RClamp0564P Datasheet

RClamp0564P
Femto Farad RailClamp®
4-Line, 170fF ESD Protection
PROTECTION PRODUCTS
Description
Features
RClamp®0564P is an ultra low capacitance ESD
protection device specifically designed to protect highspeed differential lines. It offers desirable characteristics
for board level protection including fast response time,
low operating and clamping voltage, and no device
degradation
• High ESD Withstand Voltage
ŒŒ IEC 61000-4-2 (ESD) 10kV (contact)
• Ultra-Low Capacitance: 0.17pF Typical
• Very Small PCB Area
• Protects Four High-Speed Data Lines
• Working Voltage: 5V
• Low Dynamic Resistance: 0.65 Ohms
• Large Operating Bandwidth: 12GHz
• Solid-State Silicon-Avalanche Technology
RClamp0564P features extremely good ESD protection
characteristics highlighted by low peak ESD clamping
voltage, and high ESD withstand voltage (+/-10kV
contact per IEC 61000-4-2). RClamp0564P is designed
to minimize both the ESD peak clamping and the TLP
clamping. Package inductance is reduced at each
pin resulting in lower peak ESD clamping voltage.
RClamp0564P has a typical capacitance of 0.17pF
allowing it to be used in high bandwidth applications
such as HDMI 2.0 4K/2K, Thunderbolt, and USB 3.1. Each
device will protect four high-speed data lines operating
up to 5 volts. RClamp0564P is in a 5-pin SGP2010N5 package measuring 2.0 x 1.0mm with a nominal height of
0.60mm. The leads have a nominal pin-to-pin pitch of
0.40mm. Flow- through package design simplifies PCB
layout and maintains signal integrity on high-speed lines. Nominal Dimensions
Mechanical Characteristics
•
•
•
•
•
•
•
SGP2010N5 Package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 2.0 x 1.0 x 0.60 mm
Lead Pitch: 0.40mm
Lead Finish: NiPdAu
Marking : Marking Code
Packaging : Tape and Reel
Applications
•
•
•
•
•
HDMI 1.4, HDMI1.4b and HDMI 2.0
USB 3.0 and USB 3.1
USB Type-C
Thunderbolt
MIPI / MDDI
Schematic
2.00
1
2
1.00
Pin 3
0.40 BSC
GND
0.60
Nominal Dimensions in mm
RClamp0564P
Final Datasheet
July 22, 2015
Rev 3.0
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1
Semtech
Absolute Maximum Ratings
Rating
Symbol
Value
Units
Peak Pulse Current (tp = 8/20µs)
IPP
3
A
ESD per IEC 61000-4-2 (Contact)
ESD per IEC 61000-4-2 (Air)(2)
VESD
±10
±15
kV
Operating Temperature
TJ
-40 to +85
O
Storage Temperature
TSTG
-55 to +150
O
(1)
C
C
Electrical Characteristics (T=25OC unless otherwise specified)
Parameter
Symbol Conditions
Reverse Stand-Off Voltage
VRWM
Reverse Breakdown Voltage
VBR
Holding Current
IH
Min.
Typ.
-40OC to 85OC
It = 10mA
-40 C to 85 C
O
O
6.5
9.5
Max.
5
V
10.5
V
100
mA
T = 25 C
1
50
nA
T = 85 C
10
150
nA
O
VRWM = 5V
Units
Reverse Leakage Current
IR
Clamping Voltage3
VC
IPP = 3A, tp = 8/20µs
4
V
ESD Clamping Voltage4
VC
IPP = 4A, tp = 0.2/100ns (TLP)
5.5
V
ESD Clamping Voltage4
VC
IPP = 16A, tp = 0.2/100ns (TLP)
13.5
V
Dynamic Resistance4, 5
RDYN
tp = 0.2/100ns (TLP)
0.65
Ohms
Junction Capacitance
CJ
VR = 0V, f = 1MHz
Cutoff Frequency
FC
-3dB
O
T = 25OC
0.17
12
0.20
pF
GHz
Notes:
(1) Measured with a 40dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to Ground Reference Plane (GRP)
(2) In-System ESD withstand voltage
(3) Measured using a 1.2/50us voltage, 8/20us current combination waveform. Clamping is defined as the peak voltage across the device
after the device snaps back to a conducting state.
(4) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns.
(5) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
RClamp0564P
Final Datasheet
July 22, 2015
Rev 3.0
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2
Semtech
Typical Characteristics
ESD Clamping (+8kV Contact per IEC 61000-4-2)
140
0
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 40dB attenuator. ESD gun
return path connected to ESD ground plane.
-20
ESD Clamping Voltage (V)
120
Clamping Voltage - VC (V)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
100
80
60
40
-60
-80
-100
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 40dB attenuator. ESD gun
return path connected to ESD ground plane.
-120
20
0
-40
-10
0
10
20
30
40
50
60
70
-140
80
-10
0
10
20
Time (ns)
TLP IV Curve - Positive Pulse
16
6
4
-4
-6
-8
-10
2
-12
0
-14
2
4
80
-2
8
0
70
0
10
-2
60
2
TLP Current (A)
TLP Current (A)
12
50
TLP IV Curve - Negative Pulse
Transmission Line Pulse Test
(TLP) Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
14
30
40
Time (ns)
6
8
10
12
14
-16
Transmission Line Pulse Test
(TLP) Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
-14
-12
-10
-8
Clamping Voltage (V)
-6
-4
-2
0
Clamping Voltage (V)
Capacitance vs. Reverse Voltage
Insertion Loss (S21)
0
0.2
0.18
‐0.5
0.14
Insertion Loss ‐ IL (dB)
Junction Capacitance - CJ (pF)
0.16
0.12
0.1
0.08
0.06
0.04
‐1
‐1.5
‐2
‐2.5
0.02
0
f = 1 MHz
0
1
2
3
4
5
6
‐3
0.01
Voltage (V)
RClamp0564P
Final Datasheet
July 22, 2015
Rev 3.0
www.semtech.com
0.1
Frequency (GHz)
1
10
3
Semtech
Application Information
HDMI 2.0 Interface Protection
HDMI 2.0 chips are constantly exposed to external ESD
and cable discharge threats. Adding external ESD protection is critical but can be challenging. Both electrical and
mechanical requirements must be considered. HDMI 2.0
provides the necessary bandwidth to support the higher
resolution and frame rates of Ultra HD. This is accomplished by increasing the data rate on each data lane
from 3.4 Gbps to 6 Gbps, which means the protection
device must present an extremely low capacitance to
preserve signal integrity. The external protection device
should also have good ESD protection properties including low ESD peak clamping voltage and low dynamic
resistance. Mechanically, the package design should
allow the traces to easily flow through the package. This
is important since differential pair trace lengths should
be matched to avoid signal skew. Protection Solutions
RClamp0564P has been specifically designed to protect
high-speed interfaces. It has a typical capacitance of
0.17pF and a flow through package design. A typical HDMI 2.0 protection solution is shown below. RClamp0564P is used to protect two high-speed differential data pairs. Line pairs are routed through pins
1, 5 and pins 3, 4. Ground connection is made at pin 2. RClamp0564P has little affect on a 5.94Gb/s signal with
an HDMI 2.0 eye mask as shown in the eye diagrams
below. Two RClamp0564P are required to protect all four
clock and data differential pairs. The remaining six lines
can also be protected using RClamp0564P. However,
since they are not as sensitive to capacitive loading as the
TMDS lines, a device such as RClamp7538P may be used
as shown. Device Placement
Placement of the protection component is a critical element for effective ESD suppression. TVS diodes should
be placed as close to the connector as possible to reduce
transient coupling to nearby traces. Ground connections
should be made directly to the ground plane using micro-vias. This reduces parasitic inductance in the ground
path and minimizes the clamping voltage seen by the
protected device.
HDMI 2.0 Protection Example
5.94Gb/s Eye Diagram with RClamp0564P
HDMI Type A Connector
HPD
+5V
SDA
SCL
HEC_DAT
CEC
RClamp7538P
CLKCLK+
RClamp0564P
D0D0+
Horizontal Scale: 28ps/div
Vertical Scale: 200mV/div
Data Rate: 5.94 Gb/s
Mask: HDMI 2.0
5.94Gb/s Eye Diagram without RClamp0564P
D1D1+
RClamp0564P
D2D2+
Horizontal Scale: 28ps/div
Vertical Scale: 200mV/div
Data Rate: 5.94 Gb/s
Mask: HDMI 2.0
RClamp0564P
Final Datasheet
July 22, 2015
Rev 3.0
www.semtech.com
4
Semtech
Applications Information
Assembly Guidelines
Recommended Mounting Pattern
The small size of this device means that some care must
be taken during the mounting process to insure reliable
solder joints. The figure at the right details Semtech’s
recommended mounting pattern. Recommended
assembly guidelines are shown in Table 1. Note that
these are only recommendations and should serve only
as a starting point for design since there are many factors
that affect the assembly process. Exact manufacturing
parameters will require some experimentation to get the
desired solder application. Semtech’s recommended
mounting pattern is based on the following design
guidelines:
0.200
0.025
0.400
0.650
1.000
0.025
0.300
0.200
0.800
2.000
All Dimensions are in mm.
Land Pattern
Land Pad.
The recommended land pattern follows IPC standards and is
designed for maximum solder coverage. Detailed dimensions
are shown elsewhere in this document.
Stencil opening
Component
Table 1 - Recommended Assembly Guidelines
Assembly Parameter
Recommendation
Solder Stencil
Solder Stencil Design
Laser Cut, Electro-Polished
Stencil design is one of the key factors which will determine
the volume of solder paste which is deposited onto the land
pad. The area ratio of the stencil aperture will determine how
well the stencil will print. The area ratio takes into account the
aperture shape, aperture size, and stencil thickness. An area
ratio of 0.70 – 0.75 is preferred for the subject package. The
area ratio of a rectangular aperture is given as:
Aperture Shape
Rectangular with rounded
corners
Solder Stencil Thickness
0.100mm (0.004”)
Solder Paste Type
Type 4 size sphere or smaller
Solder Reflow Profile
Per JEDEC J-STD-020
PCB Solder pad Design
Non-Solder Mask Defined
PCB Pad Finish
OSP or NiAu
Area Ratio = (L * W )/ (2 * (L + W) * T)
Where:
L = Aperture Length
W = Aperture Width
T = Stencil Thickness
Semtech recommends a stencil thickness of 0.100mm for
this device. The stencil should be laser cut with electropolished finish. The stencil should have a positive taper of
approximately 5 degrees. Electro polishing and tapering
the walls results in reduced surface friction and better paste
release. For small pitch components, Semtech recommends
a square aperture with rounded corners for consistent solder
release. Due to the small aperture size, a solder paste with
Type 4 or smaller particles are recommended. RClamp0564P
Final Datasheet
July 22, 2015
Rev 3.0
www.semtech.com
5
Semtech
Outline Drawing - SGP2010N5
D
A
B
DIMENSIONS
MILLIMETERS
MIN NOM MAX
DIM
PIN 1
INDICATOR
(LASER MARK)
A
A1
b
D
E
e
e1
L
N
aaa
bbb
E
A
SEATING
PLANE
aaa C
A1
0.57 0.60 0.63
0.00 0.03 0.05
0.15 0.20 0.25
1.95 2.00 2.075
0.95 1.00 1.075
0.40 BSC
0.80 BSC
0.25 0.30 0.35
5
0.08
0.10
C
D/2
1
2
LxN
(0.025-0.075)
N
E/2
bxN
bbb
e
C A B
e1
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SGP2010N5
P1
P
DIMENSIONS
Y
(C)
Z
G
DIM
C
G
P
P1
X
Y
Z
MILLIMETERS
(0.85)
0.25
0.40
0.80
0.20
0.60
1.45
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
RClamp0564P
Final Datasheet
July 22, 2015
Rev 3.0
www.semtech.com
6
Semtech
Marking Code
0564P
YYWW
Notes: YYWW = Alphanumeric Date Code
Tape and Reel Specification
YYWW
0564P
YYWW
0564P
YYWW
0564P
YYWW
0564P
Pin 1 Location (Towards Sprocket Holes )
Ordering Information
Part Number
RClamp0564P.TNT
Qty per Reel
10000
Reel Size
7 Inch
RailClamp and RClamp are registered trademarks of Semtech Corporation.
RClamp0564P
Final Datasheet
July 22, 2015
Rev 3.0
www.semtech.com
7
Semtech
IMPORTANT NOTICE
Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a
guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right
to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders
and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time
of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.
SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES
OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE
OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN
SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall
indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney
fees which could arise.
The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and
names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document
without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any
particular purpose. All rights reserved.
© Semtech 2015
Contact Information
Semtech Corporation
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111, Fax: (805) 498-3804
www.semtech.com
RClamp0564P
Final Datasheet
July 22, 2015
Rev 3.0
8
Semtech