 40 VIREF P20, WDOUT 67 39 VCOMP P21, STOP, VOUT0 68 38 VMOUT P27, SBT0 69 37 AVDD P30, SBD0 70 36 FBPIN P31, SBO0 71 35 AVSS *P32, SDA1 72 34 EW *P33, SCL1 73 33 VOUT P34, PWM0 74 32 AVDD P35, PWM1 75 31 FSCOUT P36, PWM2 76 30 FSCIN DVDD 77 29 FPCO DVSS 78 28 AVSS P22, SYSCLK 79 27 FVCOI *P23, TM5IO 80 26 HOUT *P26, TM8IO 81 25 HDOWN P43, /RST 82 24 EHTIN P44, /IRQ0 83 23 BEAMIN P45, /IRQ1 84 22 ABLIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 P46, /IRQ2 P47, /IRQ3 VSYNC P40, PWM4 PIPYS PIPYIN PIPVIN PIPUIN AVDD AVSS VREFH VREFM MCOMPIN VREFL MSCIN CREFH MVIN CLH MUIN CLL CREFL MN102H81G QFP084-P-1818E *Lead-free *5 V dielectric Nch open drain output pin Support Tool In-circuit Emulator MAE00017CEM PX-ICE102H81-QFP084-P-1818E Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2003 SEP