RClamp0564P Femto Farad RailClamp® 4-Line, 170fF ESD Protection PROTECTION PRODUCTS Description Features RClamp®0564P is an ultra low capacitance ESD protection device specifically designed to protect highspeed differential lines. It offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation • High ESD Withstand Voltage IEC 61000-4-2 (ESD) 10kV (contact) • Ultra-Low Capacitance: 0.17pF Typical • Very Small PCB Area • Protects Four High-Speed Data Lines • Working Voltage: 5V • Low Dynamic Resistance: 0.65 Ohms • Large Operating Bandwidth: 12GHz • Solid-State Silicon-Avalanche Technology RClamp0564P features extremely good ESD protection characteristics highlighted by low peak ESD clamping voltage, and high ESD withstand voltage (+/-10kV contact per IEC 61000-4-2). RClamp0564P is designed to minimize both the ESD peak clamping and the TLP clamping. Package inductance is reduced at each pin resulting in lower peak ESD clamping voltage. RClamp0564P has a typical capacitance of 0.17pF allowing it to be used in high bandwidth applications such as HDMI 2.0 4K/2K, Thunderbolt, and USB 3.1. Each device will protect four high-speed data lines operating up to 5 volts. RClamp0564P is in a 5-pin SGP2010N5 package measuring 2.0 x 1.0mm with a nominal height of 0.60mm. The leads have a nominal pin-to-pin pitch of 0.40mm. Flow- through package design simplifies PCB layout and maintains signal integrity on high-speed lines. Nominal Dimensions Mechanical Characteristics • • • • • • • SGP2010N5 Package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 2.0 x 1.0 x 0.60 mm Lead Pitch: 0.40mm Lead Finish: NiPdAu Marking : Marking Code Packaging : Tape and Reel Applications • • • • • HDMI 1.4, HDMI1.4b and HDMI 2.0 USB 3.0 and USB 3.1 USB Type-C Thunderbolt MIPI / MDDI Schematic 2.00 1 2 1.00 Pin 3 0.40 BSC GND 0.60 Nominal Dimensions in mm RClamp0564P Final Datasheet July 22, 2015 Rev 3.0 www.semtech.com 1 Semtech Absolute Maximum Ratings Rating Symbol Value Units Peak Pulse Current (tp = 8/20µs) IPP 3 A ESD per IEC 61000-4-2 (Contact) ESD per IEC 61000-4-2 (Air)(2) VESD ±10 ±15 kV Operating Temperature TJ -40 to +85 O Storage Temperature TSTG -55 to +150 O (1) C C Electrical Characteristics (T=25OC unless otherwise specified) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage VBR Holding Current IH Min. Typ. -40OC to 85OC It = 10mA -40 C to 85 C O O 6.5 9.5 Max. 5 V 10.5 V 100 mA T = 25 C 1 50 nA T = 85 C 10 150 nA O VRWM = 5V Units Reverse Leakage Current IR Clamping Voltage3 VC IPP = 3A, tp = 8/20µs 4 V ESD Clamping Voltage4 VC IPP = 4A, tp = 0.2/100ns (TLP) 5.5 V ESD Clamping Voltage4 VC IPP = 16A, tp = 0.2/100ns (TLP) 13.5 V Dynamic Resistance4, 5 RDYN tp = 0.2/100ns (TLP) 0.65 Ohms Junction Capacitance CJ VR = 0V, f = 1MHz Cutoff Frequency FC -3dB O T = 25OC 0.17 12 0.20 pF GHz Notes: (1) Measured with a 40dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to Ground Reference Plane (GRP) (2) In-System ESD withstand voltage (3) Measured using a 1.2/50us voltage, 8/20us current combination waveform. Clamping is defined as the peak voltage across the device after the device snaps back to a conducting state. (4) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns. (5) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A RClamp0564P Final Datasheet July 22, 2015 Rev 3.0 www.semtech.com 2 Semtech Typical Characteristics ESD Clamping (+8kV Contact per IEC 61000-4-2) 140 0 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane. -20 ESD Clamping Voltage (V) 120 Clamping Voltage - VC (V) ESD Clamping (-8kV Contact per IEC 61000-4-2) 100 80 60 40 -60 -80 -100 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane. -120 20 0 -40 -10 0 10 20 30 40 50 60 70 -140 80 -10 0 10 20 Time (ns) TLP IV Curve - Positive Pulse 16 6 4 -4 -6 -8 -10 2 -12 0 -14 2 4 80 -2 8 0 70 0 10 -2 60 2 TLP Current (A) TLP Current (A) 12 50 TLP IV Curve - Negative Pulse Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns 14 30 40 Time (ns) 6 8 10 12 14 -16 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns -14 -12 -10 -8 Clamping Voltage (V) -6 -4 -2 0 Clamping Voltage (V) Capacitance vs. Reverse Voltage Insertion Loss (S21) 0 0.2 0.18 ‐0.5 0.14 Insertion Loss ‐ IL (dB) Junction Capacitance - CJ (pF) 0.16 0.12 0.1 0.08 0.06 0.04 ‐1 ‐1.5 ‐2 ‐2.5 0.02 0 f = 1 MHz 0 1 2 3 4 5 6 ‐3 0.01 Voltage (V) RClamp0564P Final Datasheet July 22, 2015 Rev 3.0 www.semtech.com 0.1 Frequency (GHz) 1 10 3 Semtech Application Information HDMI 2.0 Interface Protection HDMI 2.0 chips are constantly exposed to external ESD and cable discharge threats. Adding external ESD protection is critical but can be challenging. Both electrical and mechanical requirements must be considered. HDMI 2.0 provides the necessary bandwidth to support the higher resolution and frame rates of Ultra HD. This is accomplished by increasing the data rate on each data lane from 3.4 Gbps to 6 Gbps, which means the protection device must present an extremely low capacitance to preserve signal integrity. The external protection device should also have good ESD protection properties including low ESD peak clamping voltage and low dynamic resistance. Mechanically, the package design should allow the traces to easily flow through the package. This is important since differential pair trace lengths should be matched to avoid signal skew. Protection Solutions RClamp0564P has been specifically designed to protect high-speed interfaces. It has a typical capacitance of 0.17pF and a flow through package design. A typical HDMI 2.0 protection solution is shown below. RClamp0564P is used to protect two high-speed differential data pairs. Line pairs are routed through pins 1, 5 and pins 3, 4. Ground connection is made at pin 2. RClamp0564P has little affect on a 5.94Gb/s signal with an HDMI 2.0 eye mask as shown in the eye diagrams below. Two RClamp0564P are required to protect all four clock and data differential pairs. The remaining six lines can also be protected using RClamp0564P. However, since they are not as sensitive to capacitive loading as the TMDS lines, a device such as RClamp7538P may be used as shown. Device Placement Placement of the protection component is a critical element for effective ESD suppression. TVS diodes should be placed as close to the connector as possible to reduce transient coupling to nearby traces. Ground connections should be made directly to the ground plane using micro-vias. This reduces parasitic inductance in the ground path and minimizes the clamping voltage seen by the protected device. HDMI 2.0 Protection Example 5.94Gb/s Eye Diagram with RClamp0564P HDMI Type A Connector HPD +5V SDA SCL HEC_DAT CEC RClamp7538P CLKCLK+ RClamp0564P D0D0+ Horizontal Scale: 28ps/div Vertical Scale: 200mV/div Data Rate: 5.94 Gb/s Mask: HDMI 2.0 5.94Gb/s Eye Diagram without RClamp0564P D1D1+ RClamp0564P D2D2+ Horizontal Scale: 28ps/div Vertical Scale: 200mV/div Data Rate: 5.94 Gb/s Mask: HDMI 2.0 RClamp0564P Final Datasheet July 22, 2015 Rev 3.0 www.semtech.com 4 Semtech Applications Information Assembly Guidelines Recommended Mounting Pattern The small size of this device means that some care must be taken during the mounting process to insure reliable solder joints. The figure at the right details Semtech’s recommended mounting pattern. Recommended assembly guidelines are shown in Table 1. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. Semtech’s recommended mounting pattern is based on the following design guidelines: 0.200 0.025 0.400 0.650 1.000 0.025 0.300 0.200 0.800 2.000 All Dimensions are in mm. Land Pattern Land Pad. The recommended land pattern follows IPC standards and is designed for maximum solder coverage. Detailed dimensions are shown elsewhere in this document. Stencil opening Component Table 1 - Recommended Assembly Guidelines Assembly Parameter Recommendation Solder Stencil Solder Stencil Design Laser Cut, Electro-Polished Stencil design is one of the key factors which will determine the volume of solder paste which is deposited onto the land pad. The area ratio of the stencil aperture will determine how well the stencil will print. The area ratio takes into account the aperture shape, aperture size, and stencil thickness. An area ratio of 0.70 – 0.75 is preferred for the subject package. The area ratio of a rectangular aperture is given as: Aperture Shape Rectangular with rounded corners Solder Stencil Thickness 0.100mm (0.004”) Solder Paste Type Type 4 size sphere or smaller Solder Reflow Profile Per JEDEC J-STD-020 PCB Solder pad Design Non-Solder Mask Defined PCB Pad Finish OSP or NiAu Area Ratio = (L * W )/ (2 * (L + W) * T) Where: L = Aperture Length W = Aperture Width T = Stencil Thickness Semtech recommends a stencil thickness of 0.100mm for this device. The stencil should be laser cut with electropolished finish. The stencil should have a positive taper of approximately 5 degrees. Electro polishing and tapering the walls results in reduced surface friction and better paste release. For small pitch components, Semtech recommends a square aperture with rounded corners for consistent solder release. Due to the small aperture size, a solder paste with Type 4 or smaller particles are recommended. RClamp0564P Final Datasheet July 22, 2015 Rev 3.0 www.semtech.com 5 Semtech Outline Drawing - SGP2010N5 D A B DIMENSIONS MILLIMETERS MIN NOM MAX DIM PIN 1 INDICATOR (LASER MARK) A A1 b D E e e1 L N aaa bbb E A SEATING PLANE aaa C A1 0.57 0.60 0.63 0.00 0.03 0.05 0.15 0.20 0.25 1.95 2.00 2.075 0.95 1.00 1.075 0.40 BSC 0.80 BSC 0.25 0.30 0.35 5 0.08 0.10 C D/2 1 2 LxN (0.025-0.075) N E/2 bxN bbb e C A B e1 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SGP2010N5 P1 P DIMENSIONS Y (C) Z G DIM C G P P1 X Y Z MILLIMETERS (0.85) 0.25 0.40 0.80 0.20 0.60 1.45 X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. RClamp0564P Final Datasheet July 22, 2015 Rev 3.0 www.semtech.com 6 Semtech Marking Code 0564P YYWW Notes: YYWW = Alphanumeric Date Code Tape and Reel Specification YYWW 0564P YYWW 0564P YYWW 0564P YYWW 0564P Pin 1 Location (Towards Sprocket Holes ) Ordering Information Part Number RClamp0564P.TNT Qty per Reel 10000 Reel Size 7 Inch RailClamp and RClamp are registered trademarks of Semtech Corporation. RClamp0564P Final Datasheet July 22, 2015 Rev 3.0 www.semtech.com 7 Semtech IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015 Contact Information Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com RClamp0564P Final Datasheet July 22, 2015 Rev 3.0 8 Semtech